CN219957680U - Depth-variable chip placement seat and chip test system with same - Google Patents
Depth-variable chip placement seat and chip test system with same Download PDFInfo
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- CN219957680U CN219957680U CN202321523985.7U CN202321523985U CN219957680U CN 219957680 U CN219957680 U CN 219957680U CN 202321523985 U CN202321523985 U CN 202321523985U CN 219957680 U CN219957680 U CN 219957680U
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- floating plate
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- base
- hole
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- 238000012360 testing method Methods 0.000 title claims abstract description 47
- 230000007246 mechanism Effects 0.000 abstract description 4
- 238000001179 sorption measurement Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Abstract
The utility model provides a chip placing seat with variable depth and a chip testing system with the same, wherein the chip placing seat with variable depth comprises a base, a floating plate and a plurality of elastic resetting pieces; the base comprises a groove and a chip placing part, the floating plate is accommodated in the groove of the base and comprises a through hole, and the chip placing part is exposed from the through hole of the floating plate. The elastic resetting pieces are accommodated in the grooves of the base and drive the floating plate to be far away from the bottom surfaces of the grooves. Accordingly, the floating plate can be accommodated in the groove of the base under the action of external force or other external mechanisms, so that the depth of the chip placing seat is reduced; on the other hand, when the external force is removed or other external mechanisms are removed, the floating plate can restore to the original position, so that the depth of the chip placing seat is increased.
Description
Technical Field
The present utility model relates to a chip placement seat with variable depth and a chip testing system with the same, and more particularly to a device or apparatus for detecting or transferring chips.
Background
In general, a chip carrier is usually disposed in a chip inspection apparatus, for example, a chip transfer device (shift), which is mainly used for transferring chips from a feeding area to a testing area. In addition, a common chip inspection apparatus uses Pick & Place arms (Pick & Place) to load or unload chips from a chip mounting base, and uses a test head to adsorb chips for testing.
Fig. 1A is a schematic diagram of a conventional pick-and-place arm P for placing a chip C on a chip carrier S; as shown in the figure, if the depth of the chip slot S1 of the chip carrier S is insufficient, when the pick-and-place arm P throws down the chip C, the chip C is easily stuck on one side of the chip slot S1 and cannot slide into the chip slot S1 smoothly, so that the chip carrier S cannot load the chip C smoothly. At this time, the chip C is likely to slip around when the chip transfer device moves once.
Fig. 1B is a schematic diagram illustrating a conventional test head H sucking a chip C from a chip carrier S. On the other hand, if the depth of the chip groove S1 of the chip mounting seat S is too deep, the test head H may fail to adsorb the chip C. Further, as shown in the figure, since the depth of the chip slot S1 is too deep, when the test head H adsorbs the chip C, the chip C may laterally move, which may result in the chip C not being fully aligned with the adsorption slot H1 of the test head H, and an air gap is formed, thereby causing adsorption failure.
Disclosure of Invention
In view of the above, the present utility model provides a chip placement base with variable depth and a chip testing system with the same, wherein the depth for accommodating chips can be changed according to different pick-and-place requirements, so as to solve the above-mentioned problems.
The utility model provides a variable-depth chip placement seat, which comprises a base, a floating plate and at least one elastic reset piece. The base comprises a groove and a chip placing part, and the chip placing part is positioned in the groove. The floating plate is accommodated in the groove of the base, and comprises a through hole, and the chip placing part is exposed from the through hole of the floating plate. At least one elastic reset piece is accommodated in the groove of the base and drives the floating plate to be far away from the bottom surface of the groove.
In an embodiment of the utility model, the recess includes a boss protruding from a bottom surface of the recess; the chip placement part is arranged on the boss.
In an embodiment of the utility model, the chip placement portion includes a rectangular ring frame, and a chip accommodating groove is defined inside the rectangular ring frame; the rectangular ring frame is accommodated in the through hole of the floating plate.
In an embodiment of the utility model, the through hole of the floating plate includes a diverging portion and a vertical portion along an axial direction; when the at least one elastic reset piece drives the floating plate to be far away from the bottom surface of the groove, the divergent part and the vertical part are positioned above the outer side of the rectangular ring frame; when the floating plate is clung to the bottom surface of the groove, the diverging part is positioned above the outer side of the rectangular ring frame.
In an embodiment of the utility model, the boss includes a positioning pin, the floating plate includes a positioning hole, and the positioning hole of the floating plate is sleeved on the positioning pin of the boss.
In an embodiment of the utility model, the chip holder further includes a plurality of locking parts, each locking part including a head and a rod; the base is provided with a plurality of locking holes which are annularly arranged on the periphery of the groove; the side end edge of the floating plate comprises a plurality of movable grooves which correspond to the locking holes respectively; the rod bodies of the locking accessories are respectively locked in the locking holes, and at least parts of the heads of the locking accessories are respectively accommodated in the movable grooves of the floating plate.
In an embodiment of the utility model, the chip placement portion includes a negative pressure adsorption hole located in the chip placement portion.
The chip testing system with the variable-depth chip placing seat comprises a feeding area, a testing area, a movable carrier and at least one variable-depth chip placing seat, wherein the movable carrier can be selectively moved between the feeding area and the testing area. The variable-depth chip placing seat is arranged on the movable carrier and comprises a base, a floating plate and at least one elastic resetting piece. The base comprises a groove and a chip placing part, and the chip placing part is positioned in the groove. The floating plate is accommodated in the groove of the base, and comprises a through hole, and the chip placing part is exposed from the through hole of the floating plate. At least one elastic reset piece is accommodated in the groove of the base and drives the floating plate to be far away from the bottom surface of the groove.
In an embodiment of the above-mentioned chip testing system of the present utility model, the chip testing system further includes a lifting testing head disposed in the testing area, and a lower surface of the lifting testing head includes at least one frame-shaped suction device for sucking at least one chip.
In an embodiment of the above-mentioned chip testing system of the present utility model, the chip placement portion includes a negative pressure adsorption hole located in the chip placement portion.
In summary, according to the variable depth chip placement base and the chip testing system with the same according to some embodiments, the depth of the chip placement base can be controlled by lifting the floating plate. Further, in some embodiments of the present utility model, the floating plate can be accommodated in the groove of the base under the action of external force or other external mechanisms, so as to reduce the depth of the chip placement seat; on the other hand, when the external force is removed or other external mechanisms are removed, the floating plate can restore to the original position, so that the depth of the chip placing seat is increased.
Drawings
Fig. 1A is a schematic diagram of a conventional pick-and-place arm for placing a chip on a chip carrier.
FIG. 1B is a schematic diagram of a conventional test head sucking a chip from a chip carrier.
Fig. 2 is a perspective view of an embodiment of a variable depth chip placement base according to the present utility model.
FIG. 3 is an exploded view of one embodiment of a variable depth chip placement base of the present utility model.
Fig. 4A is a cross-sectional view of one embodiment of a variable depth die pad of the present utility model.
Fig. 4B is a cross-sectional view of an embodiment of the variable depth chip placement base of the present utility model, which shows the floating plate when it is pressed down by an external force.
FIG. 5 is a schematic diagram of an embodiment of a chip testing system according to the present utility model.
Wherein, the reference numerals:
1, chip placing seat with variable depth
2 base
3 Floating plate
4 locking accessory
5 moving carrier
6 lifting test head
7 elastic restoring piece
21 groove
22 chip placement part
23 locking hole
31 through hole
32 positioning hole
33 movable groove
41 head part
42 rod body
61 frame-shaped suction device
210 groove bottom surface
211 boss
221 rectangular ring frame
222 chip container
223 positioning pin
224 negative pressure adsorption hole
311 gradually expanding part
312 vertical part
C chip
D1 maximum depth
D2 minimum depth
H: test head
H1 adsorption tank
P, picking and placing arm
S-chip mounting seat
S1 chip groove
VS negative pressure source
Zp feed zone
Zt test zone
Detailed Description
Referring to fig. 2 and 3, fig. 2 is a perspective view of an embodiment of the variable depth chip holder 1 according to the present utility model, and fig. 3 is an exploded view of an embodiment of the variable depth chip holder 1 according to the present utility model. As shown in the drawings, the variable depth chip placement seat 1 according to an embodiment of the present utility model includes a base 2, a floating plate 3, eight elastic restoring members 7, and eight locking attachments 4. The base 2 is provided with a groove 21 and a chip placing part 22, and the groove 21 comprises a boss 211 which protrudes from the bottom surface 210 of the groove; the chip placement portion 22 is disposed on the boss 211. In addition, the chip placement portion 22 includes a rectangular ring frame 221, the inner side of which defines a chip accommodating groove 222, and a negative pressure adsorption hole 224 is further formed in the center of the chip accommodating groove 222, which can be connected to a negative pressure source VS (see fig. 5). The negative pressure source VS may be a factory shared negative pressure source or a vacuum pump.
Additionally, please refer to fig. 4A, which is a cross-sectional view of an embodiment of the variable depth chip holder 1 according to the present utility model; the floating plate 3 is accommodated in the recess 21 of the base 2, the floating plate 3 includes a through hole 31, and the chip placement portion 22 is exposed from the through hole 31 of the floating plate 3 in a top view of the front projection of the variable depth chip placement base 1, that is, the rectangular ring frame 221 of the chip placement portion 22 is accommodated in the through hole 31 of the floating plate 3. The through hole 31 of the floating plate 3 includes a divergent portion 311 and a vertical portion 312 along an axial direction (vertical axial direction), and the divergent portion 311 is divergent toward the upper surface of the floating plate 3.
Furthermore, in the embodiment of the present utility model, the elastic restoring element 7 is a compression spring, and the elastic restoring element 7 is accommodated in the groove 21 of the base 2, wherein a pair of elastic restoring elements 7 are respectively disposed at four corners of the groove 21. In other words, the elastic restoring member 7 is interposed between the bottom surface 210 of the groove 21 and the floating plate 3, and is used for driving the floating plate 3 away from the bottom surface 210 of the groove 21.
In addition, referring to fig. 2 and 3, the boss 211 is provided with a positioning pin 223, and the floating plate 3 is provided with a positioning hole 32. When the floating plate 3 is accommodated in the groove 21, the positioning pin 223 of the boss 211 is sleeved with the positioning hole 32 of the floating plate 3, so that the floating plate 3 can be vertically lifted, and the transverse displacement and dislocation of the floating plate 3 are avoided.
In one embodiment of the present utility model, the locking member 4 is a screw, which includes a head 41 and a rod 42. In addition, the base 2 is provided with eight locking holes 23, and the side edge of the floating plate 3 also comprises eight semicircular movable grooves 33; and eight locking holes 23 and eight movable grooves 33 are equidistantly formed around the outer circumferences of the groove 21 and the floating plate 3, respectively. Furthermore, the rod bodies 42 of the eight locking attachments 4 are respectively locked in the eight locking holes 23, and part of the head 41 of the locking attachment 4 is accommodated in the movable groove 33 of the floating plate 3. Accordingly, the head 41 of the locking member 4 is engaged with the bottom surface of the movable groove 33, thereby making it possible to form the top dead center of the lifting displacement of the floating plate 3 and to prevent the floating plate 3 from being separated from the base 2.
Referring to fig. 4A and 4B together, fig. 4B is a cross-sectional view of an embodiment of the variable depth chip holder 1 according to the present utility model, which shows a state when the floating plate 3 is pressed by an external force. In one embodiment of the present utility model, when the floating plate 3 is not under normal condition of pressing down, i.e. as shown in fig. 4A, the elastic restoring member 7 drives the floating plate 3 away from the bottom surface 210 of the recess 21, and the diverging portion 311 and the vertical portion 312 of the through hole 31 of the floating plate 3 are located above the outer side of the rectangular ring frame 221, so that the overall depth of the seat presents the maximum depth D1.
On the other hand, as shown in fig. 4B, when the floating plate 3 is pressed down by an external force enough to overcome the elastic force of all the elastic restoring members 7, the floating plate 3 moves down, and the lower surface of the floating plate 3 is closely attached to the bottom surface 210 of the groove 21, only the diverging portion 311 is located above the outer side of the rectangular ring frame 221, and the vertical portion 312 is already sunk below the outer upper edge of the rectangular ring frame 221, so that the overall depth of the placement seat presents the minimum depth D2. It should be noted that, in other embodiments of the present utility model, the overall depth of the placement seat can also be controlled by controlling the magnitude of the external force pressing down on the floating plate 3; that is, the depth is not limited to the maximum depth D1 and the minimum depth D2, and other depths therebetween may be realized by controlling the lowering displacement amount of the floating plate 3.
FIG. 5 is a schematic diagram of a chip test system according to an embodiment of the utility model; an embodiment of the chip testing system of the present utility model includes a feeding zone Zp, a testing zone Zt, and a moving carrier 5, and two chip placement seats 1 with variable depths are disposed on the moving carrier 5. Wherein, a pick-and-place arm P is disposed in the feeding zone Zp for transferring the chips C from a chip tray (not shown) to the variable-depth chip placement base 1 on the moving carrier 5, and when all the variable-depth chip placement bases 1 on the moving carrier 5 are loaded with chips C, the moving carrier 5 will move into the testing zone Zt.
Further, in the process of carrying the chip C by the pick-and-place arm P, the variable-depth chip-placing seat 1 maintains the maximum depth D1, see fig. 4A; at this time, during the process of throwing the chip C by the pick-and-place arm P, the chip C will smoothly slide down and be fixed in the chip accommodating groove 222 because the chip accommodating groove 222 has a sufficient depth. In addition, when the chip C is fixed in the chip accommodating groove 222, the negative pressure suction hole 224 in the center of the chip accommodating groove 222 will start negative pressure to suck the chip C. Therefore, the chip C is firmly accommodated in the chip accommodating groove 222 during the moving process of the moving carrier 5.
Furthermore, in one embodiment of the present utility model, a lifting test head 6 is disposed in the test zone Zt, which can lift and move to test the chip C. The lower surface of the lifting test head 6 of the present embodiment includes two frame-shaped suction devices 61 for sucking the chip C in the chip placement base 1 with variable depth, and the outer ring frame of the frame-shaped suction devices 61 can just abut against the outer circumference of the chip C.
Referring to fig. 4B and fig. 5, in one embodiment of the present utility model, when the lifting test head 6 is to test the chip C on the moving carrier 5, the lifting test head 6 descends first, and applies a force to press the floating plate 3 downward, so that the floating plate 3 descends until the lower surface of the floating plate 3 is closely attached to the bottom surface 210 of the groove 21. At this time, the depth of the chip placement seat 1 with variable depth will be changed to the minimum depth D2, that is, the frame-shaped suction device 61 on the lower surface of the lifting test head 6 will easily suck the chip C from the chip accommodating groove 222, and the chip C will not be laterally moved or bent due to the small displacement amount of the chip C during the sucking process, so that the frame-shaped suction device 61 can suck the chip C smoothly and stably.
In summary, the embodiment of the utility model can provide chip accommodating grooves with different depths according to different picking and placing requirements; for example, when the chip is placed in the chip placement seat, a pattern with relatively deeper depth can be provided, so that the chip can smoothly slide into the chip accommodating groove, and the situation that the chip is shifted or even falls down due to the fact that the chip is not placed in the chip placement seat can be avoided; on the other hand, when the chip is taken out from the chip placing seat, the mode with relatively shallow depth can be provided, so that the whole sucking process is smooth and stable, and the situation of chip transverse movement or bending does not occur.
Although the present utility model has been described with reference to the above embodiments, it should be understood that the utility model is not limited thereto, but rather is capable of modification and variation without departing from the spirit and scope of the present utility model.
Claims (10)
1. A variable depth chip placement seat, comprising:
the base comprises a groove and a chip placing part, and the chip placing part is positioned in the groove;
a floating plate which is accommodated in the groove of the base and comprises a through hole, wherein the chip placing part is exposed out of the through hole of the floating plate; and
at least one elastic reset piece which is accommodated in the groove of the base and drives the floating plate to be far away from a groove bottom surface of the groove.
2. The variable depth die holder according to claim 1, wherein the recess comprises a boss protruding from a bottom surface of the recess; the chip placement part is arranged on the boss.
3. The variable depth die holder according to claim 2, wherein the die holder comprises a rectangular ring frame defining a die pocket inside; the rectangular ring frame is accommodated in the through hole of the floating plate.
4. The variable depth die holder according to claim 3, wherein the through hole of the floating plate comprises a diverging portion and a vertical portion along an axial direction; when the at least one elastic reset piece drives the floating plate to be far away from the bottom surface of the groove, the divergent part and the vertical part are positioned above the outer side of the rectangular ring frame; when the floating plate is clung to the bottom surface of the groove, the diverging part is positioned above the outer side of the rectangular ring frame.
5. The variable depth chip placement holder according to claim 2, wherein the boss comprises a positioning pin, the floating plate comprises a positioning hole, and the positioning hole of the floating plate is sleeved on the positioning pin of the boss.
6. The variable depth chip placement holder according to claim 1, further comprising a plurality of locking attachments, each locking attachment comprising a head and a stem; the base is provided with a plurality of locking holes which are annularly arranged on the periphery of the groove; the side end edge of the floating plate comprises a plurality of movable grooves which correspond to the locking holes respectively; the rod bodies of the locking accessories are respectively locked in the locking holes, and at least parts of the heads of the locking accessories are respectively accommodated in the movable grooves of the floating plate.
7. The variable depth die pad of claim 1, wherein the die pad includes a negative pressure suction hole located in the die pad.
8. A chip testing system having a variable depth chip placement base, comprising:
a feed zone;
a test area;
a moving carrier selectively movable between the feeding zone and the testing zone; and
at least one variable depth chip placement base disposed on the mobile carrier, the variable depth chip placement base comprising:
the base comprises a groove and a chip placing part, and the chip placing part is positioned in the groove;
a floating plate which is accommodated in the groove of the base and comprises a through hole, wherein the chip placing part is exposed out of the through hole of the floating plate; and
at least one elastic reset piece which is accommodated in the groove of the base and drives the floating plate to be far away from a groove bottom surface of the groove.
9. The chip testing system of claim 8, further comprising a lift test head disposed in the test zone, a lower surface of the lift test head including at least one frame-shaped suction for sucking at least one chip.
10. The chip testing system of claim 9, wherein the chip placement portion includes a negative pressure suction hole located in the chip placement portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321523985.7U CN219957680U (en) | 2023-06-15 | 2023-06-15 | Depth-variable chip placement seat and chip test system with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321523985.7U CN219957680U (en) | 2023-06-15 | 2023-06-15 | Depth-variable chip placement seat and chip test system with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219957680U true CN219957680U (en) | 2023-11-03 |
Family
ID=88552593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321523985.7U Active CN219957680U (en) | 2023-06-15 | 2023-06-15 | Depth-variable chip placement seat and chip test system with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219957680U (en) |
-
2023
- 2023-06-15 CN CN202321523985.7U patent/CN219957680U/en active Active
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