CN219937027U

CN219937027U - Semiconductor panel processing positioning mechanism

Info

Publication number: CN219937027U
Application number: CN202320646500.7U
Authority: CN
Inventors: 李华香
Original assignee: Suzhou Riyou Electronics Co ltd
Current assignee: Suzhou Riyou Electronics Co ltd
Priority date: 2023-03-29
Filing date: 2023-03-29
Publication date: 2023-10-31
Anticipated expiration: 2033-03-29

Abstract

The utility model relates to a semiconductor plate processing and positioning mechanism, which comprises a wafer carrying platform, wherein an axle center hole is formed in the wafer carrying platform, a plurality of abutting rings are further arranged on the wafer carrying platform, the abutting rings are concentrically arranged, the axle center hole is formed in the centers of the abutting rings, the abutting rings are convexly arranged, and gaps are formed between the adjacent abutting rings; the wafer carrying platform is provided with the abutting ring, so that the contact between the wafer and the carrying platform in a large area can be reduced, whether the wafer is positioned at the center position or not can be judged according to the abutting ring, and the negative pressure adsorption device can be arranged at the axle center hole, so that the wafer can be better fixed on the carrying platform, and falling is avoided.

Description

Semiconductor panel processing positioning mechanism

Technical Field

The present disclosure relates to semiconductor processing devices, and particularly to a positioning mechanism for processing semiconductor boards.

Background

Semiconductors refer to materials with conductivity between conductors and insulators at normal temperature, and are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, and other fields, for example, circuit board chips are devices made of semiconductors.

If the wafer on the slide holder shakes in the transmission process, the wafer is easy to crack, and in the subsequent process of the integrated circuit, the photoetching effect on the surface of the wafer is seriously affected by the wafer crack or pollution, so that the wafer yield is reduced, and the production cost is increased.

Disclosure of Invention

The utility model aims to provide a semiconductor board processing and positioning mechanism.

The technical aim of the utility model is realized by the following technical scheme: the utility model provides a semiconductor panel processing positioning mechanism, includes the wafer slide holder, be provided with the axle center hole on the wafer slide holder, still be provided with a plurality of butt rings on the wafer slide holder, a plurality of butt ring concentricity sets up, the axle center hole sets up a plurality of butt ring centers, the protruding setting of butt ring forms the gap between adjacent on the butt ring.

Through adopting above-mentioned technical scheme, set up the butt ring on the wafer slide glass platform, firstly can reduce the contact of wafer and slide glass platform large tracts of land, secondly can judge whether the wafer is located central point department according to the butt ring, secondly can set up negative pressure adsorption equipment in axle center hole department to make the wafer can be better fix on the slide glass platform, avoid droing, thereby effectively solve the technical problem among the background art.

Preferably, the device further comprises an abutting ball clamped in the gap, and the abutting ball is detachably arranged in the gap.

Through adopting above-mentioned technical scheme, set up in the gap butt ball and play certain blocking protection effect to the wafer, when the wafer produced the trend that outwards drops, the butt ball played good guard action.

Preferably, the abutting balls are provided with at least two groups, and the surfaces of the abutting balls are provided with flexible protective layers.

By adopting the technical scheme, the flexible protective layer adopts the rubber layer, so that the damage to the wafer caused by the collision between the flexible protective layer and the wafer is avoided, and the abutting ball is prevented from falling off from the gap.

Preferably, a plurality of air holes are arranged in the gap.

By adopting the technical scheme, the negative pressure adsorption device can be arranged at the air hole.

Preferably, the device further comprises a supporting rod which is arranged in the axle center hole in a disassembling mode, and a fixed sucker is arranged at the end portion of the supporting rod.

Preferably, the abutting rod comprises an abutting sleeve and a fixing rod, and the fixing sucker is arranged on the fixing rod.

Preferably, the abutting sleeve is coaxially sleeved with the fixing rod, the abutting sleeve is provided with an abutting disc in an extending mode, and the elastic device is arranged between the abutting disc and the fixing sucker.

Preferably, the abutment ball surface is disposed higher than the abutment ring.

In summary, the utility model has the following beneficial effects:

1. the wafer carrying platform is provided with the abutting ring, so that the contact between the wafer and the carrying platform in a large area can be reduced, whether the wafer is positioned at the center position or not can be judged according to the abutting ring, and the negative pressure adsorption device can be arranged at the axle center hole, so that the wafer can be better fixed on the carrying platform, and falling is avoided.

Drawings

FIG. 1 is a schematic view of a part of the structure of an embodiment;

FIG. 2 is a cross-sectional view of the overall structure in an embodiment;

FIG. 3 is an enlarged schematic view of the portion A of FIG. 2;

fig. 4 is a partial structural sectional view of the embodiment.

In the figure, 1, a wafer carrying platform; 11. an axial hole; 111. a butt joint rod; 112. fixing a sucker; 113. abutting the sleeve; 114. a fixed rod; 115. an abutment plate; 12. an abutment ring; 121. a slit; 122. abutting the ball; 123. a flexible protective layer; 124. and (5) air holes.

Detailed Description

The present utility model will be described in further detail with reference to the accompanying drawings.

The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and modifications to the present embodiment, which may not creatively contribute to the present utility model as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present utility model.

Examples:

the utility model provides a semiconductor panel processing positioning mechanism, as shown in fig. 1, 2, includes wafer slide holder 1, be provided with axle center hole 11 on the wafer slide holder 1, still be provided with a plurality of butt rings 12 on the wafer slide holder 1, a plurality of butt rings 12 concentricity sets up, axle center hole 11 sets up a plurality of butt rings 12 centers, the protruding setting of butt ring 12, adjacent form gap 121 between on the butt ring 12.

As shown in fig. 2, the device further comprises an abutting ball 122 clamped in the gap 121, and the abutting ball 122 is detachably arranged in the gap 121.

As shown in fig. 4, the abutment balls 122 are provided with at least two groups, the surface of the abutment ball 122 is provided with a flexible protection layer 123, the flexible protection layer 123 adopts a rubber layer, so that the rigidity of the flexible protection layer is prevented from being too high, the wafer is prevented from being damaged after the flexible protection layer collides with the wafer, and the abutment ball 122 is prevented from falling off from the gap 121.

As shown in fig. 1, a plurality of air holes 124 are provided in the slit.

As shown in fig. 2 and 3, the detachable shaft center hole 11 further comprises a supporting rod 111 arranged in the shaft center hole 11, a fixed sucker 112 is arranged at the end part of the supporting rod 111, and the fixed sucker 112 is in the prior art.

As shown in fig. 2 and 3, the abutting rod 111 includes an abutting sleeve 113 and a fixing rod 114, and the fixing suction cup 112 is disposed on the fixing rod 114.

As shown in fig. 2 and 3, the abutment sleeve 113 is coaxially sleeved with the fixing rod 114, the abutment sleeve 113 is provided with an abutment disc 115 in an extending manner, and the abutment sleeve further comprises an elastic device arranged between the abutment disc 115 and the fixing suction disc 112, and the elastic device can adopt a spring.

As shown in fig. 2, the surface of the contact ball 122 is higher than the contact ring 12, the wafer placed on the carrier is adsorbed and fixed by the fixing chuck 112, and the elastic device plays a role in buffering and damping.

Working principle:

the wafer carrying platform is provided with the abutting ring, so that the contact between the wafer and the carrying platform in a large area can be reduced, whether the wafer is positioned at the center position or not can be judged according to the abutting ring, and the negative pressure adsorption device can be arranged at the axle center hole, so that the wafer can be better fixed on the carrying platform and prevented from falling off; when the wafer is placed on the slide glass, the wafer is adsorbed and fixed by the fixed sucker 112 arranged at the central position, so that the wafer is prevented from falling off in the transportation process; when the movement trend of outwards shifting is generated in the transportation process, the abutting ball clamped in the gap can play a good role in protecting, and the falling probability of the abutting ball is reduced as much as possible.

Claims

1. The utility model provides a semiconductor panel processing positioning mechanism, includes wafer slide holder (1), its characterized in that: the wafer carrying platform (1) is provided with an axle center hole (11), the wafer carrying platform (1) is also provided with a plurality of abutting rings (12), a plurality of the abutting rings (12) are concentrically arranged, the axle center hole (11) is arranged at the centers of the abutting rings (12), the abutting rings (12) are convexly arranged, and gaps (121) are formed between the abutting rings (12) adjacently.

2. The semiconductor board processing positioning mechanism according to claim 1, wherein: the device further comprises an abutting ball (122) clamped in the gap (121), and the abutting ball (122) is detachably arranged in the gap (121).

3. A semiconductor board processing positioning mechanism according to claim 2, wherein: the abutting balls (122) are provided with at least two groups, and the surfaces of the abutting balls (122) are provided with flexible protective layers (123).

4. A semiconductor board processing positioning mechanism according to claim 3, wherein: a plurality of air holes (124) are arranged in the gap.

5. The semiconductor board processing positioning mechanism according to claim 4, wherein: the device further comprises a supporting rod (111) arranged in the shaft center hole (11) in a disassembling mode, and a fixed sucker (112) is arranged at the end portion of the supporting rod (111).

6. The semiconductor board processing positioning mechanism according to claim 5, wherein: the abutting rod (111) comprises an abutting sleeve (113) and a fixing rod (114), and the fixing sucker (112) is arranged on the fixing rod (114).

7. The semiconductor board processing positioning mechanism according to claim 6, wherein: the abutting sleeve (113) is coaxially sleeved with the fixing rod (114), an abutting disc (115) is arranged on the abutting sleeve (113) in an extending mode, and the elastic device is arranged between the abutting disc (115) and the fixing sucker (112).

8. The semiconductor board processing positioning mechanism of claim 7, wherein: the surface of the abutting ball (122) is higher than the abutting ring (12).