CN219818371U

CN219818371U - High bonding wire machine of security

Info

Publication number: CN219818371U
Application number: CN202321360426.9U
Authority: CN
Inventors: 杨斌
Original assignee: Jiangsu Fukun Photoelectric Technology Co ltd
Current assignee: Jiangsu Fukun Photoelectric Technology Co ltd
Priority date: 2023-05-31
Filing date: 2023-05-31
Publication date: 2023-10-13
Anticipated expiration: 2033-05-31

Abstract

The utility model discloses a high-safety wire welding machine, which comprises a support, wherein a plurality of workbenches are connected to the top of the support, a feeding plate, a discharging plate, an operating plate, a wire welding main body, a rotary table, a discharging mechanism and a feeding mechanism are respectively arranged on the surface of the workbench, the structures of the discharging mechanism and the feeding mechanism are consistent, the discharging mechanism comprises a support frame, an automatic telescopic rod is arranged on the support frame, a movable frame is arranged on one side of the automatic telescopic rod, a lifting motor is arranged on the movable frame, a movable block is arranged at the bottom of the lifting motor, a movable clamping block is movably connected to one side of the movable block through a shaft, a feeding belt conveying device is arranged on one side of the feeding plate, and a discharging belt conveying device is arranged on one side of the discharging plate.

Description

High bonding wire machine of security

Technical Field

The utility model belongs to the technical direction of semiconductors, and particularly relates to a high-safety wire bonding machine.

Background

The wire bonding machine is generally an ultrasonic wire bonding machine, and is classified into a gold wire machine, an aluminum wire machine and a copper wire machine according to wires, and is classified into a ball-shaped welding machine and a wedge-shaped welding machine according to welding modes. The method is mainly applied to internal lead welding of high-power devices, mosfets, IGBTs, light Emitting Diodes (LEDs), laser tubes (lasers), medium and small power triodes, integrated circuits and some special semiconductor devices.

The existing wire bonding machine adopts manual operation during feeding and discharging, the overall efficiency is relatively low, and the manual operation can lead to high potential safety hazard. This phenomenon is a problem to be solved by those skilled in the art.

Disclosure of Invention

The utility model aims to solve the problems in the background technology by aiming at the existing device, namely a wire bonding machine with high safety.

In order to solve the technical problems, the utility model provides the following technical scheme: the utility model provides a high bonding wire machine of security, includes the support, a plurality of workstation that is connected with in top of support, feed plate, flitch, operating panel, bonding wire main part, revolving stage, unloading mechanism and feed mechanism are installed respectively to the surface of workstation, the structure of unloading mechanism and feed mechanism is unanimous.

The blanking mechanism comprises a supporting frame, install automatic telescopic link on the supporting frame, one side of automatic telescopic link is provided with the movable frame, install elevator motor on the movable frame, elevator motor's bottom is provided with the movable block, there is the movable clamp splice one side of movable block through axle swing joint, through being provided with support, workstation, charge-in board, feeding belt conveyor, the flitch, ejection of compact belt conveyor, the operation panel, the bonding wire main part, the revolving stage, blanking mechanism, the supporting frame, automatic telescopic link, the movable frame, elevator motor, the movable block, the movable clamp splice, gag lever post and feed mechanism, whole full-automatic feeding, the function of unloading has been realized, the effectual holistic machining efficiency that has improved, and be favorable to practicing thrift the manpower consumption, and then improved the security of processing.

According to the utility model, the feeding belt conveying device is arranged on one side of the feeding plate, so that the semiconductor is conveniently driven to move by the feeding belt conveying device.

According to the utility model, the discharging belt conveying device is arranged on one side of the discharging plate, so that the semiconductor is conveniently driven to move by the discharging belt conveying device.

According to the utility model, the movable frame and the support frame form a sliding structure through the automatic telescopic rod, and the guide rod is fixedly connected to the inside of the support frame, so that the automatic telescopic rod can conveniently drive the movable frame to slide.

According to the utility model, the movable frame is in sliding connection with the support frame through the guide rods, and the number of the guide rods is two, so that the sliding stability of the movable frame is improved.

According to the utility model, the movable block and the movable frame form a sliding structure through the lifting motor, and the movable clamping blocks are symmetrically distributed on two sides of the movable block, so that the movable block can be lifted conveniently.

The utility model further discloses that the inner wall of the movable block is provided with a guide groove, and a limit rod is arranged in the guide groove.

According to the utility model, the limiting rod is fixed on the outer wall of the movable frame, and the limiting rod is connected with the movable clamping block in a penetrating way through the guide groove, so that the limiting rod can conveniently guide the movable frame.

Compared with the prior art, the utility model has the following beneficial effects: in the present utility model, the number of the components,

(1) Through being provided with support, workstation, charge-in board, feeding belt conveyor, flitch, ejection of compact belt conveyor, operation panel, bonding wire main part, revolving stage, unloading mechanism, support frame, automatic telescopic link, adjustable shelf, elevator motor, movable block, movable clamp splice, gag lever post and feed mechanism, whole function of full-automatic feeding, unloading has been realized, the effectual holistic machining efficiency that has improved to be favorable to practicing thrift the manpower consumption, and then improved the security of processing.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a schematic view of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of the front composition structure of the blanking mechanism of the present utility model;

FIG. 3 is a schematic view of the bottom perspective of the blanking mechanism of the present utility model;

fig. 4 is a schematic perspective view of a movable clamp block according to the present utility model.

In the figure: 1. a bracket; 2. a work table; 3. a feed plate; 301. a feed belt conveyor; 4. a discharge plate; 401. a discharging belt conveying device; 5. an operation panel; 6. a bonding wire body; 7. a rotary table; 8. a blanking mechanism; 801. a support frame; 802. an automatic telescopic rod; 803. a movable frame; 804. a lifting motor; 805. a movable block; 806. a movable clamping block; 807. a limit rod; 9. and a feeding mechanism.

Detailed Description

The technical scheme of the present utility model is further described in non-limiting detail below with reference to the preferred embodiments and the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides the following technical solutions: the utility model provides a high bonding wire machine of security, includes support 1, and a plurality of workstation 2 that are connected with in top of support 1, and feed plate 3, discharge plate 4, operation panel 5, bonding wire main part 6, revolving stage 7, feed mechanism 8 and feed mechanism 9 are installed respectively to the surface of workstation 2, and feed mechanism 8 and feed mechanism 9's structure is unanimous.

The unloading mechanism 8 includes support frame 801, install automatic telescopic link 802 on the support frame 801, one side of automatic telescopic link 802 is provided with movable frame 803, install elevator motor 804 on the movable frame 803, elevator motor 804's bottom is provided with movable block 805, one side of movable block 805 has movable clamp block 806 through axle swing joint, through being provided with support 1, workstation 2, feeding plate 3, feeding belt conveyor 301, discharging plate 4, discharging belt conveyor 401, operating panel 5, bonding wire main part 6, revolving stage 7, unloading mechanism 8, support frame 801, automatic telescopic link 802, movable frame 803, elevator motor 804, movable block 805, movable clamp block 806, gag lever post 807 and feed mechanism 9, the whole function of full-automatic feeding, unloading has been realized, the effectual machining efficiency that has improved, and be favorable to practicing thrift the manpower consumption, and then the security of processing has been improved.

One side of the feeding plate 3 is provided with a feeding belt conveying device 301, and the belt pulley is driven to rotate by a motor, so that after the belt pulley drives the conveying belt to move, the semiconductor is driven to move to the position of the feeding mechanism 9, and the feeding work of the semiconductor is facilitated.

One side of the discharging plate 4 is provided with a discharging belt conveying device 401 which is the same as the principle above, but the conveying direction is opposite, thereby facilitating the discharging work of the semiconductor.

The movable frame 803 forms a sliding structure with the support frame 801 through the automatic telescopic rod 802, and a guide rod is fixedly connected inside the support frame 801, so that the automatic telescopic rod 802 can conveniently drive the movable frame 803 to slide.

The movable frame 803 is connected with the support frame 801 in a sliding mode through the guide rods, and the number of the guide rods is two, so that the sliding stability of the movable frame 803 is improved.

The movable block 805 and the movable frame 803 form a sliding structure through the lifting motor 804, and the movable clamping blocks 806 are symmetrically distributed on two sides of the movable block 805, so that the movable block 805 can conveniently lift.

The inner wall of the movable block 805 is provided with a guide groove, and a limit rod 807 is provided inside the guide groove.

The limiting rod 807 is fixed on the outer wall of the movable frame 803, and the limiting rod 807 is connected with the movable clamping block 806 in a penetrating way through the guide groove, so that the limiting rod 807 can conveniently guide the movable frame 803.

Firstly, a semiconductor is placed on a feeding belt conveying device 301, the feeding belt conveying device 301 drives the semiconductor to move to a feeding mechanism 9, then an automatic telescopic rod 802 in the feeding mechanism 9 drives a movable frame 803 to move, after the movable frame 803 drives a lifting motor 804 to move to a proper position, the lifting motor 804 drives a movable block 805 to lift, the movable block 805 drives a movable clamping block 806 to lift, the movable clamping block 806 is guided by the outer wall of a limiting rod 807 through a guide groove to realize loosening or clamping, then the feeding mechanism 9 drives the semiconductor to be fixed on a rotary table 7, then the rotary table 7 drives a workpiece to rotate, then a wire bonding main body 6 drives a cable to be connected with the semiconductor through an internal wire stripping structure, and performs wire bonding processing between the cable and the semiconductor through a bonding head, after the processing is completed, the rotary table 7 drives the semiconductor to move to a discharging mechanism 8, and the discharging mechanism 8 drives the semiconductor to move to the discharging belt conveying device 401 through the raw materials, so that automatic work is realized.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Finally, it should be pointed out that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting. Although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified or some technical features may be equivalently replaced, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. The utility model provides a high bonding wire machine of security, includes support (1), its characterized in that: the device comprises a plurality of support frames (1), wherein a plurality of work tables (2) are connected to the top of each support frame (1), a feeding plate (3), a discharging plate (4), an operating plate (5), a bonding wire main body (6), a rotating table (7), a discharging mechanism (8) and a feeding mechanism (9) are respectively arranged on the surfaces of the work tables (2), and the structures of the discharging mechanism (8) and the feeding mechanism (9) are consistent;

the blanking mechanism (8) comprises a supporting frame (801), an automatic telescopic rod (802) is arranged on the supporting frame (801), a movable frame (803) is arranged on one side of the automatic telescopic rod (802), a lifting motor (804) is arranged on the movable frame (803), a movable block (805) is arranged at the bottom of the lifting motor (804), and a movable clamping block (806) is movably connected to one side of the movable block (805) through a shaft.

2. A high safety wire bonding machine as claimed in claim 1 wherein: one side of the feeding plate (3) is provided with a feeding belt conveying device (301).

3. A high safety wire bonding machine as claimed in claim 1 wherein: one side of the discharging plate (4) is provided with a discharging belt conveying device (401).

4. A high safety wire bonding machine as claimed in claim 1 wherein: the movable frame (803) and the support frame (801) form a sliding structure through an automatic telescopic rod (802), and a guide rod is fixedly connected inside the support frame (801).

5. A high safety wire bonding machine as claimed in claim 4 wherein: the movable frame (803) is in sliding connection with the supporting frame (801) through guide rods, and two guide rods are arranged.

6. A high safety wire bonding machine as claimed in claim 1 wherein: the movable block (805) and the movable frame (803) form a sliding structure through the lifting motor (804), and the movable clamping blocks (806) are symmetrically distributed on two sides of the movable block (805).

7. A high safety wire bonding machine as claimed in claim 1 wherein: guide grooves are formed in the inner walls of the movable blocks (805), and limiting rods (807) are arranged in the guide grooves.

8. The high security wire bonding machine of claim 7 wherein: the limiting rod (807) is fixed on the outer wall of the movable frame (803), and the limiting rod (807) is connected with the movable clamping block (806) in a penetrating way through the guide groove.