CN216160875U

CN216160875U - Optical module structure

Info

Publication number: CN216160875U
Application number: CN202122238775.0U
Authority: CN
Inventors: 陈福海; 桂平; 李振东
Original assignee: SHENZHEN GIGALIGHT TECHNOLOGY CO LTD
Current assignee: SHENZHEN GIGALIGHT TECHNOLOGY CO LTD
Priority date: 2021-09-15
Filing date: 2021-09-15
Publication date: 2022-04-01
Anticipated expiration: 2031-09-15

Abstract

The utility model relates to an optical module structure. The optical module structure includes: a printed circuit board, a lens, and a jumper assembly. The printed circuit board is provided with a luminous body, the lens is arranged on the printed circuit board, the lens covers the luminous body, a first sealing colloid is arranged between the lens and the printed circuit board, the jumper wire assembly comprises an insertion core, the insertion core is inserted into the lens, light generated by the luminous body can be reflected to the insertion core through a reflecting surface of the lens, and a second sealing colloid is arranged between the insertion core and the lens. The optical module structure effectively prevents cooling liquid or water vapor from entering the optical path to carry out unpredictable refraction and reflection on the propagation of light, so that the whole optical transmission path is isolated from the outside, the optical transmission path completes airtight packaging, and the optical module is prevented from losing efficacy in the liquid cooling process.

Description

Optical module structure

Technical Field

The utility model relates to the technical field of optical communication, in particular to an optical module structure.

Background

With the development of computer heat dissipation technology, liquid cooling heat dissipation technology is applied to large-scale data centers due to the advantages of ultra-silence, fast heat dissipation, energy conservation and the like. The immersion liquid cooling technique is a liquid cooling technique in which a heat generating device is immersed in liquid. In view of the use mode of the technology, the immersion type liquid cooling technology has extremely high requirements on the waterproofness and the airtightness of the heating device.

Light modules are an important source of heat in data centers. Optical components such as lasers and lenses on the optical module can generate optical refraction and reflection in cooling liquid, so that an optical transmission path of light on the optical module is changed, and the optical module is failed. Therefore, if the immersion liquid cooling technology is applied to the field of heat dissipation of the optical module, it is required to completely isolate the optical transmission path of the optical module from the cooling liquid.

Traditional packaging technology adopts the tube to carry out integral encapsulation with optical module and other devices to use spot welding technique to connect the tube gap, coolant liquid can get into light path transmission path along the gap among this technique, is difficult to realize whole light transmission path and the complete isolation of coolant liquid, and optical module has huge inefficacy risk.

SUMMERY OF THE UTILITY MODEL

Therefore, the optical module structure is provided, the whole optical path transmission path is packaged, the air tightness and the water resistance of the optical module are improved, and the optical module is prevented from losing efficacy in the liquid cooling process.

A light module structure comprising:

the printed circuit board is provided with a luminous body;

the lens is arranged on the printed circuit board, the lens covers the luminous body, and a first sealing colloid is arranged between the lens and the printed circuit board;

the jumper wire component comprises a plug core, the plug core is inserted into the lens, light generated by the luminous body is reflected into the plug core through the reflecting surface of the lens, and a second sealing colloid is arranged between the plug core and the lens.

The light is transmitted out from the luminous body, reflected by the reflecting surface, transmitted into the inserting core and further transmitted in the inserting core to form the light transmission path. Through setting up the luminous body in the space that PCB and lens enclose to set up first sealing colloid between lens and PCB, guarantee that the luminous body is in a totally enclosed environment, make the light source keep apart completely with the coolant liquid. Meanwhile, a second sealing colloid is arranged between the ferrule and the lens, so that the isolation of a transmission path of light in the ferrule from the cooling liquid is further ensured. The first sealing colloid and the second sealing colloid are matched with each other, so that the whole optical transmission path is isolated from the outside, the optical transmission path is packaged in an airtight manner, unpredictable refraction and reflection of cooling liquid or water vapor entering the optical path to the propagation of light are prevented, and failure of the optical module in the liquid cooling process is avoided.

In one embodiment, the lens is provided with an air vent, and a third sealing colloid is filled in the air vent.

In one embodiment, the optical lens further comprises a fourth sealing colloid, the printed circuit board is provided with a signal transmission element, the signal transmission element and the lens are arranged at intervals, the part of the printed circuit board provided with the lens is a sealing part, and the lens, the sealing part and the second sealing colloid are all sealed in the fourth sealing colloid.

In one embodiment, the lens is provided with a light opening groove, a groove wall of the light opening groove forms the reflecting surface, the light opening groove is covered with a blocking piece, a fifth sealing colloid is arranged between the lens and the blocking piece, and the blocking piece and the fifth sealing colloid are both sealed in the fourth sealing colloid.

In one embodiment, the jumper assembly further includes an optical fiber, a ferrule guide rod, a tail rubber, a tube sleeve, and a fiber cable sheath, the optical fiber sequentially passes through the fiber cable sheath, the tube sleeve, and the tail rubber and extends into the ferrule, the ferrule guide rod is sleeved outside the ferrule, one end surface of the fiber cable sheath is connected to one end surface of the tube sleeve, the other end surface of the tube sleeve is connected to one end surface of the tail rubber, the other end surface of the tail rubber is connected to one end surface of the ferrule, the other end surface of the tail rubber is bonded to one end surface of the fourth sealant, and the ferrule guide rod and the ferrule are both sealed in the fourth sealant.

In one embodiment, the thickness of the fourth sealant is not less than 0.4 mm.

In one embodiment, a sixth encapsulant is disposed between the printed circuit board and the fourth encapsulant.

In one embodiment, the signal transmission element is a gold finger disposed on the printed circuit board, the gold finger and the lens are respectively disposed at two opposite ends of the printed circuit board, the fourth sealing colloid is an injection molding colloid, a portion of the printed circuit board, which is located at a side of the gold finger close to the lens, is a middle portion, the middle portion is sealed in the injection molding colloid, the lens and the second sealing colloid are both disposed in the injection molding colloid, and the sixth sealing colloid is distributed at one end of the injection molding colloid, which is far away from the lens.

In one embodiment, an adapter is arranged on the lens, the ferrule is inserted into the adapter, and the second sealing colloid is positioned between the adapter and the ferrule.

In one embodiment, the light emitter includes a light emitting chip.

Drawings

FIG. 1 is a schematic structural diagram of a jumper assembly;

FIG. 2 is a schematic structural diagram of an embodiment of an optical module;

FIG. 3 is a schematic structural diagram of an embodiment of an optical module;

FIG. 4 is an exploded view of an embodiment of an optical module;

FIG. 5 is a top view of an embodiment of a light module;

FIG. 6 is a cross-sectional view of the optical module A-A shown in FIG. 5;

FIG. 7 is a cross-sectional view of the optical module B-B shown in FIG. 5;

fig. 8 is a partially enlarged view of the optical module C shown in fig. 7.

Description of reference numerals:

10. a printed circuit board; 11. a groove; 20. a signal transmission element; 30. a lens; 31. a light emitter; 32. a first sealing colloid; 33. an exhaust hole; 34. a third sealing colloid; 35. a light opening groove; 36. a baffle plate; 37. a fifth sealing colloid; 38. a reflective surface; 39. an adapter; 40. a jumper assembly; 41. inserting a core; 42. a second sealing colloid; 43. tail rubber; 44. pipe sleeve; 45. a fiber cable sheath; 46. inserting a core guide rod; 47. an optical fiber; 50. a fourth sealing gel; 60. a sixth sealing gel; 70. a bottom case; 71. an upper cover; 72. fastening screws; 73. a scarf; 74. unlocking the lock; 75. and (4) a pull ring.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

The following describes an optical module provided in an embodiment of the present application in detail with reference to the drawings.

As shown in fig. 1 and 2, an optical module structure provided in an embodiment of the present application includes: a printed circuit board 10, a lens 30 and a jumper assembly 40;

as shown in fig. 6 and 8, the printed circuit board 10 is provided with a light emitter 31;

the lens 30 is arranged on the printed circuit board 10, the lens 30 covers the luminous body 31, and a first sealing colloid 32 is arranged between the lens 30 and the printed circuit board 10;

the ferrule 41 of the jumper assembly 40 is inserted into the lens 30, the light generated by the light emitter 31 can be reflected into the ferrule 41 through the reflection surface 38 of the lens 30, and a second sealing adhesive body 42 is disposed between the ferrule 41 and the lens 30.

In the optical module provided in the above embodiment, the light emitter 31 is a light source of the optical module, and light is transmitted from the light emitter 31, reflected by the reflecting surface 38, transmitted into the ferrule 41, and further transmitted in the ferrule 41, so as to form a complete optical transmission path. By arranging the light emitting body 31 in the space enclosed by the printed circuit board 10 and the lens 30 and arranging the first sealing glue 32 between the lens 30 and the printed circuit board 10, the light emitting body 31 is ensured to be in a completely sealed environment, so that the light source is completely isolated from the cooling liquid. And a second sealant 42 is arranged between the ferrule 41 and the lens 30, so that the transmission path of light in the ferrule 41 is further isolated from the cooling liquid. The first sealing colloid 32 and the second sealing colloid 42 are matched with each other, so that the whole optical transmission path is isolated from the outside, the optical transmission path is packaged in an airtight manner, unpredictable refraction and reflection of cooling liquid or vapor entering the optical path to the propagation of light are prevented, and failure of the optical module in the liquid cooling process is avoided.

More specifically, as shown in fig. 8, in one embodiment, a groove 11 is formed on a surface of the lens 30 close to the printed circuit board 10, and the light emitter 31 is located in the groove 11 of the lens 30, i.e., a space enclosed by the printed circuit board 10 and the lens 30. Therefore, after the first sealant 32 is disposed between the lens 30 and the printed circuit board 10 for sealing, the light emitter 31 is located in the closed space formed by the recess 11.

More specifically, in one embodiment, the first encapsulant 32 includes a UV-curable glue.

Further, in one embodiment, a sealant is applied between the lens 30 and the printed circuit board 10 and cured by heating to obtain the first sealant 32.

More specifically, in one embodiment, the second encapsulant 42 includes a UV curable glue.

Further, in one embodiment, a sealant is applied between the ferrule 41 and the lens 30 and cured by heating to obtain the second sealant 42.

Specifically, as shown in fig. 2, 7 and 8, in an embodiment, the lens 30 is provided with an air vent 33, and the air vent 33 is filled with a third sealant 34. The exhaust hole 33 penetrates through the lens 30, so that the groove 11 of the lens 30 is communicated with the outside, the air pressure inside the groove 11 is effectively balanced, the first sealing colloid 32 is prevented from being heated and cured to cause air expansion and overlarge air pressure, and the sealing performance of the first sealing colloid 32 is ensured. Further, the air vent 33 is filled with a third sealing colloid 34, so that the cooling liquid is prevented from entering the groove 11 through the air vent 33 and contacting the light-emitting body 31, and unexpected refraction and reflection are generated on the light transmission.

More specifically, in one embodiment, the third encapsulant 34 includes a structural anchoring adhesive.

Specifically, during the setting process, the sealant is applied to the vent hole 33, and the third sealant 34 filled in the vent hole 33 is obtained by heating.

Specifically, as shown in fig. 3, 4, 6 and 7, in an embodiment, the optical module further includes a fourth encapsulant 50, the printed circuit board 10 is provided with a signal transmission element 20, the signal transmission element 20 and the lens 30 are arranged at an interval, a portion of the printed circuit board 10 on which the lens 30 is provided is a sealing portion, and the lens 30, the sealing portion and the second encapsulant 42 are all sealed in the fourth encapsulant 50. The fourth encapsulant 50 completes the second hermetic sealing of the optical transmission path and the first sealing of the lens 30 and the sealing portion of the printed circuit board 10, thereby improving the reliability of the optical transmission path sealing and the water-proof properties of the printed circuit board 10 and the lens 30. Meanwhile, the signal transmission element 20 on the printed circuit board 10 is exposed outside the fourth encapsulant 50, so that signal transmission between the optical module and other electronic devices is ensured.

More specifically, in one embodiment, the fourth encapsulant 50 is injection molded over the lens 30, the encapsulant and the second encapsulant 42.

Specifically, as shown in fig. 8, in an embodiment, the lens 30 is provided with a light opening groove 35, a groove wall of the light opening groove 35 forms the reflecting surface 38, the light opening groove 35 is covered with a blocking piece 36, and a fifth sealant 37 is disposed between the lens 30 and the blocking piece 36.

Further, in one embodiment, the flap 36 and the fifth sealant 37 are both sealed within the fourth sealant 50. The blocking piece 36 can effectively prevent the fourth encapsulant 50 with high temperature from flowing into the light inlet groove 35 to damage the reflective surface 38 during the injection molding process, so as to ensure the integrity of the light transmission path during the airtight packaging process.

More specifically, in one embodiment, the fifth encapsulant 37 includes a UV curable glue.

More specifically, in one embodiment, a fifth encapsulant 37 is applied to the junction of the lens 30 and the stop 36.

More specifically, in one embodiment, the third encapsulant 34 is sealed within the fourth encapsulant 50.

Specifically, as shown in fig. 1, in an embodiment, the jumper assembly 40 further includes an optical fiber 47, a ferrule guide rod 46, a tail glue 43, a sleeve 44, and an optical fiber sheath 45, the optical fiber 47 sequentially passes through the optical fiber sheath 45, the sleeve 44, and the tail glue 43 and extends into the ferrule 41, the ferrule guide rod 46 is sleeved outside the ferrule 41, one end surface of the optical fiber sheath 45 is connected to one end surface of the sleeve 44, the other end surface of the sleeve 44 is connected to one end surface of the tail glue 43, the other end surface of the tail glue 43 is connected to one end surface of the ferrule 41, the other end surface of the tail glue 43 is bonded to one end surface of a fourth sealant 50, and both the ferrule guide rod 46 and the ferrule 41 are sealed in the fourth sealant 50. The light is reflected by the reflecting surface 38 to the ferrule 41, and then further transmitted through the optical fiber 47. The optical fiber 47 is sequentially wrapped in the optical fiber cable sheath 45, the pipe sleeve 44, the tail rubber 43 and the ferrule 41, and the end faces of the optical fiber cable sheath 45, the pipe sleeve 44, the tail rubber 43 and the fourth sealing rubber body 50 are sequentially connected, so that the optical fiber 47 is ensured to be in a completely sealed environment, the propagation of light in the optical fiber 47 is prevented from being influenced by cooling liquid, and the optical module is prevented from being out of work.

More specifically, in one embodiment, the tail glue 43 is mold-opened to wrap the optical fiber 47.

More specifically, in one embodiment, the thickness of the fourth encapsulant 50 is not less than 0.4 mm. The cooling liquid is ensured not to penetrate through the fourth sealing colloid 50 to contact with the lens 30, the sealing part of the printed circuit board 10 and the second sealing colloid 42, and the influence of the cooling liquid on the optical propagation path is prevented.

Further, as shown in fig. 7, in an embodiment, a sixth encapsulant 60 is disposed between the printed circuit board 10 and the fourth encapsulant 50. The sixth sealing colloid 60 is designed at the joint of the printed circuit board 10 and the fourth sealing colloid 50, so that the contact of the cooling liquid with the joint of the printed circuit board 10 and the fourth sealing colloid 50 is directly isolated, the risk that the cooling liquid permeates into the fourth sealing colloid 50 from the joint is reduced, and the reliability of the sealing structure of the optical module is improved.

More specifically, in one embodiment, the fourth encapsulant 50 is a plastic injection molding compound, and the sixth encapsulant 60 is disposed between the plastic injection molding compound and the printed circuit board 10.

Further, as shown in fig. 2, 3 and 4, in an embodiment, the signal transmission element 20 is a gold finger disposed on the printed circuit board 10, the gold finger and the lens 30 are respectively disposed at two opposite ends of the printed circuit board 10, the fourth encapsulant 50 is a plastic injection body, a portion of the printed circuit board 10 located at a side of the gold finger close to the lens 30 is a middle portion, the middle portion is sealed in the plastic injection body, the lens 30 and the second encapsulant 42 are both disposed in the plastic injection body, and the sixth encapsulant 60 is disposed at an end of the plastic injection body away from the lens 30. The golden finger consists of a plurality of golden conductive contact pieces and is used for transmitting electric signals. The optical module receives an electrical signal through the golden finger, the electrical signal is converted into an optical signal on the printed circuit board 10, and the optical signal is sent to the optical fiber 47 through the luminous body 31 and further transmitted on the optical fiber 47. Through setting up the relative both ends with golden finger and lens 30 at printed circuit board 10, guarantee except that the golden finger, other components on printed circuit board 10 are all encapsulated in fourth sealing colloid 50, keep apart with the coolant liquid, effectively improve the life of components and parts on printed circuit board 10.

Specifically, as shown in fig. 8, in one embodiment, the lens 30 is provided with an adapter 39, a ferrule 41 is inserted into the adapter 39, and a second sealant 42 is positioned between the adapter 39 and the ferrule 41.

Specifically, in one embodiment, the light emitter 31 includes a light emitting chip.

Further specifically, in an embodiment, the light emitting chip includes a laser emitting chip and a laser receiving chip.

Specifically, as described in fig. 4, 5, 6 and 7, in an embodiment, the optical module further includes a bottom case 70, an upper cover 71, a fastening screw 72, a neckpiece 73, an unlocking piece 74 and a pull ring 75. The bottom shell 70 and the upper cover 71 are connected by a fastening screw 72 to form a shell, an opening is formed in one side of the shell close to the golden finger, and a muffler 73 is sleeved outside the tail rubber 43. The unlocking member 74 is connected to the pull ring 75. The pull ring 75 is sleeved outside the pipe sleeve 44, and the unlocking piece 74 is connected with the bottom shell. The bottom case 70, the upper cover 71 and the neckerchief 73 further encapsulate the optical module, preventing the fourth encapsulant 50 from being damaged by external impact and scratch.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A light module structure, comprising:

the printed circuit board is provided with a luminous body;

2. The optical module structure as claimed in claim 1, wherein the lens has an air vent, and a third encapsulant is filled in the air vent.

3. The optical module structure according to claim 1, further comprising a fourth encapsulant, wherein the printed circuit board is provided with a signal transmission element, the signal transmission element and the lens are arranged at an interval, a portion of the printed circuit board on which the lens is disposed is a sealing portion, and the lens, the sealing portion, and the second encapsulant are all sealed in the fourth encapsulant.

4. The optical module structure of claim 3, wherein the lens has a light exit groove, a groove wall of the light exit groove forms the reflective surface, the light exit groove is covered with a blocking plate, a fifth sealant is disposed between the lens and the blocking plate, and the blocking plate and the fifth sealant are both sealed in the fourth sealant.

5. The optical module structure of claim 3, wherein the jumper assembly further includes an optical fiber, a ferrule guide rod, a tail rubber, a tube sleeve, and a fiber jacket, the optical fiber sequentially passes through the fiber jacket, the tube sleeve, and the tail rubber and extends into the ferrule, the ferrule guide rod is sleeved outside the ferrule, one end surface of the fiber jacket is connected to one end surface of the tube sleeve, the other end surface of the tube sleeve is connected to one end surface of the tail rubber, the other end surface of the tail rubber is connected to one end surface of the ferrule, the other end surface of the tail rubber is bonded to one end surface of the fourth sealant, and both the ferrule guide rod and the ferrule are sealed in the fourth sealant.

6. The optical module structure of claim 3, wherein the fourth encapsulant thickness is not less than 0.4 mm.

7. The optical module structure of claim 3, wherein a sixth encapsulant is disposed between the printed circuit board and the fourth encapsulant.

8. The optical module structure of claim 7, wherein the signal transmission element is a gold finger disposed on the printed circuit board, the gold finger and the lens are disposed on opposite ends of the printed circuit board, respectively, the fourth encapsulant is an injection molded plastic, a portion of the printed circuit board on a side of the gold finger near the lens is a middle portion, the middle portion is sealed in the injection molded plastic, the lens and the second encapsulant are both disposed in the injection molded plastic, and the sixth encapsulant is disposed on an end of the injection molded plastic away from the lens.

9. The optical module structure according to any one of claims 1 to 8, wherein an adapter is provided on the lens, the ferrule is inserted into the adapter, and the second sealant is located between the adapter and the ferrule.

10. The light module structure according to any one of claims 1 to 8, wherein the light emitter includes a light emitting chip.