CN219802169U - Micro inverter - Google Patents
Micro inverter Download PDFInfo
- Publication number
- CN219802169U CN219802169U CN202321098870.8U CN202321098870U CN219802169U CN 219802169 U CN219802169 U CN 219802169U CN 202321098870 U CN202321098870 U CN 202321098870U CN 219802169 U CN219802169 U CN 219802169U
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- China
- Prior art keywords
- inverter
- micro
- circuit board
- connecting piece
- housing
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- 239000003990 capacitor Substances 0.000 claims abstract description 34
- 230000017525 heat dissipation Effects 0.000 claims abstract description 32
- 238000006243 chemical reaction Methods 0.000 claims abstract description 14
- 230000004308 accommodation Effects 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 229910000838 Al alloy Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Inverter Devices (AREA)
Abstract
The utility model discloses a micro inverter. The micro inverter includes: a housing having an accommodating space provided therein; a connecting member provided at one side of the housing for connecting to the mounting frame; a circuit board disposed in the accommodation space; the voltage conversion circuit is arranged on the circuit board and comprises a plurality of capacitors and switching devices which are regularly arranged, the capacitors are arranged in rows and are positioned on the edge side of the circuit board, the switching devices are arranged between 2 rows of capacitors, the switching devices are close to the connecting piece side, and the circuit board is arranged in the accommodating space and is close to the connecting piece side. The layout of the voltage conversion circuit in the micro inverter is optimized, a device with large heat generated during operation is close to the side of the connecting piece, the micro inverter is fixed on the mounting frame made of aluminum alloy, part of heat of the micro inverter is transferred to the mounting frame through the connecting piece during operation, auxiliary heat dissipation is performed through the connecting piece and/or the mounting frame, and the heat dissipation effect is improved under the condition that the volume of the micro inverter is not increased.
Description
Technical Field
The utility model relates to the technical field of new energy, in particular to a micro inverter.
Background
The micro inverter is applied to a photovoltaic grid-connected system, and is installed corresponding to each photovoltaic module, so that each photovoltaic module is correspondingly matched with one photovoltaic module and has independent direct/alternating current conversion function and MPPT function.
The miniature inverter is internally provided with a voltage conversion circuit, the voltage conversion circuit comprises a transformer, an electrolytic capacitor and other main components, a large amount of heat can be emitted in the working process, and the heat dissipation of the structural design of the miniature inverter is ensured for realizing long-time reliable operation of the miniature inverter. The conventional micro inverter generally adopts pouring sealant to conduct heat of a circuit board to a shell, and then convection and radiation heat dissipation are carried out outwards through the shell. But the coefficient of heat conductivity of pouring sealant is lower, and simultaneously, space clearance is less between miniature dc-to-ac converter and photovoltaic module after accomplishing the installation, leads to convection heat dissipation effect relatively poor, influences miniature dc-to-ac converter whole heat dissipation, causes the life of inside components and parts to shorten.
Disclosure of Invention
To overcome the above drawbacks, the present utility model aims to: the miniature inverter is simple in structure and good in heat dissipation effect.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a micro inverter, comprising:
a housing having an accommodating space provided therein;
a connection member provided at one side of the housing for connection to a mounting frame;
a circuit board disposed in the accommodation space;
the voltage conversion circuit is arranged on the circuit board and comprises a plurality of capacitors and switching devices which are regularly arranged, the capacitors are arranged in columns and positioned at the edge side of the circuit board,
the switching device is between 2 columns of capacitors, and the switching device is close to the connector side,
the circuit board is configured to be located within the accommodation space and close to the connector side. Through the design, auxiliary heat dissipation is performed by using the connecting piece and the mounting frame, the heat dissipation surface area of the micro inverter is increased by phase change, and the heat dissipation effect is enhanced. The miniature inverters with different powers can be assembled by optimizing the layout of components of the voltage conversion circuit under the condition of the size of the existing shell (without increasing the volume of the miniature inverter). The shell is made of high heat conduction materials (such as aluminum materials and cast aluminum).
In a preferred embodiment, the components include a switch, a capacitor, and a transformer disposed on a side of the connector. Through the design, the distance between the main heating element and the connecting piece can be shortened, the thermal resistance in the conduction process is reduced, and the heat dissipation effect is enhanced.
In a preferred embodiment, the connector is provided with a mounting structure for connection to the mounting frame.
In a preferred embodiment, the mounting structure is provided as a hook structure.
In a preferred embodiment, the housing is filled with a thermally conductive adhesive.
In a preferred embodiment, the housing includes a first housing and a second housing that are mutually spliced to form the accommodation space.
In a preferred embodiment, at least a portion of the housing is integrally formed with the connector in the micro-inverter.
In a preferred embodiment, the capacitors are arranged in columns, which are arranged in 2 rows and are located at the edge sides of the circuit board respectively. The 2 preferred rows of capacitors are arranged oppositely, and the switching devices are arranged between the 2 rows of capacitors, so that the heat generated by the capacitors and the switching devices is dispersed during the operation of the micro-inverter, the heat dissipation is facilitated, and the reliability of the micro-inverter is improved.
In a preferred embodiment, the voltage conversion circuit comprises regularly arranged switching devices, which are between 2 columns of capacitors, and which are close to the connector side.
In a preferred embodiment, at least one side of the connector is provided with fins for heat dissipation.
In a preferred embodiment, the shell and the connecting piece are coated with a heat conducting layer.
Advantageous effects
According to the micro inverter provided by the utility model, components with larger power and more heat dissipation are arranged on one side close to the mounting frame by changing the arrangement layout of components in the micro inverter, heat generated in the working process is conducted to the shell and then conducted to the mounting frame through the connecting piece, and auxiliary heat dissipation is performed by utilizing the connecting piece and the mounting frame, so that the heat capacity and the heat dissipation surface area of the micro inverter are increased, the heat dissipation effect is improved, the temperature rise of the components in the micro inverter is reduced, and the service life of the components is prolonged. Meanwhile, the components are distributed at intervals, so that the convection heat dissipation in the micro inverter is improved, and the heat dissipation speed is increased.
Drawings
The accompanying drawings are included to provide an understanding of the technical aspects of the present disclosure, and are incorporated in and constitute a part of this specification, illustrate the technical aspects of the present disclosure and together with the embodiments of the disclosure, not to limit the technical aspects of the present disclosure. The shapes and sizes of the various components in the drawings are not to scale, and are intended to illustrate the present utility model only.
Fig. 1 is a schematic perspective view of a micro inverter according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of an explosion structure of a micro inverter according to an embodiment of the present utility model;
fig. 3 to 4 are schematic views illustrating an internal structure of a micro inverter according to an embodiment of the present utility model;
reference numerals:
100. a micro inverter;
1. a housing; 11. a first housing; 12. a second housing;
2. a connecting piece; 21. a mounting hole;
3. a circuit board;
4. a component; 41. a switch; 42. a capacitor; 43. a transformer;
5. and a connection terminal.
Detailed Description
The above-described aspects are further described below in conjunction with specific embodiments. It should be understood that these examples are illustrative of the present utility model and are not intended to limit the scope of the present utility model. The implementation conditions employed in the examples may be further adjusted as in the case of the specific manufacturer, and the implementation conditions not specified are typically those in routine experiments.
The utility model discloses a micro inverter, which comprises: a metal shell, wherein an accommodating space is arranged in the shell; a connecting member provided at one side end portion of the housing for connecting to a mounting frame (e.g., an aluminum material profile); a circuit board disposed in the accommodation space; the voltage conversion circuit is arranged on the circuit board, the voltage conversion circuit comprises a plurality of capacitors, the capacitors are arranged in columns (such as 2 columns) and are positioned on the edge side of the circuit board, and the circuit board is arranged in the accommodating space and is close to the connecting piece side. According to the mode, through layout optimization of components of a voltage conversion circuit in the micro-inverter, devices with large heat generated during operation are close to the side of the connecting piece, part of the heat of the micro-inverter is transferred to the mounting frame through the connecting piece during operation, auxiliary heat dissipation is performed through the connecting piece and/or the mounting frame, the heat dissipation surface area is increased under the condition that the volume of the micro-inverter is not increased, and the heat dissipation effect is improved. Thus, it is possible to increase the power of the micro-inverter to 1.4Kw or more without increasing the volume of the housing. Thus, under the condition of adopting the existing shell size, the miniature inverters with different powers are assembled through optimizing the layout of components of the voltage conversion circuit. By optimizing the layout of the components of the voltage conversion circuit, the service lives of the electrolytic capacitor and other devices can be prolonged, and the problem of poor heat dissipation performance of the micro-inverter under the condition of narrow space of empty packaging can be solved.
The micro-inverter according to the present utility model will be described with reference to the accompanying drawings.
Fig. 1 is a schematic perspective view of a micro inverter according to the present utility model.
As shown in fig. 1 and 2, the micro inverter 100 specifically includes a housing 1 having an accommodating space therein for mounting a circuit board 3 and components 4; a connecting piece 2 is arranged on one side of the shell 1, and the micro inverter is connected to an external mounting frame through the connecting piece 2; the opposite sides of the housing 1 are connected with connection terminals 5 for current conduction.
As shown in fig. 2, the housing 1 includes a first housing 11 and a second housing 12, and the first housing 11 and the second housing 12 are mutually combined to form an accommodating space. Specifically, the shell 1 and the connecting piece 2 can be made of aluminum profiles, so that the heat conductivity is better, and heat generated by the components 4 in the shell 1 can be conveniently conducted to the outside for heat dissipation.
As shown in fig. 1, a connector 2 is provided on one side of a case 1, and a micro inverter 100 is fixed to a connection frame by the connector 2. In a specific embodiment, the connecting piece 2 is provided with a mounting hole 21, and the connecting piece is fixed on the connecting frame through a bolt or a screw penetrating through the mounting hole 21, so that the micro inverter 100 is fixedly connected with the connecting frame, and the connection relationship is stable and reliable. In another embodiment, the connecting piece 2 can be provided as a hook structure, and the connecting piece 2 is directly hooked on the connecting frame, so that the connecting piece is convenient to install and detach. Preferably, the surface of the connecting piece is provided with fins for heat dissipation or is coated with a heat conducting layer. Preferably, the material of the connecting piece is the same as that of the shell.
As shown in fig. 1, the housing 1 is provided with connection terminals 5 on opposite sides thereof for inputting direct current and outputting alternating current.
As shown in fig. 2 to 4, a circuit board 3 is disposed in the accommodating space, and the circuit board 3 can be fixed on the second housing 12 by screws or bolts, and the circuit board 3 is in direct contact with the second housing 12 for conducting heat dissipation. The connection terminals 5 on the two sides are connected to the circuit board 3, a current inverter circuit is arranged on the circuit board 3, and the circuit board 3 converts direct current into alternating current.
As shown in fig. 2 to 4, a plurality of components 4 are sequentially arranged on the circuit board 3 from one end close to the connecting plate to one end far from the connecting plate, and the components 4 comprise a switch 41, a capacitor 42, a transformer 43 and other components. The power of the switch (also called a switching device) 41 and the capacitor 42 is larger, more heat is generated in the working process, the switch 41 and the capacitor 42 are distributed at one end of the circuit board 3 close to the connecting piece 2, the distance between the component with larger power and the connecting piece 2 is shortened, the thermal resistance in the conduction process is reduced, the heat generated in the working process of the switch 41 and the capacitor 42 is transferred to the upper shell 11 and the lower shell 12, the shell 1 is transferred to the connecting frame through the connecting piece 2, the auxiliary heat dissipation is performed by utilizing the connecting frame, the heat dissipation area is effectively increased, and the heat dissipation rate is improved. The components with smaller power such as the transformer 43 are arranged at one end of the circuit board 3 far away from the connecting piece 2, and the heat generated in the working process is relatively less, so that the shell 1 is used for conducting and radiating. The switch device is a MOS switch or an IGBT switch, and the adjacent connection of the switch device is covered with heat conducting glue. The capacitor is columnar.
As shown in fig. 2, in this embodiment, grooves are formed on opposite sides of the circuit board 3, and the capacitors 42 are arranged in the grooves on the two sides and directly disposed on the second housing 11, and the ends of the capacitors 42 are connected to the circuit board 3, so that the capacitors 42 can conduct and dissipate heat. The switch 41 is arranged between the capacitors 42 at two sides, so that the distance between the switch 41 and the capacitors 42 is prevented from being too close, and the switch 41 is prevented from being corroded by liquid leakage of the capacitors 42. Meanwhile, the capacitors 42 and the switches 41 are arranged separately, so that convection heat dissipation inside the micro inverter 100 is facilitated, and the heat dissipation rate is improved.
It should be noted that the technical features of the above embodiments, such as "the first housing", "the second housing", "the connector", "the capacitor", "the switch", "the transformer", "the connection terminal", etc., may be arbitrarily combined, and for brevity of description, all possible combinations of the technical features of the above embodiments are not described, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above embodiments are provided to illustrate the technical concept and features of the present utility model, and are intended to enable those skilled in the art to understand the present utility model and implement the same according to the present utility model, not to limit the scope of the present utility model. All equivalent changes or modifications made by the spirit of the utility model are intended to be covered by the scope of the utility model.
Claims (10)
1. A micro-inverter, comprising:
a housing having an accommodating space provided therein;
a connection member provided at one side of the housing for connection to a mounting frame;
a circuit board disposed in the accommodation space;
the voltage conversion circuit is arranged on the circuit board and comprises a plurality of capacitors and switching devices which are regularly arranged, the capacitors are arranged in columns and positioned at the edge side of the circuit board,
the switching device is between 2 columns of capacitors, and the switching device is close to the connector side,
the circuit board is configured to be located within the accommodation space and close to the connector side.
2. The micro-inverter of claim 1, wherein,
the connecting piece is provided with a mounting structure which is used for being connected with the mounting frame.
3. The micro-inverter of claim 2, wherein,
the mounting structure is a hook structure.
4. The micro-inverter of claim 1, wherein,
the shell is filled with heat-conducting glue.
5. The micro-inverter of claim 1, wherein,
the housing includes a first housing and a second housing that are mutually spliced to form the accommodation space.
6. The micro-inverter of claim 1, wherein,
at least part of the shell and the connecting piece are integrally formed.
7. The micro-inverter of claim 1, wherein,
the capacitors are columnar, are arranged in 2 rows and are respectively positioned at the edge side of the circuit board.
8. The micro-inverter of claim 7,
the switch device is a MOS switch or an IGBT switch, and the adjacent connection of the switch device is covered with heat-conducting glue.
9. The micro-inverter of claim 1, wherein,
at least one side of the connecting piece is provided with fins for heat dissipation.
10. The micro-inverter of claim 1, wherein,
the shell and the connecting piece are coated with a heat conducting layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321098870.8U CN219802169U (en) | 2023-05-09 | 2023-05-09 | Micro inverter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321098870.8U CN219802169U (en) | 2023-05-09 | 2023-05-09 | Micro inverter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219802169U true CN219802169U (en) | 2023-10-03 |
Family
ID=88186433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321098870.8U Active CN219802169U (en) | 2023-05-09 | 2023-05-09 | Micro inverter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219802169U (en) |
-
2023
- 2023-05-09 CN CN202321098870.8U patent/CN219802169U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |