CN219832612U

CN219832612U - Full-automatic wafer UV dispergator

Info

Publication number: CN219832612U
Application number: CN202320777470.3U
Authority: CN
Inventors: 郭易; 戚孝峰
Original assignee: Zhengfeng Semiconductor Technology Suzhou Co ltd
Current assignee: Zhengfeng Semiconductor Technology Suzhou Co ltd
Priority date: 2023-04-11
Filing date: 2023-04-11
Publication date: 2023-10-13
Anticipated expiration: 2033-04-11

Abstract

The utility model discloses a full-automatic wafer UV (ultraviolet) dispergator which comprises an equipment rack, wherein a loading platform corresponding to the equipment rack is arranged at one end of the equipment rack, a loading and unloading mechanism is correspondingly arranged at one end of the loading platform, a UV mechanism is arranged at one side of the loading and unloading mechanism, two groups of first servo modules are arranged at the rear ends of the UV mechanism and the loading and unloading mechanism, and a first conveying arm and a second conveying arm which are movably connected with the two groups of first servo modules are respectively arranged on the two groups of first servo modules. The utility model has the beneficial effects that: the automatic positioning device has the advantages that the accurate positioning of the wafer material box is realized, the loading and unloading can be automatically realized, the UV is irradiated in the fully-closed cavity, the energy value of the current UV irradiation is detected in real time, mark can be automatically carried out after the UV is finished, the production efficiency and the safety are improved, the damage of the UV light to personnel is avoided, and meanwhile, the labor cost is saved for enterprises.

Description

Full-automatic wafer UV dispergator

Technical Field

The utility model relates to the technical field of wafer UV (ultraviolet) de-sizing equipment, in particular to a full-automatic wafer UV de-sizing machine.

Background

In the prior art, wafer UV dispergation is that a wafer in a material box is taken out one by one manually, the wafer is placed on a platform in a UV cavity to irradiate UV, the wafer is taken out from the platform after UV is finished, the wafer is put back into the material box after mark, the degree of automation of the wafer UV dispergation mode is lower, the labor cost is higher, and the wafer can be damaged by UV light when being taken and put manually.

Disclosure of Invention

The utility model aims to provide a full-automatic wafer UV (ultraviolet) dispergator so as to solve the problems in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a full-automatic wafer UV dispergator, includes the equipment frame, equipment frame one end is equipped with the loading platform that corresponds with it, loading platform one end corresponds and is provided with unloading mechanism, it is equipped with the UV mechanism to go up unloading mechanism one side, the UV mechanism with it is equipped with two sets of first servo modules to go up unloading mechanism rear end, two sets of be equipped with respectively on the first servo module with its movable connection's first conveying arm and second conveying arm.

Further preferably, the end face of the loading platform is provided with a positioning block and a plurality of induction sensors, wherein the positioning block and the induction sensors correspond to the material box.

Further preferably, an anti-slip sensor is arranged at the front end of the material box corresponding to the feeding and discharging mechanism.

Further preferably, the feeding and discharging mechanism comprises a conveying rail, and a scanning sensor is arranged at the lower end of the conveying rail.

Further preferably, the UV mechanism comprises a UV chamber, a movable upper cover and a second servo module, a connecting arm connected between the movable upper cover and the second servo module, and a movable device fixedly arranged at the lower end of the UV chamber.

Further preferably, the first transfer arm is far away from two groups of the other ends of the first servo modules are provided with lifting cylinders, and the telescopic ends of the lifting cylinders are provided with wafer sucking discs connected with the lifting cylinders.

Further preferably, vacuum suction nozzles are symmetrically arranged on two sides of the wafer suction disc.

Further preferably, one side of the feeding and discharging mechanism is provided with an L-shaped bracket, and the L-shaped bracket is provided with a UVLark device.

Advantageous effects

The full-automatic wafer UV dispergator provided by the utility model realizes accurate positioning of a wafer material box, can automatically feed and discharge, irradiates UV in a full-closed chamber, detects the energy value of current UV irradiation in real time, can automatically mark after the UV is finished, improves the production efficiency and the safety, avoids the damage of UV light to personnel, and simultaneously saves the labor cost for enterprises.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is another angular schematic view of the overall structure of the present utility model.

Reference numerals

The device comprises a 1-equipment rack, a 2-loading platform, a 3-loading and unloading mechanism, a 4-servo module, a 5-first conveying arm, a 6-second conveying arm, a 7-UV mechanism, an 8-second servo module, a 9-UVLark device, a 10-UV chamber and a 11-movable upper cover.

Detailed Description

The following are specific embodiments of the present utility model and the technical solutions of the present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to these embodiments.

Examples

As shown in fig. 1-2, a full-automatic wafer UV dispergator comprises an equipment rack 1, wherein a loading platform 2 corresponding to the equipment rack is arranged at one end of the equipment rack 1, an upper and lower feeding mechanism 3 is correspondingly arranged at one end of the loading platform 2, a UV mechanism 7 is arranged at one side of the upper and lower feeding mechanism 3, two groups of first servo modules 4 are arranged at the rear ends of the UV mechanism 7 and the upper and lower feeding mechanism 3, and a first conveying arm 5 and a second conveying arm 6 which are movably connected with the two groups of first servo modules 4 are respectively arranged on the two groups of first servo modules.

In this embodiment, the end face of the loading platform 2 is provided with a positioning block and a plurality of induction sensors corresponding to the material box, and the front end of the material box corresponding to the feeding and discharging mechanism 3 is provided with an anti-slip sensor. The operator places the magazine on the loading platform (the loading platform can be switched according to the sample of magazine), and the locating block on the platform is used for accurately locating, and when the sensors on the platform sense the magazine, the accurate placement of the magazine is indicated. The phenomenon that the anti-slip sensor in front of the material box does not detect that the product slips out indicates that the feeding and discharging actions can be performed.

The feeding and discharging mechanism 3 comprises a conveying track, a scanning sensor is arranged at the lower end of the conveying track, the scanning sensor on the feeding and discharging mechanism scans the posture and existence of each layer of wafer in the material box from bottom to top in sequence, after confirming that no abnormality is finished, feeding action is carried out, and the clamping jaw sequentially takes products from the material box to the track and positions the products.

The UV mechanism 7 comprises a UV chamber 10, a movable upper cover 11 and a second servo module 8, a connecting arm connected between the movable upper cover 11 and the second servo module 8 is arranged, a moving device fixedly arranged on the lower end of the UV chamber 10 is arranged at the lower end of the UV chamber, the upper cover of the UV platform is horizontally moved to the upper side of the platform and is downwards closed, the upper cover is pulled to horizontally move together with the platform for UV, the upper cover returns to the arm material taking position after UV is completed, and the upper cover is lifted and returns to the initial position.

The other end that two sets of first servo module 4 were kept away from to first conveying arm 5 all is equipped with the lift cylinder, and the flexible end of lift cylinder is equipped with the wafer that is connected with it and absorbs the dish, and second conveying arm 6 absorbs the product from the track, and the translation is to the top of UV cavity, descends and puts into the product on the UV irradiation platform, and first conveying arm 5 descends, absorbs the product from the UV irradiation platform, rises and moves to the track top, descends and puts into the track with the product on, and wafer absorbs the dish bilateral symmetry and is equipped with vacuum nozzle.

An L-shaped support is arranged on one side of the feeding and discharging mechanism 3, a UVLark device 9 is arranged on the L-shaped support, clamping jaws clamp a product to move to the lower portion of the UV mark to perform UV mark, and the product is returned to the material box after the mark is completed.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the summary of the present utility model within the scope of the present utility model.

Claims

1. A full-automatic wafer UV dispergator, its characterized in that: including equipment frame (1), equipment frame (1) one end is equipped with loading platform (2) that corresponds with it, loading platform (2) one end corresponds and is provided with unloading mechanism (3), it is equipped with UV mechanism (7) to go up unloading mechanism (3) one side, UV mechanism (7) with it is equipped with two sets of servo module (4) to go up unloading mechanism (3) rear end, two sets of be equipped with respectively on the servo module (4) with it remove first conveying arm (5) and second conveying arm (6) of being connected.

2. The fully automatic wafer UV dispenser of claim 1, wherein: the end face of the loading platform (2) is provided with a positioning block corresponding to the material box and a plurality of induction sensors.

3. The fully automatic wafer UV dispenser of claim 2, wherein: and an anti-slip sensor is arranged at the front end of the material box, which corresponds to the feeding and discharging mechanism (3).

4. The fully automatic wafer UV dispenser of claim 1, wherein: the feeding and discharging mechanism (3) comprises a conveying rail, and a scanning sensor is arranged at the lower end of the conveying rail.

5. The fully automatic wafer UV dispenser of claim 1, wherein: the UV mechanism (7) comprises a UV chamber (10), a movable upper cover (11) and a second servo module (8), wherein a connecting arm connected between the movable upper cover (11) and the second servo module (8) is arranged, and a movable device fixedly arranged at the lower end of the UV chamber (10).

6. The fully automatic wafer UV dispenser of claim 1, wherein: the other ends of the first conveying arms (5) far away from the two groups of the first servo modules (4) are respectively provided with a lifting cylinder, and the telescopic ends of the lifting cylinders are provided with wafer sucking discs connected with the lifting cylinders.

7. The fully automatic wafer UV dispenser of claim 6, wherein: and vacuum suction nozzles are symmetrically arranged on two sides of the wafer suction disc.

8. The fully automatic wafer UV dispenser of claim 1, wherein: an L-shaped bracket is arranged on one side of the feeding and discharging mechanism (3), and a UVLark device (9) is arranged on the L-shaped bracket.