CN220325914U - Component welding and packaging device - Google Patents
Component welding and packaging device Download PDFInfo
- Publication number
- CN220325914U CN220325914U CN202321770392.0U CN202321770392U CN220325914U CN 220325914 U CN220325914 U CN 220325914U CN 202321770392 U CN202321770392 U CN 202321770392U CN 220325914 U CN220325914 U CN 220325914U
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- Prior art keywords
- bonding pad
- pin
- component
- packaging
- welding
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 32
- 238000003466 welding Methods 0.000 title claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 230000009471 action Effects 0.000 claims abstract description 4
- 238000007667 floating Methods 0.000 claims abstract description 3
- 238000007650 screen-printing Methods 0.000 claims abstract description 3
- 238000005476 soldering Methods 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a device for welding and packaging components, which is characterized by comprising a PCB, wherein the PCB comprises at least one packaging screen print determined according to the size of the components to be welded; a plurality of bonding pads are arranged in the packaging screen printing, and the position of each bonding pad corresponds to the position of one pin of the component to be welded; setting at least two bonding pads as small bonding pads, and setting the rest bonding pads as large bonding pads; the size of the small bonding pad is equivalent to that of the corresponding pin, and the pin floating above the tin liquid formed by the small bonding pad can only float in the tin liquid area formed by the small bonding pad under the action of the surface tension of the liquid when the solder paste is in a liquid state in the welding process, so that the welding positioning precision is improved; the size of the large bonding pad is larger than that of the corresponding pin, so that the large bonding pad and the corresponding pin are ensured to have enough contact area, and the welding firmness of the pin is enhanced. The utility model improves the welding positioning accuracy and the assembly stability of the high-integration component.
Description
Technical Field
The utility model belongs to the fields of electron electricians, electron science board manufacturing, electron science board welding and the like, and particularly relates to a device for welding and packaging components.
Background
Along with the development and application of electronic equipment and particle detection equipment, an electronic board processing technology with small precision, high integration level and high reliability has become a focus of leading-edge electronics development, wherein the technology can involve high integration level packaging, safe wiring, electromagnetic coupling, board welding and the like of chips, resistors and capacitors and connectors. Taking the connector as an example, the pin pitch has been extended from conventional 5.08mm, 3.96mm, 2.54mm, 2.0mm, 1.27mm to 0.4mm. Meanwhile, connectors for high frequency communication are often found in pin-intensive high-integration connectors.
Connectors are commonly connected wire to board, board to board. The high-integration connector with dense pins can greatly save the space of an electronic circuit board, but the bonding pad plate firmness is low because the size of the PCB packaging bonding pad of the connector is too small; because the connector pins and the PCB are packaged too densely, the problems of easy welding, low welding firmness and the like occur; meanwhile, because the single connector is small in size and high in assembly, the single-pin transfer is easy to shake, and the single-pin transfer is usually used in pairs, but in the assembly process of the pairs (A1-B1 and A2-B2), the welding precision of the connector 2A and the connector 2B is required to be very high, otherwise, the welding deviation of 0.2mm can lead to the problems that the connector 2A and the connector 2B cannot finish assembly or the assembly contact is unstable and the like. Although some high-integration connectors are provided with welding positioning pins, the positioning precision of the positioning pins is difficult to meet the positioning precision within 0.2mm, and meanwhile, the diameter of the positioning pins is more than or equal to 1mm, so that the positioning through holes of some PCB (printed circuit boards) are not allowed to be punched by the connectors when the high-integration connectors are used.
Disclosure of Invention
Aiming at the problems in the prior art, the utility model designs a component welding and packaging device which is used for improving the welding positioning accuracy and the assembly stability of components with high integration level (including but not limited to connectors).
The device for welding and packaging the components is characterized by comprising a PCB, wherein the PCB comprises at least one packaging screen print determined according to the size of the components to be welded; a plurality of bonding pads are arranged in the packaging silk screen, and the position of each bonding pad corresponds to the position of one pin of the component to be packaged;
setting at least two bonding pads as small bonding pads, and setting the rest bonding pads as large bonding pads;
the size of the small bonding pad is equivalent to that of the corresponding pin, and the small bonding pad is used for floating the pin above the tin liquid formed by the small bonding pad under the action of the surface tension of the liquid only in the tin liquid region formed by the small bonding pad when the soldering paste is heated to be liquid in the welding process, so that the welding positioning precision of the component is improved;
the size of the large bonding pad is larger than that of the corresponding pin, so that the large bonding pad and the corresponding pin are ensured to have enough contact area, and the welding firmness of the pin is enhanced.
Further, the bonding pad corresponding to the pin is determined to be a large bonding pad or a small bonding pad according to the importance degree of the pin.
Further, the small bonding pads are located at symmetrical positions in the packaging silk screen.
Further, two small bonding pads are respectively arranged at two opposite angles in the packaging silk screen.
Further, the positions of the PCB corresponding to the large bonding pads are provided with hole structures for improving the firmness of the corresponding large bonding pads.
Further, the hole structure is a half-through hole or a through hole.
Further, the outer diameter of the through hole is smaller than or equal to the large bonding pad; the through holes are round through holes or square through holes.
Further, the bonding pad is round, square, rectangular, elliptic or polygonal.
Further, the component is a multi-pin component.
Further, the component is a connector, a sensor or a chip.
The utility model has the following advantages:
the connector disclosed by the utility model improves the welding positioning accuracy and the assembly stability of high-integration components.
Drawings
Fig. 1 is a schematic structural view of a soldering and packaging device for a pair of fitting connectors.
Reference numerals: 1-small bonding pad, 2-large bonding pad, 3-assembly area of first component and 4-assembly area of second component.
Detailed Description
The utility model will now be described in further detail with reference to the accompanying drawings, which are given by way of illustration only and are not intended to limit the scope of the utility model.
The utility model designs the component package in a mode of matching the large and small bonding pads. The component welding and packaging device structure is shown in fig. 1, and comprises a PCB board, wherein the PCB board comprises packaging silk-screen printing determined according to the size of a component to be welded, namely an assembly area 3 of a first component and an assembly area 4 of a second component; a plurality of bonding pads are arranged in each packaging silk screen, and the position of each bonding pad corresponds to the position of one pin of the component to be packaged.
At least two bonding pads are arranged as small bonding pads, and the rest bonding pads are large bonding pads; and determining that the bonding pad corresponding to the pin is a large bonding pad or a small bonding pad according to the importance degree of the pin, and generally selecting the bonding pad corresponding to the pin with smaller importance degree as the small bonding pad.
The component may be a connector, a sensor, a chip or other multi-pin component, and the connector is described below as an example.
The large pads 2 ensure that the pads have sufficient contact area with the connector pins to enhance the solder integrity of the connector pins. The width and length of the small pad 1 are comparable to the width and length dimensions of the connector pin dimensions to achieve: in the high-temperature welding process, the solder paste is heated into liquid state, and pins which are "floated" above "tin liquid" formed by the small bonding pads 1 can only float in the narrow area corresponding to the small bonding pads 1 under the action of the surface tension of the liquid; because the size of the connector pins is equivalent to that of the small bonding pads 1, the random movement space of the corresponding pins of the connector is very narrow, so that the random movement of the connector pins in the up-down left-right direction is restrained, and the welding positioning precision of the connector is improved.
In the paired assembly packaging design, the small bonding pads 1 are deployed at the positions of the connector which are vertically and horizontally symmetrical, so that the small bonding pads 1 are prevented from restraining the connector from rotating on tin liquor formed by the large bonding pads 2 when randomly moving; further improving the welding positioning accuracy of the connector.
In the implementation process of the scheme of the utility model, part of the large bonding pad 2 is perforated (the large bonding pad 2 can be a half through hole or a through hole, the outer diameter of the through hole is smaller than or equal to that of the large bonding pad 2, and the through hole can be round, square or other shapes) so as to increase the manufacturing firmness of the large bonding pad 2;
in the implementation process of the scheme of the utility model, the shape of the bonding pad can be round, square, rectangle, polygon or other shapes.
In the implementation process of the scheme of the utility model, the hard suction nozzle is adopted to replace the soft suction nozzle so as to overcome the elastic inertia of the soft suction nozzle in the automatic high-speed paster process and improve the paster positioning precision of the connector.
Although specific embodiments of the utility model have been disclosed for illustrative purposes, it will be appreciated by those skilled in the art that the utility model may be implemented with the help of a variety of examples: various alternatives, variations and modifications are possible without departing from the spirit and scope of the utility model and the appended claims. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this utility model, but that the utility model will have the scope indicated by the scope of the appended claims.
Claims (10)
1. The device for welding and packaging the components is characterized by comprising a PCB, wherein the PCB comprises at least one packaging screen print determined according to the size of the components to be welded; a plurality of bonding pads are arranged in the packaging screen printing, and the position of each bonding pad corresponds to the position of one pin of the component to be welded;
setting at least two bonding pads as small bonding pads, and setting the rest bonding pads as large bonding pads;
the size of the small bonding pad is equivalent to that of the corresponding pin, and the small bonding pad is used for floating the pin above the tin liquid formed by the small bonding pad under the action of the surface tension of the liquid only in the tin liquid region formed by the small bonding pad when the soldering paste is heated to be liquid in the welding process, so that the welding positioning precision of the component is improved;
the size of the large bonding pad is larger than that of the corresponding pin, so that the large bonding pad and the corresponding pin are ensured to have enough contact area, and the welding firmness of the pin is enhanced.
2. The component soldering and packaging device according to claim 1, wherein the bonding pad corresponding to the pin is determined to be a large bonding pad or a small bonding pad according to the importance degree of the pin.
3. The component soldering packaging apparatus according to claim 1, wherein the pads are located at symmetrical positions within the packaging screen.
4. A device soldering and packaging apparatus according to claim 1, 2 or 3, wherein the two opposite corners of the package screen are respectively provided with a small bonding pad.
5. The component soldering and packaging device according to claim 1, 2 or 3, wherein the positions of the PCB corresponding to the plurality of large pads have a hole structure for increasing the firmness of the corresponding large pads.
6. The component soldering and packaging apparatus according to claim 5, wherein the hole structure is a half-through hole or a through hole.
7. The component soldering and packaging apparatus according to claim 6, wherein the through hole has an outer diameter smaller than or equal to the large pad; the through holes are round through holes or square through holes.
8. The component soldering and packaging apparatus according to claim 1, wherein the bonding pad is circular, square, rectangular, elliptical or polygonal.
9. The component soldering and packaging apparatus according to claim 1, wherein the component is a multi-pin component.
10. The component soldering and packaging apparatus according to claim 1 or 9, wherein the component is a connector, a sensor or a chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321770392.0U CN220325914U (en) | 2023-07-06 | 2023-07-06 | Component welding and packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321770392.0U CN220325914U (en) | 2023-07-06 | 2023-07-06 | Component welding and packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220325914U true CN220325914U (en) | 2024-01-09 |
Family
ID=89425830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321770392.0U Active CN220325914U (en) | 2023-07-06 | 2023-07-06 | Component welding and packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220325914U (en) |
-
2023
- 2023-07-06 CN CN202321770392.0U patent/CN220325914U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |