CN219873407U - Ball-planting mould structure - Google Patents
Ball-planting mould structure Download PDFInfo
- Publication number
- CN219873407U CN219873407U CN202320994358.5U CN202320994358U CN219873407U CN 219873407 U CN219873407 U CN 219873407U CN 202320994358 U CN202320994358 U CN 202320994358U CN 219873407 U CN219873407 U CN 219873407U
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- die plate
- die
- ball
- template
- conical
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 20
- 238000010276 construction Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a ball planting die structure, which is characterized in that a plurality of conical supporting parts are uniformly arranged on the bottom end surface of a die plate, conical grooves are formed between the conical supporting parts correspondingly, air holes are formed in the middle of the conical grooves and are connected with the top end surface of the die plate, a die plate is magnetically attracted and fixed by a magnetic piece of the die plate, the die plate is covered on the bottom end surface of the die plate, the conical supporting parts of the die plate are utilized to firmly lean against the die plate, tin ball sucking holes are formed in the die plate at positions corresponding to the positions where tin balls are required to be distributed on an IC chip, and the conical grooves of the die plate respectively correspond to the tin ball sucking holes; therefore, when the positions of the solder balls required to be distributed on the IC chip are changed, the mould plate does not need to be replaced, the mould plate can be simply and quickly replaced for construction operation, the working hours are effectively saved, the efficiency is improved, the manufacturing cost can be reduced, and the practical effect characteristic is improved in the whole implementation and use.
Description
Technical Field
The utility model relates to the field of IC chips, in particular to a ball-planting die structure.
Background
Due to the continuous progress of the electronic industry technology, the requirements of quality, speed, precision and the like of various related devices applied in the manufacturing process of electronic products are gradually improved; with the increase of various operation functions of various IC chips, circuits formed by packaging are relatively more, and meanwhile, pins required by various IC chips are relatively more, the ball grid array package (Ball Grid Array Package, BGA) can be applied to packages with high density and high integrated number, and has the advantages of sufficient heat dissipation path, better electrical property, low height of solder balls, thin packaging, difficult deformation of solder balls and the like, so the ball grid array package (Ball Grid Array Package, BGA) becomes the mainstream of the current multi-pin IC chip package.
The ball grid array packaging technology comprises the steps of utilizing a ball planting machine die to carry out solder ball arrangement, and then moving the arranged solder balls to an IC chip by using a transfer device so as to enable the solder balls to be connected with pins arranged on the IC chip; the general ball-planting machine mould is mainly characterized in that a plurality of hole areas are formed on the mould, and a plurality of ball suction holes corresponding to pins of the IC chip are arranged in each hole area, so that when a vacuum suction device connected with the mould sucks air, tin balls can be adsorbed on each ball suction hole of the mould, and the tin balls can be quickly and simply arranged.
However, although the above-mentioned ball-planting machine die can achieve the expected effect of arranging solder balls rapidly and simply, it is found that in practical operation and use, the positions of the ball-sucking holes in each hole area of the ball-planting machine die are fixed and cannot be changed, so that when the positions of the solder balls required to be arranged on the IC chip are changed, the ball-planting machine die cannot be suitable for the changed IC chip, and a new die corresponding to the positions of the solder balls arranged on the IC chip needs to be manufactured again.
Disclosure of Invention
The utility model aims to provide a ball-planting die structure, which can simply and rapidly replace a die plate to perform construction operation without replacing a die plate when the positions of solder balls required to be distributed on an IC chip are changed, thereby effectively saving working hours, improving efficiency and reducing manufacturing cost.
The implementation purpose of the utility model is mainly realized by the following technical scheme:
the utility model provides a ball planting mold structure, which comprises: die holder, template and mold piece; wherein:
the die holder is used for being combined with the machine table in a combined way, an air suction slot is formed in the middle of the die holder, and a connecting part is formed at the periphery of the air suction slot;
the template is combined and positioned with the assembling part, the template covers the air suction slot, a plurality of conical supporting parts are uniformly arranged and formed on the bottom end surface of the template, conical grooves are formed among the conical supporting parts, the middle of each conical groove is connected with the top end surface of the template and provided with an air hole, the air hole is connected and communicated with the air suction slot, and a plurality of magnetic pieces are arranged on the bottom end surface of the template;
the die plate is magnetically attracted and fixed with the magnetic piece of the die plate, the die plate covers the bottom end surface of the die plate, each conical supporting part of the die plate is firmly abutted against the die plate, tin ball suction holes are formed in the die plate at positions corresponding to positions where tin balls are required to be distributed on the IC chip, and each conical groove of the die plate corresponds to each tin ball suction hole.
The utility model relates to a preferred embodiment of a ball-planting mould structure, wherein the assembling part is provided with a plurality of assembling pieces, the periphery of the template is provided with assembling holes which can be combined with the assembling pieces corresponding to the assembling pieces, and the template and the assembling part are assembled and positioned.
In a preferred embodiment of the ball-implanting mold structure of the present utility model, the periphery of the mold plate is integrally formed at the assembling portion of the mold base.
In a preferred embodiment of the ball-planting mold structure of the present utility model, the magnetic member is disposed at a periphery of a bottom surface of the mold plate.
In a preferred embodiment of the ball-planting mold structure of the present utility model, the magnetic member is disposed at a middle position between a periphery of a bottom surface of the mold plate and the bottom surface of the mold plate.
In a preferred embodiment of the present utility model, the magnetic member is embedded in the mold plate.
In a preferred embodiment of the present utility model, the magnetic member is embedded in a combining hole concavely formed in the mold plate.
Compared with the prior art, the technical scheme provided by the utility model has the following characteristics and advantages:
the novel ball-planting die structure enables the die to be simply and rapidly replaced without replacing the die plate for construction operation when the position of the solder balls required to be distributed on the IC chip is changed, thereby effectively saving working hours, improving efficiency and reducing manufacturing cost.
Drawings
Fig. 1 is a schematic perspective exploded view of the present utility model.
Fig. 2 is a schematic view of a three-dimensional combination structure of the present utility model.
Fig. 3 is a partially enlarged sectional view of the combined structure of the present utility model.
Fig. 4 is a schematic view of a partially exploded perspective view of a form according to the present utility model.
Fig. 5 is a schematic perspective exploded view of another embodiment of the present utility model.
Reference numerals illustrate:
1. a die holder; 11. air suction slotting; 12. a connecting part; 121. assembling pieces;
2. a template; 21. a connecting hole; 22. a tapered support portion; 23. a conical groove; 24. air holes; 25. a magnetic member;
251. a coupling hole;
3. a die; 31. a solder ball suction hole;
4. solder balls.
Detailed Description
For a more complete and clear disclosure of the technical content, objects and effects achieved by the present utility model, please refer to the accompanying drawings and figures, which are listed below:
first, referring to fig. 1, which is a schematic diagram of a three-dimensional exploded structure of the present utility model, fig. 2, which is a schematic diagram of a three-dimensional combined structure of the present utility model, and fig. 3, which is a schematic diagram of a partially enlarged combined cross-sectional structure of the present utility model, the present utility model includes: the die comprises a die holder 1, a die plate 2 and a die sheet 3; wherein:
the die holder 1 is used for being combined with a machine table, an air suction slot 11 is formed in the middle of the die holder 1, a connecting part 12 is formed at the periphery of the air suction slot 11, and a plurality of connecting pieces 121 are arranged at the connecting part 12.
Referring to fig. 4 again to show a partially exploded structure of the die plate of the present utility model, the periphery of the die plate 2 is formed with a connecting hole 21 corresponding to the connecting piece 121 of the connecting portion 12 of the die holder 1, so that the die plate 2 can be assembled with the connecting portion 12, and the die plate 2 is covered outside the air intake slot 11, a plurality of tapered supporting portions 22 are uniformly arranged on the bottom surface of the die plate 2, a tapered slot 23 is formed between the tapered supporting portions 22, the middle of each tapered slot 23 is connected with the top surface of the die plate 2 and is provided with an air hole 24, the air hole 24 is connected and conducted with the air intake slot 11, and a plurality of magnetic members 25 are disposed on the periphery of the die plate 2 or at the middle position of the periphery of the die plate 2 and the die plate 2, so that the magnetic members 25 are embedded in the die plate 2 or the magnetic members 25 are embedded in the connecting holes 251 concavely provided in the die plate 2.
The die 3 is magnetically fixed by the magnetic piece 25 of the die plate 2, and the die 3 is covered on the bottom surface of the die plate 2, and the conical supporting parts 22 of the die plate 2 can be firmly abutted against the die 3 to prevent the die 3 from bending and deforming, and solder ball sucking holes 31 are formed on the die 3 at positions corresponding to positions where the solder balls 4 of the IC chip are required to be arranged, and the conical grooves 23 of the die plate 2 respectively correspond to the plurality of solder ball sucking holes 31.
The die holder 1 and the die plate 2 can be separately arranged for combination, and referring to fig. 5, another embodiment of the utility model is shown in a three-dimensional exploded structure, wherein the die holder 1 and the die plate 2 can be integrally formed, so that the periphery of the die plate 2 is integrally formed at the assembling portion 12 of the die holder 1, and the die plate 2 is covered outside the air suction slot 11.
Therefore, in the operation and use of the utility model, the die holder 1 and a machine can be combined, the suction slot 11 of the die holder 1 is vacuumized by the machine to generate negative pressure, the generated negative pressure generates suction force to the conical slots 23 through the air holes 24 of the die plate 2, and the generated suction force can suck the solder balls 4 through the solder ball sucking holes 31 on the die plate 3; when the position of the solder ball to be arranged on the IC chip is changed, the thickness of the die sheet 3 is thinner, and the construction is simple and quick, so that the die sheet 3 is separated from the magnetic adsorption state of the die plate 2, and a new die sheet 3 is convenient to replace.
Compared with the existing structure, the utility model mainly ensures that the ball-planting die does not need to replace a template when the position of the solder balls required to be distributed on the IC chip changes, can simply and rapidly replace the template to perform construction operation, effectively saves working hours, improves efficiency, can reduce manufacturing cost, and increases practical effect characteristics on the whole implementation and use.
Claims (7)
1. Ball mould structure is planted, a serial communication port includes: die holder, template and mold piece; wherein,,
the die holder is used for being combined with the machine table in a combined mode, an air suction slot is formed in the middle of the die holder, and a connecting part is formed at the periphery of the air suction slot;
the template is combined and positioned with the assembling parts, the template covers the air suction grooves, a plurality of conical supporting parts are uniformly arranged on the bottom end surface of the template, conical grooves are formed between the conical supporting parts, the middle of each conical groove is connected with the top end surface of the template, air holes are formed in the middle of each conical groove and are connected and communicated with the air suction grooves, and a plurality of magnetic pieces are arranged on the bottom end surface of the template;
the die plate is magnetically attracted and fixed with the magnetic piece of the die plate, the die plate covers the bottom end surface of the die plate, each conical supporting part of the die plate is firmly abutted against the die plate, tin ball suction holes are formed in the die plate at positions corresponding to positions where tin balls are required to be distributed on the IC chip, and each conical groove of the die plate corresponds to each tin ball suction hole.
2. The ball-planting die structure according to claim 1, wherein the assembling portion is provided with a plurality of assembling pieces, assembling holes capable of being combined with the assembling pieces are formed on the periphery of the template corresponding to the assembling pieces, and the template is assembled with the assembling portion.
3. The ball placement die structure of claim 1, wherein a periphery of the die plate is integrally formed at the set of portions of the die holder.
4. The ball placement die structure according to claim 1, wherein the magnetic member is provided at a periphery of a bottom end surface of the die plate.
5. The ball placement die structure according to claim 1, wherein the magnetic member is provided at an intermediate position between a periphery of the bottom end face of the die plate and the bottom end face of the die plate.
6. The ball placement die structure as in any one of claims 1, 4, 5, wherein the magnetic member is embedded within the die plate.
7. The ball placement die structure as defined in any one of claims 1, 4 and 5, wherein the magnetic member is embedded in a coupling hole recessed in the die plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320994358.5U CN219873407U (en) | 2023-04-27 | 2023-04-27 | Ball-planting mould structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320994358.5U CN219873407U (en) | 2023-04-27 | 2023-04-27 | Ball-planting mould structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219873407U true CN219873407U (en) | 2023-10-20 |
Family
ID=88333782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320994358.5U Active CN219873407U (en) | 2023-04-27 | 2023-04-27 | Ball-planting mould structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219873407U (en) |
-
2023
- 2023-04-27 CN CN202320994358.5U patent/CN219873407U/en active Active
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| GR01 | Patent grant |