CN219986634U - General parallel seam welding bonding fixture - Google Patents
General parallel seam welding bonding fixture Download PDFInfo
- Publication number
- CN219986634U CN219986634U CN202320433752.1U CN202320433752U CN219986634U CN 219986634 U CN219986634 U CN 219986634U CN 202320433752 U CN202320433752 U CN 202320433752U CN 219986634 U CN219986634 U CN 219986634U
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- China
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- base
- semiconductor device
- block
- placing plate
- push rod
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- 238000003466 welding Methods 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 51
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a general parallel seam welding bonding fixture which can be used for fixing a product shell when semiconductor devices with various sizes are subjected to parallel seam welding and bonding, and is convenient to clamp when in use. The device comprises a base, a semiconductor device placing plate arranged on the base, and a push rod, wherein the push rod is connected with a device pressing block, the upper end of the device pressing block protrudes out of the semiconductor device placing plate, a positioning block opposite to the semiconductor device placing plate is arranged on the semiconductor device placing plate, and a first reset spring is connected between the push rod and the base; the base is provided with side device stop blocks transversely opposite to each other, the semiconductor device placing plate is provided with an avoidance groove, the top ends of the side device stop blocks protrude out of the avoidance groove from the semiconductor device placing plate, the bottom ends of the side device stop blocks are connected with the base through second reset springs, the push rod is further connected with a fixed block longitudinally moving along with the push rod, the fixed block is located below the semiconductor device placing plate, and inclined pushing surfaces are arranged on two sides of the end portions of the fixed block.
Description
Technical Field
The utility model relates to the technical field of semiconductor device processing, in particular to a general parallel seam welding bonding clamp.
Background
When the semiconductor devices are subjected to parallel seam welding and bonding, the product shell is required to be fixed, and the semiconductor devices are various in size, so that when the semiconductor devices of different types are subjected to parallel seam welding and bonding, different fixture clamps are required to correspond to the semiconductor devices of different sizes so as to fix the shells of the semiconductor devices, if each semiconductor device is required to be designed with the corresponding fixture clamp, waste is generated, and therefore, a universal fixture suitable for the semiconductor devices of various sizes is required.
Disclosure of Invention
Aiming at the problems that the existing parallel seam welding bonding clamp is not suitable for semiconductor devices with various sizes and inconvenient, the utility model provides a general parallel seam welding bonding clamp which can be used for fixing a product shell when the semiconductor devices with various sizes are subjected to parallel seam welding and bonding, and is convenient to clamp when in use.
The technical scheme is as follows: the utility model provides a general type parallel seam welding bonding anchor clamps, its includes the base, installs the semiconductor device on the base and places the board, its characterized in that: the device pressing block is longitudinally penetrated through the base and then connected with a device pressing block positioned at one side of the base, the upper end of the device pressing block protrudes out of the semiconductor device placing plate, a positioning block opposite to the semiconductor device placing plate is arranged on the semiconductor device placing plate, and a first reset spring is connected between the push rod and the base; the semiconductor device placing device is characterized in that side device check blocks are oppositely arranged on the base along the transverse direction, an avoidance groove is formed in the semiconductor device placing plate, the top ends of the side device check blocks protrude out of the semiconductor device placing plate from the avoidance groove, the bottom ends of the side device check blocks are connected with the base through second reset springs, fixing blocks longitudinally moving along with the push rods are further connected to the push rods, the fixing blocks are located below the semiconductor device placing plate, inclined pushing surfaces are arranged on two sides of the end portions of the fixing blocks, and when the side device check blocks are not in contact with the fixing blocks, the side device check blocks are located on the advancing paths of the inclined pushing surfaces.
It is further characterized by:
the push rod is provided with a slot, a connecting block at the bottom of the fixed block is inserted into the slot and connected with the push rod, a longitudinal through groove for the push rod to pass through is formed in the middle of the base, and an opening above the through groove is used for avoiding the connecting block;
the push rod comprises a head and a rod part, the diameter of the head is larger than that of the rod part, the reset spring is sleeved outside the rod part, one end of the reset spring abuts against the head, the other end of the reset spring abuts against a spring stop block, the spring stop block is connected with the base, and a through hole for the rod part to pass through is formed in the middle of the spring stop block;
two ends of the base, which are opposite to the through groove, are provided with transverse mounting grooves which are oppositely arranged, the bottom end of the side device stop block and the second reset spring are respectively positioned in the mounting grooves, one end of the second reset spring abuts against the bottom end of the side device stop block, and the other end of the second reset spring abuts against a limiting block connected with the base;
the limiting block comprises a supporting block extending into the penetrating groove, and the supporting block is used for supporting the second reset spring.
The beneficial effects of the utility model are as follows: when the device pressing block is used, the device pressing block can be far away from the positioning block only by pushing the push rod, the two side device check blocks are mutually separated, so that semiconductor device shells of different sizes can be placed between the device pressing block and the positioning block, then the device pressing block and the positioning block can clamp the semiconductor device longitudinally under the action of the reset spring by loosening the push rod, the two side device check blocks can clamp the semiconductor device transversely, and therefore the device pressing block can be used for clamping the semiconductor device in parallel seam welding and bonding, is convenient to use and is suitable for semiconductor devices of various sizes.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
fig. 2 is a view showing a structure of a jig omitting a semiconductor device placing board;
FIG. 3 is a schematic view of a base structure;
FIG. 4 is a schematic side device block mounting view;
fig. 5 is a schematic view of a connection structure of the push rod and the fixing block.
Detailed Description
The general parallel seam welding bonding fixture as shown in fig. 1-4 comprises a base 1, a semiconductor device placing plate 2 arranged on the base 1, and a push rod 3, wherein the push rod 3 longitudinally penetrates through the base 1 and then is connected with a device pressing block 4 positioned on one side of the base 1, the upper end of the device pressing block 4 protrudes out of the semiconductor device placing plate 2, a positioning block 5 opposite to the semiconductor device placing plate 2 is arranged on the semiconductor device placing plate 2, and a first reset spring (not shown in the figure) is connected between the push rod 3 and the base 1; the base 1 is provided with side device check blocks 6 transversely and oppositely, the semiconductor device placing plate 1 is provided with avoidance grooves 7, the top ends of the side device check blocks 6 protrude out of the semiconductor device placing plate 1 from the avoidance grooves 7, the bottom ends of the side device check blocks 6 are connected with the base 1 through reset springs II 8, the push rod 3 is also connected with a fixing block 9 moving longitudinally along with the push rod, the fixing block 9 is located below the semiconductor device placing plate 2, two sides of the end part of the fixing block 9 are provided with inclined pushing surfaces 10, and when the side device check blocks 6 are not contacted with the fixing block 9, the side device check blocks 6 are located on the advancing paths of the inclined pushing surfaces 10.
When the semiconductor device is required to be clamped, the push rod 3 is pushed to move longitudinally and drive the device pressing block 4 and the fixing block 9 to move, the fixing block 9 can be contacted with the circular arc chamfer of the side device stop block 6 through the inclined push surface 10 in the moving process, so that the side device stop block 6 can move transversely, the device pressing block 4 and the positioning block 5 can be mutually far away, the two side device stop blocks 6 are mutually far away, the semiconductor device can be placed between the two side device stop blocks, after the push rod is loosened, the device pressing block and the side device stop block are reset under the action of the reset spring I and the reset spring II, the semiconductor device clamping device is convenient to use, and the clamped semiconductor device can be subjected to parallel seam welding and bonding operation subsequently.
Specifically, be equipped with the slot on the push rod 3, the connecting block of fixed block 9 bottom inserts in the slot and is connected with push rod 3, has offered vertically in the middle of the base 1 and is used for the push rod to pass through groove 11, runs through groove 11 top opening and is used for dodging the connecting block.
Referring to fig. 5, the push rod 3 includes a push block 30, a head 31 and a rod 32, wherein the diameter of the head 31 is larger than that of the rod 32, a return spring is sleeved outside the rod 32, one end of the return spring abuts against the head 31, the other end abuts against the spring stop 12, the spring stop 12 is in screw connection with the base 1, and a through hole for the rod 32 to pass through is formed in the middle of the spring stop.
Two ends of the base 1, which are opposite to the through groove 11, are provided with transverse mounting grooves 12 which are opposite to each other, the bottom end of the side device stop block 6 and the second return spring 8 are respectively positioned in the mounting grooves 12, one end of the second return spring 8 is propped against the bottom end of the side device stop block 6, and the other end is propped against a limiting block 13 connected with the base 1 through screws; the limiting block 13 comprises a supporting block 14 extending into the through groove, and the supporting block 14 is used for supporting the second return spring 8, so that the spring installation is not affected by the groove depth.
The present utility model is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the scope of the present utility model are intended to be included in the scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claims.
Claims (5)
1. The utility model provides a general type parallel seam welding bonding anchor clamps, its includes the base, installs the semiconductor device on the base and places the board, its characterized in that: the device pressing block is longitudinally penetrated through the base and then connected with a device pressing block positioned at one side of the base, the upper end of the device pressing block protrudes out of the semiconductor device placing plate, a positioning block opposite to the semiconductor device placing plate is arranged on the semiconductor device placing plate, and a first reset spring is connected between the push rod and the base; the semiconductor device placing device is characterized in that side device check blocks are oppositely arranged on the base along the transverse direction, an avoidance groove is formed in the semiconductor device placing plate, the top ends of the side device check blocks protrude out of the semiconductor device placing plate from the avoidance groove, the bottom ends of the side device check blocks are connected with the base through second reset springs, fixing blocks longitudinally moving along with the push rods are further connected to the push rods, the fixing blocks are located below the semiconductor device placing plate, inclined pushing surfaces are arranged on two sides of the end portions of the fixing blocks, and when the side device check blocks are not in contact with the fixing blocks, the side device check blocks are located on the advancing paths of the inclined pushing surfaces.
2. A universal parallel seam welding bonding fixture as defined in claim 1, wherein: the push rod is provided with a slot, a connecting block at the bottom of the fixed block is inserted into the slot and connected with the push rod, a longitudinal through groove for the push rod to pass through is formed in the middle of the base, and an opening above the through groove is used for avoiding the connecting block.
3. A universal parallel seam welding bonding fixture as defined in claim 2, wherein: the push rod comprises a head and a rod part, the diameter of the head is larger than that of the rod part, the reset spring is sleeved outside the rod part, one end of the reset spring abuts against the head, the other end of the reset spring abuts against the spring stop block, the spring stop block is connected with the base, and a through hole for the rod part to pass through is formed in the middle of the spring stop block.
4. A universal parallel seam welding bonding fixture as defined in claim 2, wherein: the base is provided with transverse mounting grooves which are arranged oppositely at two ends of the through groove, the bottom end of the side device stop block and the second reset spring are respectively positioned in the mounting grooves, one end of the second reset spring abuts against the bottom end of the side device stop block, and the other end of the second reset spring abuts against the limiting block connected with the base.
5. A universal parallel seam welding bonding fixture as defined in claim 4, wherein: the limiting block comprises a supporting block extending into the penetrating groove, and the supporting block is used for supporting the second reset spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320433752.1U CN219986634U (en) | 2023-03-09 | 2023-03-09 | General parallel seam welding bonding fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320433752.1U CN219986634U (en) | 2023-03-09 | 2023-03-09 | General parallel seam welding bonding fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219986634U true CN219986634U (en) | 2023-11-10 |
Family
ID=88614486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320433752.1U Active CN219986634U (en) | 2023-03-09 | 2023-03-09 | General parallel seam welding bonding fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219986634U (en) |
-
2023
- 2023-03-09 CN CN202320433752.1U patent/CN219986634U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |