CN219780791U - Heat dissipation protective housing - Google Patents
Heat dissipation protective housing Download PDFInfo
- Publication number
- CN219780791U CN219780791U CN202320895254.9U CN202320895254U CN219780791U CN 219780791 U CN219780791 U CN 219780791U CN 202320895254 U CN202320895254 U CN 202320895254U CN 219780791 U CN219780791 U CN 219780791U
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- Prior art keywords
- heat dissipation
- heat
- groove
- protective
- backboard
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 172
- 230000001681 protective effect Effects 0.000 title claims abstract description 40
- 239000007788 liquid Substances 0.000 claims description 31
- 238000007789 sealing Methods 0.000 claims description 20
- 239000012530 fluid Substances 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 17
- 238000013021 overheating Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 10
- 239000007787 solid Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 239000012809 cooling fluid Substances 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation protective housing, which comprises: a frame; the heat-conducting backboard is connected to the frame, a heat dissipation area is arranged on the heat-conducting backboard, and a heat dissipation piece is arranged in the heat dissipation area; the annular support is arranged on the heat conduction backboard; the heat dissipation area comprises a first heat dissipation area surrounded by the annular support on the heat conduction backboard. According to the utility model, the heat-conducting backboard is additionally arranged on the protective shell, the heat-conducting backboard is provided with the heat dissipation piece in the area surrounded by the support, and the heat dissipation piece is utilized to dissipate heat of the protective shell in a wireless charging state so as to avoid affecting the wireless charging efficiency; in addition, the heat dissipation piece can also dissipate heat of the electronic equipment in the normal use process, so that the problem of overheating caused by long-time use of the electronic equipment is avoided.
Description
Technical Field
The utility model belongs to the technical field of mobile terminal accessories, and particularly relates to a heat dissipation protective shell.
Background
In the prior art, electronic equipment such as a mobile phone and the like generally conduct wireless charging on a wireless charging device through magnetic attraction of a built-in magnet, but the magnetic attraction is not stable enough due to the thickness influence of a mobile phone protective shell. So in order to solve the above-mentioned problems, a magnetic ring may be built in the protective case to increase magnetic force, and the bracket is generally designed in a ring shape and coupled with the magnetic ring.
However, the above improvement scheme brings new problems, when the electronic equipment loaded on the protective housing is charged wirelessly by using the wireless charging, compared with the protective housing without the magnetic ring and the support, the protective housing with the magnetic ring and the support can interfere with wireless charging transmission to a certain extent to cause heating, especially the temperature of the area surrounded by the support and the magnetic ring rises faster, and then the wireless charging transmission is disconnected or the service life of the electronic equipment is influenced.
Disclosure of Invention
The utility model aims to provide a heat dissipation protective housing, and aims to solve the problem that a protective housing with a bracket in the prior art influences wireless charging efficiency or influences service life of electronic equipment.
The utility model provides a heat dissipation protective housing, which comprises:
a frame;
the heat-conducting backboard is connected to the frame, a heat dissipation area is arranged on the heat-conducting backboard, and a heat dissipation piece is arranged in the heat dissipation area;
the annular support is arranged on the heat conduction backboard;
the heat dissipation area comprises a first heat dissipation area surrounded by the annular support on the heat conduction backboard.
Further, the heat dissipation part comprises a first heat dissipation part, and the first heat dissipation part is arranged in the first heat dissipation area.
Further, the first heat dissipation area is provided with a first groove, the heat conduction backboard comprises a first surface and a second surface which are opposite to each other, the annular support is arranged on the first surface, the first groove is arranged on the first surface or the second surface, and the first heat dissipation piece is arranged in the first groove.
Further, the heat dissipation protective housing further comprises a heat conduction member, and the heat conduction member covers the opening of the first groove.
Further, the first heat dissipation piece is heat dissipation liquid, the heat conduction piece and the first groove form a sealed accommodating cavity, and the heat dissipation liquid is arranged in the sealed accommodating cavity.
Further, the heat conducting piece comprises a liquid inlet hole and a sealing plug which are communicated with the sealed accommodating cavity, and the sealing plug is in sealing connection with the liquid inlet hole.
Further, the surface of the heat conducting piece is flush with the surface of the heat conducting backboard.
Further, the heat dissipation piece is detachably connected in the first groove.
Further, the heat conducting backboard is provided with a camera avoiding hole, the heat dissipation area comprises a second heat dissipation area, the heat dissipation piece comprises a second heat dissipation piece, the second heat dissipation area is adjacent to the camera avoiding hole, and the second heat dissipation piece is arranged in the second heat dissipation area.
Further, the second heat dissipation area is provided with a second groove, the second heat dissipation piece is arranged in the second groove, the heat conduction backboard comprises a first surface and a second surface which are opposite, the annular support is arranged on the first surface, and the second groove is arranged on the first surface or the second surface.
The utility model discloses a heat radiation protection shell, wherein a heat conduction backboard is additionally arranged on the protection shell, a heat radiation area is surrounded on an annular support by the heat conduction backboard, a heat radiation piece is arranged in the heat radiation area, and the heat radiation piece is used for radiating the protection shell in a wireless charging state so as to avoid influencing the wireless charging efficiency and prevent the temperature of electronic equipment from rising faster in the wireless charging state; in addition, the heat dissipation piece can also dissipate heat of the electronic equipment in the normal use process, so that the problem of overheating caused by long-time use of the electronic equipment is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic overall structure of a heat dissipation protective shell according to a first embodiment of the present utility model;
fig. 2 is a schematic cross-sectional view of a heat dissipation protective shell according to a first embodiment of the utility model;
FIG. 3 is an enlarged schematic view of the portion A in FIG. 2;
fig. 4 is a schematic overall structure of a heat dissipation protective shell according to a second embodiment of the present utility model;
fig. 5 is a schematic cross-sectional view of a heat dissipation protective shell according to a second embodiment of the utility model;
FIG. 6 is an enlarged schematic view of the portion B of FIG. 5;
fig. 7 is a schematic overall structure of a heat dissipation protective shell according to a third embodiment of the present utility model;
fig. 8 is a schematic cross-sectional view of a heat dissipation protective shell according to a third embodiment of the utility model;
FIG. 9 is an enlarged schematic view of the portion C of FIG. 8;
fig. 10 is a schematic overall structure of a heat dissipation protective shell according to a fourth embodiment of the utility model;
fig. 11 is a schematic cross-sectional view of a heat dissipation protective shell according to a fourth embodiment of the utility model;
fig. 12 is an enlarged schematic view of the portion D in fig. 11.
The marks in the figure are as follows:
10. a frame; 20. a thermally conductive backplate; 30. an annular bracket; 40. a first groove; 41. a second groove; 50. a first heat sink; 51. a second heat sink; 60. a first heat conductive member; 61. a second heat conductive member; 70. a first step portion; 71. a second step portion; 80. a glue overflow groove; 90. the camera dodges the hole.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring to fig. 1, an embodiment of the utility model provides a heat dissipation protective housing, which includes: a frame 10; the heat-conducting backboard 20 is connected to the frame 10, and a heat dissipation area is arranged on the heat-conducting backboard 20 and is provided with a heat dissipation piece; an annular bracket 30 provided on the heat conductive back plate 20; the heat dissipation area includes a first heat dissipation area surrounded by the annular support 30 on the heat-conducting back plate 20.
In this embodiment, a heat dissipation member is disposed in the heat dissipation area, and the heat-conducting back plate 20 can absorb heat generated in the wireless charging process and transfer the heat to the heat dissipation member, and the heat dissipation member can absorb heat transferred by the heat-conducting back plate 20. The heat dissipation piece is utilized to dissipate heat of the protective shell in the wireless charging state, so that the influence on the wireless charging efficiency is avoided, and the electronic equipment is prevented from rising faster in the wireless charging state; in addition, the heat dissipation piece can also dissipate heat of the electronic equipment in the normal use process, so that the problem of overheating caused by long-time use of the electronic equipment is avoided.
In this embodiment, the heat dissipation element includes a first heat dissipation element, and the first heat dissipation element is disposed in the first heat dissipation area. Because the heat dissipation area in the subsequent embodiment of the present utility model further includes the second heat dissipation area, for convenience of description, the heat dissipation elements in the first heat dissipation area are named as the first heat dissipation element 50, and the heat dissipation elements in the second heat dissipation area are named as the second heat dissipation element 51. Meanwhile, the groove corresponding to the first heat sink 50 is named as a first groove 40, the groove corresponding to the second heat sink 51 is named as a second groove 41, the heat conductive member corresponding to the first heat sink 50 is named as a first heat conductive member 60, and the heat conductive member corresponding to the second heat sink 51 is named as a second heat conductive member 61.
In one embodiment, the first heat dissipation element 50 is attached to the heat dissipation area. That is, the first heat sink 50 may be directly attached to the heat dissipation area, for example, by fixing adhesive on the periphery.
In an embodiment, as shown in fig. 2 and 3, the first heat dissipation area is provided with a first groove 40, the heat-conducting back plate 20 includes a first surface and a second surface opposite to each other, the annular support 30 is disposed on the first surface, the first groove 40 is disposed on the first surface, and the first heat dissipation element 50 is disposed in the first groove 40, that is, the first heat dissipation element 50 is disposed on the first surface. That is, the first heat dissipation element 50 and the annular support 30 are both disposed on a surface of the heat-conducting back plate 20 away from the electronic device.
In another embodiment, as shown in fig. 4-6, a first heat sink 50 is provided on the second face. That is, the first heat dissipation element 50 and the annular support 30 are located on different sides of the heat-conducting back plate 20, for example, the annular support 30 is located on a side of the heat-conducting back plate 20 away from the electronic device, and the first heat dissipation element 50 is located on a side of the heat-conducting back plate 20 where the electronic device is mounted. In the present embodiment, the first heat sink 50 is hidden inside the heat conductive backplate 20, so that the protective case is of a unitary structure from the outside.
The two embodiments can realize the heat dissipation effect on the protective shell, and the subsequent embodiments can be realized on the basis of the two embodiments.
In an embodiment, the heat dissipation protective shell further includes a first heat conducting member 60, and the first heat conducting member 60 covers the opening of the first groove 40. The first heat conducting member 60 is capable of absorbing heat on the heat conducting back plate 20, and further transferring the heat to the first heat dissipating member 50 through the first heat conducting member 60.
In one of the above solutions of the first heat dissipation element 50, the first heat dissipation element 50 is in a solid state when the temperature is low, and becomes a liquid state when the temperature is high, and the first heat dissipation element 50 absorbs heat in the process of changing from the solid state to the liquid state, so as to achieve the heat dissipation effect. In this embodiment, the first heat dissipation element 50 may be fixed, or may be detachably connected to the first recess 40, so as to provide a continuous heat dissipation effect. When the first heat dissipation element 50 is solid, the heat dissipation effect is lost after the first heat dissipation element is completely changed into liquid, at this time, a new first heat dissipation element 50 can be replaced, and after the new first heat dissipation element 50 loses the heat dissipation effect, the old first heat dissipation element 50 is solidified again and can be reused, so that the zero-clearance recycling is realized.
In another aspect, the first heat dissipation element 50 is in a liquid state, that is, is a heat dissipation liquid, and the first heat conduction element 60 and the first groove 40 form a sealed accommodating cavity, and the heat dissipation liquid is disposed in the sealed accommodating cavity. In this embodiment, the first heat dissipation area is provided with a first groove 40, the heat dissipation liquid is filled in the first groove 40, the opening of the first groove 40 is provided with a first heat conducting member 60, the first heat conducting member 60 comprises a liquid inlet hole and a sealing plug which are communicated with the sealed accommodating cavity, and the sealing plug is in sealing connection with the liquid inlet hole. When the efficiency of the cooling fluid is reduced due to the fact that the service time is too long, the sealing plug can be pulled out to replace new cooling fluid, and the sealing plug is plugged into the liquid inlet hole again after replacement, so that the sealing plug is in sealing connection with the liquid inlet hole.
The first heat conductive member 60 herein has not only a heat conductive function but also a sealing function. That is, the first heat conductive member 60 may seal the opening of the first groove 40 to prevent the heat dissipation liquid from flowing out. Further, the surface of the first heat conducting member 60 is flush with the surface of the heat conducting back plate 20, so that the surface of the heat conducting back plate 20 assembled with the first heat dissipating member 50 and the first heat conducting member 60 has higher flatness.
Further, in each embodiment, the first heat sink 50 may be manufactured in the first recess 40 by a filling or a beer-over process. The notch circumference of first recess 40 is provided with the first step portion 70 that expands outward, and the area of first heat conduction spare 60 is greater than the area of first radiating member 50, and first heat conduction spare 60 is set up on first step portion 70, like this, first heat conduction spare 60 can all cover first radiating member 50, forms a airtight space between first heat conduction spare 60 and first recess 40, and first radiating member 50 is located this airtight space, has effectively avoided the condition emergence that first radiating member 50 overflowed first recess 40.
Further, the first heat conductive member 60 may be sealed to the first groove 40 by adhesion, ultrasonic or the like. The first heat conducting member 60 and the first step portion 70 have a gap therebetween, and the gap is a glue overflow groove 80, and when the first heat conducting member 60 is adhered, the glue overflow groove 80 can accommodate the first heat dissipating member 50 that partially overflows, preventing the first heat dissipating member 50 from overflowing.
Further, in an embodiment, as shown in fig. 7, the heat-conducting backboard 20 is provided with a camera avoiding hole 90, the heat dissipation area includes a second heat dissipation area, the heat dissipation element includes a second heat dissipation element 51, the second heat dissipation area is disposed adjacent to the camera avoiding hole 90, and the second heat dissipation element 51 is disposed in the second heat dissipation area. In the electronic device, the electronic components on the side of the camera generally generate a larger amount of heat, so the present embodiment provides the second heat sink 51 in the second heat dissipation area, thereby improving the heat dissipation efficiency in this area.
As for the specific structure of the second heat dissipation area, reference may be made to the arrangement of the first heat dissipation area, as shown in fig. 8 and 9, that is, the second heat dissipation element 51 may be disposed on the first surface of the heat conduction back plate 20, or, as shown in fig. 10 to 12, the second heat dissipation element 51 may be disposed on the second surface of the heat conduction back plate 20. It should be noted that, the first heat dissipation element 50 and the second heat dissipation element 51 may be disposed on the same surface of the heat-conducting back plate 20, or may be disposed on different surfaces of the heat-conducting back plate 20, so as to achieve the heat dissipation effect in the corresponding area.
The second heat dissipation element 51 may be attached to the second heat dissipation area. Alternatively, the second heat dissipation area is provided with a second groove 41, and the second heat dissipation element 51 is disposed in the second groove 41. Alternatively, the second heat dissipation area is provided with a second groove 41, the second heat dissipation element 51 is disposed in the second groove 41, and the opening of the second groove 41 is provided with the second heat conduction element 61. Alternatively, the second heat dissipation area is provided with a second groove 41, the second heat dissipation element 51 is a heat dissipation liquid, the heat dissipation liquid is disposed in the second groove 41, the opening of the second groove 41 is provided with a second heat conduction element 61, and the opening of the second groove 41 is sealed by the second heat conduction element 61.
In one of the above solutions of the second heat dissipation element 51, the second heat dissipation element 51 is in a solid state when the temperature is low, and becomes a liquid state when the temperature is raised, and the second heat dissipation element 51 absorbs heat in the process of changing from the solid state to the liquid state, thereby achieving the heat dissipation effect. In this embodiment, the second heat dissipation element 51 may be fixed, or may be detachably connected to the second recess 41, so as to provide a continuous heat dissipation effect. When the second heat dissipation element 51 is solid, the heat dissipation effect is lost after the second heat dissipation element is completely changed into liquid, at this time, a new second heat dissipation element 51 can be replaced, and after the new second heat dissipation element 51 loses the heat dissipation effect, the old second heat dissipation element 51 is solidified again and can be reused, so that the zero-clearance recycling is realized.
In another aspect, the second heat dissipation element 51 is in a liquid state, that is, is a heat dissipation liquid, and the second heat conduction element 61 and the second groove 41 form a sealed accommodating cavity, and the heat dissipation liquid is disposed in the sealed accommodating cavity. Further, the second heat conducting member 61 includes a liquid inlet hole communicating with the seal accommodating chamber and a sealing plug, and the sealing plug is hermetically connected to the liquid inlet hole. When the efficiency of the cooling fluid is reduced due to the fact that the service time is too long, the sealing plug can be pulled out to replace new cooling fluid, and the sealing plug is plugged into the liquid inlet hole again after replacement, so that the sealing plug is in sealing connection with the liquid inlet hole.
The second heat conductive member 61 here has not only a heat conductive function but also a sealing function. That is, the second heat conductive member 61 may seal the opening of the second groove 41 to prevent the heat dissipation liquid from flowing out. Further, the surface of the second heat conducting member 61 is flush with the surface of the heat conducting back plate 20, so that the surface flatness of the heat conducting back plate 20 equipped with the second heat dissipating member 51 and the second heat conducting member 61 is higher.
In addition, the second heat sink 51 may be formed in the second recess 41 by filling or beer-over process. The notch circumference of second recess 41 is provided with the second step portion 71 that expands outward, and the area of second heat conduction spare 61 is greater than the area of second radiating member 51, and second heat conduction spare 61 is taken on second step portion 71, so, second heat conduction spare 61 can all cover second radiating member 51, forms a sealed space between second heat conduction spare 61 and second recess 41, and second radiating member 51 is located this sealed space, has effectively avoided second radiating member 51 to spill over the condition emergence of second recess 41.
Further, the second heat conducting member 61 may be sealed on the second groove 41 by means of adhesion or ultrasound, and a gap is provided between the second heat conducting member 61 and the second step portion 71, where the gap is a glue overflow groove 80, and when the second heat conducting member 61 is adhered, the glue overflow groove 80 can accommodate the second heat dissipating member 51 that partially overflows, so as to prevent the second heat dissipating member 51 from overflowing.
In summary, in the embodiment of the present utility model, the heat-conducting backboard is additionally installed on the protective shell, and the heat-conducting backboard is provided with the first heat dissipation element in the area surrounded by the bracket, so that the first heat dissipation element is utilized to dissipate heat of the protective shell in the wireless charging state, so as to avoid affecting the wireless charging efficiency; in addition, the first heat dissipation piece can also dissipate heat of the electronic equipment in the normal use process, so that the problem of overheating caused by long-time use of the electronic equipment is avoided.
In the description, each embodiment is described in a progressive manner, and each embodiment is mainly described by the differences from other embodiments, so that the same similar parts among the embodiments are mutually referred. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the utility model can be made without departing from the principles of the utility model and these modifications and adaptations are intended to be within the scope of the utility model as defined in the following claims.
It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprise," "include," or any other variation thereof, are intended to cover a non-exclusive inclusion.
Such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. A protective heat dissipation shell, comprising:
a frame;
the heat-conducting backboard is connected to the frame, a heat dissipation area is arranged on the heat-conducting backboard, and a heat dissipation piece is arranged in the heat dissipation area;
the annular support is arranged on the heat conduction backboard;
the heat dissipation area comprises a first heat dissipation area surrounded by the annular support when the annular support is contained on the heat conduction backboard.
2. The protective heat dissipating shell of claim 1, wherein the heat dissipating member comprises a first heat dissipating member disposed in the first heat dissipating region.
3. The protective heat dissipation shell of claim 2, wherein the first heat dissipation area is provided with a first groove, the heat-conducting back plate comprises a first surface and a second surface which are opposite, the annular support is arranged on the first surface, the first groove is arranged on the first surface or the second surface, and the first heat dissipation element is arranged in the first groove.
4. The protective heat sink housing of claim 3 further comprising a thermally conductive member covering an opening of the first recess.
5. The protective heat dissipation shell of claim 4, wherein the first heat dissipation element is a heat dissipation liquid, the heat conduction element and the first groove form a sealed accommodating cavity, and the heat dissipation liquid is disposed in the sealed accommodating cavity.
6. The protective heat dissipating housing of claim 5, wherein said thermally conductive member comprises a fluid inlet opening in communication with said sealed receiving chamber and a sealing plug in sealing engagement with said fluid inlet opening.
7. The protective heat dissipation case of claim 4, wherein a surface of the thermally conductive member is flush with a surface of the thermally conductive backplate.
8. The protective heat dissipating housing of claim 3 or 4, wherein the first heat dissipating member is removably coupled within the first recess.
9. The protective heat dissipation shell according to any one of claims 1-7, wherein the heat-conducting backboard is provided with a camera avoiding hole, the heat dissipation area comprises a second heat dissipation area, the heat dissipation piece comprises a second heat dissipation piece, the second heat dissipation area is arranged adjacent to the camera avoiding hole, and the second heat dissipation piece is arranged in the second heat dissipation area.
10. The protective heat dissipation shell of claim 9, wherein the second heat dissipation area is provided with a second groove, the second heat dissipation element is disposed in the second groove, the heat conduction backboard comprises a first surface and a second surface which are opposite, the annular support is disposed on the first surface, and the second groove is disposed on the first surface or the second surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320895254.9U CN219780791U (en) | 2023-04-11 | 2023-04-11 | Heat dissipation protective housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320895254.9U CN219780791U (en) | 2023-04-11 | 2023-04-11 | Heat dissipation protective housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219780791U true CN219780791U (en) | 2023-09-29 |
Family
ID=88133204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320895254.9U Active CN219780791U (en) | 2023-04-11 | 2023-04-11 | Heat dissipation protective housing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219780791U (en) |
-
2023
- 2023-04-11 CN CN202320895254.9U patent/CN219780791U/en active Active
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