CN219871877U - Silicon optical module - Google Patents
Silicon optical module Download PDFInfo
- Publication number
- CN219871877U CN219871877U CN202321710094.2U CN202321710094U CN219871877U CN 219871877 U CN219871877 U CN 219871877U CN 202321710094 U CN202321710094 U CN 202321710094U CN 219871877 U CN219871877 U CN 219871877U
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- CN
- China
- Prior art keywords
- heat sink
- silicon optical
- shell
- heat
- power laser
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Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 45
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 31
- 239000010703 silicon Substances 0.000 title claims abstract description 31
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 27
- 230000000694 effects Effects 0.000 abstract description 8
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
Abstract
The utility model belongs to the technical field of optical communication, and particularly relates to a silicon optical module, which comprises an upper cover of a shell, a lower cover of the shell, a high-power laser chip, a converging lens, a silicon optical chip, a reflective collimating lens and a high-power laser chip, wherein the reflective collimating lens and the high-power laser chip are arranged on the side face of a first heat sink; the bottom surface of the first heat sink, the converging lens and the silicon optical chip are all arranged on the second heat sink, and the second heat sink is attached to the lower cover of the shell. According to the utility model, the high-power laser chip is arranged on the first heat sink, the bottom surface of the first heat sink is attached to the second heat sink on the lower cover of the shell, and the top surface of the first heat sink and the side surface deviating from the high-power laser are both attached to the upper cover of the shell, so that the first heat sink forms a heat dissipation path with the upper cover of the shell and the lower cover of the shell at the same time, three sides of heat dissipation is formed, the heat dissipation path is increased, and a better heat dissipation effect is achieved.
Description
Technical Field
The utility model belongs to the technical field of optical communication, and particularly relates to a silicon optical module.
Background
In the existing silicon optical module, a high-power laser is generally adopted as a light source. However, the heat generated by the high-power laser is large, in order to timely dissipate the heat of the high-power laser, the high-power laser is generally eutectic on an aluminum nitride heat sink, and the aluminum nitride heat sink is fixed with the shell through a heat conducting piece to realize heat dissipation, but the heat dissipation path is single, the heat dissipation capacity is limited, and the heat dissipation effect is poor.
Disclosure of Invention
In order to overcome the defects in the prior art, the utility model aims to provide a silicon optical module which can increase a heat dissipation path and improve a heat dissipation effect.
In order to achieve the above purpose, the technical scheme of the utility model is that the silicon optical module comprises an upper cover of a shell, a lower cover of the shell, a high-power laser chip, a converging lens and a silicon optical chip, and further comprises a reflective collimating lens, wherein the reflective collimating lens and the high-power laser chip are arranged on the side surface of a first heat sink, and the reflective collimating lens is positioned below the high-power laser chip; the top surface of the first heat sink and the side surface, deviating from the high-power laser chip, of the first heat sink are attached to the upper cover of the shell; the bottom surface of the first heat sink, the converging lens and the silicon optical chip are arranged on a second heat sink, and the second heat sink is attached to the lower cover of the shell.
As one of the implementation manners, the top surface of the reflective collimating lens is a reflecting surface, and the reflecting surface is a concave cambered surface.
As one implementation mode, the reflective collimating lens is made of metal materials, and the surface of the concave cambered surface is plated with a high-reflection film.
As one implementation mode, the reflective collimating lens is made of glass materials, and the surface of the concave cambered surface is plated with a reflective film.
As one embodiment, a gap is formed between the reflective collimating lens and the second heat sink.
As one of the implementation modes, an optical isolator is further arranged between the converging lens and the reflective collimating lens, and the optical isolator is fixed on the second heat sink.
As one of the implementation manners, a first heat conduction piece is arranged between the first heat sink and the upper cover of the shell, and the first heat conduction piece is of an inverted-L shape.
As one embodiment, the first heat sink is an aluminum nitride heat sink, and the first heat conducting member is a heat conducting gel.
As one embodiment, a second heat conducting member is provided between the second heat sink and the housing lower cover.
As one embodiment, the second heat sink is a metal heat sink, and the second heat conducting member is a heat conducting gel.
Compared with the prior art, the utility model has the beneficial effects that:
(1) According to the utility model, the high-power laser chip is arranged on the first heat sink, the bottom surface of the first heat sink is attached to the second heat sink on the lower cover of the shell, and the top surface of the first heat sink and the side surface deviating from the high-power laser are both attached to the upper cover of the shell, so that the first heat sink forms a heat dissipation path with the upper cover of the shell and the lower cover of the shell simultaneously, three sides are formed for heat dissipation, the heat dissipation path is increased, the heat dissipation capacity is improved, a better heat dissipation effect is achieved, and the heat dissipation problem of the high-power laser chip is effectively solved;
(2) The utility model adds a reflective collimating lens between the high-power laser chip and the optical isolator, rotates and collimates the light beam emitted by the high-power laser chip, then makes the light beam incident on the optical isolator, and then makes the light beam incident into the silicon optical chip through the optical isolator and the converging lens.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a silicon optical module according to an embodiment of the present utility model;
in the figure: 1. an upper cover of the housing; 2. a housing lower cover; 3. a first heat sink; 4. a second heat sink; 5. a high power laser chip; 6. a reflective collimating lens; 7. an optical isolator; 8. a converging lens; 9. a silicon optical chip; 10. a first heat conductive member; 11. and a second heat conductive member.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second" may include one or more such features, either explicitly or implicitly; in the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
As shown in fig. 1, an embodiment of the present utility model provides a silicon optical module, which includes a housing upper cover 1, a housing lower cover 2, a high-power laser chip 5, a converging lens 8, and a silicon optical chip 9, and further includes a reflective collimating lens 6, where the reflective collimating lens 6 and the high-power laser chip 5 are both disposed on a side surface of a first heat sink 3, and the reflective collimating lens 6 is located below the high-power laser chip 5; the top surface of the first heat sink 3 and the side surface of the first heat sink 3, which is away from the high-power laser chip 5, are attached to the upper cover 1 of the shell; the bottom surface of the first heat sink 3, the converging lens 8 and the silicon optical chip 9 are all arranged on the second heat sink 4, and the second heat sink 4 is attached to the lower cover 2 of the shell. In the embodiment, the high-power laser chip 5 is arranged on the first heat sink 3, the bottom surface of the first heat sink 3 is attached to the second heat sink 4 on the lower cover 2 of the shell, and the top surface of the first heat sink 3 and the side surface deviating from the high-power laser are both attached to the upper cover 1 of the shell, so that the first heat sink 3 and the upper cover 1 of the shell and the lower cover 2 of the shell form a heat dissipation path simultaneously, three sides are formed for heat dissipation, the heat dissipation path is increased, the heat dissipation capacity is improved, the better heat dissipation effect is achieved, the heat dissipation problem of the high-power laser chip 5 can be effectively solved, and the purpose of saving power consumption is achieved.
In this embodiment, a reflective collimating lens 6 is further added on the light emitting side of the high-power laser chip 5, so as to rotate and collimate the light path, and the light beam emitted by the high-power laser chip 5 is incident on the reflective surface of the reflective collimating lens 6, is rotated by 90 degrees and collimated by the reflective collimating lens 6, and finally is converged by a converging lens 8 and then is emitted into a silicon optical chip 9.
As shown in fig. 1, the housing upper cover 1 includes a top plate and a side plate, the top surface of the first heat sink 3 is attached to the inner side of the top plate of the housing upper cover 1, and the side surface of the first heat sink 3, which faces away from the high-power laser, is attached to the inner side of the side plate of the housing upper cover 1, so that an L-shaped heat dissipation path is formed between the first heat sink 3 and the housing upper cover 1, and the heat dissipation effect is improved.
Further, the top surface of the reflective collimating lens 6 is a reflective surface, and the reflective surface is a concave cambered surface. As shown in fig. 1, the top surface of the reflective collimating lens 6 is recessed downwards from one end close to the first heat sink 3 to one end far away from the first heat sink 3, so that the light beam emitted by the high-power laser chip 5 can rotate the light path by 90 degrees and collimate after being reflected by the concave cambered surface, and the light beam reflected by the concave cambered surface can smoothly enter the silicon optical chip 9 through the converging lens 8.
In this embodiment, the reflective collimator lens 6 may be made of metal or glass by molding. When the reflective collimating lens 6 is made of metal, the surface of the concave cambered surface is plated with a high-reflection film, and the high-reflection film can be gold; when the reflective collimating lens 6 is made of glass, the surface of the concave cambered surface is plated with a reflective film.
Further, a gap is formed between the reflective collimating lens 6 and the second heat sink 4.
In optimizing the above embodiment, an optical isolator 7 is further disposed between the converging lens 8 and the reflective collimating lens 6, and the optical isolator 7 is used for isolating the light beam reflected by the reflective collimating lens 6, where the optical isolator 7 is fixed on the second heat sink 4.
In optimizing the above embodiment, a first heat conducting member 10 is disposed between the top surface of the first heat sink 3 and the side surface of the first heat sink 3 facing away from the optical isolator 7 and the upper cover 1 of the housing, and the first heat conducting member 10 is in an inverted L shape. Further, the first heat conductive member 10 is a flexible member heat conductive member. As an embodiment, the first heat sink 3 is an aluminum nitride heat sink, and the first heat conductive member 10 is a heat conductive gel. The aluminum nitride heat sink can be aluminum nitride with high heat conductivity coefficient, the heat conductivity coefficient is more than 230W/mk, and the heat dissipation effect is good.
In optimizing the above embodiment, a second heat conducting member 11 is disposed between the second heat sink 4 and the lower cover 2 of the housing. Further, the second heat conductive member 11 is a flexible member heat conductive member. As an embodiment, the second heat sink 4 is a metal heat sink, and the second heat conducting member 11 is a heat conducting gel. The metal heat sink can be a tungsten copper heat sink or other alloy heat sinks, and has better heat dissipation performance.
In this embodiment, the heat of the first heat sink 3 and the second heat sink 4 can be respectively conducted to the lower cover 2 and the upper cover 1 of the housing through the heat conducting gel, and can be timely dissipated, so that the heat dissipation effect is improved. The heat-conducting gel can adopt phase-change materials, so that the silicone oil is prevented from volatilizing to pollute the light path.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (10)
1. The utility model provides a silicon optical module, includes shell upper cover, shell lower cover, high-power laser chip, convergent lens and silicon optical chip, its characterized in that: the high-power laser chip is arranged on the side face of the first heat sink, and the high-power laser chip is arranged below the high-power laser chip; the top surface of the first heat sink and the side surface, deviating from the high-power laser chip, of the first heat sink are attached to the upper cover of the shell; the bottom surface of the first heat sink, the converging lens and the silicon optical chip are arranged on a second heat sink, and the second heat sink is attached to the lower cover of the shell.
2. A silicon optical module as defined in claim 1, wherein: the top surface of the reflective collimating lens is a reflecting surface, and the reflecting surface is a concave cambered surface.
3. A silicon optical module as defined in claim 2, wherein: the reflective collimating lens is made of metal materials, and the surface of the concave cambered surface is plated with a high-reflection film.
4. A silicon optical module as defined in claim 3 wherein: the reflective collimating lens is made of glass materials, and the surface of the concave cambered surface is plated with a reflective film.
5. A silicon optical module as defined in claim 1, wherein: and a gap is reserved between the reflective collimating lens and the second heat sink.
6. A silicon optical module as defined in claim 1, wherein: an optical isolator is further arranged between the converging lens and the reflective collimating lens, and the optical isolator is fixed on the second heat sink.
7. A silicon optical module as defined in claim 1, wherein: a first heat conduction piece is arranged between the first heat sink and the upper cover of the shell, and the first heat conduction piece is in an inverted L shape.
8. A silicon optical module as defined in claim 7, wherein: the first heat sink is an aluminum nitride heat sink, and the first heat conducting piece is heat conducting gel.
9. A silicon optical module as defined in claim 1, wherein: and a second heat conduction piece is arranged between the second heat sink and the lower cover of the shell.
10. A silicon optical module as defined in claim 9 wherein: the second heat sink is a metal heat sink,
the second heat conduction piece is heat conduction gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321710094.2U CN219871877U (en) | 2023-07-03 | 2023-07-03 | Silicon optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321710094.2U CN219871877U (en) | 2023-07-03 | 2023-07-03 | Silicon optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219871877U true CN219871877U (en) | 2023-10-20 |
Family
ID=88322095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321710094.2U Active CN219871877U (en) | 2023-07-03 | 2023-07-03 | Silicon optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219871877U (en) |
-
2023
- 2023-07-03 CN CN202321710094.2U patent/CN219871877U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |