CN214202354U

CN214202354U - COM-E core board based on crystal quenching platform

Info

Publication number: CN214202354U
Application number: CN202023248913.5U
Authority: CN
Inventors: 李倩; 严朋
Original assignee: Hefei Zhuoyi Hengtong Information Security Co Ltd
Current assignee: Hefei Zhuoyi Hengtong Information Security Co Ltd
Priority date: 2020-12-28
Filing date: 2020-12-28
Publication date: 2021-09-14
Anticipated expiration: 2030-12-28

Abstract

The utility model provides a COM-E core plate based on crystal quenching platform. The COM-E core board based on the crystal quenching platform comprises: the device comprises a crystal quenching processor, a COM-E connector electrically connected with the crystal quenching processor, a temperature control chip electrically connected with the crystal quenching processor and a power supply electrically connected with the crystal quenching processor and the temperature control chip respectively; the crystal quenching processor is provided with a THRM port, the temperature control chip is electrically connected with the THRM port of the crystal quenching processor and used for reading the temperature of the crystal quenching processor and sending a protection signal to the power supply when the temperature of the crystal quenching processor exceeds a preset temperature range so as to turn off the power supply, so that the over-temperature burning of the chip can be effectively prevented, and the working stability of the product is improved.

Description

COM-E core board based on crystal quenching platform

Technical Field

The utility model relates to the technical field of computers, especially, relate to a COM-E nuclear core plate based on brilliant platform that quenches.

Background

The Computer module extension standard (COM-Express, COM-E) is a Computer module standard established by the international industry Computer Manufacturers association (PCI Industrial computers Manufacturers Group, PICMG), and is an upgraded version of the Embedded Technology Extended (ETX) standard. COM-E is an open industrial standard, is a novel Bus Technology based on high-speed Input/Output (IO) interfaces such as high-speed Serial computer expansion Bus standard (PCIE), Low-Voltage Differential Signaling (LVDS), gigabit net, Universal Serial Bus (USB) 2.0, Serial Advanced Technology Attachment (SATA), and is particularly suitable for implementing a customized industrial computer solution.

The COM-E core board is an electronic main board which packages the core function of a traditional computer, the processor comprises signals such as USB, SMBUS, DP, VGA and the like, the core board integrates a processor, a memory module and a COM-E connector matched with a substrate and corresponding to the substrate, and the COM-E connector of the core board is connected with the COM-E connector of the substrate so as to realize system chip application in a certain field.

However, chip platforms of the existing COM-E core boards are basically produced by foreign enterprises, and the chip platforms of the foreign platforms are completely closed to us in the core technology, so that the core technical principle of the chip platforms cannot be deeply mastered, the technical risk and the potential safety hazard uncontrollable in maintenance exist in product use, the product is seriously imported, the management and control of the product are serious, and the risk that the product cannot be produced due to the fact that the chip platforms are out of supply at any time exists. In recent years, through the arrangement of national science and technology development plans, the domestic computer software and hardware technology makes major breakthrough, such as more representative high-performance processors represented by dragon cores, Feiteng, Shenwei, Mega cores, crystal quenching and the like. In order to ensure autonomous controllability, safety and the like, some COM-E core boards adopting domestic chip platforms have appeared at present, but the COM-E core boards still have some defects, for example, the chips are easy to burn out due to lack of a temperature protection mechanism, and the interfaces are not rich enough to meet different use scenes and the working performance of products is not enough.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a COM-E nuclear core plate based on brilliant platform that quenches can promote COM-E nuclear core plate's job stabilization nature, improves COM-E nuclear core plate's performance.

In order to achieve the above object, the utility model provides a COM-E core plate based on brilliant platform that quenches, include: the device comprises a crystal quenching processor, a COM-E connector electrically connected with the crystal quenching processor, a temperature control chip electrically connected with the crystal quenching processor and a power supply electrically connected with the crystal quenching processor and the temperature control chip respectively;

the crystal quenching processor is provided with a THRM port, and the temperature control chip is electrically connected with the THRM port of the crystal quenching processor and used for reading the temperature of the crystal quenching processor and sending a protection signal to the power supply to turn off the power supply when the temperature of the crystal quenching processor exceeds a preset temperature range.

The COM-E core board based on the crystal quenching platform further comprises a memory module electrically connected with the crystal quenching processor.

The COM-E core board based on the crystal quenching platform further comprises: the crystal quenching device comprises a BIOS ROM, wherein the crystal quenching processor is also provided with an SPI port, and the BIOS ROM is electrically connected with the SPI port of the crystal quenching processor.

The COM-E core board based on the crystal quenching platform further comprises a Debug connector, the crystal quenching processor is further provided with an LPC port, and the Debug connector is electrically connected with the LPC port of the crystal quenching processor.

The COM-E core board based on the crystal quenching platform further comprises a network card chip, wherein the network card chip is electrically connected with the crystal quenching processor and the COM-E connector respectively, and the network card chip acquires a PCIE signal from the crystal quenching processor, converts the PCIE signal into an MDI signal and outputs the MDI signal to the COM-E connector.

The crystal quenching processor is also provided with an HDMI port, a VGA port and a DP port, and the HDMI port, the VGA port and the DP port are respectively and electrically connected with the COM-E connector.

The crystal quenching processor is also provided with a PCIEX 4 port, a PCIEX 1 port, a USB2.0 port and a USB3.0 port, wherein the PCIEX 4 port, the PCIEX 1 port, the USB2.0 port and the USB3.0 port are respectively and electrically connected with the COM-E connector.

The crystal quenching processor is also provided with a SATA port, a HDA port, an ACPI port, an SMBUS port and an I2C port, and the SATA port, the HDA port, the ACPI port, the SMBUS port and the I2C port are respectively and electrically connected with the COM-E connector.

The COM-E connector is a TYPE6 connector.

The model of the crystal quenching processor is crystal quenching CD-3445-BTB, and the model of the temperature control chip is nano-core micro NST 175H-QMSR.

The utility model has the advantages that: the utility model provides a COM-E core plate based on crystal quenching platform. The COM-E core board based on the crystal quenching platform comprises: the device comprises a crystal quenching processor, a COM-E connector electrically connected with the crystal quenching processor, a temperature control chip electrically connected with the crystal quenching processor and a power supply electrically connected with the crystal quenching processor and the temperature control chip respectively; the crystal quenching processor is provided with a THRM port, the temperature control chip is electrically connected with the THRM port of the crystal quenching processor and used for reading the temperature of the crystal quenching processor and sending a protection signal to the power supply when the temperature of the crystal quenching processor exceeds a preset temperature range so as to turn off the power supply, so that the over-temperature burning of the chip can be effectively prevented, and the working stability of the product is improved.

Drawings

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the present invention and accompanying drawings, which are provided for the purpose of illustration and description and are not intended to limit the present invention.

In the drawings, there is shown in the drawings,

fig. 1 is a schematic block diagram of a COM-E core board based on a crystal quenching platform according to the present invention.

Detailed Description

To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.

Referring to fig. 1, the present invention provides a COM-E core board based on a crystal quenching platform, including: the device comprises a crystal quenching processor 1, a COM-E connector 2 electrically connected with the crystal quenching processor 1, a temperature control chip 3 electrically connected with the crystal quenching processor 1 and a power supply 4 respectively electrically connected with the crystal quenching processor 1 and the temperature control chip 3;

the crystal quenching processor 1 is provided with a THRM port, and the temperature control chip 3 is electrically connected with the THRM port of the crystal quenching processor 1 and used for reading the temperature of the crystal quenching processor 1 and sending a protection signal to the power supply 4 to turn off the power supply 4 when the temperature of the crystal quenching processor 1 exceeds a preset temperature range.

Preferably, the crystal quenching processor 1 is of a model of crystal quenching CD-3445-BTB, and has a thermal protection (THRM) port, a Serial Peripheral Interface (SPI) port, a Low Pin Count (LPC) port, and a PCIE network card port.

Specifically, the temperature control chip 3 is of a nano-core micro NST175H-QMSR type, the therm +/-signal can be obtained through the THRM port to read the temperature of the crystal quenching processor 1, and when the temperature exceeds a preset temperature range, the temperature control chip 3 can send a low-potential protection signal to the power supply 4 to turn off the power supply 4, so that the whole machine is shut down, and the product is prevented from being burnt out due to over-temperature.

Preferably, COM-E connector 2 is the standard TYPE6 connector, can be should through this standard TYPE6 connector with have the base plate of standard TYPE6 connector link to each other equally, promptly the utility model discloses a COM-E nuclear core plate based on brilliant quenching platform can arrange the all kinds of base plates that develop according to customer's different functional requirements and use, development cost is low, and it is convenient to use.

Further, the COM-E core board based on the crystal quenching platform further includes a memory module 5 electrically connected to the crystal quenching processor 1. Preferably, the memory module 5 is a Double Data Rate (DDR 4) memory module of generation 4, the memory dominant frequency may reach 2133MHz, and the memory performance is greatly improved compared with a DDR3 memory module adopted by an existing COM-E core board.

Specifically, the COM-E core board based on a crystal quenching platform further comprises: a Basic Input/output system read-Only Memory (BIOS ROM)6, wherein the BIOS ROM6 is electrically connected to the SPI port of the crystal quenching processor 1.

Specifically, the COM-E core board based on the wafer quenching platform further includes a hardware Debug (Debug) connector 7, the Debug connector 7 is electrically connected to the LPC port of the wafer quenching processor 1, preferably, the Debug connector 7 is a 0.8Pitch connector, and is connected to a Debug module through an external lead to read the code running condition of the CPU, thereby completing the hardware Debug of the product and ensuring the working stability of the product.

Specifically, the COM-E core board based on the crystal quenching platform further includes a network card chip 8, the network card chip 8 is electrically connected to the crystal quenching processor 1 and the COM-E connector 2, and the network card chip 8 acquires a PCIE signal from the crystal quenching processor 1 and converts the PCIE signal into a Media Dependent Interface (MDI) signal, and outputs the MDI signal to the COM-E connector 2. Preferably, the network card chip is an Intel I210-IT industrial-grade chip, the network card chip 8 can reach a gigabit network rate, and compared with a hundred-megabyte network card adopted by the existing COM-E core board, the network transmission rate is greatly improved.

In addition, the crystal quenching processor 1 further has a High Definition Multimedia Interface (HDMI) port, a Video Graphics Array (VGA) port, and a Display Port (DP) port, and the HDMI port, the VGA port, and the DP port are electrically connected to the COM-E connector 2, respectively.

Further, the COM-E core board based on the crystal quenching platform can be used in cooperation with a display module, a DP signal is directly led out from a DP port of the crystal quenching processor 1 through the COM-E connector 2, and DP signal display can be realized on a substrate side connected with the COM-E core board based on the crystal quenching platform or converted into an interface signal required by a corresponding display module.

Furthermore, the crystal quenching processor 1 further has a PCIE × 4 port, a PCIE × 1 port, a USB2.0 port, and a USB3.0 port, where the PCIE × 4 port, the PCIE × 1 port, the USB2.0 port, and the USB3.0 port are electrically connected to the COM-E connector 2, and by configuring the PCIE × 4 port, the PCIE × 1 port, the USB2.0 port, and the USB3.0 port at the same time, compared with an existing COM-E core board, peripheral interfaces are more abundant, and a usage scenario is wider.

Specifically, the crystal quenching processor 1 further has an SATA port, a High fidelity Audio (HDA) port, an Advanced Configuration and Power Interface (ACPI) port, a System Management Bus (SMBUS) port, and an Inter-Integrated-Circuit Bus (I2C) port, where the SATA port, the HDA port, the ACPI port, the SMBUS port, and the I2C port are electrically connected to the COM-E connector 2, respectively.

Preferably, the number of the PCIE × 4 ports is 1, the number of the PCIE × 1 ports is 5, the number of the USB2.0 ports is 2, the number of the USB3.0 ports is 4, and the number of the SATA ports is 2.

In addition, according to the use requirement, the COM-E core board based on the crystal quenching platform may further include a fan module, a switch key module and a reset key module electrically connected to the crystal quenching processor 1. The fan module is provided with a 4pin connector, the rotating speed can be controlled through a Pulse Width Modulation (PWM) signal of the crystal quenching processor 1, the switch key module can be used for on-off control, related signals are also connected to the substrate side, the substrate can also control on-off, and the reset key module is used for hardware reset.

Specifically, the power supply 4 is connected to a 12V original voltage, and is capable of converting the 12V original voltage into various working voltage outputs, such as 12V to 5VSB, 5VSB to 3V3SB, 3V3S to 1.1V, and 1.1V to 0.8V, so as to meet the working requirements of various hardware contained in the product.

Therefore, the utility model realizes the over-temperature protection of the COM-E core board based on the crystal quenching platform by setting the temperature control chip 3 electrically connected with the crystal quenching processor 1 to read the temperature of the crystal quenching processor 1, overcomes the defect that the existing COM-E core board based on the domestic chip platform lacks an over-temperature protection mechanism, meanwhile, the Debug connector 7 is matched to realize the function of hardware debugging, the stability of the product can be effectively improved, the product comprises abundant external interfaces, can meet the connection requirements of various peripherals, has wide use scenes, simultaneously, the DDR4 memory module and the gigabit network card chip are matched, so that the use requirements in the field of industrial control can be effectively met, and the product is developed based on a domestic chip platform, the core components are independently controllable, the safety is high, and various service environments with higher requirements on safety and controllability can be met.

To sum up, the utility model provides a COM-E core plate based on brilliant platform that quenches. The COM-E core board based on the crystal quenching platform comprises: the device comprises a crystal quenching processor, a COM-E connector electrically connected with the crystal quenching processor, a temperature control chip electrically connected with the crystal quenching processor and a power supply electrically connected with the crystal quenching processor and the temperature control chip respectively; the crystal quenching processor is provided with a THRM port, the temperature control chip is electrically connected with the THRM port of the crystal quenching processor and used for reading the temperature of the crystal quenching processor and sending a protection signal to the power supply when the temperature of the crystal quenching processor exceeds a preset temperature range so as to turn off the power supply, so that the over-temperature burning of the chip can be effectively prevented, and the working stability of the product is improved.

From the above, it is obvious to those skilled in the art that various other changes and modifications can be made according to the technical solution and the technical idea of the present invention, and all such changes and modifications should fall within the protection scope of the claims of the present invention.

Claims

1. A COM-E core board based on a crystal quenching platform is characterized by comprising: the device comprises a crystal quenching processor (1), a COM-E connector (2) electrically connected with the crystal quenching processor (1), a temperature control chip (3) electrically connected with the crystal quenching processor (1), and a power supply (4) electrically connected with the crystal quenching processor (1) and the temperature control chip (3) respectively;

the crystal quenching processor (1) is provided with a THRM port, the temperature control chip (3) is electrically connected with the THRM port of the crystal quenching processor (1) and used for reading the temperature of the crystal quenching processor (1) and sending a protection signal to the power supply (4) to turn off the power supply (4) when the temperature of the crystal quenching processor (1) exceeds a preset temperature range.

2. A COM-E core board based on a crystal quenching platform according to claim 1, further comprising a memory module (5) electrically connected to the crystal quenching processor (1).

3. A COM-E core board based on a crystal quenching platform according to claim 1, further comprising: the crystal quenching processor (1) is also provided with an SPI port, and the BIOS ROM (6) is electrically connected with the SPI port of the crystal quenching processor (1).

4. A COM-E core board based on a crystal quenching platform according to claim 1, further comprising a Debug connector (7), wherein the crystal quenching processor (1) further has an LPC port, and wherein the Debug connector (7) is electrically connected to the LPC port of the crystal quenching processor (1).

5. The COM-E core board based on a crystal quenching platform according to claim 1, further comprising a network card chip (8), wherein the network card chip (8) is electrically connected with the crystal quenching processor (1) and the COM-E connector (2) respectively, and the network card chip (8) acquires a PCIE signal from the crystal quenching processor (1), converts the PCIE signal into an MDI signal and outputs the MDI signal to the COM-E connector (2).

6. A COM-E core board based on a crystal quenching platform according to claim 1, wherein the crystal quenching processor (1) further comprises an HDMI port, a VGA port and a DP port, and the HDMI port, the VGA port and the DP port are electrically connected to the COM-E connector (2), respectively.

7. The COM-E core board based on a crystal quenching platform according to claim 1, wherein the crystal quenching processor (1) further has PCIE x 4 port, PCIE x 1 port, USB2.0 port and USB3.0 port, and the PCIE x 4 port, the PCIE x 1 port, the USB2.0 port and the USB3.0 port are respectively and electrically connected with the COM-E connector (2).

8. A COM-E core board based on a crystal quenching platform according to claim 1, wherein the crystal quenching processor (1) further has SATA ports, HDA ports, ACPI ports, SMBUS ports and I2C ports, and the SATA ports, HDA ports, ACPI ports, SMBUS ports and I2C ports are electrically connected to the COM-E connector (2), respectively.

9. A COM-E core board based on a crystal quenching platform according to claim 1, wherein the COM-E connector (2) is a TYPE6 connector.

10. A COM-E core board based on a crystal quenching platform according to claim 1, wherein the model of the crystal quenching processor (1) is crystal quenching CD-3445-BTB, and the model of the temperature control chip (3) is nano-core micro NST 175H-QMSR.