CN217847981U

CN217847981U - LED lamp bead, display module and electronic equipment

Info

Publication number: CN217847981U
Application number: CN202222210798.5U
Authority: CN
Inventors: 周恒�
Original assignee: Jiangxi Zhaochi Photoelectric Co ltd
Current assignee: Jiangxi Zhaochi Photoelectric Co ltd
Priority date: 2022-08-22
Filing date: 2022-08-22
Publication date: 2022-11-18
Anticipated expiration: 2032-08-22

Abstract

The utility model provides a LED lamp pearl, display module assembly and electronic equipment, this LED lamp pearl include the base plate and locate LED chip on the base plate still includes bowl cup colloid, bowl cup colloid pass through the moulding-die with base plate integrated into one piece, the inside cavity of bowl cup colloid is in order to form a solid brilliant region, the LED chip is located gu brilliant regional center, bowl cup colloid is used for absorbing the light that LED chip side sent, it has the protective layer to fill in the solid brilliant region, the protective layer parcel the LED chip. Through this application, utilize the bowl cup colloid to absorb the light of beating to the side of the LED chip to make LED lamp pearl follow top light-emitting, reduce luminous angle, avoided the product that has a plurality of LED lamp pearls after lighting, photometry interference problem between the adjacent LED lamp pearl has improved the picture effect of product, and luminance is more even.

Description

LED lamp bead, display module and electronic equipment

Technical Field

The utility model relates to a LED encapsulation technology field, in particular to LED lamp pearl, display module assembly and electronic equipment.

Background

With the overall opening of the interconnection of everything, the LED display panel gradually replaces the Shan Shuangse panel and the traditional display products such as projection under the continuous development of LED device materials and display technologies by virtue of its excellent characteristics of self-luminescence, full-color visibility, seamless splicing, etc., and its excellent performances such as thinner body, wider color gamut, longer service life, higher contrast and reliability, and becomes the most hot display terminal in the current LED industry, and is the direction of mass production in the overall arrangement of various manufacturers.

The development of LED display screens is not away from the constant upgrade iterations of LED RGB display packaging technology. At present, CHIP RGB 1010 lamp beads are used for producing indoor P1.25 distance display screens of mainstream, but because the light-emitting angle of the lamp bead products is large, a five-surface light-emitting mode is adopted, the whole module is small in distance when being lightened, side light-emitting between adjacent lamp beads can influence each other, and the picture effect consistency and the brightness are different.

SUMMERY OF THE UTILITY MODEL

Based on this, the utility model aims at providing a LED lamp pearl, display module assembly and electronic equipment to solve not enough among the above-mentioned prior art.

In order to realize the above object, the utility model provides a LED lamp pearl, include the base plate and locate LED chip on the base plate still includes bowl cup colloid, bowl cup colloid pass through the moulding-die with base plate integrated into one piece, the inside cavity of bowl cup colloid is in order to form a solid brilliant region, the LED chip is located gu brilliant regional center, bowl cup colloid is used for absorbing the light that LED chip side sent, gu the brilliant regional intussuseption of packing has the protective layer, the protective layer parcel the LED chip.

The utility model has the advantages that: through on the base plate through moulding-die integrated into one piece bowl cup colloid, utilize bowl cup colloid to absorb the light of beating to the side of the LED chip to make LED lamp pearl follow top light-emitting, reduce luminous angle, avoided the product that has a plurality of LED lamp pearls after lighting, photometry interference problem between the adjacent LED lamp pearl has improved the picture effect of product, and luminance is more even.

Preferably, the protective layer is formed by press molding.

Preferably, the depth of the die bonding area is greater than the thickness of the LED chip.

Preferably, the protective layer includes first colloid layer and the second colloid layer of range upon range of setting, first colloid layer is located gu in the crystalline region, and the parcel the LED chip, the second colloid layer is located gu the crystalline region outside, and cover the bowl cup colloid.

Preferably, the protective layer is T-shaped, and the cross-sectional area of the second colloid layer is larger than that of the first colloid layer.

Preferably, an end face of the protective layer, which is far away from the substrate, is parallel to the substrate.

In order to realize the purpose, the utility model also provides a display module assembly, in the aforesaid LED lamp pearl.

In order to achieve the above object, the utility model also provides an electronic equipment, including in the aforesaid display module assembly.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is the utility model discloses the structure schematic diagram of LED lamp pearl that the first embodiment provided.

Description of the main element symbols:

substrate board	10	Protective layer	40
				LED chip	20	First colloid layer	41
Bowl and cup colloid	30	Second colloid layer	42

The following detailed description of the invention will be further described in conjunction with the above-identified drawings.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are given in the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to fig. 1, which is an LED lamp bead according to a first embodiment of the present invention, including a substrate 10, an LED chip 20 and a bowl colloid 30.

Wherein: LED chip 20 and bowl cup colloid 30 all are located same one side of base plate 10, and respectively with base plate 10 fixed connection, specifically, bowl cup colloid 30 passes through moulding-die and base plate 10 integrated into one piece, the inside cavity of bowl cup colloid 30 is in order to form a solid brilliant region, LED chip 20 then is located solid brilliant regional center, solid brilliant regional intussuseption is filled again protective layer 40, protective layer 40 parcel LED chip 20, not only can protect LED chip 20, can also strengthen the relation of connection of LED chip 20 and base plate 10, it needs to explain, bowl cup colloid 30 is used for absorbing the light that LED chip 20 side sent, so that LED lamp pearl follow top light-emitting, the luminous angle of LED lamp pearl has been reduced, the product that has had a plurality of LED lamp pearls is lighting the back, the photometry interference problem between the adjacent LED lamp pearl, the picture effect of product has been improved, and luminance is more even.

In the present embodiment, the protective layer 40 is formed by compression molding, specifically, after the bowl colloid 30 is formed by compression molding, secondary compression molding is performed to form the protective layer 40.

In the present embodiment, the depth of the die bonding region is greater than the thickness of the LED chip 20, so that the bowl-cup colloid 30 can completely absorb the side light emitted from the LED chip 20.

In this embodiment, protective layer 40 adopts epoxy, diffusant and grey agent three mix and make, and the protective layer 40 that forms can present for grey, be different from transparent protective layer 40, through making grey protective layer 40, can avoid dazzling the problem of light, can understand, bowl cup colloid 30 adopts epoxy and black agent two to mix and makes, and the bowl cup colloid 30 that forms can present for black, in order to realize carrying out absorptive effect to the side light that LED chip 20 sent, even two adjacent LED chips 20 are luminous simultaneously, can not cause the problem of photometry interference yet.

In the present embodiment, the protection layer 40 is T-shaped, one of the protection layer 40 far from the substrate 10 protrudes out of the die bonding region and covers an end portion of the bowl colloid 30, it can be understood that the protection layer 40 includes a first colloid layer 41 and a second colloid layer 42 which are stacked, the first colloid layer 41 is located in the die bonding region, the second colloid layer 42 is located outside the die bonding region, and the second colloid layer 42 covers the bowl colloid 30 and is flush with an edge of the bowl colloid 30, it should be noted that a cross-sectional area of the first colloid layer 41 is smaller than a cross-sectional area of the second colloid layer 42.

In this embodiment, the first colloid layer 41 and the second colloid layer 42 are an integral structure, and the cross-sectional area of the first colloid layer 41 is smaller than that of the second colloid layer 42.

In the present embodiment, an end surface of the protective layer 40 away from the substrate 10 is parallel to the substrate 10, that is, a sidewall of the second colloid layer 42 away from the first colloid layer 41 is parallel to an end surface of the substrate 10.

When concrete implementation, through on base plate 10 through moulding-die integrated into one piece bowl cup colloid 30, utilize bowl cup colloid 30 to absorb the light of emitting to the side of LED chip 20 to make LED lamp pearl follow top light-emitting, reduce luminous angle, avoided the product that has a plurality of LED lamp pearls after lighting, photometry interference problem between the adjacent LED lamp pearl has improved the picture effect of product, and luminance is more even.

It should be noted that the implementation process described above is only for illustrating the applicability of the present application, but this does not mean that the LED lamp bead of the present application has only the above-mentioned one implementation flow, and on the contrary, the LED lamp bead of the present application can be incorporated into the feasible embodiments of the present application as long as the LED lamp bead of the present application can be implemented.

The utility model discloses the second embodiment still provides a display module assembly, including the LED lamp pearl in the first embodiment.

The utility model discloses the third embodiment still provides an electronic equipment, including the display module assembly in the second embodiment.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above-mentioned embodiments only represent several embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a LED lamp pearl, includes the base plate and locates LED chip on the base plate, its characterized in that still includes bowl cup colloid, bowl cup colloid pass through the moulding-die with base plate integrated into one piece, the inside cavity of bowl cup colloid is in order to form a solid brilliant region, the LED chip is located gu brilliant regional center, bowl cup colloid is used for absorbing the light that LED chip side sent, it has the protective layer to fill in the solid brilliant region, the protective layer parcel LED chip.

2. The LED lamp bead according to claim 1, wherein the protective layer is formed by compression molding.

3. The LED lamp bead according to claim 1, wherein the depth of the die attach region is greater than the thickness of the LED chip.

4. The LED lamp bead according to claim 1, wherein the protective layer includes a first colloid layer and a second colloid layer which are stacked, the first colloid layer is located in the die bonding region and wraps the LED chip, and the second colloid layer is located outside the die bonding region and covers the bowl-cup colloid.

5. The LED lamp bead according to claim 4, wherein the protective layer is T-shaped, and the cross-sectional area of the second colloid layer is larger than the cross-sectional area of the first colloid layer.

6. The LED lamp bead according to claim 1, wherein an end face of the protective layer away from the substrate is parallel to the substrate.

7. A display module, characterized in that, includes the LED lamp pearl of any one of claims 1-6.

8. An electronic device, comprising the display module of claim 7.