CN220985121U - Laser and vehicle - Google Patents

Abstract

The application relates to a laser and a vehicle, wherein the laser utilizes a semiconductor refrigeration sheet to actively dissipate heat of a light-emitting component by connecting the cold end of the semiconductor refrigeration sheet with the light-emitting component so as to reduce the temperature of the light-emitting component, thereby meeting the temperature requirement of a vehicle gauge and ensuring the performance of the laser under the high-temperature condition; in addition, the laser adopts a side light-emitting mode, so that a reflecting prism is omitted structurally, the size of the laser is reduced, optical loss caused by laser reflection is avoided, and light-emitting efficiency is improved.

Description

Laser and vehicle

Technical Field

The application relates to the technical field of laser display, in particular to a laser and a vehicle.

Background

The technology of lasers is becoming mature, and lasers in the visible light bands (blue, red and green) have all been mass produced, and the development of three-color lasers has been becoming a trend. The control of the temperature of the laser chip is very critical, the power and the electro-optical conversion efficiency (Wall Plug Efficiency, WPE) of the chip are greatly influenced by different temperatures, and the performance of the RGB chip is also reduced along with the increase of the temperature.

In the related art, a laser mainly adopts a passive heat dissipation mode, namely, a chip conducts heat through a heat sink substrate, namely, a high heat conduction glue and a high heat conduction metal bottom plate, wherein thermal resistance is a main index for calibrating heat dissipation performance, and the lower the thermal resistance is, the better the heat dissipation performance is, and the thermal resistance is related to the heat conductivity, thickness, scale and the like of a material.

As high-power visible light is mature, the application requirements in the vehicle-mounted aspect are increasing. The requirements on the vehicle-mounted aspect on the heat dissipation are strict, for example, a blue chip needs to work below 105 degrees, a red chip needs to work below 60 degrees, and the passive heat dissipation can not meet the requirements on the heat dissipation temperature of the vehicle-mounted aspect.

Disclosure of utility model

In order to solve the technical problems or at least partially solve the technical problems, the application provides a laser and a vehicle, wherein the laser utilizes a semiconductor refrigeration sheet to actively dissipate heat of a light-emitting component so as to reduce the temperature of the light-emitting component, thereby meeting the temperature requirement of the vehicle gauge and ensuring the performance of the laser under the high-temperature condition.

In a first aspect, the present application provides a laser comprising:

A bottom plate;

A semiconductor refrigeration sheet; the semiconductor refrigerating sheet comprises a hot end and a cold end which are oppositely arranged, the semiconductor refrigerating sheet and the bottom plate are arranged in a lamination mode, and the hot end of the semiconductor refrigerating sheet faces the bottom plate;

A light emitting assembly; the light-emitting component is positioned at one side of the semiconductor refrigerating piece, which is away from the bottom plate, and is connected with the cold end of the semiconductor refrigerating piece, the semiconductor refrigerating piece is used for cooling the light-emitting component, and the light-emitting component is used for emitting laser along the direction intersecting with the direction of the semiconductor refrigerating piece, which points to the bottom plate;

A tube shell; the tube shell is positioned at one side of the bottom plate, surrounds the semiconductor refrigeration piece and the light-emitting component, and is provided with an opening;

A light window; the light window covers the opening and is used for transmitting laser emitted by the light-emitting component.

Optionally, the optical window includes a fixing portion and a lens portion;

The fixing part covers the opening, the lens part is positioned at one side of the fixing part, which is away from the tube shell, and the lens part is used for collimating the laser emitted by the light emitting component.

Optionally, the laser further comprises:

A polarization conversion element; the polarization conversion element is positioned on one side of the lens part, which is away from the fixed part, and is used for adjusting the polarization state of the laser.

Optionally, the laser includes at least one semiconductor refrigeration piece and at least one light-emitting component, and the semiconductor refrigeration piece corresponds to the light-emitting component one by one;

Or alternatively

The laser comprises one semiconductor refrigerating sheet and at least two luminous components, and the semiconductor refrigerating sheet corresponds to the at least two luminous components.

Optionally, the light emitting assembly includes a light emitting chip and a heat sink substrate;

The heat sink substrate is positioned at one side of the semiconductor refrigerating sheet, which is away from the bottom plate, and the light emitting chip is positioned at one side of the heat sink substrate, which is away from the semiconductor refrigerating sheet.

Optionally, the semiconductor refrigeration sheet comprises a ceramic refrigeration sheet;

the light-emitting assembly comprises a light-emitting chip, and the light-emitting chip is positioned on one side of the semiconductor refrigeration piece, which is away from the bottom plate.

Optionally, the laser further comprises:

A temperature detector; the temperature detector is used for monitoring the temperature of the light-emitting component, and the distance between the temperature detector and the light-emitting component is smaller than or equal to a preset distance;

A controller; the controller is electrically connected with the temperature detector and the semiconductor refrigerating sheet, and is used for controlling the working current of the semiconductor refrigerating sheet according to the temperature of the light-emitting component.

Optionally, the temperature detector comprises a thermistor and/or thermocouple.

Optionally, the laser further comprises:

A ceramic substrate; the ceramic substrate is arranged around the bottom plate and is connected with the bottom plate; wherein the tube shell is positioned on one side of the ceramic substrate and surrounds the semiconductor refrigeration sheet and the light-emitting component;

a plug-in component; the plug connector is positioned on one side of the ceramic substrate and on one side of the tube shell away from the light-emitting chip and is used for connecting an external power supply;

A connection circuit; the connecting circuit is positioned in the ceramic substrate and exposed on the surface of one side of the ceramic substrate facing the tube shell, and the connecting circuit is used for electrically connecting the light emitting component and the semiconductor refrigerating sheet with the plug connector.

In a second aspect, the present application also provides a vehicle comprising: any of the lasers described above.

Compared with the prior art, the technical scheme provided by the application has the following advantages:

According to the technical scheme provided by the application, the cold end of the semiconductor refrigeration piece is connected with the light-emitting component, and the semiconductor refrigeration piece is utilized to actively dissipate heat of the light-emitting component so as to reduce the temperature of the light-emitting component, so that the temperature requirement of the vehicle is met, and the performance of the laser under the high-temperature condition is ensured; in addition, the laser adopts a side light-emitting mode, so that a reflecting prism is omitted structurally, the size of the laser is reduced, optical loss caused by laser reflection is avoided, and light-emitting efficiency is improved.

Drawings

FIG. 1 is a schematic diagram of a related art laser;

FIG. 2 is a schematic diagram of another related art laser;

FIG. 3 is a graph of the correspondence between light output power and package temperature in the related art;

fig. 4 is a schematic diagram of a laser according to an exemplary embodiment of the present application;

fig. 5 is a schematic diagram of another laser according to an exemplary embodiment of the present application;

Fig. 6 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

Fig. 7 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

Fig. 8 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

Fig. 9 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

Fig. 10 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

Fig. 11 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

Fig. 12 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

fig. 13 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

Fig. 14 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

Fig. 15 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

fig. 16 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

Fig. 17 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

Fig. 18 is a schematic diagram of a structure of yet another laser according to an exemplary embodiment of the present application;

fig. 19 is a schematic view illustrating an operation principle of a semiconductor refrigeration sheet according to an exemplary embodiment of the present application;

Fig. 20 is a schematic structural view of a vehicle according to an exemplary embodiment of the present application.

Detailed Description

For the purposes of making the objects and embodiments of the present application more apparent, an exemplary embodiment of the present application will be described in detail below with reference to the accompanying drawings in which exemplary embodiments of the present application are illustrated, it being apparent that the exemplary embodiments described are only some, but not all, of the embodiments of the present application.

It should be noted that the brief description of the terminology in the present application is for the purpose of facilitating understanding of the embodiments described below only and is not intended to limit the embodiments of the present application. Unless otherwise indicated, these terms should be construed in their ordinary and customary meaning.

The terms first, second, third and the like in the description and in the claims and in the above-described figures are used for distinguishing between similar or similar objects or entities and not necessarily for describing a particular sequential or chronological order, unless otherwise indicated. It is to be understood that the terms so used are interchangeable under appropriate circumstances.

The terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a product or apparatus that comprises a list of elements is not necessarily limited to all elements explicitly listed, but may include other elements not expressly listed or inherent to such product or apparatus.

In the related art, as shown in fig. 1, in the laser, light emitted from a light emitting component is reflected by a right angle prism and exits from the top surface of the laser. The influence of different temperatures on the power and the electro-optical conversion efficiency of the chip is relatively large, and the temperature control is mainly performed by controlling the temperature value T _m in the Packaging (PKG) of the integrated circuit chip; as shown in fig. 2, the temperature of the light emitting side of the light emitting chip is collected as a temperature value T _m. As shown in fig. 3, as the package temperature increases, the optical output power of the chip gradually decreases, and thus temperature control is extremely important. At present, the chip package mainly adopts a passive heat dissipation mode to dissipate heat, namely, the light-emitting chip passes through the heat sink substrate and then passes through the high heat conduction glue and the high heat conduction bottom plate to conduct out heat, and the heat dissipation performance of the heat dissipation mode is poor. The requirements on the vehicle-mounted aspect on the heat dissipation of the vehicle gauge are strict, and the passive heat dissipation mode is difficult to meet the temperature requirements of the vehicle gauge.

In order to solve the above technical problems, an embodiment of the present application provides a laser and a vehicle, the laser includes: a bottom plate; a semiconductor refrigeration sheet; the semiconductor refrigerating sheet comprises a hot end and a cold end which are oppositely arranged, the semiconductor refrigerating sheet is arranged in a lamination way with the bottom plate, and the hot end of the semiconductor refrigerating sheet faces the bottom plate; a light emitting assembly; the light-emitting component is positioned at one side of the semiconductor refrigerating piece, which is away from the bottom plate, and is connected with the cold end of the semiconductor refrigerating piece, the semiconductor refrigerating piece is used for cooling the light-emitting component, and the light-emitting component is used for emitting laser along the direction intersecting with the direction of the semiconductor refrigerating piece, which points to the bottom plate; a tube shell; the tube shell is positioned on one side of the bottom plate and surrounds the semiconductor refrigerating sheet and the light-emitting component, and the tube shell positioned on the light-emitting side of the light-emitting component is provided with an opening; a light window; the light window covers the opening and is used for transmitting the laser emitted by the light emitting component. By the arrangement, the cold end of the semiconductor refrigerating sheet is connected with the light-emitting component, and the semiconductor refrigerating sheet is utilized to actively dissipate heat of the light-emitting component so as to reduce the temperature of the light-emitting component, thereby meeting the temperature requirement of the vehicle gauge and ensuring the performance of the laser under the high-temperature condition; in addition, the laser adopts a side light-emitting mode, so that a reflecting prism is omitted structurally, the size of the laser is reduced, optical loss caused by laser reflection is avoided, and light-emitting efficiency is improved.

The laser and the vehicle provided by the embodiment of the application are exemplified below with reference to the accompanying drawings.

In some embodiments, as shown in fig. 4, a schematic structural diagram of a laser according to an exemplary embodiment of the present application is shown. Referring to fig. 4, the laser 100 includes a base plate 1, a semiconductor cooling fin (TEC) 2, a light emitting assembly 3, a package 4, and an optical window 5. Wherein, bottom plate 1, semiconductor refrigeration piece 2 and luminous subassembly 3 stromatolite setting, semiconductor refrigeration piece 2 are located between bottom plate 1 and the luminous subassembly 3, and semiconductor refrigeration piece 2 is located the top of bottom plate 1 promptly, and luminous subassembly 3 is located the top of semiconductor refrigeration piece 2. The semiconductor refrigerating sheet 2 comprises a hot end and a cold end which are oppositely arranged, the hot end is downward, the hot end is opposite to the bottom plate 1, the cold end is upward and is connected with the light-emitting component 3, the cold end of the semiconductor refrigerating sheet 2 absorbs heat generated by the light-emitting component 3 and releases the heat at the hot end to be dispersed out through the bottom plate 1, so that the heat dissipation and the temperature reduction of the light-emitting component 3 are realized, and the heat dissipation efficiency of the active heat dissipation mode is high. The tube shell 4 is located on one side of the bottom plate 1 and is connected with the bottom plate 1, the tube shell 4 and the bottom plate 1 form a groove, the bottom plate 1 is used for forming the bottom of the groove, the tube shell 4 forms the groove wall of the groove, and the semiconductor refrigeration piece 2 and the luminous component 3 are located in the groove. The light emitting component 3 is used for emitting laser along the direction intersecting with the direction of the semiconductor refrigeration piece 2 pointing to the bottom plate 1, namely the laser 100 adopts a side light emitting mode, and the laser emitted by the light emitting component 3 is emitted to the tube shell 4; the envelope 4 positioned on the light-emitting side of the light-emitting element 3 has an opening 41, the light window 5 covers the opening 41, and the laser light emitted from the light-emitting element 3 is emitted through the light window 5.

The base plate 1 is made of a material with good thermal conductivity, for example, oxygen-free copper or ceramic, and metal materials such as copper, aluminum, iron, nickel and molybdenum, or ceramic materials such as aluminum nitride and silicon carbide can be selected. The material of the envelope 4 comprises at least one of aluminum nitride, silicon carbide and aluminum oxide; preferably, the envelope 4 comprises a black ceramic, which is effective in suppressing the influence of stray light. The tube shell 4 can be combined with the bottom plate 1 in a welding mode, the tube shell 4 is annular, a groove is formed by combining the tube shell 4 with the bottom plate 1, and the semiconductor refrigeration piece 2 and the luminous component 3 are surrounded in the groove.

The semiconductor refrigeration piece 2 can be connected with the bottom plate 1 and the light-emitting component 3 in a welding or glue sintering mode, and the surface of one side of the semiconductor refrigeration piece 2 connected with the bottom plate 1 is a hot surface and the surface of one side of the semiconductor refrigeration piece connected with the light-emitting component 3 is a cold surface. The gold plating layer can be formed on the hot surface and the cold surface by electroplating, vapor plating or ion beam sputtering, which is beneficial to strengthening the connection between the semiconductor refrigeration piece 2 and the luminous component 3 and the bottom plate 1. The semiconductor cooling fin 2 may be sized according to the requirements of the laser 100 and has a thickness ranging from 0.1mm to 1mm. The semiconductor refrigeration piece 2 can be of a single-layer structure or a multi-layer structure, and the semiconductor refrigeration piece 2 of the multi-layer structure has better heat dissipation effect. The cold end of the semiconductor refrigerating sheet 2 absorbs heat, the hot end dissipates heat, the working current of the semiconductor refrigerating sheet 2 is controlled, the heat is rapidly conducted, and the temperature of the light-emitting component 3 can be controlled in a target temperature range in extremely short time (less than 1 min).

The light-emitting component 3 may only include a light-emitting chip 31, where the light-emitting chip 31 is directly attached to a side of the semiconductor refrigeration sheet 2 facing away from the bottom plate 1; or the light-emitting component 3 comprises a light-emitting chip 31 and a heat sink substrate 32, wherein the heat sink substrate 32 is positioned on one side of the semiconductor refrigeration piece 2 away from the bottom plate 1, and the light-emitting chip 31 is positioned on one side of the heat sink substrate 32 away from the semiconductor refrigeration piece 2.

The light-emitting component 3 adopts a side light-emitting mode, and laser emitted by the light-emitting component 3 has a certain divergence angle. Illustratively, as shown in fig. 4, the base plate 1 and the semiconductor device are stacked in a vertical direction, and the light emitting direction of the light emitting element 3 intersects the vertical direction, that is, the light emitting direction is a horizontal direction and a direction deflected up and down by a predetermined angle in the horizontal direction, and the laser light emitted from the light emitting element 3 is emitted to the package 4.

The light window 5 is made of a light-transmitting material such as sapphire or quartz, and has high light transmittance for the laser emitted by the light emitting component 3. The size of the optical window 5 is larger than the size of the opening 41, and this arrangement is advantageous in ensuring that the laser 100 has a high level of air tightness. Glue (e.g. UV glue) may be used to fix the light window 5. The light window 5 may be disposed on a side of the envelope 4 facing away from the light emitting element 3, or may be disposed on a side of the envelope 4 facing toward the light emitting element 3, which is not limited herein.

It should be noted that, fig. 4 only illustrates that the shape of the optical window 5 is a flat plate, but the laser 100 provided in the embodiment of the present application is not limited thereto. In other embodiments, the optical window 5 may be configured in other shapes, so as to have a laser shaping function, such as a converging or collimating function, which is not limited herein.

The laser 100 provided by the embodiment of the application comprises: a base plate 1; a semiconductor refrigerating sheet 2; the semiconductor refrigerating sheet 2 comprises a hot end and a cold end which are oppositely arranged, the semiconductor refrigerating sheet 2 and the bottom plate 1 are arranged in a lamination mode, and the hot end of the semiconductor refrigerating sheet 2 faces the bottom plate 1; a light emitting component 3; the light-emitting component 3 is positioned at one side of the semiconductor refrigeration piece 2, which is away from the bottom plate 1, and is connected with the cold end of the semiconductor refrigeration piece 2, the semiconductor refrigeration piece 2 is used for cooling the light-emitting component 3, and the light-emitting component 3 is used for emitting laser along the direction intersecting the direction of the semiconductor refrigeration piece 2, which points to the bottom plate 1; a tube shell 4; the tube shell 4 is positioned on one side of the bottom plate 1, surrounds the semiconductor refrigeration piece 2 and the light-emitting component 3, and is positioned on the light-emitting side of the light-emitting component 3, and the tube shell 4 is provided with an opening 41; a light window 5; the light window 5 covers the opening 41 for transmitting the laser light emitted from the light emitting element 3. The cold end of the semiconductor refrigeration piece 2 is connected with the light-emitting component 3, and the semiconductor refrigeration piece 2 is utilized to actively dissipate heat of the light-emitting component 3 so as to reduce the temperature of the light-emitting component 3, thereby meeting the temperature requirement of the vehicle gauge and ensuring the performance of the laser 100 under the high-temperature condition; in addition, the laser 100 adopts a side light emitting mode, so that a reflecting prism is omitted structurally, the size of the laser 100 is reduced, optical loss caused by laser reflection is avoided, and light emitting efficiency is improved.

In some embodiments, as shown in fig. 4, the laser 100 further includes a sealing cap 6, the sealing cap 6 being located on a side of the envelope 4 facing away from the base plate 1 (i.e., a top surface of the envelope 4); the sealing cover 6 is used for sealing the grooves formed by the bottom plate 1 and the tube shell 4 to form a closed space, and the semiconductor refrigeration piece 2 and the luminous component 3 are positioned in the closed space.

By the arrangement, substances such as external water and oxygen are prevented from eroding all parts in the closed space, the working reliability of all the parts is guaranteed, and the service life of the laser 100 is prolonged.

The bottom edge of the sealing cover 6 can be pre-set with an adhesive 7, or the adhesive 7 is pre-set at one side of the tube shell away from the bottom plate (namely the top end of the tube shell), and the sealing cover 6 is fixedly connected with the tube shell 4 in a welding mode so as to seal a groove formed by the bottom plate 1 and the tube shell 4; the adhesive 7 comprises gold-tin solder. The welding process may use a metal parallel seal welding technique or a sapphire gold-tin welding technique, wherein the sapphire gold-tin welding technique is used to facilitate miniaturization of the laser 100.

In some embodiments, as shown in fig. 5, in the laser 100, the optical window 5 includes a fixing portion 51 and a lens portion 52; the fixing portion 51 covers the opening 41, and the lens portion 52 is located on a side of the fixing portion 51 facing away from the package 4, and the lens portion 52 is used for collimating the laser light emitted from the light emitting element 3.

Wherein, the fixed part 51 is connected with the tube shell 4 and covers the opening 41 on the tube shell 4, and the lens part 52 is positioned in the direction of the fixed part 51 away from the tube shell 4. The laser beam emitted from the light emitting device 3 has a certain divergence angle, passes through the fixing portion 51, is collimated by the lens portion 52, and then is converted into parallel light.

In some embodiments, as shown in fig. 6, the laser 100 further comprises: a polarization conversion element 8; the polarization conversion element 8 is located on a side of the lens portion 52 facing away from the fixed portion 51, and the polarization conversion element 8 is configured to adjust the polarization state of the partial laser light.

Wherein the polarization conversion element 8 is capable of adjusting the polarization state of the laser light, and is disposed on the side of the lens portion 52 facing away from the fixed portion 51, i.e., on the side of the arcuate surface of the lens portion 52. The polarization conversion element 8 includes a phase retarder (also referred to as a "wave plate").

Illustratively, as shown in fig. 6, a half-wave plate is disposed on the outer side of the lens portion 52, the light emitting component 3 emits laser light with three colors of red, green and blue, the polarization states of the green laser light and the blue laser light are the same, the polarization state of the red laser light is different from the polarization state of the red laser light, the polarization state of the red laser light is adjusted to be the same as the polarization state of the blue laser light (or the polarization state of the blue laser light is adjusted to be the same as the polarization state of the red laser light) by using the half-wave plate, and thus, the arrangement ensures that the polarization states of the laser light with three colors of red, green and blue are consistent, and more functions are realized.

The polarization conversion element 8 covers only a partial region of the lens portion 52, and adjusts the polarization state of the laser light emitted to the region, and the laser light emitted to the region may be blue laser light, green laser light, or red laser light.

In some embodiments, as shown in fig. 7-9, the light emitting assembly 3 includes a light emitting chip 31 and a heat sink substrate 32; the heat sink base plate 32 is positioned on one side of the semiconductor refrigeration piece 2, which is away from the bottom plate 1, and the light emitting chip 31 is positioned on one side of the heat sink base plate 32, which is away from the semiconductor refrigeration piece 2.

The heat sink substrate 32 has a larger heat conductivity coefficient, and can rapidly conduct out the heat when the light emitting chip 31 emits light to generate heat, so as to avoid the damage of the heat to the light emitting chip 31. The material of the heatsink base plate 32 may include one or more of aluminum nitride and silicon carbide. The heat sink substrate 32 may be sized according to the requirements of the laser 100, and the thickness of the heat sink substrate 32 may be in a range of 0.2mm to 0.3mm, that is, the distance between the end of the heat sink substrate 32 away from the semiconductor cooling fin 2 and the semiconductor cooling fin 2.

In some embodiments, semiconductor cooling fin 2 comprises a ceramic cooling fin; the light emitting assembly 3 comprises a light emitting chip 31, the light emitting chip 31 being located on the side of the semiconductor cooling fin 2 facing away from the base plate 1.

In this embodiment, the material of the ceramic cooling plate is aluminum nitride, which has a higher thermal conductivity coefficient as the same as the material of the heat sink substrate 32, so that the ceramic cooling plate can be used as the heat sink substrate 32 to directly weld the light emitting chip 31 to the ceramic substrate 9.

In other embodiments, the light emitting chip 31 and the heat sink substrate 32 may be connected by wires to form a eutectic, and then the eutectic is soldered to the semiconductor refrigeration sheet 2.

In some embodiments, as shown in fig. 10-15, the laser 100 further comprises: a ceramic substrate 9; the ceramic substrate 9 is arranged around the bottom plate 1, and the ceramic substrate 9 is connected with the bottom plate 1; wherein the tube shell 4 is positioned on one side of the ceramic substrate 9 and surrounds the semiconductor refrigeration piece 2 and the light-emitting component 3; a plug 10; the plug connector 10 is positioned on one side of the ceramic substrate 9 and on one side of the tube shell 4 away from the light-emitting chip 31 and is used for connecting an external power supply; a connection circuit; a connection circuit is provided in the ceramic substrate 9 and exposed at a side surface of the ceramic substrate 9 facing the package 4, the connection circuit being used for electrically connecting the light emitting module 3 and the semiconductor cooling fin 2 with the plug 10.

Wherein, the ceramic substrate 9 can be made of materials such as aluminum nitride or silicon carbide, and the ceramic substrate 9 can be combined with the bottom plate 1 by welding or gluing; the tube shell 4 is positioned on one side of the ceramic base plate 9 and is connected with the ceramic base plate 9, the tube shell 4, the ceramic base plate 9 and the bottom plate 1 form grooves, the tube shell 4 is used for forming groove walls of the grooves, and the ceramic base plate 9 and the bottom plate 1 are used for forming bottoms of the grooves. The semiconductor refrigerating sheet 2 and the luminous component 3 are positioned in the groove, and the plug connector 10 is positioned on the ceramic substrate 9 outside the groove; the plug connector 10 includes one of a socket and a plug for corresponding connection with an external power source.

A connection circuit is provided inside the ceramic substrate 9 and on the surface of the side facing the package 4, one end of the connection circuit being electrically connected to the plug 10 and the other end being electrically connected to the devices (such as the semiconductor cooling sheet 2, the heat sink substrate 32 and the light emitting chip 31) in the enclosed space. By the arrangement, no perforation is needed on the tube shell 4, so that the electrical connection of the semiconductor refrigeration piece 2, the heat sink substrate 32, the light-emitting chip 31 and other packaging devices is realized, and the tightness of the laser 100 is ensured.

In some embodiments, as shown in fig. 16 to 18, the laser 100 further includes a transfer stage 12, where the transfer stage 12 is located on the ceramic substrate 9 in the enclosed space, and is used to electrically connect the devices in the enclosed space (such as the semiconductor refrigeration sheet 2, the heat sink substrate 32, and the light emitting chip 31) to the connection circuit. By the arrangement, wiring difficulty of the light emitting assembly 3 and the semiconductor refrigeration piece 2 is reduced.

As shown in fig. 16, the laser 100 includes three light emitting components 3 for emitting red laser light, green laser light, and blue laser light, respectively, the three light emitting components 3 share one semiconductor cooling sheet 2, and the three light emitting components 3 and the semiconductor cooling sheet 2 are electrically connected to a connection circuit through a relay 12, respectively, so as to electrically connect the light emitting components 3 and the semiconductor cooling sheet 2 to the plug 10; the connector 10 is connected to an external power source.

As shown in fig. 17, the laser 100 includes three light emitting components 3 that emit red laser light, green laser light, and blue laser light, respectively, the three light emitting components 3 share one semiconductor refrigeration sheet 2, and the three light emitting components 3 are electrically connected to a connection circuit through two switching stages 12, respectively, so as to electrically connect the light emitting components 3 to the plug 10; the semiconductor refrigeration piece 2 comprises an anode and a cathode, and is electrically connected with the connecting circuit through the anode and the cathode, so that the semiconductor refrigeration piece 2 is electrically connected with the plug connector 10; the plug 10 includes positive and negative terminals respectively connected to positive and negative poles of an external power source.

As shown in fig. 18, the laser 100 includes two package structures, wherein one package structure includes two red light emitting components 3, the two red light emitting components 3 share one semiconductor refrigeration piece 2, the light emitting components 3 and the semiconductor refrigeration piece 2 are connected with a plug connector 10, and the plug connector 10 includes a positive terminal and a negative terminal; the other packaging structure comprises a green light-emitting component 3 and a blue light-emitting component 3, the two light-emitting components 3 share one semiconductor refrigerating piece 2, and the light-emitting component 3 and the semiconductor refrigerating piece 2 are connected with the plug connector 10.

It should be noted that, in fig. 16 to 18, the manner of filling the light emitting chips 31 with different patterns is used to distinguish the red light emitting chips 31, the green light emitting chips 31 and the blue light emitting chips 31, which do not limit the laser 100 provided in the embodiment of the present application, and the color of the laser emitted by the light emitting chips 31 may be at least one of red, green and blue according to the requirement of the laser 100, which is not limited herein.

In some embodiments, as shown in fig. 11, 13 and 15, in the laser 100, the package 4 and the ceramic substrate 9 are made of the same material, and the package 4 and the ceramic substrate 9 are in an integrated structure. By doing so, the sealability of the laser 100 is further improved.

In some embodiments, the laser 100 includes at least one semiconductor cooling fin 2 and at least one light emitting component 3, where the semiconductor cooling fin 2 corresponds to the light emitting components 3 one to one, i.e. one semiconductor cooling fin 2 is provided for each light emitting component 3.

In some embodiments, as shown in fig. 16-18, the laser 100 includes a semiconductor refrigeration sheet 2 and at least two light emitting assemblies 3, the semiconductor refrigeration sheet 2 corresponding to the at least two light emitting assemblies 3, i.e., the at least two light emitting assemblies 3 share a semiconductor refrigeration sheet 2 in the laser 100. Optionally, all the light emitting components 3 in the laser 100 share one semiconductor cooling fin 2.

In some embodiments, the laser 100 further comprises, as shown in FIGS. 16-18: a temperature detector 11 and a controller (not shown). The temperature detector 11 is located on the side of the envelope 4 facing away from the light emitting assembly 3 and on the ceramic substrate 9, i.e. the temperature detector 11 is located on the ceramic substrate 9 outside the recess. The temperature detector 11 is used for monitoring the temperature of the light emitting component 3, and in order to ensure the accuracy of the detected temperature value, the distance between the temperature detector 11 and the light emitting component 3 is controlled to be smaller than or equal to a preset distance. The controller is electrically connected with the temperature detector 11 and the semiconductor refrigeration piece 2, and is used for controlling the working current of the semiconductor refrigeration piece 2 according to the temperature of the light-emitting component 3.

Wherein the temperature detector 11 comprises a thermistor and/or thermocouple. The current temperature of the light emitting component 3 obtained by the processor through the temperature detector 11, if the current temperature is greater than or equal to a preset temperature threshold value, the working current of the semiconductor refrigeration piece 2 is regulated, so that the power of the semiconductor refrigeration piece 2 is improved, namely the heat dissipation rate is improved, the light emitting component 3 is effectively dissipated, the temperature of the light emitting chip 31 is ensured to be constant within a target temperature range, the light emitting component 3 is prevented from being overhigh in temperature, the performance of the laser 100 is ensured, and the service life of the laser 100 is prolonged.

Illustratively, as shown in fig. 19, a working schematic diagram of a semiconductor refrigeration sheet 2 provided in the application embodiment is provided. Referring to fig. 19, the semiconductor refrigeration sheet 2 includes P-type bismuth telluride elements and N-type bismuth telluride elements alternately arranged in this order, which are connected together by two ceramic electrodes and interposed between the two to-such electrodes. When current flows through the semiconductor refrigeration piece 2, heat generated by the current can be transferred from one end to the other end, namely a hot end and a cold end are generated on the semiconductor refrigeration piece 2; the cold end is connected with the light-emitting component 3, the hot end is connected with the bottom plate 1, the cold end actively absorbs heat generated when the light-emitting component 3 emits light, and the heat is conducted to the bottom plate 1 from the hot end, so that active heat dissipation is realized; the adjustment of the heat dissipation rate can be achieved by controlling the operating current of the semiconductor cooling fin 2.

On the basis of the implementation mode, the embodiment of the application further provides a vehicle. As shown in fig. 20, the vehicle 200 includes: any of the above lasers 100 has corresponding advantages, and are not limited to this for avoiding repetitive description.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.

The foregoing description, for purposes of explanation, has been presented in conjunction with specific embodiments. The illustrative discussions above are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed above. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles and the practical application, to thereby enable others skilled in the art to best utilize the embodiments and various embodiments with various modifications as are suited to the particular use contemplated.

Claims (10)

1. A laser, comprising:

A bottom plate;

A semiconductor refrigeration sheet; the semiconductor refrigerating sheet comprises a hot end and a cold end which are oppositely arranged, the semiconductor refrigerating sheet and the bottom plate are arranged in a lamination mode, and the hot end of the semiconductor refrigerating sheet faces the bottom plate;

A light emitting assembly; the light-emitting component is positioned at one side of the semiconductor refrigerating piece, which is away from the bottom plate, and is connected with the cold end of the semiconductor refrigerating piece, the semiconductor refrigerating piece is used for cooling the light-emitting component, and the light-emitting component is used for emitting laser along the direction intersecting with the direction of the semiconductor refrigerating piece, which points to the bottom plate;

A tube shell; the tube shell is positioned at one side of the bottom plate, surrounds the semiconductor refrigeration piece and the light-emitting component, and is provided with an opening;

A light window; the light window covers the opening and is used for transmitting laser emitted by the light-emitting component.

2. The laser of claim 1, wherein the optical window comprises a fixed portion and a lens portion;

The fixing part covers the opening, the lens part is positioned at one side of the fixing part, which is away from the tube shell, and the lens part is used for collimating the laser emitted by the light emitting component.

3. The laser of claim 2, further comprising:

A polarization conversion element; the polarization conversion element is positioned on one side of the lens part, which is away from the fixed part, and is used for adjusting the polarization state of the laser.

4. A laser as claimed in claim 1, wherein,

The laser comprises at least one semiconductor refrigerating sheet and at least one light-emitting component, and the semiconductor refrigerating sheets are in one-to-one correspondence with the light-emitting components;

Or alternatively

The laser comprises one semiconductor refrigerating sheet and at least two luminous components, and the semiconductor refrigerating sheet corresponds to the at least two luminous components.

5. The laser of claim 1, wherein the light emitting assembly comprises a light emitting chip and a heat sink substrate;

The heat sink substrate is positioned at one side of the semiconductor refrigerating sheet, which is away from the bottom plate, and the light emitting chip is positioned at one side of the heat sink substrate, which is away from the semiconductor refrigerating sheet.

6. The laser of claim 1, wherein the semiconductor cooling fin comprises a ceramic cooling fin;

the light-emitting assembly comprises a light-emitting chip, and the light-emitting chip is positioned on one side of the semiconductor refrigeration piece, which is away from the bottom plate.

7. The laser of claim 1, further comprising:

A temperature detector; the temperature detector is used for monitoring the temperature of the light-emitting component, and the distance between the temperature detector and the light-emitting component is smaller than or equal to a preset distance;

A controller; the controller is electrically connected with the temperature detector and the semiconductor refrigerating sheet, and is used for controlling the working current of the semiconductor refrigerating sheet according to the temperature of the light-emitting component.

8. The laser of claim 7, wherein the temperature detector comprises a thermistor and/or thermocouple.

9. The laser of any one of claims 1-8, further comprising:

A ceramic substrate; the ceramic substrate is arranged around the bottom plate and is connected with the bottom plate; wherein the tube shell is positioned on one side of the ceramic substrate and surrounds the semiconductor refrigeration sheet and the light-emitting component;

A plug-in component; the plug connector is positioned on one side of the ceramic substrate and on one side of the tube shell away from the light-emitting component and is used for connecting an external power supply;

A connection circuit; the connecting circuit is positioned in the ceramic substrate and exposed on the surface of one side of the ceramic substrate facing the tube shell, and the connecting circuit is used for electrically connecting the light emitting component and the semiconductor refrigerating sheet with the plug connector.

10. A vehicle, characterized by comprising: a laser as claimed in any one of claims 1 to 9.