CN219811479U - Vacuum adsorption plummer and wafer bearing device - Google Patents

Abstract

The utility model provides a vacuum adsorption bearing table and a wafer bearing device, wherein the vacuum adsorption bearing table comprises a carrier plate and a vacuum generating source, a plurality of through holes communicated with the upper surface and the lower surface of the carrier plate are formed in the carrier plate, the carrier plate is divided into a plurality of adsorption areas for adsorbing wafers, and the adsorption areas are nested inside and outside; the vacuum adsorption source is connected to at least one adsorption zone; the adsorption state of each adsorption area is controlled by the vacuum generating source. Through dividing the carrier plate with the through holes into a plurality of adsorption areas, when the wafers with different specifications are required to be adsorbed, negative pressure can be generated in the corresponding areas, so that the operation of wafers with different specifications can be adapted without changing the shape of the wafers, and the production efficiency is improved.

Description

Vacuum adsorption plummer and wafer bearing device

Technical Field

The present utility model relates to wafer processing technology, and more particularly, to a vacuum adsorption carrier and a wafer carrier.

Background

The structure of the existing wafer carrying platform is usually to form holes on the carrying plate, and use cavities or management to connect the holes for adsorbing wafers. For example, patent CN115732389a discloses a wafer carrier, in which a top plate, a side wall and a bottom plate enclose a cavity, a plurality of openings are formed in the top plate, and when a wafer is placed on the top plate, the cavity is vacuumized to adsorb the wafer on the top plate.

However, the openings of the bearing structure are mutually communicated, the adsorption force is uniformly distributed, and the production operation of wafers with different sizes cannot be satisfied. For example, when a 4 inch wafer is placed on an 8 inch carrier table, the openings in the uncovered portion (non-working area) of the wafer may leak air, resulting in insufficient suction to hold the 4 inch wafer. Therefore, the wafers of each specification need to be matched with the bearing platforms of corresponding sizes, and when the sizes of the wafers are changed, the matched adsorption platforms need to be replaced to perform operation, so that the equipment cost is increased, and the production efficiency is reduced.

Disclosure of Invention

The utility model aims to provide a vacuum adsorption bearing table and a wafer bearing device suitable for producing wafers of different specifications.

The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

According to a first aspect of the present utility model, there is provided a vacuum adsorption carrier, including a carrier plate and a vacuum generating source, wherein a plurality of through holes communicating with an upper surface and a lower surface of the carrier plate are formed on the carrier plate, the carrier plate is divided into a plurality of adsorption areas for adsorbing wafers, and the plurality of adsorption areas are nested inside and outside; the vacuum adsorption source is connected to at least one adsorption zone; the adsorption state of each adsorption area is controlled by the vacuum generating source. Through dividing the carrier plate with the through holes into a plurality of adsorption areas, when the wafers with different specifications are required to be adsorbed, negative pressure can be generated in the corresponding areas, so that the operation of wafers with different specifications can be adapted without changing the shape of the wafers, and the production efficiency is improved. In addition, by arranging the plurality of adsorption areas in a nested manner, the area of the empty adsorption bearing table can be reduced, and the utilization space can be maximized.

Preferably, the through holes are radially arranged on the carrier plate with the center of the carrier plate as a starting point and the boundary of the adsorption area as an end point; the aperture of the through hole in each adsorption area is gradually increased along the radial direction of the carrier plate by taking the center of the carrier plate as a starting point. By the technical means, the effect of automatic time-sharing adsorption from outside to inside can be achieved. When the wafer is adsorbed, the periphery of the wafer is adsorbed first, and the middle part of the wafer is adsorbed later, so that the wafer is prevented from warping or deforming.

Preferably, the carrier plate is divided into at least a first adsorption area and a second adsorption area, the first adsorption area is a circular area located at the center of the carrier plate, and the second adsorption area is a circular area sleeved outside the first adsorption area. By the technical means, at least two wafers with different specifications can be matched, and good air tightness can be ensured because the shape of the adsorption area is consistent with the shape of the wafer.

Preferably, an air groove is formed in the lower surface of the carrier plate, and the through hole is connected to the vacuum generating source through the air groove. By the technical means, the connection process of the through hole and the vacuum generating source can be simplified, and the time required for generating negative pressure by vacuumizing is shortened.

Preferably, the air groove comprises a plurality of circular grooves with coincident circle centers and unequal inner diameters and outer diameters and a plurality of linear grooves arranged along the radial direction; the center of each circular groove coincides with the center of the lower surface of the carrier plate. Through the technical means, each through hole can generate uniform adsorption force, and wafer deformation caused by uneven adsorption is avoided.

Preferably, the adsorption state of each adsorption area is independently controlled by the vacuum generating source, air grooves in the same adsorption area are communicated with each other, and air grooves in different adsorption areas are not communicated with each other. By this means, it is ensured that a sufficient adsorption force can be generated in each adsorption region.

Preferably, the adsorption state of each of the adsorption regions is controlled by the vacuum generating source in a non-independent manner; the air grooves in the same adsorption area are communicated with each other, and the air grooves in different adsorption areas are also communicated with each other; the vacuum adsorption bearing table further comprises a jig cover plate, wherein the jig cover plate is used for covering a non-adsorption area of the carrier plate; wherein the non-adsorbed region is an adsorbed region where the wafer is not adsorbed. By the technical means, the adsorption force can be concentrated in the adsorption area, and the tightness of the non-adsorption area is ensured.

Preferably, the bottom surface of the carrier plate is further provided with a sealing element mounting groove, the sealing element mounting groove is located between any two adjacent adsorption areas, and a sealing element is arranged in the sealing element mounting groove. By this means, the negative pressure shortage caused by the air leakage can be prevented.

Preferably, the bottom surface of the carrier plate is provided with a plurality of air passage connecting holes, each air passage connecting hole is communicated with an air groove in an adsorption area, and the air passage connecting holes are used for being connected with the vacuum generating source. Through the technical means, the rapid installation connection of the air tank and the air channel can be realized.

According to a second aspect of the present utility model, there is provided a wafer carrying apparatus comprising the vacuum adsorption carrier as described above, further comprising a mounting platform on which at least one air pipe joint is provided, the air pipe joint being connected to a vacuum generating source through air pipes, each of the air pipes being provided with a vacuum solenoid valve; when the vacuum adsorption plummer is placed on the mounting platform, the lower surface of the vacuum adsorption plummer is attached to the mounting platform, so that the through holes in the adsorption areas are connected with a vacuum generation source. Through setting up the mounting platform that matches with vacuum absorption plummer, can simplify installation and gas circuit connection process, when fixing the mounting platform with vacuum absorption plummer, can accomplish the connection of gas circuit.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

The above features and advantages of the present utility model will be better understood after reading the detailed description of embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily to scale and components having similar related features or characteristics may have the same or similar reference numerals.

FIG. 1 is a top view of a vacuum chuck table according to a first embodiment (first opening mode);

FIG. 2 is a top view of a vacuum chuck table according to the first embodiment (second opening mode);

FIG. 3 is a bottom view of a vacuum chuck table according to the first embodiment;

FIG. 4 is a schematic view of a vacuum chuck table of the first embodiment mounted to a mounting platform;

FIG. 5 is a schematic diagram of the installation process of the vacuum adsorption stage of the second embodiment;

FIG. 6 is a bottom view of a vacuum chuck table according to a second embodiment;

FIG. 7 is a schematic view of a vacuum chuck table of the second embodiment mounted to a mounting platform;

wherein: 100-supporting plate; 101-a through hole; 102-an air tank; 102 a-a circular groove; 102 b-a circular groove; 1 a-a first adsorption zone; 1 b-a second adsorption zone; 1 c-a third adsorption zone; 103-seal mounting groove; 104-an air path connecting hole; 200-mounting a platform; 201-tracheal tube joint; 300-wafer carrier; 400-jig cover plate; 2 a-adsorption zone; 2 b-non-adsorbed region.

Detailed Description

The utility model is described in detail below with reference to the drawings and the specific embodiments. It is noted that the aspects described below in connection with the drawings and the specific embodiments are merely exemplary and should not be construed as limiting the scope of the utility model in any way.

Example 1

As shown in fig. 1 to 4, the embodiment of the utility model provides a vacuum adsorption bearing table. The vacuum adsorption bearing table comprises a carrier plate 100, wherein a plurality of through holes 101 which are communicated with the upper surface and the lower surface are formed in the carrier plate 100. The carrier 100 is divided into a plurality of suction areas for sucking the wafer. The vacuum adsorption source is connected to at least one adsorption region, and an adsorption state of each adsorption region is controlled by the vacuum generation source. The adsorption state can include adsorption state and non-adsorption state, through dividing the support plate that opens there is the through-hole into a plurality of adsorption areas, when needs adsorb the wafer of different specifications, the production negative pressure in corresponding region can to need not the retooling alright adaptation different specification wafer operations, improved production efficiency.

In the present embodiment, the through holes 101 are radially formed on the carrier 100 with the center of the carrier 100 as a starting point and the boundary of the adsorption region as an end point. Wherein, the through hole 101 arranged on the carrier plate 100 can be a multi-circle annular through hole circle, and the circle centers of the through hole circles are coincident with the center of the carrier plate 100, and are sequentially distributed from inside to outside, so that the through hole arrangement can be matched with the shape of the wafer, the area where the wafer is adsorbed and omitted is avoided when the wafer is adsorbed and fixed, and the annular through hole circle ensures the adsorption stability of the wafer when the wafer is adsorbed and fixed.

It should be understood that in a practical application scenario, a wafer generally includes an active device area and a peripheral area located at the periphery of the active device area, where the size of the peripheral area is different according to different process requirements, the number of devices in the peripheral area of the wafer is smaller, the number of devices in the active device area is larger, and the warpage of the wafer is generally generated due to the difference in the device density of the active device area, and the device density of the active device area is large, so that the wafer protrudes downwards in the middle under the action of gravity, and the wafer generates a bowl-like warpage that protrudes in the periphery of the middle recess.

In this embodiment, therefore, the aperture of the through hole 101 gradually increases in the radial direction with the center of the carrier plate 100 as the starting point. For example, the diameter of the through hole 101 in the region near the center is 0.8mm, the diameter of the through hole in the middle region is 0.9mm, and the diameter of the through hole 101 in the peripheral region is 1mm. Since the through holes with smaller diameters generate negative pressure later than the through holes with larger diameters, the effect of automatic time-sharing adsorption from outside to inside can be formed. When the wafer is adsorbed, the peripheral part of the wafer is adsorbed firstly, and the central part of the wafer is adsorbed later, so that the situation that the wafer is warped when the wafer is adsorbed fixedly can be reduced or even avoided; and when the wafer to be adsorbed and fixed has warp, the warp wafer can be flattened.

In a practical application scenario, when the size of the wafer to be adsorbed is too large, if the wafer is sequentially adsorbed and fixed from the peripheral area of the wafer to the device effective area of the wafer, the stability of the wafer is poor, and the wafer may deviate. Such as: when the size of the wafer to be suction-fixed is 8 inches, there is substantially no difference in device density in the size range of 7 inches or more, and if suction-fixing is instantaneously performed only on the 8-inch edge area, the wafer may be offset.

In a possible embodiment, the through holes can thus also be designed to increase gradually in the radial direction of the carrier plate 100 starting from the center of the carrier plate 100 in each of the adsorption areas. For example, in the first adsorption region, the pore diameter of the through hole near the inner side is 0.8mm, and the pore diameter of the through hole near the outer side is 1mm. In the second adsorption region, the pore diameter of the through hole near the inner side is 0.8mm, and the pore diameter of the through hole near the outer side is 1mm. When adsorbing fixed wafer, the outside through-hole of first absorption region and the outside through-hole of second absorption region begin the absorption earlier simultaneously, and the inboard through-hole of first absorption region and the inboard through-hole of second absorption region adsorb later simultaneously to reach the effect that the multiple spot adsorbs simultaneously, help promoting the stability of wafer, and can carry out the flattening to the warpage wafer.

In this embodiment, the carrier 100 is made of 440c stainless steel, and has about 300 through holes formed thereon. The conventional vacuum adsorption platform is complicated in gas path connection structure, and usually only tens of adsorption holes can be formed, but the mounting is simplified in the gas tank connection mode, and the gas tanks are connected with all through holes, so that the number of holes can be greatly increased, more uniform adsorption force can be provided, and the warping and deformation of the wafer are reduced. The diameter of the through hole 101 cannot be too large, otherwise the wafer is easily deformed due to too large air flow, and cannot be too small, otherwise blockage is easily generated. In this embodiment, the diameter of the through hole 101 is preferably 0.8-1 mm, which not only meets the requirement of vacuum adsorption force, but also is convenient to clean and not easy to block.

The adsorption area can be divided according to the specification and shape of the wafer to be adsorbed, and can be slightly deformed. Wafer grids typically include 4 inches (100 mm), 4.9 inches (125 mm), 150 mm (5.9 inches, commonly referred to as "6 inches"), 200 mm (7.9 inches, commonly referred to as "8 inches"), 300 mm (11.8 inches, commonly referred to as "12 inches"), 450 mm (17.7 inches), 675 mm (26.6 inches), and the like. In this embodiment, the shape of the adsorption area is consistent with the shape and size of the wafer to be adsorbed, so as to ensure good air tightness and adsorption effect.

The adsorption areas can be independently arranged or overlapped. In this embodiment, in order to reduce the area of the carrier plate and simplify the structure, a plurality of adsorption areas are nested inside and outside, the adsorption area of the central portion is used for adsorbing a small-sized wafer, and the adsorption area of the peripheral portion is used for adsorbing a larger-sized wafer in combination with the adsorption area of the central portion. Further, in this embodiment, the adsorption regions are concentrically arranged to facilitate wafer placement.

In this embodiment, the carrier is divided into a first adsorption area 1a, a second adsorption area 1b and a third adsorption area 1c, wherein the first adsorption area 1a is a circular area located at the center of the carrier, the second adsorption area 1b is a circular area sleeved outside the first adsorption area 1a, and the third adsorption area 1c is a circular area sleeved outside the first adsorption area 1 b. The diameter of the first suction area 1a corresponds to a 4 inch wafer, which has a diameter of 4 inches. The size of the suction region formed by the first suction region 1a and the second suction region 1b corresponds to 6 inches of wafer, and the outer diameter of the second suction region 1b is 6 inches and the inner diameter is 4 inches. The suction areas formed by the first suction area 1a, the second suction area 1b, and the third suction area 1c correspond to 8-inch wafers, and the third suction area 1c has an outer diameter of 8 inches and an inner diameter of 6 inches.

When a 4-inch wafer needs to be adsorbed, the connection between the first adsorption area 1a and a vacuum generation source is independently opened, so that negative pressure is generated in the through holes in the area. When the 6-inch wafer needs to be adsorbed, the first adsorption area 1a and the second adsorption area 1b are simultaneously started, so that negative pressure is generated in the through holes in the two areas. When the 8-inch wafer needs to be adsorbed, the first adsorption area 1a, the second adsorption area 1b and the third adsorption area 1c are simultaneously started, so that negative pressure is generated in through holes in the 3 adsorption areas.

There are various ways of connecting the through holes to the vacuum generating source, either by directly connecting each through hole through a pipe or by connecting the through holes to a cavity through which they are connected to the vacuum generating source. The manner in which the individual adsorption zones are controlled individually varies depending on the manner of connection. For example, a valve may be provided on the pipe to control the opening and closing of the pipe, or an openable and closable stopper may be provided in the chamber to control the opening and closing of the chamber.

In the present embodiment, an air groove 102 is provided in the lower surface of the carrier plate 100, and the through hole 101 is connected to a vacuum generating source through the air groove 102. The air tank 102 minimizes the structural volume and reduces the time required to create negative pressure by evacuating the air compared to an entire chamber. Meanwhile, the air tank structure can simplify the connection and installation process, and the carrier plate 100 can be directly placed on the installation platform 200 to realize the closed connection of the air paths.

In order to substantially maintain the negative pressure generated by each through hole 101 uniform, the air groove 102 may be designed to have a spider-web-like structure, including a plurality of circular grooves 102a with coincident centers and unequal inner and outer diameters, and a plurality of radial linear grooves 102b, wherein the linear grooves 102b pass through each circular groove 102a. Wherein the air tanks 102 in the same adsorption region are communicated with each other, and the air tanks 102 in different adsorption regions are not communicated with each other, so that each adsorption region can be individually connected to a vacuum generating source.

Further, in order to prevent gas channeling or overflowing between the respective regions, it is also necessary to seal the respective adsorption regions separately, for example, a seal may be provided between the respective adsorption regions. In this embodiment, a seal mounting groove 103 is formed in the bottom surface of the carrier plate, the seal mounting groove 103 is located between the respective adsorption areas, and a seal, such as a rubber seal ring (not shown in the figure), is provided in the seal mounting groove 103.

In addition, the bottom surface of the carrier plate 100 is further provided with a plurality of air passage connection holes 104, each air passage connection hole 104 is communicated with an air groove in an adsorption area, and the air passage connection holes 104 are used for being connected with a vacuum generation source. When the carrier plate 100 is placed on the mounting platform, the air passage connection hole 104 can be directly abutted with the air tap, so that quick mounting is realized.

Further, each gas path connecting hole 104 is communicated with the outermost gas groove 102 in one adsorption area, and by the technical means, as the gas path connecting hole 104 is closest to the outermost gas groove in the adsorption area, the effect of evacuating air in the outermost through hole of the adsorption area can be achieved, so that the effect of adsorbing the periphery of the wafer first and then adsorbing the middle part of the wafer, namely, adsorbing the wafer in a time-sharing manner, can be achieved, and further, the warpage of the wafer can be reduced and the warped wafer can be flattened.

The embodiment of the utility model also provides a wafer carrying device, which comprises the vacuum adsorption carrying platform and also comprises a mounting platform 200, wherein the mounting platform 200 is provided with a flat mounting surface, a plurality of air pipe joints 201 are arranged on the mounting surface, each air pipe joint 201 is connected to a vacuum generating source through an air pipe, and a vacuum electromagnetic valve is arranged on each air pipe; when the vacuum adsorption plummer is placed on the mounting platform, the lower surface of the vacuum adsorption plummer is attached to the mounting surface, so that each air groove is sealed, and each air pipe joint 201 extends into the air groove of each adsorption area.

The product adsorption process of the wafer bearing device comprises the following steps: placing a wafer to be processed in an adsorption area on a carrier plate; and controlling the vacuum electromagnetic valve corresponding to the adsorption area to be opened, so that negative pressure is generated in the through hole in the corresponding adsorption area and the product is adsorbed.

The wafer bearing device can be applied to various wafer processing equipment. For example, when the device is used in a ball planting machine, the mounting platform needs to be connected with a vacuum generating source and has a heating function, and meanwhile, each sealing piece and each gas pipeline are made of high-temperature resistant materials.

Example two

The embodiment provides a vacuum adsorption bearing table, as shown in fig. 5-7, which comprises a carrier plate 100, wherein a plurality of through holes 101 communicated with the upper surface and the lower surface are formed in the carrier plate, and the carrier plate is divided into at least one group of adsorption areas and non-adsorption areas, such as adsorption area 2a and non-adsorption area 2b in fig. 5. Both the suction zone and the non-suction zone are connected to the same vacuum generating source. Each set of the adsorption regions being complementary to the non-adsorption regions; the adsorption area is used for adsorbing the wafer, and the non-adsorption area needs to be kept airtight. Therefore, the vacuum adsorption bearing table further comprises at least one fixture cover plate 400, wherein the fixture cover plate 400 is used for covering the non-adsorption area 2b on the carrier plate 101. Through the through-hole of corresponding specification tool apron 400 cover non-absorption region, can prevent that gas from excessive, cause the negative pressure of absorption region not enough.

For example, two jig cover plates may be provided, the first jig cover plate having an inner diameter of 4 inches and an outer diameter of 6 inches. The second jig cover plate had an inner diameter of 6 inches and an outer diameter of 8 inches. When the vacuum adsorption bearing table adsorbs a 4-inch wafer, the first jig cover plate can be placed on the carrier plate so as to cover the rest non-adsorption area. When the vacuum adsorption bearing table adsorbs a 6-inch wafer, a second jig cover plate can be placed on the carrier plate to cover the rest non-adsorption area. When the vacuum absorption bearing table absorbs the 8-inch wafer, a jig cover plate is not required to be arranged.

The adsorption area and the non-adsorption area can be divided according to the crystal compass grids required to be adsorbed, but can be slightly deformed. For example, if the wafer to be suctioned is 4 inches in size, the suction area 2a is a circular area with a diameter of 4 inches, and the non-suction area 2b is a complementary circular area, so that the shape of the jig cover plate 400 matches the shape of the non-suction area.

Further, in order to ensure air tightness and stability of the jig cover plate, the jig cover plate 400 and the carrier plate 100 may be connected by bolts, screws, buckles, etc. In this embodiment, bolt holes are formed in the periphery of the jig cover plate 400, and bolt holes are also formed in the periphery of the carrier plate 100 at corresponding positions, and the jig cover plate 400 is fixed by bolts after being mounted on the carrier plate 100.

Also, each through hole 101 may be connected to a vacuum generating source through an air tank 102 in the present embodiment. The arrangement of the through holes 101 may refer to the first embodiment, and will not be described herein. Unlike the first embodiment, the air grooves 102 between the respective adsorption areas are communicated with each other so that the respective adsorption areas are commonly connected to the same vacuum generating source through the same air passage connection hole (the air passage connection hole 104 at the center of the circle in fig. 7 in the present embodiment).

As will be readily understood, the present embodiment also provides a wafer carrier apparatus, including the vacuum adsorption carrier table as described above, and further including a mounting platform 200, the mounting platform 200 having a flat mounting surface on which an air pipe connector 201 is provided, the air pipe connector 201 being connected to a vacuum generating source through an air pipe on which a vacuum solenoid valve is provided; when the vacuum absorption plummer is placed on the mounting platform, the lower surface of the vacuum absorption plummer is attached to the mounting surface, so that each air groove is sealed, and the air pipe joint 201 extends into the air path connecting hole 104.

The product adsorption process of the wafer bearing device comprises the following steps: placing the product in an adsorption area on a carrier plate; covering the jig cover plate on a non-adsorption area on the vacuum adsorption bearing table; and controlling the vacuum electromagnetic valve to be opened, so that negative pressure is generated in the through hole in the adsorption area and the product is adsorbed.

Example III

The embodiment of the utility model also provides a ball planter, which comprises the wafer bearing device. In the ball implantation process, the wafer bearing device is used for realizing the adsorption and fixation of the wafer. Meanwhile, it should be noted that, because the ball-mounting process needs to be heated, the sealing member and the air path structure in the wafer carrying device are all made of high temperature resistant materials.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description is only of preferred embodiments of the utility model and is not intended to limit the utility model to the particular embodiments disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.

Claims (10)

1. A vacuum adsorption plummer, its characterized in that: the wafer suction device comprises a carrier plate and a vacuum generating source, wherein a plurality of through holes which are communicated with the upper surface and the lower surface of the carrier plate are formed in the carrier plate, the carrier plate is divided into a plurality of suction areas for sucking wafers, and the suction areas are nested inside and outside; the vacuum adsorption source is connected to at least one adsorption zone; the adsorption state of each adsorption area is controlled by the vacuum generating source.

2. The vacuum adsorption stage of claim 1, wherein: the through holes are radially arranged on the carrier plate by taking the center of the carrier plate as a starting point and taking the boundary of the adsorption area as an end point; the aperture of the through hole in each adsorption area is gradually increased along the radial direction of the carrier plate by taking the center of the carrier plate as a starting point.

3. The vacuum adsorption stage of claim 2, wherein: the carrier plate is divided into at least a first adsorption area and a second adsorption area, the first adsorption area is a circular area positioned at the center of the carrier plate, and the second adsorption area is a circular area sleeved outside the first adsorption area.

4. A vacuum adsorption stage according to claim 3 wherein: the lower surface of the carrier plate is provided with an air groove, and the through hole is connected with the vacuum generating source through the air groove.

5. The vacuum chuck as set forth in claim 4, wherein: the air groove comprises a plurality of circular grooves with coincident circle centers and unequal inner diameter and outer diameter, and a plurality of linear grooves arranged along the radial direction; the center of each circular groove coincides with the center of the lower surface of the carrier plate.

6. The vacuum chuck as set forth in claim 5, wherein: the adsorption state of each adsorption area is independently controlled by the vacuum generation source, air grooves in the same adsorption area are communicated with each other, and air grooves in different adsorption areas are not communicated with each other.

7. The vacuum chuck as set forth in claim 5, wherein: the adsorption state of each adsorption area is controlled by the vacuum generation source in an independent mode, air grooves in the same adsorption area are communicated with each other, and air grooves in different adsorption areas are also communicated with each other;

the vacuum adsorption bearing table further comprises a jig cover plate, wherein the jig cover plate is used for covering a non-adsorption area of the carrier plate; wherein the non-adsorbed region is an adsorbed region where the wafer is not adsorbed.

8. The vacuum chuck as set forth in claim 6, wherein: the bottom surface of the carrier plate is also provided with a sealing element mounting groove, the sealing element mounting groove is positioned between any two adjacent adsorption areas, and a sealing element is arranged in the sealing element mounting groove.

9. The vacuum chuck as set forth in claim 8 wherein: the bottom surface of the carrier plate is provided with a plurality of air passage connecting holes, each air passage connecting hole is communicated with an air groove in an adsorption area, and the air passage connecting holes are used for being connected with the vacuum generating source.

10. A wafer carrying device, characterized by comprising the vacuum adsorption carrying platform according to any one of claims 1 to 9, and further comprising a mounting platform, wherein at least one air pipe connector is arranged on the mounting platform, the air pipe connector is connected to a vacuum generating source through an air pipe, and a vacuum electromagnetic valve is arranged on each air pipe; when the vacuum adsorption plummer is placed on the mounting platform, the lower surface of the vacuum adsorption plummer is attached to the mounting platform, so that the through holes in the adsorption areas are connected with a vacuum generation source.