CN219917151U - Radiator, power device assembly and household appliance - Google Patents

Abstract

The utility model discloses a radiator, a power device assembly and a household appliance, wherein the power device assembly is provided with a substrate, the substrate is provided with a first surface and a second surface which are arranged in a back-to-back way, the first surface is used for installing a power device, the second surface is provided with a jack penetrating to the first surface, the radiator comprises a radiator body and an inserting piece, and the radiator body is arranged on the second surface of the substrate; one end of the plug connector is connected to the radiator body, the other end of the plug connector is used for penetrating through the jack and bending to be attached to the first surface of the substrate, and one end of the plug connector, located on the first surface, is used for being in heat conduction contact with the power device. The technical scheme of the utility model can reduce the risk that the radiator is easy to fall off.

Description

Radiator, power device assembly and household appliance

Technical Field

The utility model relates to the technical field of household appliances, in particular to a radiator, a power device assembly and a household appliance.

Background

At present, in an electric control driving power device, a mode of adding an additional radiator is generally adopted for radiating the power device so as to ensure that the power device can work in a lower temperature range and ensure the reliability of operation.

In the related art, for the plug-in type power device, the power device is fixed on the radiator through the screw first, then the radiator with the power device is adhered on the substrate through glue, and in the working process, the radiator can absorb heat on the power device, and the heat can be transferred to the glue, so that the radiator is easy to fall off.

Disclosure of Invention

The utility model mainly aims to provide a radiator, a power device assembly and a household appliance, and aims to reduce the risk that the radiator is easy to fall off.

In order to achieve the above object, the present utility model provides a heat sink applied to a power device assembly, the power device assembly having a substrate, the substrate having a first surface and a second surface disposed opposite to each other, the first surface being for mounting a power device, the second surface having a socket penetrating to the first surface, the heat sink comprising:

the radiator body is arranged on the second surface of the substrate;

the plug connector, the one end of plug connector connect in the radiator body, the other end of plug connector is used for wearing to establish the jack and bend in order with the laminating of the first surface of base plate, just the plug connector is located the one end of first surface is used for with power device heat conduction contact.

In one embodiment of the utility model, the plug comprises:

one end of the first connecting section is connected with the radiator body;

one end of the bending section is connected with the first connecting section and one end far away from the radiator body, and the other end of the bending section is used for penetrating through the jack;

the heat conduction section is connected to one end, far away from the first connection section, of the bending section, and the heat conduction section and the radiator body are oppositely arranged.

In an embodiment of the utility model, the radiator body has a first plate surface facing the substrate and a connection side disposed adjacent to the first plate surface, and one end of the first connection section is connected to the connection side.

In an embodiment of the utility model, the second surface has two insertion holes, the two connectors are arranged at intervals along the extending direction of the connecting side edge, and the bending section of each connector is used for penetrating through one insertion hole so that the power device is located between the two heat conducting sections.

In an embodiment of the utility model, a limiting boss is disposed on a peripheral wall of the heat conducting section, and the limiting boss is used for abutting against the first surface.

In one embodiment of the present utility model, the heat sink body includes:

the heat dissipation main body is connected with the plug connector and provided with a first plate surface facing the substrate;

the first bending part is connected to the first plate surface and is abutted against the second surface.

In an embodiment of the utility model, the heat dissipating body further has a second plate surface opposite to the first plate surface, and the heat dissipating body further includes a second bending portion, wherein the second bending portion is connected to the second plate surface, and a bending direction of the first bending portion is opposite to a bending direction of the second bending portion.

In an embodiment of the present utility model, the heat dissipation main body includes at least two heat dissipation sections disposed at intervals, two adjacent heat dissipation sections are connected through a second connection section, and two ends of the heat dissipation section are respectively connected with the first bending portion and the second bending portion; the plug connector is connected with one of the heat dissipation sections.

In an embodiment of the present utility model, in two adjacent heat dissipation sections, a first bending portion on one of the heat dissipation sections and a second bending portion on the other heat dissipation section are close to each other.

The utility model also provides a power device assembly, comprising:

the device comprises a substrate, a first substrate and a second substrate, wherein the substrate is provided with a first surface and a second surface which are arranged in a back-to-back mode, and the second surface is provided with a jack penetrating to the first surface;

the power device is arranged on the first surface;

the radiator body of the radiator is arranged on the second surface and is opposite to the power device, the plug connector of the radiator penetrates through the jack and is bent to be attached to the first surface of the substrate, and one end of the plug connector, which is located on the first surface, is in heat conduction contact with the power device.

The utility model also proposes a household appliance comprising a radiator as described above, or comprising a power device assembly as described above.

In the radiator provided by the utility model, when the power device is required to radiate, the radiator can be directly inserted into the jack of the substrate through the plug connector, and one end of the plug connector, which is far away from the radiator body, is bent to be attached to the first surface of the substrate, so that one end of the plug connector, which is positioned on the first surface, is in heat conduction contact with the power device arranged on the first surface, and meanwhile, the radiator body of the radiator is fixed on the second surface of the substrate, so that heat generated by the power device in the working process can be transmitted to the radiator body through the plug connector, and the power device can be effectively radiated through the radiator body. Therefore, the radiator is fixed on the substrate in a mode of splicing instead of a mode of glue adhesion, so that the risk that the radiator easily falls off can be effectively reduced.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a heat sink according to an embodiment of the present utility model before assembly;

FIG. 2 is a front view of an embodiment of a heat sink of the present utility model prior to assembly;

FIG. 3 is a top view of an embodiment of a heat sink of the present utility model prior to assembly;

FIG. 4 is a schematic diagram of an assembled heat sink according to an embodiment of the present utility model;

fig. 5 is a side view of an embodiment of a power device assembly of the present utility model after assembly;

fig. 6 is a rear view of an embodiment of the power device assembly of the present utility model after assembly.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				1000	Power device assembly	20	Plug-in connector
100	Radiator	21	First connecting section
				10	Radiator body	22	Bending section
10a	First panel	23	Heat conduction section
				10b	Connecting side edge	231	Spacing boss
10c	Second panel	200	Substrate board
				11	Heat dissipation main body	20a	A first surface
111	Heat dissipation section	20b	A second surface
				112	Second connecting section	20c	Jack (Jack)
12	First bending part	300	Power device
				13	Second bending part

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present utility model, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The utility model provides a radiator 100, a power device assembly 1000 and a household appliance, and aims to reduce the risk that the radiator 100 is easy to fall off.

The specific structure of the radiator 100, the power device assembly 1000, and the home appliance of the present utility model will be described as follows:

referring to fig. 1 to 6 in combination, in an embodiment of the heat spreader 100 of the present utility model, the heat spreader 100 is applied to a power device assembly 1000, the power device assembly 1000 has a substrate 200, the substrate 200 has a first surface 20a and a second surface 20b disposed opposite to each other, the first surface 20a is used for mounting a power device 300, and the second surface 20b has a receptacle 20c penetrating to the first surface 20a; the heat sink 100 includes a heat sink body 10 and a plug 20; the heat sink body 10 is disposed on the second surface 20b of the substrate 200; one end of the plug 20 is connected to the radiator body 10, the other end of the plug 20 is used for penetrating through the jack 20c and bending to be attached to the first surface 20a of the substrate 200, and the plug 20 is located at one end of the first surface 20a and is used for thermally contacting with the power device 300.

It can be appreciated that, in the heat sink 100 according to the present utility model, when the heat dissipation needs to be performed on the power device 300, the heat sink 100 can be directly inserted into the insertion hole 20c of the substrate 200 through the plug 20, and one end of the plug 20 away from the heat sink body 10 is bent to be attached to the first surface 20a of the substrate 200, so that one end of the plug 20 located on the first surface 20a is in heat conduction contact with the power device 300 mounted on the first surface 20a, and meanwhile, the heat sink body 10 of the heat sink 100 is fixed on the second surface 20b of the substrate 200, so that heat generated during the operation of the power device 300 can be conducted to the heat sink body 10 through the plug 20, so that the heat dissipation of the power device 300 is effectively performed through the heat sink body 10. Therefore, the heat sink 100 is fixed on the substrate 200 by adopting the plugging manner instead of the glue bonding manner, so that the risk that the heat sink 100 is easy to fall off can be effectively reduced.

In addition, the heat spreader 100 of the present embodiment may be applied to a single-sided board (a structure in which the power device 300 is disposed on only one of the board surfaces of the substrate 200), so that the problem of complex production process caused by a double-sided board (a structure in which the power device 300 is disposed on both of the board surfaces of the substrate 200) can be avoided.

In addition, the plug connector 20 in the scheme can be used as a braid, so that machine plug equipment can be clamped conveniently, and the radiator 100 can be assembled quickly.

It should be noted that, before the heat sink 100 is assembled, the structure may be as shown in fig. 1 to 3, at this time, the plug connector 20 may be substantially in a long-strip-shaped needle structure, at this time, when the heat sink 100 is assembled to the substrate 200, the plug connector 20 of the heat sink 100 may be inserted from the insertion hole 20c on the second surface 20b to the first surface 20a, and then the plug connector 20 is bent, so that one end of the plug connector 20 located on the first surface 20a is in heat-conducting contact with the power device 300 on the first surface 20a, that is, heat generated by the power device 300 is conducted to the heat sink body 10 through the plug connector 20, so that the heat dissipation of the power device 300 is effectively performed through the heat sink body 10.

In some embodiments, during the assembly process, the heat sink 100 may be fixedly mounted on the substrate 200, and then the power device 300 is mounted on the first surface 20a of the substrate 200 by means of a patch, so that the power device 300 is in heat-conducting contact with one end of the plug 20 located on the first surface 20a, that is, heat generated by the power device 300 is conducted to the heat sink body 10 through the plug 20, so that the heat of the power device 300 is effectively dissipated through the heat sink body 10. In other embodiments, during the assembly process, the power device 300 may be mounted on the first surface 20a of the substrate 200 by means of a patch, and then the heat sink 100 is fixedly mounted on the substrate 200, so that the power device 300 is in heat-conducting contact with one end of the plug 20 located on the first surface 20a, that is, the heat generated by the power device 300 is conducted to the heat sink body 10 through the plug 20, so that the heat of the power device 300 is effectively dissipated through the heat sink body 10.

In the practical application process, one end of the plug connector 20 far away from the radiator body 10 can be bent upwards, so that one end of the plug connector 20 positioned on the first surface 20a is opposite to the radiator body 10; alternatively, the end of the plug 20 away from the radiator body 10 may be bent downward, so that the end of the plug 20 located on the first surface 20a is offset from the radiator body 10; or, the end of the plug connector 20 far away from the radiator body 10 can be bent in the left or right direction; the heat sink 100 is not limited herein, as long as it is capable of being fixedly mounted on the substrate 200, and one end of the plug 20 located on the first surface 20a may be in thermal contact with the power device 300 located on the first surface 20 a.

In practical applications, the connector 20 may be connected to a surface of the heat sink body 10 facing the substrate 200, or may be connected to one side of the heat sink body 10, which is not limited herein. In some embodiments, when the connector 20 is connected to a surface of the heat sink body 10 facing the substrate 200, during the assembly process, after an end of the connector 20 away from the heat sink body 10 passes through the insertion hole 20c, only one end of the connector 20 located on the first surface 20a may be required to be bent. In other embodiments, when the connector 20 is connected to one side of the radiator body 10, after the end of the connector 20 away from the radiator body 10 passes through the insertion hole 20c during the assembly process, the end of the connector 20 located on the first surface 20a and the end located on the second surface 20b need to be bent, as shown in fig. 4 and 5, so that the radiator 100 can be fixedly mounted on the substrate 200, and at this time, the substrate 200 is sandwiched between the radiator body 10 and the end of the connector 20 located on the first surface 20 a.

In some embodiments, the radiator body 10 and the plug 20 may be integrally formed, so as to ensure the connection strength between the radiator body 10 and the plug 20, and reduce the manufacturing process.

Further, referring to fig. 4 and 5 in combination, in an embodiment of the heat sink 100 of the present utility model, the plug 20 includes a first connection section 21, a bending section 22, and a heat conducting section 23; one end of the first connecting section 21 is connected to the radiator body 10; one end of the bending section 22 is connected to the first connecting section 21 and one end far away from the radiator body 10, and the other end of the bending section 22 is used for penetrating the jack 20c; the heat conducting section 23 is connected to an end of the bending section 22 away from the first connecting section 21, and the heat conducting section 23 is disposed opposite to the heat sink body 10. That is, during the assembly process, the end of the plug 20 away from the radiator body 10 may be bent upward so that the heat conducting section 23 of the plug 20 is disposed opposite to the radiator body 10.

By the arrangement, the bent plug connector 20 can be approximately formed into a U-shaped structure, so that the radiator 100 can be fully fixed on the substrate 200 through the U-shaped plug connector 20, and the installation stability of the radiator 100 is ensured; and, the heat generated by the power device 300 in the working process can be sequentially conducted to the bending section 22 and the first connecting section 21 through the heat conducting section 23, and finally conducted to the radiator body 10 through the first connecting section 21, so that the power device 300 can be effectively radiated.

It should be noted that, the heat conducted to the radiator body 10 may be naturally radiated, or may radiate the heat of the radiator body 10 by accelerating the airflow by the fan.

Further, in order to facilitate the insertion of the connector 20 into the insertion hole 20c of the substrate 200, referring to fig. 1 and 2, in an embodiment of the heat sink 100 of the present utility model, the heat sink body 10 may have a first plate surface 10a facing the substrate 200, and a connection side 10b disposed adjacent to the first plate surface 10a, so that one end of the first connection section 21 is connected to the connection side 10b.

So set up, in the assembly process, can insert the jack 20c in the base plate 200 with the jack 20 along the extending direction of jack 20 before the assembly, then after bending the jack 20, can make the heat conduction section 23 of jack 20 and the first surface 20a laminating of base plate 200, make radiator body 10 smoothly fixed on the second surface 20b of base plate 200 simultaneously, can realize the quick cartridge of jack 20.

Further, referring to fig. 6 in combination, in an embodiment of the heat sink 100 of the present utility model, the second surface 20b has two insertion holes 20c, two of the connectors 20 are disposed at intervals along the extending direction of the connecting side 10b, and the bent section 22 of each connector 20 is configured to be inserted into one of the insertion holes 20c, so that the power device 300 is located between the two heat conducting sections 23.

In this way, in the assembly process, the two connectors 20 respectively penetrate through the two insertion holes 20c of the substrate 200, and then the connectors 20 are respectively bent, so that the two connectors 20 can be approximately in a U-shaped structure, the radiator 100 can be fixed on the substrate 200 through the two connectors 20, the radiator 100 is prevented from deflecting relative to the substrate 200, and therefore the installation stability of the radiator 100 can be effectively improved, meanwhile, the power device 300 can be smoothly attached between the two heat conducting sections 23 through the power device 300 being installed between the two heat conducting sections 23, and the heat dissipation effect of the power device 300 can be effectively ensured on the basis that the heat conducting sections 23 do not influence the patch production of the power device 300.

In addition, the power device 300 may be in thermal contact with the thermal conductive section 23 of the at least one connector 20 to ensure a heat dissipation effect on the power device 300.

Further, referring to fig. 1, 2 and 6 in combination, in an embodiment of the heat sink 100 of the present utility model, a circumferential wall of the heat conducting section 23 is provided with a limiting boss 231, and the limiting boss 231 is used to abut against the first surface 20 a.

By this arrangement, the heat conducting section 23 can be fixed on the first surface 20a of the substrate 200 by the limiting boss 231, so as to prevent the heat conducting section 23 from falling out from the insertion hole 20c to the second surface 20b, and further effectively prevent the heat sink 100 from falling out.

Further, referring to fig. 1 to 4 in combination, in an embodiment of the heat sink 100 of the present utility model, the heat sink body 10 includes a heat sink main body 11 and a first bending portion 12; the heat dissipation body 11 is connected with the plug 20 and has a first plate surface 10a facing the substrate 200; the first bending portion 12 is connected to the first plate surface 10a and abuts against the second surface 20 b.

By the arrangement, the heat dissipation area of the heat dissipation body 10 can be increased through the arrangement of the heat dissipation body 11 and the first bending part 12, and meanwhile, the effect of convection heat dissipation can be increased through the arrangement of the first bending part 12, so that the heat dissipation efficiency of the heat dissipation body 10 to the power device 300 can be improved; in addition, the first bending portion 12 abuts against the second surface 20b of the substrate 200, so that the mounting stability of the heat sink body 10 and, therefore, the mounting stability of the heat sink 100 can be improved.

Further, referring to fig. 1 to 4 in combination, in an embodiment of the heat sink 100 of the present utility model, the heat dissipating body 11 further has a second plate surface 10c opposite to the first plate surface 10a, the heat sink body 10 further includes a second bending portion 13, the second bending portion 13 is connected to the second plate surface 10c, and a bending direction of the first bending portion 12 is opposite to a bending direction of the second bending portion 13.

By such arrangement, the heat dissipation area of the heat sink body 10 can be further increased by the arrangement of the second bending portion 13, and meanwhile, the effect of convection heat dissipation can be increased by the arrangement of the second bending portion 13, so that the heat dissipation efficiency of the heat sink body 10 to the power device 300 can be further improved.

Further, referring to fig. 1 and 2 in combination, in an embodiment of the heat sink 100 of the present utility model, the heat dissipation main body 11 includes at least two heat dissipation sections 111 disposed at intervals, and two adjacent heat dissipation sections 111 are connected by a second connection section 112, and two ends of the heat dissipation section 111 are respectively connected with the first bending portion 12 and the second bending portion 13; the plug 20 is connected to one of the heat dissipation sections 111.

By arranging the heat dissipation main body 11 to include at least two heat dissipation sections 111, so that two adjacent heat dissipation sections 111 are connected through a second connecting section 112, and the two ends of each heat dissipation section 111 are respectively connected with the first bending part 12 and the second bending part 13, the effect of convection heat dissipation can be effectively increased under the combined action of the at least two heat dissipation sections 111 and the plurality of first bending parts 12 and the second bending parts 13, so that the heat dissipation efficiency of the heat dissipation main body 10 to the power device 300 can be further improved.

In addition, the at least two first bending portions 12 may be abutted against the second surface 20b of the substrate 200, so that the at least two first bending portions 12 may be fixed on the second surface 20b of the substrate 200 to avoid the radiator body 10 from tilting, so as to effectively ensure the installation stability of the radiator body 10, and further effectively ensure the installation stability of the radiator 100.

In some embodiments, the heat dissipating body 11 may include three heat dissipating sections 111 and two second connecting sections 112, and at this time, the heat dissipating body 11 may have a substantially "king" shape, which may achieve a better heat dissipating effect.

Further, referring to fig. 1 and 2 in combination, in an embodiment of the heat sink 100 of the present utility model, in two adjacent heat dissipation sections 111, a first bending portion 12 on one of the heat dissipation sections 111 and a second bending portion 13 on the other heat dissipation section 111 are close to each other. That is, in the two adjacent heat dissipation sections 111, the structure formed by one of the heat dissipation sections 111 and the first and second bent portions 12 and 13 may be substantially a forward S-shaped structure, and the structure formed by the other heat dissipation section 111 and the first and second bent portions 12 and 13 may be substantially a reverse S-shaped structure.

By the arrangement, the heat dissipation area of the radiator body 10 can be effectively increased, and the convection heat dissipation effect can be effectively increased, so that the heat dissipation efficiency of the radiator body 10 to the power device 300 can be further improved.

Referring to fig. 5 and fig. 6 in combination, the present utility model further provides a power device assembly 1000, where the power device assembly 1000 includes a substrate 200, a power device 300, and the heat sink 100 as described above, and the specific structure of the heat sink 100 refers to the foregoing embodiments, and since the power device assembly 1000 adopts all the technical solutions of all the foregoing embodiments, at least all the beneficial effects brought by the technical solutions of the foregoing embodiments are not described herein again. Wherein the substrate 200 has a first surface 20a and a second surface 20b disposed opposite to each other, and the second surface 20b is provided with a receptacle 20c penetrating to the first surface 20a; the power device 300 is disposed on the first surface 20a; the heat sink body 10 of the heat sink 100 is disposed on the second surface 20b and opposite to the power device 300, the plug 20 of the heat sink 100 passes through the insertion hole 20c and is bent to be attached to the first surface 20a of the substrate 200, and one end of the plug 20 located on the first surface 20a is in thermal contact with the power device 300.

It can be appreciated that, during the assembly process, the heat spreader 100 may be directly inserted into the insertion hole 20c of the substrate 200 through the connector 20, and one end of the connector 20 away from the heat spreader body 10 is bent to be attached to the first surface 20a of the substrate 200, and then the power device 300 is attached to the first surface 20a of the substrate 200, so that one end of the connector 20 located on the first surface 20a is in heat-conducting contact with the power device 300 mounted on the first surface 20a, and meanwhile, the heat spreader body 10 of the heat spreader 100 is fixed on the second surface 20b of the substrate 200, so that heat generated during the operation of the power device 300 can be conducted to the heat spreader body 10 through the connector 20, so as to effectively dissipate the heat of the power device 300 through the heat spreader body 10. Therefore, the heat sink 100 is fixed on the substrate 200 by adopting the plugging manner instead of the glue bonding manner, so that the risk that the heat sink 100 is easy to fall off can be effectively reduced.

The power device 300 may include a power driven semiconductor device employing a chip package, such as an IGBT or a MOS transistor.

The utility model also provides a household appliance, which comprises the radiator 100 or the power device assembly 1000, wherein the specific structure of the radiator 100 or the power device assembly 1000 refers to the above embodiments, and the household appliance adopts all the technical schemes of all the embodiments, so that the household appliance at least has all the beneficial effects brought by the technical schemes of the embodiments, and the description is omitted herein.

In some embodiments, the household appliance may include, but is not limited to, appliances such as induction cookers, refrigerators, air conditioners, washing machines, and the like.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (11)

1. A heat sink for a power device assembly having a substrate with oppositely disposed first and second surfaces, the first surface for mounting a power device and the second surface having a receptacle therethrough to the first surface, the heat sink comprising:

the radiator body is arranged on the second surface of the substrate;

the plug connector, the one end of plug connector connect in the radiator body, the other end of plug connector is used for wearing to establish the jack and bend in order with the laminating of the first surface of base plate, just the plug connector is located the one end of first surface is used for with power device heat conduction contact.

2. The heat sink of claim 1, wherein the plug comprises:

one end of the first connecting section is connected with the radiator body;

one end of the bending section is connected with the first connecting section and one end far away from the radiator body, and the other end of the bending section is used for penetrating through the jack;

the heat conduction section is connected to one end, far away from the first connection section, of the bending section, and the heat conduction section and the radiator body are oppositely arranged.

3. The heat sink of claim 2, wherein the heat sink body has a first plate surface facing the substrate and a connection side disposed adjacent to the first plate surface, and one end of the first connection section is connected to the connection side.

4. The heat sink of claim 3, wherein the second surface has two insertion holes, the two connectors are arranged at intervals along the extending direction of the connecting side, and the bending section of each connector is used for penetrating through one insertion hole so that the power device is located between the two heat conducting sections.

5. The heat sink of claim 2, wherein the peripheral wall of the heat conducting section is provided with a limit boss for abutment with the first surface.

6. The heat sink as recited in any one of claims 1 to 5, wherein the heat sink body includes:

the heat dissipation main body is connected with the plug connector and provided with a first plate surface facing the substrate;

the first bending part is connected to the first plate surface and is abutted against the second surface.

7. The heat sink of claim 6, wherein the heat dissipating body further has a second plate surface opposite to the first plate surface, the heat dissipating body further comprises a second bending portion, the second bending portion is connected to the second plate surface, and a bending direction of the first bending portion is opposite to a bending direction of the second bending portion.

8. The heat sink of claim 7 wherein the heat dissipating body comprises at least two heat dissipating sections arranged at intervals, two adjacent heat dissipating sections are connected by a second connecting section, and two ends of the heat dissipating section are respectively connected with the first bending part and the second bending part; the plug connector is connected with one of the heat dissipation sections.

9. The heat sink of claim 8, wherein in two adjacent heat dissipating sections, a first bend on one of the heat dissipating sections is adjacent to a second bend on the other of the heat dissipating sections.

10. A power device assembly, comprising:

the device comprises a substrate, a first substrate and a second substrate, wherein the substrate is provided with a first surface and a second surface which are arranged in a back-to-back mode, and the second surface is provided with a jack penetrating to the first surface;

the power device is arranged on the first surface;

the heat sink according to any one of claims 1 to 9, wherein the heat sink body of the heat sink is disposed on the second surface and opposite to the power device, the plug of the heat sink passes through the insertion hole and is bent to be attached to the first surface of the substrate, and one end of the plug on the first surface is in heat-conducting contact with the power device.

11. A household appliance comprising a radiator as claimed in any one of claims 1 to 9, or comprising a power device assembly as claimed in claim 10.