CN219876218U - Static electricity eliminating module for removing static electricity of photoresist removing wafer - Google Patents
Static electricity eliminating module for removing static electricity of photoresist removing wafer Download PDFInfo
- Publication number
- CN219876218U CN219876218U CN202320749553.1U CN202320749553U CN219876218U CN 219876218 U CN219876218 U CN 219876218U CN 202320749553 U CN202320749553 U CN 202320749553U CN 219876218 U CN219876218 U CN 219876218U
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- Prior art keywords
- wafer
- transfer
- static electricity
- fan assembly
- photoresist
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- 230000003068 static effect Effects 0.000 title claims abstract description 48
- 230000005611 electricity Effects 0.000 title claims abstract description 29
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 24
- 230000001681 protective effect Effects 0.000 claims abstract description 13
- 230000008030 elimination Effects 0.000 claims abstract description 6
- 238000003379 elimination reaction Methods 0.000 claims abstract description 6
- 230000003472 neutralizing effect Effects 0.000 claims abstract description 6
- 238000007599 discharging Methods 0.000 claims abstract description 4
- 235000012431 wafers Nutrition 0.000 claims description 86
- 238000005192 partition Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 238000007664 blowing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a static electricity eliminating module for eliminating static electricity of a photoresist-eliminating wafer, which is used for eliminating static electricity of the wafer before photoresist elimination or after photoresist elimination, and comprises a transfer disc, wherein a transfer protecting box for enclosing and protecting the periphery of the transfer disc is arranged at a discharging opening of the wafer, and a wafer transfer cavity opening is formed in the front side opening of the transfer protecting box; the top side of the transfer protective box is provided with a fan assembly which blows external air into the corresponding inner space of the transfer disc from top to bottom and discharges the external air from the positive pressure at the wafer transfer cavity port at the side; the lower side air port of the fan assembly transversely penetrates through a beam, two ends of the beam are fixed on two sides of the transfer protective box and are positioned right above the transfer disc, at least one static eliminator is arranged on the beam, and a large amount of positive and negative charges generated by the static eliminator are blown by the air flow of the fan assembly to form a positive and negative charge air flow for neutralizing charges on the surface of the wafer so as to eliminate static on the upper surface and the lower surface of the wafer.
Description
[ field of technology ]
The present utility model relates to a wafer static eliminating technology, and more particularly, to a static eliminating module for removing static from a wafer.
[ background Art ]
In the manufacturing process of a semiconductor wafer, the manufacturing process of the wafer is complex, a plurality of working procedures are provided, different chemical materials are used in different working procedures, chemical agents, particles, metals and other impurities are usually remained on the surface of the wafer, the quality of the wafer is affected by impurity dust and static electricity, the dispensing effect in electronic packaging is not good easily, the quality of the wafer is affected, and the static electricity can cause interference to electronic equipment and affect normal use. In addition, charges are accumulated continuously and can move to important positions such as a circuit, a cable and the like, and accidents such as fire disaster and the like can be caused when the charges are serious; therefore, in the process of manufacturing wafers, it is highly desirable to perform the operations of removing static electricity and cleaning the wafers.
[ utility model ]
The embodiment of the utility model provides a static electricity eliminating module for eliminating static electricity of a photoresist-eliminating wafer, which is used for carrying out positive pressure blowing attachment on the wafer after photoresist elimination and cleaning in a semi-closed transfer space by emitting positive and negative ion wind through a static electricity eliminator, so that the positive and negative ion wind can effectively approach to the upper surface and the lower surface of the wafer, the static electricity on the wafer is effectively eliminated, and the subsequent processing quality of the wafer is effectively improved.
The technical scheme adopted by at least one embodiment of the utility model is as follows:
the static electricity eliminating module for eliminating static electricity of the wafer before or after removing the photoresist of the wafer comprises at least one transfer disc for supporting wafer transfer, wherein the transfer disc is arranged at a wafer blanking opening of a wafer photoresist removing cavity and is used for supporting and facilitating external transfer of the wafer to be sent into the wafer photoresist removing cavity through the wafer blanking opening for photoresist removal or receiving the wafer after photoresist removal sent from the wafer blanking opening and waiting for transfer to the outside;
a transfer protecting box which is arranged at the position of the discharging opening on the wafer, is provided with a front side local opening and is used for enclosing and protecting the periphery of the transfer disc, and a wafer transfer cavity opening which is convenient for transferring external wafers onto the transfer disc or transferring the wafers out after the glue removal of the transfer disc is arranged at the front side opening of the transfer protecting box;
a fan assembly which blows external air into the internal space corresponding to the transfer disc from top to bottom and discharges the external air from the positive pressure at the wafer transfer cavity port on the side is arranged on the top side of the transfer protective box;
the device is characterized in that a cross beam with two ends fixed on two sides of the transfer protective box and positioned right above the transfer disc is transversely arranged at a wind port on the lower side of the fan assembly, at least one static eliminator for ionizing air to generate a large amount of positive and negative charges is arranged on the cross beam, and the large amount of positive and negative charges generated by the static eliminator are blown by forward downward airflow of the fan assembly to form a positive and negative charge airflow for neutralizing charges on the surface of a wafer so as to eliminate static on the upper surface and the lower surface of the wafer.
Preferably, the transfer protective box comprises a square frame, wall plates or/and transparent observation plates positioned around the periphery of the square frame, and a wafer blanking opening positioned on the inner side of the middle part of the square frame; the fan assembly is installed in the upper space of the square frame, and directly enters air from the top and directly discharges air from the bottom.
Preferably, a horizontal partition plate is further arranged at the lower part of the square frame and sealed with the space cover at the lower part of the transfer plate.
Preferably, four side beams for bearing and installing the fan assembly are respectively arranged on the square frame corresponding to the periphery of the lower part of the fan assembly, and L-shaped fixing sheets for locking and fixing the fan assembly are respectively arranged at the two ends of the front side and the rear side of the square frame.
Preferably, a cross beam positioned right above the transfer plate is connected between two side beams at the left side and the right side of the square frame, and two ends of the cross beam are respectively lapped on the side beams at the two sides.
The beneficial effects of the utility model are as follows:
the top side of the transfer protection box is provided with a fan assembly which blows external air from top to bottom, an electrostatic eliminator which is arranged right above the transfer disc is arranged at an air port on the lower side of the fan assembly, a large amount of positive and negative charges generated by the electrostatic eliminator are blown by forward downward air flow of the fan assembly, a positive and negative charge air flow for neutralizing charges on the surface of a wafer is formed to eliminate static electricity on the upper surface and the lower surface of the wafer, and after static elimination is completed, the subsequent processing of the wafer is facilitated, and the processing quality of the wafer is improved.
[ description of the drawings ]
FIG. 1 is a schematic view of a partially exploded construction in an embodiment of the present utility model;
FIG. 2 is a schematic perspective view of an embodiment of the present utility model with the upper front sidewall panel removed;
reference numerals:
a. a supporting and leveling mechanism; 1. a base plate; 2. a support plate; 3. a receiving table; 4. an elastic float leveling assembly; 40. an adjusting screw; 41. leveling blocks; 42. an elastic floating support spring; 43. a stepped hole; 5. a guide post; 6. a spring receiving groove; 7. limiting angle blocks; 8. limit strakes; 9. a support pad; b. a rotation mechanism; 10. a rotation shaft; 11. a rotating bracket; 12. a bearing; 13. a bottom swing arm; 14. and a drive assembly.
[ detailed description ] of the utility model
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The embodiment provides a static electricity eliminating module for eliminating static electricity of a wafer after removing photoresist, as shown in fig. 1 and 2, which is used for eliminating static electricity before removing photoresist on the wafer or after removing photoresist on the wafer, and comprises two transfer trays 1 for supporting wafer transfer, wherein the transfer trays 1 are arranged at a wafer blanking port of a wafer photoresist removing cavity (not shown), and the transfer trays 1 are used for supporting the wafer from the outside and facilitating the wafer to be sent into the wafer photoresist removing cavity through the wafer blanking port for removing photoresist or receiving the wafer after removing photoresist sent from the wafer blanking port and waiting to be transferred to the outside; a transfer protective box 2 which is arranged at a front side part open and is used for enclosing and protecting the periphery of the transfer disc 1 is arranged at the position of the feeding opening on the wafer, and a wafer transfer cavity opening 3 which is convenient for transferring external wafers onto the transfer disc 1 or transferring the wafers out of the transfer disc 1 after the photoresist is removed is arranged at the front side open of the transfer protective box 2; the top side of the transfer protecting box 2 is provided with a fan assembly 4 which blows external air into the corresponding inner space of the transfer tray 1 from top to bottom and discharges the external air from the side at the positive pressure at the wafer transfer cavity opening 3.
As shown in fig. 1 and 2, a cross beam 5 with two ends fixed on two sides of the transfer protective box 2 and positioned right above the transfer tray 1 is transversely arranged at the air inlet at the lower side of the fan assembly 4, a static eliminator 6 for ionizing air to generate a large amount of positive and negative charges is arranged on the cross beam 5, and a large amount of positive and negative charges generated by the static eliminator 6 are blown by the forward downward air flow of the fan assembly 4 to form a positive and negative charge air flow for neutralizing charges on the surface of a wafer, so that static is eliminated on the wafer after photoresist removal or the upper and lower surfaces of the wafer transferred before photoresist removal respectively.
As shown in fig. 1 and 2, the transfer protective box 2 comprises a square frame 20, wall plates 21 and transparent observing plates 22 positioned around the periphery of the square frame 20, and a wafer blanking opening 23 positioned on the inner side of the middle part of the square frame 20, wherein the fan assembly 4 is arranged in the upper space of the square frame 20, directly enters air from the top and directly discharges air from the bottom, and a horizontal partition plate 24 for sealing the lower space of the transfer tray 1 is also arranged at the lower part of the square frame 20; four side beams 7 for carrying and installing the fan assembly 4 are respectively arranged on the corresponding square frames 20 on the periphery of the lower part of the fan assembly 4, L-shaped fixing sheets 8 for locking and fixing the fan assembly 4 are respectively arranged at the two ends of the front side and the rear side of the square frames 20, a cross beam 5 positioned right above the transfer disc 1 is connected between the two side beams 7 on the left side and the right side of the square frames 20, and two ends of the cross beam 5 are respectively lapped on the side beams 7 on the two sides.
In the embodiment, a fan assembly 4 for blowing external air from top to bottom is arranged on the top side of a transfer protective box 2, a static eliminator 6 positioned right above a transfer tray 1 is arranged at an air port on the lower side of the fan assembly 4, and when the transfer protective box works, a large amount of positive and negative charges generated by the static eliminator 6 form a positive and negative charge air flow for neutralizing charges on the surface of a wafer under the forward downward air flow blowing of the fan assembly 4; when the surface of the wafer is charged with positive charges, the wafer can attract the positive charges in the air flow, and when the surface of the wafer is charged with positive charges, the wafer can attract the negative charges in the current, so that static electricity on the surface of the wafer is neutralized, the aim of eliminating the static electricity is achieved, the subsequent processing of the wafer is facilitated after the static electricity elimination is completed, and the processing quality of the wafer is effectively improved.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "front", "rear", "left", "right", etc., are based on directions or positional relationships shown in the drawings, or directions or positional relationships in which the inventive product is conventionally put in use, are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present utility model.
The above embodiments are merely preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model, but all equivalent changes according to the shape, construction and principle of the present utility model are intended to be included in the scope of the present utility model.
Claims (5)
1. The static electricity eliminating module for eliminating static electricity of the wafer is used for eliminating static electricity of the wafer before or after removing the photoresist and is characterized by comprising at least one transfer disc for supporting wafer transfer, wherein the transfer disc is arranged at a wafer blanking opening of a wafer photoresist removing cavity and is used for supporting and facilitating external transfer of the wafer to the wafer photoresist removing cavity through the wafer blanking opening or receiving the wafer after removing the photoresist sent from the wafer blanking opening and waiting to be transferred to the outside;
a transfer protecting box which is arranged at the position of the discharging opening on the wafer, is provided with a front side local opening and is used for enclosing and protecting the periphery of the transfer disc, and a wafer transfer cavity opening which is convenient for transferring external wafers onto the transfer disc or transferring the wafers out after the glue removal of the transfer disc is arranged at the front side opening of the transfer protecting box;
a fan assembly which blows external air into the internal space corresponding to the transfer disc from top to bottom and discharges the external air from the positive pressure at the wafer transfer cavity port on the side is arranged on the top side of the transfer protective box;
the device is characterized in that a cross beam with two ends fixed on two sides of the transfer protective box and positioned right above the transfer disc is transversely arranged at a wind port on the lower side of the fan assembly, at least one static eliminator for ionizing air to generate a large amount of positive and negative charges is arranged on the cross beam, and the large amount of positive and negative charges generated by the static eliminator are blown by forward downward airflow of the fan assembly to form a positive and negative charge airflow for neutralizing charges on the surface of a wafer so as to eliminate static on the upper surface and the lower surface of the wafer.
2. The module according to claim, wherein the transfer protecting box comprises a square frame, wall plates or/and transparent observing plates around the periphery of the square frame, and a wafer discharging opening inside the middle of the square frame; the fan assembly is installed in the upper space of the square frame, and directly enters air from the top and directly discharges air from the bottom.
3. The static elimination module for eliminating static electricity of a photoresist-eliminating wafer according to claim 2, wherein a horizontal partition plate for sealing a space cover at the lower part of the transfer plate is further arranged at the lower part of the square frame.
4. The static electricity eliminating module for removing static electricity from a wafer according to claim 2, wherein four edge beams for carrying and installing the fan assembly are respectively arranged on the corresponding square frames on the periphery of the lower part of the fan assembly, and L-shaped fixing sheets for locking and fixing the fan assembly are respectively arranged at the two ends of the front side and the rear side of the square frames.
5. The module according to claim 4, wherein a beam located right above the transfer plate is connected between two side beams on the left and right sides of the square frame, and two ends of the beam are respectively overlapped with the side beams on the two sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320749553.1U CN219876218U (en) | 2023-04-04 | 2023-04-04 | Static electricity eliminating module for removing static electricity of photoresist removing wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320749553.1U CN219876218U (en) | 2023-04-04 | 2023-04-04 | Static electricity eliminating module for removing static electricity of photoresist removing wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219876218U true CN219876218U (en) | 2023-10-20 |
Family
ID=88331632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320749553.1U Active CN219876218U (en) | 2023-04-04 | 2023-04-04 | Static electricity eliminating module for removing static electricity of photoresist removing wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219876218U (en) |
-
2023
- 2023-04-04 CN CN202320749553.1U patent/CN219876218U/en active Active
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