CN219805532U - LED chip laser marking device - Google Patents
LED chip laser marking device Download PDFInfo
- Publication number
- CN219805532U CN219805532U CN202320142473.XU CN202320142473U CN219805532U CN 219805532 U CN219805532 U CN 219805532U CN 202320142473 U CN202320142473 U CN 202320142473U CN 219805532 U CN219805532 U CN 219805532U
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- Prior art keywords
- marking device
- laser marking
- led chip
- horizontal direction
- wafer
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- 238000010330 laser marking Methods 0.000 title claims abstract description 32
- 238000005286 illumination Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the field of LED illumination, in particular to an LED chip laser marking device which comprises a workbench, a movable seat, a Wafer carrying disc, a laser and a CCD detector, wherein the movable seat is arranged on the workbench; the Wafer carrying disc is arranged on the moving seat in a sliding manner along a second horizontal direction, and the first horizontal direction is perpendicular to the second horizontal direction; the CCD detector and the laser are arranged on the workbench; the CCD detector, the laser and the Wafer carrier disc are sequentially arranged from top to bottom along the vertical direction. The LED chip laser marking device provided by the utility model does not need an installer to go up again to disassemble, assemble and debug the Wafer carrying disc and the laser marking device again, so that the client can adjust the relative positions of the Wafer carrying disc and the laser marking device by himself, the labor cost is saved, and the application range is wide.
Description
Technical Field
The utility model relates to the field of LED illumination, in particular to an LED chip laser marking device.
Background
An LED, light emitting diode, is a solid state semiconductor device that converts electrical energy into light energy. The new LED chip has complex process, and various anomalies such as chip pollution and abnormal photoelectric performance can be generated in the processing process. To analyze anomalies, it is often necessary to conduct a sample analysis after wafer dicing programs a single chip. Typically, the number of chips produced by each wafer process is tens of thousands, and each wafer has the same appearance, which can take a lot of time and effort to find an abnormal chip among such a huge number of chips. In order to solve the above problems, in the prior art, a method of marking the chips with anomalies by using laser and then searching for the chips with specific markings among a large number of chips is adopted, so that the time can be saved and the labor cost can be reduced. The traditional laser marking device can refer to Chinese patent application number CN201420120344.1, and the name of the traditional laser marking device is a chip laser marking device. The traditional laser marking device can not carry out position adjustment to Wafer piece carrier disc, but the customer need change the position of mark location to the LED chip of different models, just needs the installer to go up again for the customer again dismouting and debugging this time, and is not only wasted time and energy, and is unfavorable for guaranteeing the life of device.
Disclosure of Invention
In order to overcome the defects in the prior art, the technical problem to be solved by the utility model is to provide the LED chip laser marking device which is convenient for adjusting the relative positions of the Wafer carrying disc and the laser marking device by oneself, saves labor cost and has wide application range.
In order to solve the technical problems, the utility model adopts the following technical scheme: the LED chip laser marking device comprises a workbench, a movable seat, a Wafer carrying disc, a laser and a CCD detector;
the Wafer carrying disc is arranged on the moving seat in a sliding manner along a second horizontal direction, and the first horizontal direction is perpendicular to the second horizontal direction;
the CCD detector and the laser are arranged on the workbench;
the CCD detector, the laser and the Wafer carrier disc are sequentially arranged from top to bottom along the vertical direction.
Further, the workbench is provided with a first guide rail along a first horizontal direction, the movable seat is slidably connected with the first guide rail, the movable seat is provided with a second guide rail along a second horizontal direction, and the Wafer carrying disc is slidably connected with the second guide rail.
Further, a mortise is formed in the movable seat, and a boss joggled with the mortise is arranged on the second guide rail.
Further, the automatic positioning device further comprises a positioning base, wherein the positioning base is arranged on the workbench, and the movable base is arranged on the positioning base in a sliding manner along the first horizontal direction.
Further, the workbench is provided with an array of mounting lock holes, and the positioning base is locked with the mounting lock holes through adjusting bolts.
Further, the Wafer carrying disc is provided with a Wafer loading notch.
Further, a horizontal adjusting handle is arranged on the Wafer carrying disc.
Further, the horizontal adjustment handle is locked with the base through a fastener.
The utility model has the beneficial effects that: the Wafer carrying disc position adjusting component is designed on the workbench, the use requirements of most customers can be met, the positions of the Wafer carrying discs can be flexibly adjusted for different types of LED chips, the positions of the lasers marked and positioned on the Wafer carrying discs are changed, an installer is not required to get on again to disassemble and debug the Wafer carrying discs and the laser marking device again, the customers can adjust the relative positions of the Wafer carrying discs and the laser marking device by themselves, labor cost is saved, and the application range is wide.
Drawings
Fig. 1 is a schematic structural diagram of an LED chip laser marking device according to an embodiment of the present utility model;
fig. 2 is a schematic structural view of a Wafer carrier in accordance with an embodiment of the present utility model;
FIG. 3 is a schematic view of a movable seat according to an embodiment of the present utility model;
FIG. 4 is a schematic view showing the structure of a second rail according to an embodiment of the present utility model;
description of the reference numerals:
1. a work table; 11. A first guide rail; 2. a movable seat; 21. a second guide rail; 22. a tongue and groove; 23. A boss; 3. Wafer plate; 31. A notch for loading a sheet; 32. A horizontal adjustment handle; 4. a laser; 5. a CCD detector; 6. and positioning the base.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present utility model in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
The utility model provides an LED chip laser marking device which is applied to LED chip detection operation.
Referring to fig. 1 to 4, the LED chip laser marking device of the present utility model includes a workbench 1, a movable base 2, a Wafer carrier 3, a laser 4 and a CCD detector 5;
the movable seat 2 is arranged on the workbench 1 in a sliding manner along a first horizontal direction, the Wafer carrying disc 3 is arranged on the movable seat 2 in a sliding manner along a second horizontal direction, and the first horizontal direction is perpendicular to the second horizontal direction;
the CCD detector 5 and the laser 4 are arranged on the workbench 1;
the CCD detector 5, the laser 4 and the Wafer carrying disc 3 are sequentially arranged from top to bottom along the vertical direction.
From the above description, the beneficial effects of the utility model are as follows: the Wafer carrying disc 3 position adjusting assembly capable of being horizontally adjusted along two shafts is designed on a workbench 1, the position of the Wafer carrying disc 3 can be adjusted in one horizontal direction by controlling the movement of a movable seat 2, the Wafer carrying disc 3 can be adjusted in the other horizontal direction by moving the movable seat 2, an image is acquired by a CCD detector 5 after positioning, the laser marking position is determined, and then the Wafer carrying disc 3 is marked and positioned by a laser 4.
In an alternative embodiment, the workbench 1 is provided with a first guide rail 11 along a first horizontal direction, the movable seat 2 is slidably connected with the first guide rail 11, the movable seat 2 is provided with a second guide rail 21 along a second horizontal direction, and the Wafer carrier 3 is slidably connected with the second guide rail 21.
From the above description, the first guide rail 11 and the second guide rail 21 are used for guiding and positioning the moving seat 2 and the Wafer carrier 3, so as to ensure the adjustment smoothness and stability.
In an alternative embodiment, the movable seat 2 is provided with a mortise 22, and the second guide rail 21 is provided with a boss 23 joggled with the mortise 22.
From the above description, the movable seat 2 and the second guide rail 21 are connected by joggles, which not only ensures stable structural connection, but also facilitates disassembly and replacement.
In an alternative embodiment, the positioning base 6 is further included, the positioning base 6 is disposed on the workbench 1, and the movable base 2 is slidably disposed on the positioning base 6 along the first horizontal direction.
From the above description, the positioning base 6 plays a role in supporting and fixing, and can control the parallelism between the positioning base 6 and the workbench 1 by matching with the adjusting bolt, so that the inclination angle of the whole device is adjusted, and the marking quality is improved.
In an alternative embodiment, the workbench 1 is provided with an array of mounting lock holes, and the positioning base 6 is locked with the mounting lock holes through adjusting bolts.
As is apparent from the above description, the heights of different portions of the positioning base 6 are adjusted using a plurality of sets of adjusting bolts to change the inclination angle of the positioning base 6.
In an alternative embodiment, the Wafer carrier 3 is provided with a Wafer loading notch 31.
As can be seen from the above description, the upper sheet notch 31 facilitates the taking and placing of sheets.
In an alternative embodiment, the Wafer carrier 3 is provided with a horizontal adjustment handle 32.
From the above description, the level adjustment knob 32 facilitates operation by the customer.
In an alternative embodiment, the level adjustment handle 32 is locked to the base by fasteners.
From the above description, after the horizontal adjustment handle 32 is fastened to the base by the fastener, the Wafer pallet 3 is also fixed in position, and the marking operation can be performed.
The working principle of the utility model is as follows: when the device is used, wafer sheets are placed on the Wafer sheet carrying disc 3, the movable seat 2 is controlled to move to adjust the position of the Wafer sheet carrying disc 3 in one horizontal direction, the horizontal adjusting handle 32 is operated to adjust the position of the Wafer sheet carrying disc 3 in the other horizontal direction, the CCD detector 5 is used for collecting images after positioning and determining the laser marking position, then the laser 4 is used for marking and positioning on the Wafer sheet carrying disc 3, and a sheet source is removed through the sheet feeding notch 31 after marking, so that marking is completed.
Referring to fig. 1 to 4, a first embodiment of the present utility model is as follows: the LED chip laser marking device comprises a workbench 1, a movable seat 2, a Wafer carrying disc 3, a laser 4 and a CCD detector 5;
the movable seat 2 is arranged on the workbench 1 in a sliding manner along a first horizontal direction, the Wafer carrying disc 3 is arranged on the movable seat 2 in a sliding manner along a second horizontal direction, and the first horizontal direction is perpendicular to the second horizontal direction;
the CCD detector 5 and the laser 4 are arranged on the workbench 1;
the CCD detector 5, the laser 4 and the Wafer carrying disc 3 are sequentially arranged from top to bottom along the vertical direction.
The workbench 1 is provided with a first guide rail 11 along a first horizontal direction, the movable seat 2 is slidably connected with the first guide rail 11, the movable seat 2 is provided with a second guide rail 21 along a second horizontal direction, and the Wafer carrier 3 is slidably connected with the second guide rail 21. The movable seat 2 is provided with a mortise 22, and the second guide rail 21 is provided with a boss 23 joggled with the mortise 22. The movable base 2 is arranged on the positioning base 6 in a sliding manner along the first horizontal direction. The workbench 1 is provided with an array of mounting lock holes, and the positioning base 6 is locked with the mounting lock holes through adjusting bolts. The Wafer carrying disc 3 is provided with a Wafer loading notch 31. The Wafer carrying disc 3 is provided with a horizontal adjusting handle 32. The level adjustment handle 32 is locked with the base by fasteners.
In summary, the utility model provides the laser marking device for the LED chip, the Wafer carrying disc position adjusting assembly which can be horizontally adjusted along two axes is designed on the workbench, so that the use needs of most customers can be met, the positions of the Wafer carrying discs can be flexibly adjusted for different types of LED chips, the positions of the lasers for marking and positioning on the Wafer carrying discs are changed, an installer is not required to get on the Wafer carrying discs again to disassemble and debug the Wafer carrying discs again, and the customers can automatically adjust the relative positions of the Wafer carrying discs and the laser marking device, so that the labor cost is saved, and the application range is wide.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent changes made by the specification and drawings of the present utility model, or direct or indirect application in the relevant art, are included in the scope of the present utility model.
Claims (8)
1. The LED chip laser marking device is characterized by comprising a workbench, a movable seat, a Wafer carrying disc, a laser and a CCD detector;
the Wafer carrying disc is arranged on the moving seat in a sliding manner along a second horizontal direction, and the first horizontal direction is perpendicular to the second horizontal direction;
the CCD detector and the laser are arranged on the workbench;
the CCD detector, the laser and the Wafer carrier disc are sequentially arranged from top to bottom along the vertical direction.
2. The LED chip laser marking device according to claim 1, wherein the working table is provided with a first guide rail along a first horizontal direction, the movable seat is slidably connected with the first guide rail, the movable seat is provided with a second guide rail along a second horizontal direction, and the Wafer carrier plate is slidably connected with the second guide rail.
3. The LED chip laser marking device according to claim 2, wherein the movable base is provided with a mortise, and the second guide rail is provided with a boss joggled with the mortise.
4. The LED chip laser marking device of claim 1, further comprising a positioning base disposed on the table, the movable base being slidably disposed on the positioning base along the first horizontal direction.
5. The LED chip laser marking device according to claim 4, wherein the mounting lock holes are arranged on the workbench in an array manner, and the positioning base is locked with the mounting lock holes through adjusting bolts.
6. The LED chip laser marking device according to claim 1, wherein the Wafer carrier is provided with a notch.
7. The LED chip laser marking device according to claim 6, wherein the Wafer tray is provided with a horizontal adjustment handle.
8. The LED chip laser marking device of claim 7, wherein the level adjustment handle is locked to the base by a fastener.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320142473.XU CN219805532U (en) | 2023-01-30 | 2023-01-30 | LED chip laser marking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320142473.XU CN219805532U (en) | 2023-01-30 | 2023-01-30 | LED chip laser marking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219805532U true CN219805532U (en) | 2023-10-10 |
Family
ID=88214379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320142473.XU Active CN219805532U (en) | 2023-01-30 | 2023-01-30 | LED chip laser marking device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219805532U (en) |
-
2023
- 2023-01-30 CN CN202320142473.XU patent/CN219805532U/en active Active
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| GR01 | Patent grant |