CN219832690U

CN219832690U - LED lamp bead, backlight module and electronic equipment

Info

Publication number: CN219832690U
Application number: CN202320999796.0U
Authority: CN
Inventors: 程杰东; 卢鹏; 王金鑫
Original assignee: Jiangxi Zhaochi Photoelectric Co ltd
Current assignee: Jiangxi Zhaochi Photoelectric Co ltd
Priority date: 2023-04-27
Filing date: 2023-04-27
Publication date: 2023-10-13
Anticipated expiration: 2033-04-27

Abstract

The utility model provides an LED lamp bead, a backlight module and electronic equipment, wherein the LED lamp bead comprises a substrate, an LED chip and a silica gel layer, wherein the LED chip and the silica gel layer are arranged on the substrate, the LED chip comprises an optical DBR layer, the optical DBR layer is used for refracting part of light rays emitted from the top of the LED chip so that the part of light rays are emitted from the side part of the LED chip, the silica gel layer covers the LED chip, and the silica gel layer is of a double-peak structure. According to the utility model, the optical DBR layer is utilized to refract part of light rays emitted from the top of the LED chip, so that the part of light rays can be emitted from the side part of the LED chip, and the silica gel layer is designed into a double-peak structure, so that the light emitting angle of the LED lamp bead is enlarged, the wider-angle light emission is realized, and the higher visual effect requirement is met.

Description

LED lamp bead, backlight module and electronic equipment

Technical Field

The utility model relates to the technical field of LED packaging, in particular to an LED lamp bead, a backlight module and electronic equipment.

Background

Under the background that the competitiveness brought by the performance quality of the LED products is weakened gradually, lower cost and higher visual effect requirements become main trends of the development of the current LED backlight industry, and under the trend, the elimination of lenses has become the development direction of Mini backlight.

At present, as shown in fig. 1, the conventional LED lamp bead packaging form is that a conventional angle chip is matched with a dispensing flat cup or a concave cup, a finished product is matched with a lens for use on SMT, and only the requirements of brightness and quality are met, but the light-emitting angle is lower, and the light-emitting efficiency is not high.

Disclosure of Invention

Based on the above, the utility model aims to provide an LED lamp bead, a backlight module and electronic equipment so as to solve the defects in the prior art.

In order to achieve the above object, the present utility model provides an LED lamp bead, which includes a substrate, and an LED chip and a silica gel layer disposed on the substrate, where the LED chip includes an optical DBR layer, and the optical DBR layer is used to refract a portion of light emitted from the top of the LED chip, so that the portion of light is emitted from the side of the LED chip, and the silica gel layer is covered on the LED chip, and the silica gel layer has a bimodal structure.

The beneficial effects of the utility model are as follows: through add optical DBR layer in the structure to the LED chip, utilize optical DBR layer to the partial light that sends out at LED chip top to make this partial light can send from the lateral part of LED chip, then design the silica gel layer into double-peak form structure, cover the silica gel layer on the LED chip, with this light-emitting angle that enlarges the LED lamp pearl, realize that the wider angle is luminous, in order to satisfy higher visual effect requirement.

Preferably, a die bonding bowl cup is arranged on the substrate, and the LED chip is located at the center of the die bonding bowl cup.

Preferably, the cavity of the die bonding bowl cup is of a stepped structure, and the die bonding bowl cup is integrally formed through a pressing film.

Preferably, the material of the die bonding bowl cup is transparent silica gel.

Preferably, the LED chip further comprises a substrate and an epitaxial structure, and the optical DBR layer, the substrate and the epitaxial structure are sequentially stacked on the substrate from bottom to top.

Preferably, a protective layer is filled in the die bonding bowl cup, and the protective layer is integrally connected with the silica gel layer through injection molding.

In order to achieve the above object, the present utility model further provides a backlight module, which comprises a backlight plate, and is characterized by further comprising a plurality of LED lamp beads, wherein the plurality of LED lamp beads are uniformly distributed on the backlight plate, a diffusion plate is arranged on the backlight plate, and the diffusion plate covers the plurality of LED lamp beads.

Preferably, the distance between the backlight plate and the diffusion plate is 8mm-12mm.

In order to achieve the above object, the present utility model further provides an electronic device, including the backlight module described in the above.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

Fig. 1 is a cross-sectional view of an LED lamp bead according to a first embodiment of the present utility model;

fig. 2 is a perspective view of a silica gel layer according to a first embodiment of the present utility model;

fig. 3 is a cross-sectional view of a backlight module according to a second embodiment of the utility model.

Description of main reference numerals:

LED lamp bead	10	Crystal fixing bowl cup	14
				Substrate board	11	Backlight board	20
LED chip	12	Diffusion plate	30
				Silica gel layer	13

The utility model will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 2, an LED lamp bead according to a first embodiment of the present utility model includes a substrate 11, an LED chip 12, and a silica gel layer 13.

Wherein: the die bonding bowl cup 14 is integrally formed on the substrate 11 through a die bonding technology, the LED chip 12 is connected with the substrate 11 through the die bonding technology, and the LED chip 12 is located at the center of the die bonding bowl cup 14, it can be appreciated that in other embodiments, the LED chip 12 can be connected with the substrate 11 through a welding technology, the LED chip 12 comprises an optical DBR layer for refracting part of light emitted from the top of the LED chip 12, so that the part of light can be emitted from the side of the LED chip 12, thereby achieving the purposes of reducing the top light output of the LED lamp bead 10 and increasing the side light output of the LED lamp bead 10.

In this embodiment, in order to ensure that the LED lamp bead 10 can better emit light from the side, the silica gel layer 13 is designed to have a double-peak structure, and the silica gel layer 13 is disposed right above the die bonding bowl 14, and the LED chip 12 is covered with the silica gel layer 13 to encapsulate the LED chip 12. It can be understood that the existing LED lamp bead 10 generally forms a bowl cup with a cylindrical or concave cavity by dispensing on the substrate 11 once, then fixes the LED chip 12 in the bowl cup by using a die bonding technology, and connects a lens on the bowl cup to realize packaging, in this way, the light emitting angle of the LED lamp bead 10 is between 120 ° and 140 °, in the present utility model, the light emitting angle of the LED lamp bead 10 can be controlled between 160 ° and 170 ° by designing the silica gel layer 13 to be a double-peak structure and combining the LED chip 12 with the optical DBR layer, thereby effectively increasing the light emitting angle of the LED lamp bead 10, realizing wider-angle light emission, and meanwhile, the LED lamp bead 10 in the present utility model replaces the lens by injection molding silica gel, thereby reducing the production and generation to a certain extent.

It should be noted that, the material of the optical DBR layer is a DBR (distributed Bragg reflection, distributed bragg reflector), and the reflection bandwidth of the LED chip 12 can be widened based on the DBR, so as to refract a portion of the light emitted from the top of the LED chip 12 and enable the portion of the light to be emitted from the side of the LED chip 12.

In this embodiment, the cavity of the die bonding bowl 14 is in a stepped structure, i.e. the upper end area of the cavity of the die bonding bowl 14 is smaller than the lower end area thereof, and it can be understood that the LED chip 12 is more convenient to emit light from the side under the arrangement of the die bonding bowl 14, so that the light-emitting efficiency of the corresponding LED lamp bead 10 at the side is higher.

The material of the die bonding bowl 14 is transparent silica gel.

In this embodiment, the die bonding bowl 14 is filled with a protection layer, and the protection layer is integrally connected with the silica gel layer 13 through injection molding, and it can be understood that the protection layer is identical to the silica gel layer 13 in material and is transparent silica gel, wherein the protection layer can wrap the LED chip 12 to protect the LED chip 12.

In the present embodiment, the LED chip 12 further includes a substrate and an epitaxial structure, and the optical DBR layer is located directly under the substrate, and it is understood that the optical DBR layer, the substrate and the epitaxial structure are sequentially stacked on the substrate 11 from bottom to top.

In specific implementation, the optical DBR layer is additionally arranged in the structure of the LED chip 12, and the optical DBR layer is used for refracting part of light emitted from the top of the LED chip 12, so that the part of light can be emitted from the side of the LED chip 12, then the silica gel layer 13 is designed into a double-peak structure, and the silica gel layer 13 is covered on the LED chip 12, so that the light emitting angle of the LED lamp bead 10 is enlarged, and the wider-angle light emission is realized, so as to meet the higher visual effect requirement.

It should be noted that the above implementation is only for illustrating the feasibility of the present utility model, but this does not represent that the LED lamp bead 10 of the present utility model has only one implementation, and may be incorporated into the feasible embodiment of the present utility model as long as the LED lamp bead 10 of the present utility model can be implemented.

Referring to fig. 3, a backlight module according to a second embodiment of the utility model includes a backlight plate 20 and LED lamp beads 10 according to a first embodiment.

The number of the LED lamp beads 10 is multiple, the multiple LED lamp beads 10 are uniformly distributed on the backlight plate 20 in a rectangular array, a diffusion plate 30 is arranged on the backlight plate 20, and the diffusion plate 30 is used for converting point light emitted by each LED lamp bead 10 into surface light emitted, so that the aesthetic degree of the backlight module during light emitted is ensured.

It should be noted that, by using the LED lamp bead 10 in the first embodiment, since the light emitting angle is increased compared with the light emitting angle of the existing LED lamp bead 10, the OD distance of the backlight module is effectively reduced, that is, the distance between the diffusion plate 30 and the backlight plate 20 is effectively reduced, so that a thinner backlight module can be obtained, specifically, the OD distance of the backlight module prepared by using the existing LED lamp bead 10 is 22mm, and the OD distance of the backlight module prepared by using the LED lamp bead 10 in the first embodiment is 8mm-12mm.

Meanwhile, the LED lamp beads 10 are attached to the backlight plate 20 in the same size, and the LED lamp beads 10 in the first embodiment are utilized to prepare the backlight module, so that the use amount of the LED lamp beads 10 can be reduced due to the fact that the distance between the adjacent LED lamp beads 10 is required to be kept unchanged, and the production cost of the backlight module is reduced to a certain extent.

The electronic device in the third embodiment of the present utility model includes the backlight module in the second embodiment.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of the utility model should be assessed as that of the appended claims.

Claims

1. The utility model provides a LED lamp pearl, includes the base plate and locates LED chip and silica gel layer on the base plate, its characterized in that, the LED chip includes optical DBR layer, optical DBR layer is used for refracting the partial light that LED chip top sent to make this partial light follow the lateral part of LED chip sends, the silica gel layer cover in on the LED chip, the silica gel layer is the bipolarity structure.

2. The LED lamp bead according to claim 1, wherein a die bonding bowl is provided on the substrate, and the LED chip is located at a center of the die bonding bowl.

3. The LED lamp bead according to claim 2, wherein the cavity of the die attach bowl is a stepped structure, and the die attach bowl is integrally formed by a die pressing film.

4. The LED lamp bead according to claim 2, wherein the die attach bowl is made of transparent silica gel.

5. The LED light bead of claim 1, wherein the LED chip further comprises a substrate and an epitaxial structure, the optical DBR layer, the substrate and the epitaxial structure being sequentially stacked on the substrate from bottom to top.

6. The LED lamp bead according to claim 2, wherein a protective layer is filled in the die bonding bowl cup, and the protective layer is integrally connected with the silica gel layer through injection molding.

7. A backlight module, including the backlight unit, characterized in that still includes the LED lamp pearl of any one of claims 1-6, the quantity of LED lamp pearl is a plurality of, a plurality of LED lamp pearl evenly distributed in on the backlight unit, be equipped with the diffuser plate on the backlight unit, the diffuser plate covers in a plurality of LED lamp pearl.

8. A backlight module according to claim 7, wherein the distance between the backlight plate and the diffusion plate is 8mm-12mm.

9. An electronic device comprising a backlight module according to any one of claims 7-8.