CN219916340U

CN219916340U - COM-E core board based on Feiteng platform

Info

Publication number: CN219916340U
Application number: CN202321276817.2U
Authority: CN
Inventors: 邵流河; 谢杰峰; 康少明
Original assignee: Shenzhen Eware Information Technology Co ltd
Current assignee: Shenzhen Eware Information Technology Co ltd
Priority date: 2023-05-24
Filing date: 2023-05-24
Publication date: 2023-10-27
Anticipated expiration: 2033-05-24

Abstract

The utility model belongs to the technical field of computers, and relates to a COM-E core board based on a Feiteng platform, which comprises: the device comprises a Feiteng processor, a COM-E connector, a bridge piece, a gigabit Ethernet control chip and a PHY chip, wherein the COM-E connector is provided with a COM-E connector AB port and a COM-E connector CD port, the COM-E connector AB port and the COM-E connector CD port are electrically connected with the Feiteng processor and the bridge piece, and the PHY chip is arranged between the Feiteng processor and the COM-E connector CD port. The core module COM-E integrates a Feiteng D2000/8 core industry edition CPU, a Feiteng bridge piece X100, a double-channel DDR4L slot, a PHY chip and the like, and provides rich IO resources such as PCIE, SATA, UART, CAN, SPI, SMBus, PWM, GPIO, gigabit MDI, DP and the like for the carrier plate. The carrier plate can be flexibly designed according to the use situation to realize the function requirement; the COM-E core board based on the Feiteng platform can support large memory, multiple display interfaces and multiple IO interfaces, is compatible with COM-E standard type-6 interface definition as much as possible, replaces imported products, solves the risk of supply, and improves the product competitiveness.

Description

COM-E core board based on Feiteng platform

Technical Field

The utility model relates to the technical field of computers, in particular to a COM-E core board based on a Feiteng platform.

Background

The computer module extension standard (COM-Express, COM-E) is a computer module standard formulated by the international union of industrial computer manufacturers (PCIIndustrialComputerManufacturersGroup, PICMG) and is an upgraded version of the embedded technology extension (EmbeddedTechnologyExtended, ETX) standard. COM-E is an open industry standard, is a novel bus technology based on high-speed serial computer expansion bus standard (PeripheralComponentInterconnectExpress, PCIE), low-voltage differential signal (Low-VoltageDifferentialSignaling, LVDS), gigabit network, universal serial bus (UniversalSerialBus, USB) 2.0, serial advanced technology attachment (serial advanced TechnologyAttachment, SATA) and other high-speed input output (I0) interfaces, and is particularly suitable for executing a customized industrial computer solution.

The COM-E core board is an electronic main board for packaging the core functions of a traditional computer, the processor comprises USB, SMBUS, DP, VGA and other signals, the processor is integrated by the core board, the memory module and the COM-E connector corresponding to the substrate are connected together, so that the system chip application in a certain field is realized, and the core board integrates the general functions of the core, so that the device has the universality that one core board can customize various substrates, the development efficiency of products can be greatly improved, the development difficulty of the products is reduced, and the stability and maintainability of the system are improved.

In recent years, through the development planning and arrangement of the national science and technology, the domestic computer software and hardware technology has made a major breakthrough, such as a high-performance processor represented by a Loongson, a Feiteng, a Shenwei, a mega-core, a crystal quenching and the like. In order to ensure autonomous controllability, safety and the like, some COM-E core boards adopting domestic chip platforms are arranged at present, but the COM-E core boards still have some defects, such as single display signal interface, incapability of being matched with display modules of different signals for use, insufficient working performance of products and the like.

Disclosure of Invention

The utility model aims to solve the technical problems that a COM-E core board in the prior art has single display signal interface and can not be matched with display modules of different signals, and provides a COM-E core board based on a Feiteng platform, which comprises the following components:

the intelligent electronic device comprises a Feiteng processor, a COM-E connector, a bridge piece, a gigabit Ethernet control chip and a PHY chip, wherein the COM-E connector is provided with a COM-E connector AB port and a COM-E connector CD port, the COM-E connector AB port and the COM-E connector CD port are electrically connected with the Feiteng processor and the bridge piece, and the PHY chip is arranged between the Feiteng processor and the COM-E connector CD port.

Preferably, the Feiteng processor is provided with a PCIE3.0 port, a UART0 port, and a UART1 port, and the PCIE3.0 port, the UART0 port, and the UART1 port are all electrically connected with the COM-E connector AB port.

Preferably, the Feiteng processor is provided with an SPI port, an LPC port, a CAN port and a GPIO port, and the SPI port, the LPC port, the CAN port and the GPIO port are electrically connected with the CD port of the COM-E connector.

Preferably, the bridge piece is provided with a UART1 port, a UART2 port, a DP0 port, a DP1 port, a DP2 port and a USB port, and the UART1 port, the UART2 port, the DP0 port, the DP1 port, the DP2 port and the USB port are all electrically connected with the COM-E connector CD port.

Preferably, the bridge piece is provided with a PCIE3.0 port, a USB2.0 port, a SATA3.0 port, an SMBus port, and an I2S audio port, where the PCIE3.0 port, the USB2.0 port, the SATA3.0 port, the SMBus port, and the I2S audio port are all electrically connected with the COM-E connector CD port.

Preferably, the bridge piece is also electrically connected with the LPDDR 4.

Preferably, a 3.3V-1.8V level conversion module is further arranged between the bridge piece and the CD port of the COM-E connector.

Preferably, the Feiteng processor is further electrically connected with a memory bank socket, and the memory bank socket is provided with a memory bank.

Preferably, the COM-E connector further comprises a power supply electrically connected with the COM-E connector.

Preferably, the COM-E core board is further provided with an AUDIO interface, a UART interface, a USB interface, an SSD interface, and a DP interface, and the AUDIO interface, the UART interface, the USB interface, the SSD interface, and the DP interface are electrically connected.

The COM-E core board based on the Feiteng platform has the following beneficial effects: the core module COM-E integrates a Feiteng D2000/8 core industry edition CPU, a Feiteng bridge piece X100, a double-channel DDR4L slot, a PHY chip and the like, and provides rich IO resources such as PCIE, SATA, UART, CAN, SPI, SMBus, PWM, GPIO, gigabit MDI, DP and the like for the carrier plate. The carrier plate can be flexibly designed according to the use situation to realize the function requirement; the COM-E core board based on the Feiteng platform can support large memory, multiple display interfaces and multiple IO interfaces, is compatible with COM-E standard type-6 interface definition as much as possible, replaces imported products, solves the risk of supply, and improves the product competitiveness.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art. The utility model will be further described with reference to the accompanying drawings and examples, in which:

FIG. 1 is a schematic diagram of the structure of a COM-E core board based on a Feiteng platform of the present utility model;

fig. 2 is a working schematic diagram of a 3.3V-1.8V level conversion module used in a COM-E core board based on a fly-by platform according to the present utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present utility model, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

Please refer to fig. 1, which is a schematic structural diagram of the COM-E core board based on the fly-by platform according to the present utility model. As shown in fig. 1, in the COM-E core board based on the fly-by platform according to the first embodiment of the present utility model, at least one of the fly-by processor, the COM-E connector, the bridge chip, the gigabit ethernet control chip, and the PHY chip is provided with a COM-E connector AB port and a COM-E connector CD port, and the fly-by processor and the bridge chip are electrically connected between the COM-E connector AB port and the COM-E connector CD port, and the PHY chip is disposed between the fly-by processor and the COM-E connector CD port.

In order to expand the peripheral port functions of the COM-E core board, the Feiteng processor is provided with a PCIE3.0 port, a UART0 port and a UART1 port, and the PCIE3.0 port, the UART0 port and the UART1 port are electrically connected with the COM-E connector AB port.

The Feiteng processor is provided with an SPI port, an LPC port, a CAN port and a GPIO port, and the SPI port, the LPC port, the CAN port and the GPIO port are electrically connected with the CD port of the COM-E connector.

The bridge piece is provided with a UART1 port, a UART2 port, a DP0 port, a DP1 port, a DP2 port and a USB port, and the UART1 port, the UART2 port, the DP0 port, the DP1 port, the DP2 port and the USB port are all electrically connected with the CD port of the COM-E connector. UART1 port, UART2 port, DP0 port, DP1 port, DP2 port and USB port, and peripheral port functions of the COM-E core board are expanded.

The bridge piece is provided with a PCIE3.0 port, a USB2.0 port, a SATA3.0 port, an SMBus port and an I2S audio port, wherein the PCIE3.0 port, the USB2.0 port, the SATA3.0 port, the SMBus port and the I2S audio port are electrically connected with the CD port of the COM-E connector. The I2S audio ports may include 1 set of MIC, lineout each. Through PCIE3.0 port, USB2.0 port, SATA3.0 port, SMBus port and I2S audio port, the COM-E core board can be connected with other electronic equipment to perform information interaction

The bridge piece is also electrically connected with the LPDDR 4.

And a 3.3V-1.8V level conversion module is also arranged between the bridge piece and the CD port of the COM-E connector. Fig. 2 is a working schematic diagram of a 3.3V-1.8V level conversion module used in a COM-E core board based on a fly-by platform according to the present utility model. As shown in fig. 2, for the level shift application circuit, the gate-source voltage (GateSourceVoltage, VGS) is mainly focused on the selection parameter of the fet, and the value of the fet cannot be too small, otherwise the fet cannot be turned on (or has a larger resistance) because VGS is smaller than the gate threshold voltage (gatehold). The basic principle of the bidirectional level shift circuit is first to look at the level shift principle from left to right (1.8V to 3.3V). When the left side D0 inputs the high level "H", the fet VT1 is non-conductive because VGS is 0, and the right side D1 is pulled up to the high level (3.3V) by the resistor R2. When the left side D0 inputs the low level "L", the fet VT1 is in the on state because VGS is 1.8V, and the right side D1 is pulled down to the same low level as D0, as shown in fig. 2, and fig. 2 is.

Looking again at the level shift principle from right to left (3.3V to 1.8V). Assuming that the left side D0 is high, when the right side D1 inputs the high level "H", the fet VT1 is non-conductive because VGS is 0, and the left side D0 is pulled up to the high level (1.8V) by the resistor R1. When the right side D1 inputs a high level "H", the conversion process needs to be subdivided into two stages. Since the left side D0 is initially high "H", VGS is 0, the fet VT1 is non-conductive, but since the fet has a parasitic diode that pulls D0 down to a low level (about one diode drop above D1, here tentatively 0.7V), D0 is also low. Next, VGS (3.3V-0.7v=2.6v) is larger than the gate threshold voltage of the fet to turn on the fet VT1, and the level of D0 is further reduced (basically no difference from D1).

The Feiteng processor is also electrically connected with a memory bank socket, and the memory bank socket is provided with a memory bank.

The COM-E connector also comprises a power supply electrically connected with the COM-E connector. The power supply is led out by using an M12 connector, and the model can be the Shanghai welcome method electric RE-PS2547, and the power supply range DC is 9-36V.

The COM-E core board is also provided with an AUDIO interface, a UART interface, a USB interface, an SSD interface and a DP interface, wherein the AUDIO interface, the UART interface, the USB interface, the SSD interface and the DP interface are electrically connected.

In specific implementation, the DP interface may include a 3-way displayport1.4hbr2 display interface, where: the two paths are 4Lane, and the maximum support is 3840 multiplied by 2160@60Hz; one path is 1Lane, and the maximum support is 1366×768@60HzS.

In particular implementations, the Feiteng processor may be, but is not limited to, feiteng D2000, the bridge may be, but is not limited to, feiteng X100, the gigabit Ethernet control chip may be, but is not limited to, WX1860AL4, and the PHY chip may be, but is not limited to, PHYYT8521. The Feiteng D2000 and Feiteng X100 are also connected through I2C, PCIEX, a 3.3-1.8V level conversion module is connected with I2C, and an AT8339AT is connected with the 3.3-1.8V level conversion module.

In the implementation, a 1.8V-VPP level conversion module is also arranged between the Feiteng processor D2000 and the memory bank socket. VPP is a symbol that refers to the voltage from the lowest value to the highest value of an alternating or pulsed signal, also known as the peak-to-peak value. The definition of VPP is slightly different for different chips, such as voltage peak-to-peak. The 1.8V-VPP level conversion module is similar to the operation principle of fig. 2, and will not be described here again.

Through the design of the embodiment, the utility model has the beneficial effects that: the core module COM-E integrates a Feiteng D2000/8 core industry edition CPU, a Feiteng bridge piece X100, a double-channel DDR4L slot, a PHY chip and the like, and provides rich IO resources such as PCIE, SATA, UART, CAN, SPI, SMBus, PWM, GPIO, gigabit MDI, DP and the like for the carrier plate. The carrier plate can be flexibly designed according to the use situation to realize the function requirement; the COM-E core board based on the Feiteng platform can support large memory, multiple display interfaces and multiple IO interfaces, is compatible with COM-E standard type-6 interface definition as much as possible, replaces imported products, solves the risk of supply, and improves the product competitiveness. While the utility model has been described with reference to certain embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the utility model. In addition, many modifications may be made to adapt a particular situation to the teachings of the utility model without departing from its scope. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. COM-E core board based on a fly-by platform, characterized by comprising:

2. The fly-platform based COM-E core board according to claim 1, wherein the fly-by processor is provided with a PCIE3.0 port, a UART0 port, and a UART1 port, and the PCIE3.0 port, the UART0 port, and the UART1 port are electrically connected to the COM-E connector AB port.

3. The flying platform based COM-E core board of claim 1, wherein the flying processor is provided with an SPI port, an LPC port, a CAN port, and a GPIO port, and the SPI port, the LPC port, the CAN port, and the GPIO port are all electrically connected to the COM-E connector CD port.

4. The Feiteng platform-based COM-E core board according to claim 1, wherein the bridge piece is provided with a UART1 port, a UART2 port, a DP0 port, a DP1 port, a DP2 port and a USB port, and the UART1 port, the UART2 port, the DP0 port, the DP1 port, the DP2 port and the USB port are electrically connected with the COM-E connector CD port.

5. The fly-platform based COM-E core board according to claim 1, wherein the bridge piece is provided with a PCIE3.0 port, a USB2.0 port, a SATA3.0 port, an SMBus port, and an I2S audio port, and the PCIE3.0 port, the USB2.0 port, the SATA3.0 port, the SMBus port, and the I2S audio port are all electrically connected to the COM-E connector CD port.

6. The fly-by platform based COM-E core board of claim 1, wherein the bridge piece is further electrically connected to LPDDR 4.

7. The fly-by platform based COM-E core board according to claim 1, wherein a 3.3V-1.8V level conversion module is further provided between the bridge piece and the COM-E connector CD port.

8. The flying platform based COM-E core board of claim 1, wherein the flying processor is further electrically connected to a memory bank socket, the memory bank socket having a memory bank.

9. A fly-by platform based COM-E core board according to any one of claims 1 to 8, further comprising a power source electrically connected to the COM-E connector.

10. The fly-platform based COM-E core board according to claim 9, wherein the COM-E core board is further provided with an AUDIO interface, a UART interface, a USB interface, an SSD interface, and a DP interface, and the AUDIO interface, the UART interface, the USB interface, the SSD interface, and the DP interface are electrically connected.