CN116525486A - Wafer photoresist remover - Google Patents

Wafer photoresist remover Download PDF

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Publication number
CN116525486A
CN116525486A CN202310364927.2A CN202310364927A CN116525486A CN 116525486 A CN116525486 A CN 116525486A CN 202310364927 A CN202310364927 A CN 202310364927A CN 116525486 A CN116525486 A CN 116525486A
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CN
China
Prior art keywords
wafer
photoresist
transfer
leveling
elastic
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Pending
Application number
CN202310364927.2A
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Chinese (zh)
Inventor
李志强
赵义党
廖文晗
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Zhuhai Hengge Microelectronics Equipment Co ltd
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Zhuhai Hengge Microelectronics Equipment Co ltd
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Priority to CN202310364927.2A priority Critical patent/CN116525486A/en
Publication of CN116525486A publication Critical patent/CN116525486A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/10—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/42—Auxiliary equipment or operation thereof
    • B01D46/50—Means for discharging electrostatic potential
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/06—Carrying-off electrostatic charges by means of ionising radiation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a wafer photoresist remover, which comprises a material transferring working device and a photoresist removing device, wherein the photoresist removing device comprises a power source working box and plasma vacuum photoresist removing cavities, and the upper side of each plasma vacuum photoresist removing cavity is respectively connected with a power source; the material transferring working device comprises a material transferring working box, an automatic manipulator and at least one transferring disc mechanism; the transfer working box is a semi-closed frame box for enclosing and protecting the automatic manipulator and all transfer disc mechanisms, and a wafer transfer opening which is convenient for external wafer transfer such as wafer transfer after processing is formed in an opening of the frame box; the top side of the frame body box is provided with a dust removing fan component which is used for blowing external air into an inner space after dust removing and filtering, discharging the external air from a wafer transferring opening at the side in a positive pressure way and preventing the external air from entering a working space from the wafer transferring opening; the whole machine has compact structure and small occupied space, is convenient for full-automatically controlling the photoresist removal or mask removal of the wafer and preventing dust by positive pressure airflow in the feeding and discharging processes, and effectively improves the processing quality and the processing efficiency.

Description

Wafer photoresist remover
[ field of technology ]
The invention relates to a wafer processing technology, in particular to a wafer photoresist remover.
[ background Art ]
In the process of manufacturing semiconductor wafers, wafer handling techniques become an important factor affecting wafer production efficiency and manufacturing quality. In the wafer transfer process, wafer transfer needs to be carried out between each station, and in order to guarantee processing quality, levelness of a plane for placing the wafer needs to be adjusted so as to facilitate rapid transfer of the wafer. Meanwhile, in order to effectively avoid the pollution of dust or static electricity to the wafer in the feeding and discharging process, the yield is improved; a feeding protection cover is generally arranged on the feeding equipment and is used for covering a feeding conveying mechanism; simultaneously, a blanking protection cover is arranged on the blanking equipment and is used for covering a blanking conveying mechanism; wherein, still offered artifical quality control window on the material loading protective cover, be located personnel quality control station position department, make things convenient for personnel to carry out the quality control to the wafer.
In the wafer transferring process in the prior art, the wafer is horizontally positioned by pushing the wafer through the clamping jaw, the clamping jaw is easy to deviate or shake, the stability and the accuracy of positioning are difficult to ensure in the transferring process, the structure is complex, the operation is more troublesome, the positioning and the horizontal adjustment are inconvenient, if the horizontal state is very troublesome to adjust, a plurality of mechanism parts are required to be disassembled, the resetting and the locking are required to be carried out again, a quite long working hour is required to be consumed, and the operation process is extremely complicated.
In addition, in order to prevent the wafer from being polluted by dust or static electricity, a protective cover is arranged on the feeding equipment and the discharging equipment respectively, so that the opening and closing and sealing problems of the protective cover are needed to be considered in the feeding and discharging process of the wafer, the feeding and discharging conveying of the wafer is extremely inconvenient, the processing efficiency of the wafer is affected, in addition, the sealing problem of the feeding and discharging space is inevitably caused in the opening and closing process of the cover body, and then dust or static pollutant of the external air is caused to enter, so that the cleanliness of the processing environment cannot be effectively ensured.
[ invention ]
According to the wafer photoresist remover provided by the embodiment of the invention, the working cavity of the material transferring area discharges the filtered dust removing air outwards in a positive pressure manner to resist the entry of unfiltered air at the opening, so that effective dust prevention is realized, automatic feeding and discharging control of a wafer is conveniently realized, the whole structure is compact, the occupied space is small, and the processing quality and the processing efficiency of the wafer are effectively improved.
The technical scheme adopted by at least one embodiment of the invention is as follows:
the wafer photoresist remover is used for fully automatically controlling photoresist removal or mask removal of a wafer and positive pressure airflow dust prevention in the feeding and discharging processes and comprises a material transferring working device and a photoresist removing device, wherein the material transferring working device is horizontally connected with the photoresist removing device side by side;
the photoresist removing device comprises a power source working box and at least one plasma vacuum photoresist removing cavity which is positioned at the lower side of the power source working box and used for removing photoresist or masks of wafers in a full-automatic mode, and the upper side of each plasma vacuum photoresist removing cavity is connected with a power source positioned in the power source working box respectively;
the transfer working device comprises a transfer working box, an automatic manipulator for controlling automatic loading and unloading of the wafer and at least one transfer disc mechanism for supporting wafer transfer, wherein each transfer disc mechanism is correspondingly arranged at the corresponding position of a wafer unloading opening of each plasma vacuum photoresist removing cavity, and is used for supporting the wafer transferred from the outside and facilitating the removal of photoresist or mask fed into the plasma vacuum photoresist removing cavity through the wafer unloading opening, or receiving the wafer after the photoresist or mask is removed from the wafer unloading opening and waiting for transfer to the outside;
the transfer working box is a semi-closed frame box for enclosing and protecting the automatic mechanical arm and all the transfer disc mechanisms, a horizontal partition plate for sealing the transfer disc mechanism and a space cover at the lower part of the automatic mechanical arm is further arranged at the lower part of the frame box, and a wafer transfer opening which is convenient for transferring external wafers onto the transfer disc mechanism or transferring the processed wafers out of the transfer disc mechanism is formed at the opening at the opposite side of the frame box relative to the front side and the opposite side of the blanking opening of the wafer;
the top side of framework case is provided with outside air dust removal filtration back, from top to bottom drum into the automated mechanical arm with transfer the interior space that the dish mechanism corresponds, and follow the side the positive pressure of the open department is transported to the wafer is discharged and prevent outside non-dust removal air from transporting the open entering from the wafer automated mechanical arm with transfer the dust removal fan subassembly of the corresponding working space of dish mechanism.
Preferably, the dust removal fan assembly comprises a top fan, a top fan cover, a fan mounting frame and a dust removal filter screen, wherein the top fan is arranged at a blast hole in the middle of the top side of the top fan cover and is fixedly mounted through the fan mounting frame connected with the inner side of the top fan cover, and the dust removal filter screen is mounted at an air outlet in the lower side of the top fan cover and is used for dust removal and filtration of air blown into the inner space of the automatic manipulator and the transfer disc mechanism.
Preferably, a cross beam with two ends fixed on two sides of the frame box and positioned right above the transfer disc mechanism is also transversely arranged at the lower side air port of the dust removal fan assembly, at least one static eliminator for ionizing air to generate a large amount of positive and negative charges is arranged on the cross beam, and the large amount of positive and negative charges generated by the static eliminator are blown by the positive and negative air flow of the dust removal fan assembly to form a positive and negative charge air flow for neutralizing charges on the surface of a wafer so as to eliminate static on the upper surface and the lower surface of the wafer.
Preferably, the material transferring working device further comprises a coiled cooling disc which is arranged in the material transferring working box and used for cooling the wafer after the photoresist or mask supported on the transferring disc mechanism is removed.
Preferably, each of the transfer tray mechanisms comprises:
the bearing and leveling assembly comprises a base plate used for fixed installation, a supporting plate used for leveling and supporting an elastic floating support, a bearing table used for bearing wafers in the feeding and discharging processes and at least three groups of elastic floating support leveling pieces, wherein all the elastic floating support leveling pieces are uniformly distributed around the center of the bearing table and are respectively used for adjusting elastic pretightening force relative to the supporting plate along a plurality of angles in the circumferential direction to control the elastic floating quantity of each angle in the circumferential direction of the bearing table so as to adjust the levelness of the control table top;
the supporting plate is arranged on the upper side of the base plate in a superposition manner, at least two guide posts used for guiding the bearing table in a sliding manner along the vertical direction are arranged on the supporting plate at intervals, and elastic element accommodating grooves for accommodating and fixing the elastic elements to elastically float the supporting plate are respectively arranged on the supporting plate corresponding to each group of elastic float leveling elements;
the rotating assembly is fixedly arranged at the center of the lower side of the base plate of the supporting and leveling assembly and used for driving the bearing table on the supporting and leveling assembly to rotate clockwise and anticlockwise by a certain angle respectively so as to facilitate loading or unloading at the wafer alignment position.
Preferably, each group of elastic floating supporting leveling pieces comprises an adjusting screw, a leveling block and at least three groups of elastic floating supporting springs, the elastic floating supporting springs are uniformly arranged and installed in elastic piece accommodating grooves formed in the supporting plate, and stepped holes which are convenient for the elastic floating supporting springs to penetrate and install are formed in the supporting table and correspond to the upper sides of the elastic piece accommodating grooves;
the leveling block is locked and installed in the stepped hole through the adjusting screw, and the bottom surface of the leveling block is elastically contacted with the top ends of all the elastic floating springs; the elastic floating amount of each angle in the circumferential direction of the bearing table is adjusted by adjusting the elastic floating force between the leveling block and the elastic floating spring through the adjusting screw, so that the levelness of the table top of the bearing table is adjusted.
Preferably, both sides and opposite sides of the circumferential outer edge of the bearing table, which are opposite to the discharging position on the wafer, are respectively provided with a limiting angle block and a limiting edge strip for limiting the falling of the wafer.
Preferably, the center of the receiving table is also provided with a supporting pad for horizontally supporting the wafer.
Preferably, the rotating assembly comprises a rotating shaft, a rotating bracket, two bearings, a bottom swing arm and a driving piece, wherein a base plate of the bearing and leveling assembly is fixedly arranged at the top end of the rotating shaft, and the rotating shaft is rotatably arranged on the rotating bracket through the two bearings; the bottom swing arm one end is sleeved and buckled and connected to the bottom end of the rotating shaft, the other end of the bottom swing arm is hinged with the driving piece, and the driving piece drives the bearing table on the bearing and leveling assembly to respectively rotate positively and negatively for a certain angle to feed or discharge the wafer under the pushing of the driving piece.
Preferably, the driving piece is a driving air cylinder adopting pneumatic control, and a piston rod of the driving air cylinder is hinged to the free end of the bottom swing arm.
The beneficial effects of the invention are as follows:
in the invention, the working cavity of the material transferring area discharges the filtered dust removing air outwards in positive pressure to resist the entry of unfiltered air at the opening, thereby realizing effective dust prevention, facilitating the automatic feeding and discharging and feeding and discharging control of the wafer, and the transfer disc mechanism is convenient for manual leveling and automatic alignment feeding and discharging control, so that the whole structure is compact, the occupied space is small, and the processing quality and the processing efficiency of the wafer are effectively improved
Especially, compared with the prior art that the clamping jaw pushes the wafer to horizontally position, the stability and the accuracy of positioning are difficult to ensure, the transfer disc mechanism provided by the invention has the advantages that the manual adjustment bearing and leveling assembly is arranged, the elastic pretightening force is adjusted relative to the supporting plate along a plurality of angles in the circumferential direction, the elastic floating quantity of each angle in the circumferential direction of the bearing table is controlled to adjust the levelness of the control table top, the structure is compact, the adjustment is convenient, the automatic control of the feeding and discharging of the wafer is effectively realized, and the processing quality and the processing efficiency of the wafer are effectively improved.
In addition, compared with a cover body sealing mode in the wafer transferring process in the prior art, the invention adopts a mode of discharging positive pressure filtered air outwards through the dust removing fan assembly, and external air is blown into an internal space corresponding to the automatic manipulator and the transferring disc mechanism after dust removing and filtering and is discharged from the positive pressure of the wafer transferring opening, so that positive pressure air flow which is discharged outwards is formed in the transferring working box, and external dust-free air is prevented from entering a working space corresponding to the discharging opening on the wafer from the wafer transferring opening, namely, filtered dust removing air is discharged outwards at positive pressure to resist the entry of unfiltered air at the opening, thereby realizing effective dust prevention; meanwhile, the static eliminator is arranged at the lower side air port of the dust removal fan assembly and positioned right above the transfer disc mechanism, after the wafer is removed of glue or mask, the static eliminator is started, a large amount of positive and negative charges generated are blown by the forward downward air flow of the top fan to form a positive and negative charge air flow for neutralizing charges on the surface of the wafer, so that static elimination is carried out on the upper surface and the lower surface of the wafer, synchronous operation of dust prevention and static elimination is realized, and multifunctional protection of one machine is achieved.
[ description of the drawings ]
FIG. 1 is a schematic view of a partial explosion in an embodiment of the present invention;
FIG. 2 is a schematic diagram of a main body explosion structure in an embodiment of the invention;
FIG. 3 is a schematic perspective view of an embodiment of the present invention;
FIG. 4 is a schematic view of a left-view enlarged structure of a glue removing device according to an embodiment of the invention;
FIG. 5 is a schematic diagram of a right-view enlarged structure of the adhesive removing device according to an embodiment of the present invention;
FIG. 6 is a schematic view of an exploded main body part of a material transferring device according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a left-hand perspective structure of a transfer working apparatus according to an embodiment of the present invention;
FIG. 8 is a right side perspective view of a material transferring device according to an embodiment of the present invention;
FIG. 9 is an enlarged schematic view of an exploded construction of a transfer plate mechanism according to an embodiment of the present invention;
FIG. 10 is an enlarged schematic view of a cross-sectional structure of a main body of a turntable mechanism according to an embodiment of the present invention;
FIG. 11 is an enlarged schematic view of a front perspective of a transfer plate mechanism according to an embodiment of the present invention;
FIG. 12 is an enlarged schematic view of a rear perspective of a transfer plate mechanism according to an embodiment of the present invention;
fig. 13 is an enlarged schematic top perspective view of a tray mechanism according to an embodiment of the present invention.
[ detailed description ] of the invention
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The wafer photoresist remover provided by the embodiment is used for fully automatically controlling photoresist removal or mask removal of a wafer and positive pressure airflow dust prevention and static elimination in the feeding and discharging processes as shown in fig. 1 to 5, and comprises a photoresist removing device a and a material transferring working device b, wherein the material transferring working device b is horizontally connected with the photoresist removing device a side by side; the photoresist removing device a comprises a power source working box 1 and two plasma vacuum photoresist removing cavities 2 which are arranged in parallel and positioned at the lower side of the power source working box 1 and used for full-automatic photoresist removing or mask removing of a wafer, wherein the upper side of each plasma vacuum photoresist removing cavity 2 is respectively connected with a power source 3 positioned in the power source working box 1; the transfer working device b comprises a transfer working box 4, an automatic mechanical arm 5 for controlling automatic loading and unloading of wafers and two transfer disc mechanisms 6 for supporting wafer transfer, wherein each transfer disc mechanism 6 is correspondingly arranged at the corresponding position of a wafer blanking opening 7 of each plasma vacuum photoresist removing cavity 2, the transfer disc mechanism 6 is used for supporting the wafers from the outside and facilitating the removal of photoresist or masks fed into the plasma vacuum photoresist removing cavities 2 from the wafer blanking opening 7 through the automatic mechanical arm 5, or the transfer disc mechanism 6 is controlled by the automatic mechanical arm 5 to receive the removed photoresist or masks fed from the wafer blanking opening to remove the wafers and wait for transferring the wafers to the outside.
As shown in fig. 1 to 3 and fig. 6 to 8, the transfer working box 4 is a semi-closed frame box for enclosing and protecting the automatic mechanical arm 5 and all transfer tray mechanisms 6, a horizontal partition plate 8 for sealing the space covers at the lower parts of the transfer tray mechanisms 6 and the automatic mechanical arm 5 is further arranged at the lower part of the frame box, a side opening opposite to a feed opening 7 on a wafer is provided with a wafer transfer opening 9 for facilitating external wafers to be transferred onto the transfer tray mechanisms 6 or processed wafers to be transferred out through the transfer tray mechanisms 6, infrared alarms 10 for warning human bodies to erroneously extend into the working cavities of the box are respectively arranged at two sides of the wafer transfer opening 9, and the wall plates of the transfer working box 4 corresponding to two sides of the wafer transfer opening 9 are transparent plates. The top side of the frame body box is provided with a dust removing fan assembly 11 which is used for removing dust and filtering outside air, blowing the outside air into an inner space corresponding to the automatic mechanical arm 5 and the transfer disc mechanism 6 from top to bottom, discharging the outside air from the positive pressure at the wafer transfer opening 9 at the side and preventing the outside non-dust removing air from entering the working space corresponding to the automatic mechanical arm 5 and the transfer disc mechanism 6 from the wafer transfer opening 9. The lower side air port of the dust removing fan assembly 11 is transversely provided with a cross beam 12 with two ends fixed on two sides of the frame body box and positioned right above the transfer disc mechanism 6, the cross beam 12 is provided with at least one static eliminator 13 for ionizing air to generate a large amount of positive and negative charges, and the positive and negative charges generated by the static eliminator 13 are blown by the forward downward air flow of the dust removing fan assembly 11 to form a positive and negative charge air flow for neutralizing charges on the surface of the wafer so as to eliminate static on the upper surface and the lower surface of the wafer.
Compared with the sealing mode of the cover body in the wafer transferring process in the prior art, in the embodiment, the mode of discharging positive pressure filtered air outwards through the dust removing fan assembly 11 is adopted, external air is blown into the internal space corresponding to the automatic mechanical arm 5 and the transferring disc mechanism 6 after dust removing and filtering, and positive pressure is discharged from the position of the wafer transferring opening 9, so that positive pressure air flow which is discharged outwards is formed in the transferring working box 4, the external non-dust removing air is prevented from entering the working space corresponding to the blanking opening on the wafer from the wafer transferring opening 9, namely, the filtered dust removing air is discharged outwards by positive pressure to resist the non-filtered air at the opening to enter, and effective dust prevention is realized; meanwhile, the static eliminator positioned right above the transfer disc mechanism 6 is arranged at the lower side air port of the dust removal fan assembly 11, after the wafer is removed of glue or mask, the static eliminator is started, a large amount of generated positive and negative charges are blown by the forward downward air flow of the top fan 110 to form a positive and negative charge air flow for neutralizing the charges on the surface of the wafer, so that static elimination is carried out on the upper surface and the lower surface of the wafer, synchronous operation of dust prevention and static elimination is realized, and multifunctional protection of one machine is achieved.
As shown in fig. 6 to 8, the dust removing fan assembly 11 includes a top fan 110, a top fan housing 111, a fan mounting frame 112 and a dust removing filter screen 113, wherein the top fan 110 is disposed at a blast port in the middle of the top side of the top fan housing 111 and is fixedly mounted through the fan mounting frame 112 connected to the inner side of the top fan housing 111, and the dust removing filter screen 113 is mounted at an air outlet in the lower side of the top fan housing 111 and is used for dust removing and filtering air blown into the inner space of the automatic manipulator 5 and the transfer disc mechanism 6.
As shown in fig. 1 to 3, the transferring working device b further includes a coiled cooling disc 14 disposed in the transferring working box 4 for cooling the wafer after removing the photoresist or mask supported on the transferring disc mechanism 6; in this embodiment, during use, the wafers in the transfer working box 4 are cooled by air under the action of the dust removal fan assembly 11 by heat exchange of the external liquid nitrogen pipeline connected with the machine and the coil cooling disc 14.
Each transfer plate mechanism 6 is used for leveling and automatic alignment feeding and discharging control in the process of feeding and discharging wafers respectively, as shown in fig. 9 to 13, the transfer plate mechanism 6 comprises a bearing and leveling assembly 60 and a rotating assembly 61, the bearing and leveling assembly 60 comprises a base plate 15 for fixed installation, a supporting plate 16 for leveling and supporting an elastic floating support, a carrying table 17 for carrying the wafers in the process of feeding and discharging and three groups of elastic floating support leveling pieces 18, all the elastic floating support leveling pieces 18 are uniformly distributed around the center of the carrying table 17, and are respectively used for adjusting elastic pre-tightening force relative to the supporting plate 16 along three angles in the circumferential direction to control the elastic floating amount of each angle in the circumferential direction of the carrying table 17 so as to adjust the levelness of the control table surface; the supporting plate 16 is arranged on the upper side of the base plate 15 in a superposition way, two guide posts 19 which are arranged diagonally and used for guiding the bearing table 17 in a sliding way along the vertical direction are distributed on the supporting plate 16 at intervals, and elastic element accommodating grooves 20 which are used for accommodating and fixing elastic elements to elastically float the supporting plate 16 are respectively arranged on the supporting plate 16 corresponding to each group of elastic float leveling elements 18; the rotating assembly 61 is fixedly installed at the center of the lower side of the base plate 15 of the supporting and leveling assembly 60, and the supporting table 17 for driving the supporting and leveling assembly 60 to rotate circumferentially and positively rotates for a certain angle respectively, so that the wafer alignment position can be conveniently fed or discharged.
As shown in fig. 9 and 10, each group of elastic floating leveling members 18 comprises an adjusting screw 180, a leveling block 181 and three groups of elastic floating springs 182, wherein the elastic floating springs 182 are uniformly arranged in elastic member accommodating grooves 20 arranged on a supporting plate 16, and stepped holes 183 which are convenient for the elastic floating springs 182 to penetrate and be installed are formed on the upper side of the supporting table 17 corresponding to the elastic member accommodating grooves 20; the leveling block 181 is locked and installed in the stepped hole 183 through the adjusting screw 180, and the bottom surface of the leveling block 181 is elastically contacted with the top ends of all the elastic floating springs 182; the elastic floating amount of each angle in the circumferential direction of the bearing table 17 is adjusted by adjusting the elastic floating force between the leveling block 181 and the elastic floating spring 182 through the adjusting screw 180, so that the table surface levelness of the bearing table 17 is adjusted.
As shown in fig. 9, 10 and 11, a limiting corner block 21 and a limiting edge 22 for limiting the falling of the wafer are respectively arranged on two sides and opposite sides of the circumferential outer edge of the carrying table 17 opposite to the blanking position on the wafer, and two supporting pads 23 which are arranged at intervals and used for horizontally supporting the wafer are also arranged in the center of the carrying table 17.
As shown in fig. 9 to 13, the rotating assembly 61 includes a rotating shaft 24, a rotating bracket 25, two bearings 26, a bottom swing arm 27 and a driving member 28, the base plate 15 of the supporting and leveling assembly 60 is mounted and fixed on the top end of the rotating shaft 24, and the rotating shaft 24 is rotatably mounted on the rotating bracket 25 through the two bearings 26; one end of the bottom swing arm 27 is sleeved and buckled at the bottom end of the rotating shaft 24, the other end of the bottom swing arm 27 is hinged with the driving piece 28, and the bearing table 17 on the bearing and leveling assembly 60 is driven by the driving piece 28 to respectively rotate positively and negatively for a certain angle to feed or discharge the wafer; in this example, the driving member 28 is a driving cylinder controlled pneumatically, and a piston rod of the driving cylinder is hinged to a free end of the bottom swing arm 27.
In the working process, after the levelness of the supporting table 17 does not meet the requirement after long-time use, the adjustment screws 180 on each group of elastic floating leveling pieces 18 are respectively adjusted in a manual mode through the three groups of elastic floating leveling pieces 18 arranged in the circumferential direction, the elastic pre-tightening force is respectively adjusted along the three angles in the circumferential direction to control the elastic floating amount of each angle in the circumferential direction of the supporting table 17 to adjust the levelness of the control table surface, and the method is simple and convenient, effectively provides the platform precision in the process after the wafer loading, and effectively improves the processing quality and the processing efficiency of the wafer.
When the wafer loading and unloading device is used, after the levelness of the bearing table 17 on the bearing and leveling assembly 60 meets the requirement, the wafer on the bearing and leveling assembly 60 is driven to rotate in the circumferential direction by the rotating assembly 61 to respectively rotate forward and backward for a certain angle to carry out loading or unloading, so that the automatic control of the processing process is effectively realized.
In the description of the present invention, it should be noted that, the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship in which the inventive product is conventionally put in use, are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore, should not be construed as limiting the present invention.
The above embodiments are merely preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, but all equivalent changes according to the shape, construction and principle of the present invention are intended to be included in the scope of the present invention.

Claims (10)

1. The wafer photoresist remover is used for fully automatically controlling photoresist removal or mask removal of a wafer and positive pressure airflow dust prevention in the feeding and discharging processes, and is characterized by comprising a material transferring working device and a photoresist removing device, wherein the material transferring working device is horizontally connected with the photoresist removing device side by side;
the photoresist removing device comprises a power source working box and at least one plasma vacuum photoresist removing cavity which is positioned at the lower side of the power source working box and used for removing photoresist or masks of wafers in a full-automatic mode, and the upper side of each plasma vacuum photoresist removing cavity is connected with a power source positioned in the power source working box respectively;
the transfer working device comprises a transfer working box, an automatic manipulator for controlling automatic loading and unloading of the wafer and at least one transfer disc mechanism for supporting wafer transfer, wherein each transfer disc mechanism is correspondingly arranged at the corresponding position of a wafer unloading opening of each plasma vacuum photoresist removing cavity, and is used for supporting the wafer transferred from the outside and facilitating the removal of photoresist or mask fed into the plasma vacuum photoresist removing cavity through the wafer unloading opening, or receiving the wafer after the photoresist or mask is removed from the wafer unloading opening and waiting for transfer to the outside;
the transfer working box is a semi-closed frame box for enclosing and protecting the automatic mechanical arm and all the transfer disc mechanisms, a horizontal partition plate for sealing the transfer disc mechanism and a space cover at the lower part of the automatic mechanical arm is further arranged at the lower part of the frame box, and a wafer transfer opening which is convenient for transferring external wafers onto the transfer disc mechanism or transferring the processed wafers out of the transfer disc mechanism is formed at the opening at the opposite side of the frame box relative to the front side and the opposite side of the blanking opening of the wafer;
the top side of framework case is provided with outside air dust removal filtration back, from top to bottom drum into the automated mechanical arm with transfer the interior space that the dish mechanism corresponds, and follow the side the positive pressure of the open department is transported to the wafer is discharged and prevent outside non-dust removal air from transporting the open entering from the wafer automated mechanical arm with transfer the dust removal fan subassembly of the corresponding working space of dish mechanism.
2. The wafer photoresist remover according to claim 1, wherein the dust removing fan assembly comprises a top fan, a top fan cover, a fan mounting frame and a dust removing filter screen, wherein the top fan is arranged at a blast port in the middle of the top side of the top fan cover and is fixedly mounted through the fan mounting frame connected with the inner side of the top fan cover, and the dust removing filter screen is mounted at an air outlet in the lower side of the top fan cover and is used for removing dust and filtering air blown into the inner space of the automatic manipulator and the transfer disc mechanism.
3. The wafer photoresist remover according to claim 1 or 2, wherein a cross beam with two ends fixed on two sides of the frame box and positioned right above the transfer disc mechanism is further transversely arranged at the lower side air port of the dust removal fan assembly, at least one static eliminator for ionizing air to generate a large amount of positive and negative charges is arranged on the cross beam, and the large amount of positive and negative charges generated by the static eliminator are blown by the forward downward air flow of the dust removal fan assembly to form a positive and negative charge air flow for neutralizing charges on the wafer surface so as to eliminate static on the upper surface and the lower surface of the wafer.
4. The wafer photoresist remover according to claim 1, wherein the material transferring device further comprises a coiled cooling plate arranged in the material transferring working box for cooling the wafer after photoresist removal or mask removal carried on the transferring plate mechanism.
5. The wafer photoresist remover according to claim 1, wherein each of said transfer disc mechanisms comprises:
the bearing and leveling assembly comprises a base plate used for fixed installation, a supporting plate used for leveling and supporting an elastic floating support, a bearing table used for bearing wafers in the feeding and discharging processes and at least three groups of elastic floating support leveling pieces, wherein all the elastic floating support leveling pieces are uniformly distributed around the center of the bearing table and are respectively used for adjusting elastic pretightening force relative to the supporting plate along a plurality of angles in the circumferential direction to control the elastic floating quantity of each angle in the circumferential direction of the bearing table so as to adjust the levelness of the control table top;
the supporting plate is arranged on the upper side of the base plate in a superposition manner, at least two guide posts used for guiding the bearing table in a sliding manner along the vertical direction are arranged on the supporting plate at intervals, and elastic element accommodating grooves for accommodating and fixing the elastic elements to elastically float the supporting plate are respectively arranged on the supporting plate corresponding to each group of elastic float leveling elements;
the rotating assembly is fixedly arranged at the center of the lower side of the base plate of the supporting and leveling assembly and used for driving the bearing table on the supporting and leveling assembly to rotate clockwise and anticlockwise by a certain angle respectively so as to facilitate loading or unloading at the wafer alignment position.
6. The wafer photoresist remover according to claim 5, wherein each group of elastic floating leveling pieces comprises an adjusting screw, a leveling block and at least three groups of elastic floating springs, the elastic floating springs are uniformly arranged in elastic piece accommodating grooves formed in the supporting plate, and stepped holes which are formed in the bearing table and correspond to the upper sides of the elastic piece accommodating grooves and are convenient for the elastic floating springs to penetrate through and install;
the leveling block is locked and installed in the stepped hole through the adjusting screw, and the bottom surface of the leveling block is elastically contacted with the top ends of all the elastic floating springs; the elastic floating amount of each angle in the circumferential direction of the bearing table is adjusted by adjusting the elastic floating force between the leveling block and the elastic floating spring through the adjusting screw, so that the levelness of the table top of the bearing table is adjusted.
7. The wafer photoresist remover according to claim 5, wherein the two sides and the opposite sides of the peripheral outer edge of the receiving table opposite to the discharging position on the wafer are respectively provided with a limiting corner block and a limiting edge for limiting the falling of the wafer.
8. The wafer photoresist remover of claim 5, wherein the center of the receiving table is further provided with a support pad for horizontally supporting the wafer.
9. The wafer photoresist remover according to claim 5, wherein said rotating assembly comprises a rotating shaft, a rotating bracket, two bearings, a bottom swing arm and a driving member, wherein the base plate of said support and leveling assembly is mounted and fixed on the top end of said rotating shaft, and said rotating shaft is rotatably mounted on said rotating bracket through two bearings; the bottom swing arm one end is sleeved and buckled and connected to the bottom end of the rotating shaft, the other end of the bottom swing arm is hinged with the driving piece, and the driving piece drives the bearing table on the bearing and leveling assembly to respectively rotate positively and negatively for a certain angle to feed or discharge the wafer under the pushing of the driving piece.
10. The wafer photoresist remover according to claim 9, wherein the driving member is a driving cylinder controlled pneumatically, and the piston rod of the driving cylinder is hinged to the free end of the bottom swing arm.
CN202310364927.2A 2023-04-04 2023-04-04 Wafer photoresist remover Pending CN116525486A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310364927.2A CN116525486A (en) 2023-04-04 2023-04-04 Wafer photoresist remover

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310364927.2A CN116525486A (en) 2023-04-04 2023-04-04 Wafer photoresist remover

Publications (1)

Publication Number Publication Date
CN116525486A true CN116525486A (en) 2023-08-01

Family

ID=87402107

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310364927.2A Pending CN116525486A (en) 2023-04-04 2023-04-04 Wafer photoresist remover

Country Status (1)

Country Link
CN (1) CN116525486A (en)

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