CN219800834U - Semiconductor chip packaging base with uniform heat dissipation - Google Patents
Semiconductor chip packaging base with uniform heat dissipation Download PDFInfo
- Publication number
- CN219800834U CN219800834U CN202321044601.3U CN202321044601U CN219800834U CN 219800834 U CN219800834 U CN 219800834U CN 202321044601 U CN202321044601 U CN 202321044601U CN 219800834 U CN219800834 U CN 219800834U
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- China
- Prior art keywords
- base
- fixed
- heat dissipation
- outer frame
- semiconductor chip
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 239000012212 insulator Substances 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims 2
- 239000010439 graphite Substances 0.000 claims 2
- -1 graphite alkene Chemical class 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 13
- 229910021389 graphene Inorganic materials 0.000 abstract description 13
- 239000011159 matrix material Substances 0.000 abstract description 5
- 239000002131 composite material Substances 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a base for packaging a semiconductor chip with uniform heat dissipation, and belongs to the technical field of chip packaging bases. Including the base body, the upper surface of base body is seted up flutedly, and the upper surface of recess is fixed with outer frame, and the inside of outer frame is equipped with the bottom plate, and the bottom plate is fixed at the upper surface of base body, and the side of outer frame is connected with the pin, and the both sides wall of outer frame is fixed with the insulator, and the lower extreme of pin passes the insulator and links to each other with the bottom plate, and the lateral wall of outer frame is fixed with a plurality of fin, and a plurality of through-holes have been seted up on the surface of fin, and the base body comprises metal base and graphene sheet, is fixed with the heat conduction glue between metal base and the graphene sheet. According to the utility model, the radiating fins are arranged on the side wall of the base, and the through holes are arranged on the surface of the radiating fins, so that the radiating performance of the side surface of the base is improved; in the structure, the base matrix adopts a composite structure of metal and graphene sheets, so that the heat dissipation performance of the bottom of the base is improved, and the whole base structure is uniform in heat dissipation and good in heat dissipation performance.
Description
Technical Field
The utility model relates to the technical field of chip packaging bases, in particular to a base for packaging a semiconductor chip, which is uniform in heat dissipation.
Background
Chip packaging is an important ring in the field of semiconductor electronic equipment, a packaging base used in chip packaging is an important part, and the packaging base generally consists of a base, an insulator, a pin and a frame, and is fixedly connected with the base, the insulator, the pin and the frame mainly through welding.
In the prior art, a metal base is adopted as a base for packaging, so that the aim of increasing heat dissipation is to increase, but the heat dissipation of the existing base is uneven, and the problem of heat accumulation exists on the side wall and the bottom of the base, so that the packaging base with even heat dissipation is needed.
Disclosure of Invention
In order to solve the problems, the utility model provides a base for packaging a semiconductor chip, which has uniform heat dissipation.
The utility model is realized by the following technical scheme:
the utility model provides a semiconductor chip packaging base of heat dissipation uniformity, includes the base body, the upper surface of base body is seted up flutedly, the upper surface fixing of recess has outer frame, the inside of outer frame is equipped with the bottom plate, the upper surface at the base body is fixed to the bottom plate, the side of outer frame is connected with the pin, the both sides wall of outer frame is fixed with the insulator, the lower extreme of pin passes the insulator and links to each other with the bottom plate, the lateral wall of outer frame is fixed with a plurality of fin, the lower extreme of fin is fixed at the surface of base body, a plurality of through-holes have been seted up on the surface of fin, the base body comprises metal base and graphene sheet, be fixed with the heat conduction glue between metal base and the graphene sheet.
The outer surface of the insulator is provided with a boss, the boss is positioned below the pin, and the outer surface of the boss is a cambered surface.
The radiating fins are rectangular radiating fins, and the adjacent radiating fins are arranged in parallel.
And the adjacent radiating fins are spaced by 1mm.
The insulator is made of ceramic.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the radiating fins are arranged on the side wall of the base, and the through holes are arranged on the surface of the radiating fins, so that the radiating performance of the side surface of the base is improved; in the structure, the base matrix adopts a composite structure of metal and graphene sheets, so that the heat dissipation performance of the bottom of the base is improved, and the whole base structure is uniform in heat dissipation and good in heat dissipation performance.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model.
In the figure: 1. a base substrate; 1-1, a metal base; 1-2, heat conducting glue; 1-3, graphene sheets; 2. an outer frame; 3. a bottom plate; 4. a heat sink; 4-1, through holes; 5. an insulator; 6. pins; 7. a boss; 8. a groove.
Detailed Description
The utility model is further described below with reference to the accompanying drawings:
as shown in fig. 1 of the specification drawings, the base for packaging the semiconductor chip with uniform heat dissipation comprises a base substrate 1, a groove 8 is formed in the upper surface of the base substrate 1, an outer frame 2 is fixed on the upper surface of the groove 8, a bottom plate 3 is arranged in the outer frame 2, the bottom plate 3 is fixed on the upper surface of the base substrate 1, pins 6 are connected to the side surfaces of the outer frame 2, insulators 5 are fixed on two side walls of the outer frame 2, the lower ends of the pins 6 penetrate through the insulators 5 and are connected with the bottom plate 3, a plurality of cooling fins 4 are fixed on the side walls of the outer frame 2, the lower ends of the cooling fins 4 are fixed on the surface of the base substrate 1, a plurality of through holes 4-1 are formed in the surface of the cooling fins 4, the base substrate 1 consists of a metal base 1-1 and graphene sheets 1-3, and heat conducting glue 1-2 is fixed between the metal base 1-3 and the graphene sheets 1-3.
The outer surface of the insulator 5 is provided with a boss 7, the boss 7 is positioned below the pin 6, and the outer surface of the boss 7 is a cambered surface.
The radiating fins 4 are rectangular radiating fins, and the adjacent radiating fins 4 are arranged in parallel.
The adjacent cooling fins 4 are spaced by 1mm.
The insulator 5 is made of ceramic.
Example 1
The utility model provides a semiconductor chip packaging base of heat dissipation uniformity, includes base 1, and recess 8 has been seted up to the upper surface of base 1, and the upper surface of recess 8 is fixed with outer frame 2, and the inside of outer frame 2 is equipped with bottom plate 3, and bottom plate 3 is fixed at the upper surface of base 1, and the side of outer frame 2 is connected with pin 6, and the both sides wall of outer frame 2 is fixed with insulator 5, and insulator 5 adopts ceramic to make.
The lower ends of pins 6 penetrate through insulators 5 and are connected with a bottom plate 3, a plurality of cooling fins 4 are fixed on the side wall of an outer frame 2, the lower ends of the cooling fins 4 are fixed on the surface of a base matrix 1, the base matrix 1 consists of a metal base 1-1 and graphene sheets 1-3, and heat conducting glue 1-2 is fixed between the metal base 1-1 and the graphene sheets 1-3.
The outer surface of insulator 5 is equipped with boss 7, and boss 7 is located the below of pin 6, and the surface of boss 7 is the cambered surface, and the boss plays the supporting role to pin 6.
In this embodiment structure, fin 4 is the rectangle fin, parallel arrangement between the adjacent fin 4, and a plurality of through-holes 4-1 have been seted up on the surface of fin 4, and interval 1mm has been seted up between the adjacent fin 4, and wherein the design of fin 4 plays the radiating effect to the base side, and through-hole 4-1 can form the convection current between the fin, avoids heat gathering between the fin inside, and the design of through-hole has promoted the heat dispersion.
In the embodiment, the base matrix adopts a composite structure of metal and graphene sheets, and the heat conduction performance of the graphene sheets is more excellent than that of a metal material.
The foregoing description is only illustrative of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, but rather the equivalent variations and modifications in shape, construction, characteristics and spirit according to the scope of the claims should be construed to be included in the scope of the claims.
Claims (5)
1. The base for packaging the semiconductor chip with uniform heat dissipation is characterized in that: including base (1), recess (8) have been seted up to the upper surface of base (1), the upper surface fixed of recess (8) has outer frame (2), the inside of outer frame (2) is equipped with bottom plate (3), bottom plate (3) are fixed at the upper surface of base (1), the side of outer frame (2) is connected with pin (6), the both sides wall of outer frame (2) is fixed with insulator (5), insulator (5) are passed to the lower extreme of pin (6) links to each other with bottom plate (3), the lateral wall of outer frame (2) is fixed with a plurality of fin (4), the lower extreme of fin (4) is fixed on the surface of base (1), a plurality of through-holes (4-1) have been seted up on the surface of fin (4), base (1) are constituteed by metal base (1-1) and graphite alkene piece (1-3), be fixed with heat conduction glue (1-2) between metal base (1-1) and graphite alkene piece (1-3).
2. The base for packaging a semiconductor chip having uniform heat dissipation according to claim 1, wherein: the outer surface of the insulator (5) is provided with a boss (7), the boss (7) is positioned below the pin (6), and the outer surface of the boss (7) is a cambered surface.
3. The base for packaging a semiconductor chip having uniform heat dissipation according to claim 1, wherein: the radiating fins (4) are rectangular radiating fins, and adjacent radiating fins (4) are arranged in parallel.
4. The base for packaging a semiconductor chip having uniform heat dissipation according to claim 2, wherein: and the adjacent radiating fins (4) are spaced by 1mm.
5. The base for packaging a semiconductor chip having uniform heat dissipation according to claim 1, wherein: the insulator (5) is made of ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321044601.3U CN219800834U (en) | 2023-05-04 | 2023-05-04 | Semiconductor chip packaging base with uniform heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321044601.3U CN219800834U (en) | 2023-05-04 | 2023-05-04 | Semiconductor chip packaging base with uniform heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219800834U true CN219800834U (en) | 2023-10-03 |
Family
ID=88153395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321044601.3U Active CN219800834U (en) | 2023-05-04 | 2023-05-04 | Semiconductor chip packaging base with uniform heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219800834U (en) |
-
2023
- 2023-05-04 CN CN202321044601.3U patent/CN219800834U/en active Active
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