CN219960963U - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
- Publication number
- CN219960963U CN219960963U CN202223560373.3U CN202223560373U CN219960963U CN 219960963 U CN219960963 U CN 219960963U CN 202223560373 U CN202223560373 U CN 202223560373U CN 219960963 U CN219960963 U CN 219960963U
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- sensor
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 claims abstract description 22
- 230000008569 process Effects 0.000 claims abstract description 22
- 238000005476 soldering Methods 0.000 claims description 15
- 238000003466 welding Methods 0.000 abstract description 11
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 238000009825 accumulation Methods 0.000 abstract description 4
- 230000009466 transformation Effects 0.000 abstract description 4
- 238000004870 electrical engineering Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The embodiment of the utility model provides electronic equipment, which is applied to the technical field of electrical engineering technology, and comprises: the sensor and the printed circuit board, the upper surface of printed circuit board is pasted and is had the insulating piece, and the sensor welds in printed circuit board, and the interval between the upper surface of sensor and the printed circuit board is greater than or equal to the thickness of insulating piece. In the embodiment of the utility model, the insulating sheet is stuck between the sensor and the printed circuit board, so that the lower bottom surface of the sensor is separated from the upper bottom surface of the printed circuit board, and the problem of short circuit caused by contact between the lower bottom surface of the sensor and the upper bottom surface of the printed circuit board due to solder accumulation in the welding process is avoided. Meanwhile, the printed circuit board does not need to be subjected to process transformation, so that the increase of the reject ratio of products due to the fact that the process requirements are not up to standard is reduced.
Description
Technical Field
The utility model relates to the technical field of electrical engineering, in particular to electronic equipment.
Background
In the technical field of electrotechnical welding, there are various welding modes aiming at the sensor, one is to bend and weld the pins of the passive infrared (Passive Infra Red, PIR for short) sensor by bending and manually welding; the other is that the PIR welding part is separated from the base part of the pin by more than 4mm, and the PIR sensor is lifted for wave soldering.
However, bending the PIR pins affects the shape of the PIR sensor itself, and wave soldering to raise the PIR sensor causes short circuits.
Disclosure of Invention
The embodiment of the utility model provides electronic equipment which is used for solving the problem of welding short circuit under the condition that the shape of a PIR sensor is not influenced.
In one aspect, an embodiment of the present utility model provides an electronic device, including:
the sensor comprises a sensor and a printed circuit board, wherein an insulating sheet is stuck to the upper surface of the printed circuit board, the sensor is welded to the printed circuit board, and the distance between the lower surface of the sensor and the upper surface of the printed circuit board is greater than or equal to the thickness of the insulating sheet.
In the embodiment of the utility model, the insulating sheet is stuck between the sensor and the printed circuit board, so that the lower bottom surface of the sensor is separated from the upper bottom surface of the printed circuit board, and the problem of short circuit caused by contact between the lower bottom surface of the sensor and the upper bottom surface of the printed circuit board due to solder accumulation in the welding process is avoided. Meanwhile, the printed circuit board does not need to be subjected to process transformation, so that the increase of the reject ratio of products due to the fact that the process requirements are not up to standard is reduced.
Optionally, the sensor is soldered to a through-hole in-line component on the printed circuit board, wherein the through-hole in-line component does not include a printed circuit board package.
In the embodiment of the utility model, the printed circuit board packaging design of the through hole direct-insertion type element on the printed circuit board is canceled, so that the size of the through hole direct-insertion type element is reduced, and the problem of welding short circuit of the sensor is further avoided.
Optionally, the printed circuit board is fabricated using a positive process.
Optionally, the sensor is a passive infrared sensor.
Optionally, the sensor is soldered to the printed circuit board by wave soldering.
In the embodiment of the utility model, the insulating sheet is stuck between the sensor and the printed circuit board, so that the lower bottom surface of the sensor is separated from the upper bottom surface of the printed circuit board, and the problem of short circuit caused by contact between the lower bottom surface of the sensor and the upper bottom surface of the printed circuit board due to solder accumulation in the welding process is avoided. Meanwhile, the printed circuit board does not need to be subjected to process transformation, so that the increase of the reject ratio of products due to the fact that the process requirements are not up to standard is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it will be apparent that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic device according to the present utility model;
fig. 2 is a printed circuit board provided by the utility model.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the present utility model will be described in further detail below with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1, a schematic structural diagram of an electronic device provided by the utility model includes a sensor 101 and a printed circuit board 102, an insulating sheet 103 is adhered to an upper surface of the printed circuit board 102, the sensor 101 is welded to the printed circuit board 102, and a distance between a lower surface of the sensor 101 and an upper surface of the printed circuit board 102 is equal to or greater than a thickness of the insulating sheet 103.
Specifically, the sensor 101 is soldered to the printed circuit board 102, and an insulating sheet 103 is attached to the upper surface of the printed circuit board 102 for separating the lower surface of the sensor 101 from the upper surface of the printed circuit board 102. In soldering the sensor 101, pins of the sensor 101 are first inserted onto the printed circuit board 102, and the sensor 101 is lightly pressed downward so that the sensor 101 stops just when it comes into contact with the insulating sheet 103 on the printed circuit board 102. The distance between the lower surface of the sensor 101 and the upper surface of the printed circuit board 102 is greater than or equal to the thickness of the insulating sheet 103 to prevent the insulating sheet 103 from being deformed due to too small a distance between the sensor 101 and the printed circuit board 102. Meanwhile, the height of the insulating spacer can be adjusted according to actual needs, and the utility model is not limited. The area of the insulating sheet 103 is adapted to the area of the lower bottom surface of the sensor 101.
In the embodiment of the utility model, the insulating sheet is stuck between the sensor and the printed circuit board, so that the lower bottom surface of the sensor is separated from the upper bottom surface of the printed circuit board, and the problem of short circuit caused by contact between the lower bottom surface of the sensor and the upper bottom surface of the printed circuit board due to solder accumulation in the welding process is avoided. Meanwhile, the printed circuit board does not need to be subjected to process transformation, so that the increase of the reject ratio of products due to the fact that the process requirements are not up to standard is reduced.
In some embodiments, the printed circuit board 102 is fabricated using a positive process.
Specifically, the printed circuit board (Printed Circuit Board, abbreviated as PCB) 102 is an important electronic component, is a support for electronic components, and is a carrier for electrically interconnecting the electronic components. It is called a "printed" circuit board because it is made using electronic printing. The positive process is normally copper-free, copper is reserved in the places where the wiring and the copper are laid in the positive process, copper is not reserved in the places where the wiring and the copper are not laid in the positive process, the positive process is positive logic, the error rate is low, and the positive process adopts the mode of adding dynamic copper, so that all design requirements can be basically met, and the PCB is designed by the positive process. The printed circuit board 102 is designed by using a positive process, and the designed line width and line spacing is greater than 0.1mm.
In some embodiments, sensor 101 may be a passive infrared sensor.
Specifically, PIR sensors are passive infrared sensors, and the term "passive" means that the sensor does not actively emit infrared signals, but rather passively detects infrared radiation from nearby objects, human bodies. Typically for detecting whether a person is moving within the infrared detection range. They are small in size, low in cost, low in power consumption, easy to use and will not wear.
In some embodiments, the sensor 101 is soldered to the printed circuit board 102 by wave soldering.
Specifically, wave soldering is to make the soldering surface of the printed circuit board 102 directly contact with high-temperature liquid tin to achieve the purpose of soldering, the high-temperature liquid tin keeps an inclined plane, and the liquid tin forms a wave-like phenomenon by a special device, so that the wave soldering is called wave soldering, and the main material is soldering tin bars.
In some embodiments, as shown in fig. 2, sensor 101 is soldered to through-hole in-line component 104 on printed circuit board 102, wherein through-hole in-line component 104 does not include a printed circuit board package.
Specifically, a through-hole in-line element (PTH) 104 is located on the printed circuit board 102, and the sensor 101 is connected to the printed circuit board 102 by soldering on the PTH 104. Wherein the PTH104 does not contain a printed circuit board package. In the embodiment of the present utility model, the printed circuit board package on the PTH104 is designed to be single-sided, the printed circuit board package on the upper surface of the printed circuit board 102 is removed, and the printed circuit board package on the lower surface of the printed circuit board 102 is left. During soldering, the printed circuit board 102 is placed in a solder bath, and solder is infiltrated upward through the underside of the printed circuit board 102, thereby effecting soldering of the sensor 101.
In the embodiment of the utility model, the printed circuit board packaging design of the through hole direct-insertion type element on the printed circuit board is canceled, so that the size of the through hole direct-insertion type element is reduced, and the problem of welding short circuit of the sensor is further avoided.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (5)
1. An electronic device, comprising:
the sensor comprises a sensor and a printed circuit board, wherein an insulating sheet is stuck on the upper surface of the printed circuit board and is used for separating the lower surface of the sensor from the upper surface of the printed circuit board;
the sensor is welded on the printed circuit board, and the distance between the lower surface of the sensor and the upper surface of the printed circuit board is larger than or equal to the thickness of the insulating sheet so as to prevent deformation of the insulating sheet caused by too small distance between the sensor and the printed circuit board.
2. The electronic device of claim 1, wherein the sensor is soldered to a through-hole in-line component on the printed circuit board, wherein the through-hole in-line component does not include a printed circuit board package.
3. The electronic device of claim 1, wherein the printed circuit board is fabricated using a positive process.
4. The electronic device of claim 1, wherein the sensor is a passive infrared sensor.
5. The electronic device of claim 1, wherein the sensor is soldered to the printed circuit board by wave soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223560373.3U CN219960963U (en) | 2022-12-30 | 2022-12-30 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223560373.3U CN219960963U (en) | 2022-12-30 | 2022-12-30 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219960963U true CN219960963U (en) | 2023-11-03 |
Family
ID=88535420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223560373.3U Active CN219960963U (en) | 2022-12-30 | 2022-12-30 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219960963U (en) |
-
2022
- 2022-12-30 CN CN202223560373.3U patent/CN219960963U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |