CN219799854U

CN219799854U - PLCC48 encapsulated optical transceiver

Info

Publication number: CN219799854U
Application number: CN202321358359.7U
Authority: CN
Inventors: 董斌
Original assignee: Hubei Ruichuang Xinda Optoelectronics Co ltd
Current assignee: Hubei Ruichuang Xinda Optoelectronics Co ltd
Priority date: 2023-05-31
Filing date: 2023-05-31
Publication date: 2023-10-03
Anticipated expiration: 2033-05-31

Abstract

The utility model relates to the technical field of optical transceiver devices, in particular to a PLCC48 packaged optical transceiver device. Comprising the following steps: PCB, protective shell and optical fiber wire; a plurality of electronic elements are arranged on the PCB and are connected with the optical fiber wires; the PCB is also provided with a silk-screen wire which is wound around the electronic element; the protective shell is attached to the PCB through a silk-screen wire so as to cover the electronic element; and a colloid is filled between the protective shell and the PCB. In the prior art, the working environments of the optical transceiver device packaged by the PLCC48 are various, and sometimes the working environments are severe environments with high humidity and high dust. Under such circumstances, the components of the optical transceiver are susceptible to normal use and service life due to moisture and dust. Compared with the prior art, the electronic component is coated by the protective shell, the tightness is enhanced by the colloid, the airtight packaging is realized, the water vapor and dust are effectively isolated, the normal use of the product is ensured, and the service life is prolonged.

Description

PLCC48 encapsulated optical transceiver

Technical Field

The utility model relates to the technical field of optical transceiver devices, in particular to a PLCC48 packaged optical transceiver device.

Background

The optical transceiver device packaged by the PLCC48 structure provides high-reliability multi-path data link for short-distance high-speed data processing and transmission, and solves the bottleneck problem of data transmission. Providing a low cost, high density data transmission scheme for the overall system. The optical transceiver is composed of 4 independent wide channels, and in the case of typical applications, each channel can provide a transmission data rate of up to 3.5 Gbps. In the limit, the rate per channel can reach 10Gbps, and the total data transmission capacity of 40Gbps is provided. Meanwhile, the transmission distance of the optical transceiver packaged by the PLCC48 structure is far, and in the multimode optical fiber of the OM3 standard, the transmission distance can reach more than 300 meters. Based on the aforementioned characteristics, the PLCC 48-packaged optical transceiver is widely used in commercial, industrial, and military fields.

Because the application range of the light receiving and transmitting device is wider, in the actual state, the application environment of the light receiving and transmitting device is various, such as in-vehicle, airborne, carrier-borne, high-altitude and other environments. Therefore, the optical transceiver may face extreme environments such as high dust, high humidity, etc. The internal circuit elements are likely to be abnormal due to contact with the outside, so that the transmission rate and the transmission distance of the optical transceiver are seriously affected, and the operation of the whole system is adversely affected.

Disclosure of Invention

Aiming at the technical problems in the prior art, the utility model provides an optical transceiver device packaged by PLCC 48.

In order to solve the technical problems, the utility model provides the following technical scheme:

an optical transceiver device encapsulated by PLCC48, comprising: PCB, protective shell and optical fiber wire; a plurality of electronic elements are arranged on the PCB and are connected with the optical fiber wires; the PCB is also provided with a silk-screen wire which is wound around the electronic element; the protective shell is attached to the PCB through a silk-screen wire so as to cover the electronic element; and a colloid is filled between the protective shell and the PCB.

In the actual state, the electronic component is covered by the protective shell. Meanwhile, the colloid is guided by utilizing the silk-screen wires on the PCB, so that the colloid can fully fill the gap between the protective shell and the PCB, and the tightness between the protective shell and the PCB is enhanced. Therefore, the utility model isolates the electronic element on the PCB from the outside, thereby enhancing the operation stability of the optical transceiver under extreme environments such as high dust, high humidity and the like, and avoiding the occurrence of abnormality of the optical transceiver caused by the influence of the environment.

Further, a through hole is formed in the protective shell; the through port corresponds to the optical fiber line; the optical fiber wire passes through the protective shell through the through hole.

Furthermore, the protective shell is also provided with a guide groove; the guide groove is formed on the joint surface of the protective shell and the PCB; the guide groove corresponds to the silk screen printing line.

Furthermore, the protective shell is also provided with a glue injection groove and an observation groove; the midpoint of the glue injection groove coincides with the midpoint of the guide groove; the glue injection groove is communicated with the guide groove; the number of the observation grooves is a plurality of; the observation groove is arranged from one end of the guide groove to the other end; the observation groove is communicated with the guide groove.

Further, a positioning hole is formed in the PCB; the protective shell is also provided with a positioning pin; the positioning pins are respectively arranged at four vertex angle ends of the protective shell; the positioning pins are inserted into the positioning holes; the positioning pins are provided with drainage grooves; the drainage groove is communicated with the guiding groove.

Further, a heat dissipation structure is arranged on the protective shell; the heat dissipation structure penetrates through the protective shell; the heat dissipation structure corresponds to the electronic component.

Further, the heat dissipation structure comprises a heat absorption plate, a heat dissipation plate and a connecting column; the heat absorbing plate is arranged on the inner side of the protective shell; the heat absorbing plate corresponds to the electronic element; the heat dissipation plate is arranged outside the protective shell; the connecting column is arranged between the heat absorbing plate and the heat radiating plate; the connecting column is connected with the heat absorbing plate and the heat dissipating plate.

Drawings

Fig. 1: integral structure diagram.

Fig. 2: an explosion diagram of the whole structure.

Fig. 3: a bottom view of the protective housing.

Fig. 4: structure diagram of heat dissipation structure.

In the figure: 1. a PCB board; 11. positioning holes; 2. a protective shell; 21. a through port; 22. a guide groove; 23. a glue injection groove; 24. an observation groove; 25. positioning pins; 251. drainage grooves; 26. a heat dissipation structure; 261. a heat absorbing plate; 262. a heat dissipation plate; 263. a connecting column; 3. an optical fiber wire.

Detailed Description

The following are specific embodiments of the present utility model and the technical solutions of the present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to these embodiments.

An optical transceiver device encapsulated by PLCC48, comprising: a PCB board 1, a protective shell 2 and an optical fiber wire 3. The PCB board 1 is provided with electronic components required for operation, and the electronic components are connected with the optical fiber line 3, so as to realize the basic functions of the PLCC48 optical transceiver (hereinafter referred to as optical transceiver). And the PCB 1 is also provided with a silk-screen wire which surrounds the periphery of the electronic element. The silk-screened lines approximate fine scores imprinted on the PCB board 1 to guide the flow of liquid.

The protective shell 2 is of a cuboid structure with a groove and is matched with the PCB 1. When the protective shell 2 is attached to the PCB 1, the protective shell and the PCB are combined together to form a cavity capable of covering the electronic element. The protective shell 2 is provided with a through hole 21, and the through hole 21 corresponds to the optical fiber line 3. The optical fiber wire 3 passes through the protective housing 2 through the through opening 21. Meanwhile, the protecting shell 2 is also provided with a guiding groove 22, a glue injection groove 23 and an observing groove 24. The guide groove 22 has a semicircular cross section. The guiding groove 22 is arranged on the joint surface of the protective shell 2 and the PCB 1. The guiding groove 22 corresponds to the silk-screen thread to guide the colloid by capillary action together with the silk-screen thread. The section of the glue injection groove 23 is elliptical. The midpoint of the glue slot 23 coincides with the midpoint of the guide slot 22, i.e. the glue slot 23 is located in the central area of the guide slot 22. Meanwhile, the glue injection groove 23 communicates with the guide groove 22. The observation groove 24 communicates with the guide groove 22. The cross section of the observation tank 24 is approximately triangular. That is, the width of the observation groove 24 gradually widens from the guide groove 22 toward the outer edge of the shield shell 2. Meanwhile, the number of the observation grooves 24 is plural, the observation grooves 24 are arranged from one end of the guide groove 22 to the other end, and the observation grooves 24 are symmetrically arranged with respect to the glue injection groove 23.

On the other hand, the three sides of the protective housing 2 are provided with the combined structure of the guide groove 22, the glue injection groove 23 and the observation groove 24. The edge of the protective shell 2 provided with the through hole 21 is provided with two combined structures which are symmetrically arranged relative to the through hole 21.

The protective shell 2 is also provided with positioning pins 25. The positioning pins 25 are respectively arranged at the four vertex angle ends of the protective housing 2. The positioning pins 25 are provided with guide grooves 251 communicating with the guide grooves 22. Correspondingly, the PCB 1 is provided with positioning holes 11 corresponding to the positioning pins 25. The positioning pins 25 can be inserted into the positioning holes 11 to connect the shield case 2 with the PCB board 1.

The protective housing 2 is also provided with a heat dissipation structure 26. The heat dissipation structure 26 includes a heat absorbing plate 261, a heat dissipating plate 262, and connecting posts 263. The heat absorbing plate 261 is disposed inside the shield case 2. The heat absorbing plate 261 corresponds to an electronic component. The heat dissipation plate 262 is disposed outside the shield case 2. The connection column 263 is disposed between the heat absorbing plate 261 and the heat radiating plate 262 and connects the heat absorbing plate 261 and the heat radiating plate 262 together. Thereby, the heat dissipation structure 26 penetrates the shield case 2. Preferably, the heat dissipating structure 26 is made of copper.

In practical application, the optical fiber wire 3 is connected with the electronic components on the PCB 1. The positioning pins 25 on the shield case 2 are inserted into the positioning holes 11, thereby connecting the shield case 2 with the PCB board 1. At the same time, the through opening 21 in the protective housing 2 is located at a position corresponding to the optical fiber line 3. The protective shell 2 is compacted with the PCB 1 so as to fully attach the protective shell 2 to the PCB.

At this time, the output port of the glue injection gun or other glue injection equipment is aligned to the glue injection groove 23, so that the glue is injected into the glue injection groove 23, and the glue is accumulated in the glue injection groove 23 to form a glue pool. After the gel is injected into the gel injection groove 23. The glue will circulate along the guide grooves 22 under the capillary action and the guidance of the screen printing wires and gradually fill the guide grooves 22. As the gel flows, it gradually fills the observation tank 24 as it flows to the observation tank 24. Thus, the worker can determine the flow position of the gel by observing the state of the gel in the tank 24. When the gel fills the last observation slot 24, it is indicated that the gel has filled the entire guide slot 22. The staff member can proceed with filling the next guide groove 22. After the filling of all the guiding grooves 22 is completed, the glue is filled into the gap between the through hole 21 and the optical fiber wire 3, so that the through hole 21 is filled with the glue, and the optical fiber wire 3 can be initially positioned, so that the breakage of the joint of the optical fiber wire 3 and the electronic element caused by the external pulling of the optical fiber wire 3 in the subsequent use process is avoided. After the colloid is completely filled, the device is kept stand to solidify the colloid. Therefore, the sealing performance of the optical transceiver is effectively improved by utilizing the protective shell 2 and the colloid, so that the abnormal problem caused by the direct exposure of the electronic element in a high-humidity and high-dust environment is avoided, and the operation stability of the optical transceiver is further improved. On the other hand, through the cooperation of guiding groove 22, injecting glue groove 23, observation groove 24, very big convenience staff's operation, the effectual problem of avoiding the colloid to pour into too much or too little. Preferably, a protective shell 2 and the above structure are disposed on the other side of the PCB 1, so that the PCB 1 is completely covered by the two protective shells 2, thereby further improving the isolation effect.

On the other hand, after the guide groove 22 is filled with the gel, the gel flows into the guide groove 251, so that the gap between the positioning pin 25 and the positioning hole 11 is filled to a certain extent under the influence of the guide groove 251. Therefore, the connection stability of the protective shell 2 and the PCB 1 can be enhanced to a certain extent.

Although the sealing performance is effectively enhanced, the operation stability is improved, and the heat dissipation capacity is also reduced. The present utility model absorbs heat generated from the electronic component through the heat absorbing plate 261. The heat absorbed by the heat absorbing plate 261 is transferred to the heat radiating plate 262 through the connection posts 263. Finally, heat is emitted into the air through the heat dissipation plate 262. Therefore, the heat dissipation effect of the device is enhanced. Meanwhile, compared with the mode of directly penetrating the protective shell 2 by adopting a single plate, the utility model adopts the mode of combining the heat absorbing plate 261, the heat dissipating plate 262 and the connecting column 263, and can effectively prevent foreign matters from entering the protective shell 2 through the joint between the heat dissipating structure 26 and the protective shell 2. Thereby, the damage of the heat dissipation structure 26 to the sealing property is reduced.

Preferably, a heat dissipation pad can be laid on one side of the PCB board 1 far from the protective casing 2, and the electronic components on the PCB board 1 are led into the heat dissipation pad through the via hole, so that the heat dissipation capability of the present utility model is further enhanced by using the heat dissipation pad.

The specific embodiments described herein are offered by way of example only to illustrate the spirit of the utility model. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the utility model or exceeding the scope of the utility model as defined in the accompanying claims.

Claims

1. An optical transceiver device encapsulated by a PLCC48, which is characterized in that: comprising the following steps: the PCB (1), the protective shell (2) and the optical fiber line (3);

a plurality of electronic elements are arranged on the PCB (1), and the electronic elements are connected with the optical fiber wires (3);

the PCB (1) is also provided with a silk screen wire which is wound around the electronic element; the protective shell (2) is attached to the PCB (1) through the silk-screen wire so as to cover the electronic element;

and colloid is filled between the protective shell (2) and the PCB (1).

2. The PLCC 48-encapsulated optical transceiver of claim 1 wherein: the protective shell (2) is provided with a through hole (21);

the through hole (21) corresponds to the optical fiber line (3);

the optical fiber wire (3) passes through the protective shell (2) through the through hole (21).

3. The PLCC 48-encapsulated optical transceiver of claim 1 wherein: a guide groove (22) is also formed in the protective shell (2);

the guide groove (22) is formed on the joint surface of the protective shell (2) and the PCB (1);

the guide groove (22) corresponds to the silk screen printing line.

4. The PLCC 48-encapsulated optical transceiver of claim 3 wherein: the protective shell (2) is also provided with a glue injection groove (23) and an observation groove (24);

the midpoint of the glue injection groove (23) coincides with the midpoint of the guide groove (22);

the glue injection groove (23) is communicated with the guide groove (22);

the number of the observation grooves (24) is a plurality;

the observation grooves (24) are arranged from one end to the other end of the guide groove (22);

the observation groove (24) is communicated with the guide groove (22).

5. The PLCC 48-encapsulated optical transceiver of claim 3 wherein: a positioning hole (11) is formed in the PCB (1);

the protective shell (2) is also provided with a positioning pin (25);

the positioning pins (25) are respectively arranged at four vertex angle ends of the protective shell (2);

the positioning pins (25) are inserted into the positioning holes (11);

the positioning pins (25) are provided with drainage grooves (251);

the drainage groove (251) is communicated with the guide groove (22).

6. The PLCC 48-encapsulated optical transceiver of claim 1 wherein: a heat dissipation structure (26) is further arranged on the protective shell (2);

the heat dissipation structure (26) penetrates through the protective shell (2);

the heat dissipation structure (26) corresponds to the electronic component.

7. The PLCC 48-encapsulated optical transceiver of claim 6 wherein: the heat dissipation structure (26) comprises a heat absorption plate (261), a heat dissipation plate (262) and a connecting column (263);

the heat absorbing plate (261) is arranged on the inner side of the protective shell (2);

the heat absorbing plate (261) corresponds to the electronic component;

the heat dissipation plate (262) is arranged outside the protective shell (2);

the connecting column (263) is arranged between the heat absorbing plate (261) and the heat radiating plate (262);

the connecting column (263) is connected with the heat absorbing plate (261) and the heat radiating plate (262).