CN114157780A

CN114157780A - Video camera

Info

Publication number: CN114157780A
Application number: CN202111356893.XA
Authority: CN
Inventors: 张�浩; 周斌
Original assignee: Hangzhou Hikvision Digital Technology Co Ltd
Current assignee: Hangzhou Hikvision Digital Technology Co Ltd
Priority date: 2021-11-16
Filing date: 2021-11-16
Publication date: 2022-03-08
Anticipated expiration: 2041-11-16
Also published as: CN114157780B

Abstract

The application provides a camera, including first shell, second shell, control panel assembly and lens subassembly. The first shell and the second shell are assembled to form an accommodating cavity. The second shell is provided with a window, and the control board assembly and the lens assembly are assembled in the accommodating cavity and are positioned in the second shell. The lens assembly is assembled on the control board assembly and extends from the control board assembly to the window. The second shell is a double-color injection molding shell, the double-color injection molding shell comprises a shell inner layer made of heat-conducting plastics and a shell outer layer made of engineering plastics, the shell outer layer wraps the outer surface of the shell inner layer, and the control board assembly is in heat conduction with the shell inner layer. Set up the second shell into the double-colored shell of moulding plastics, the shell inlayer of being made by thermal conductive plastic satisfies the heat dissipation demand to promote product heat dispersion, increase camera's use scene.

Description

Video camera

Technical Field

The application relates to the technical field of cameras, in particular to a camera.

Background

With the increasing requirements of the intellectualization and the multi-functionalization of the camera, the camera has more and more forms and larger heat productivity. At present, a camera product cannot meet the heat dissipation requirement, and the use of the camera is limited.

Disclosure of Invention

The application provides a camera that satisfies product heat dissipation demand.

The application provides a camera, including: the lens module comprises a first shell, a second shell, a control board assembly and a lens assembly, wherein the first shell and the second shell are assembled to form an accommodating cavity, the second shell is provided with a window, the control board assembly and the lens assembly are both assembled in the accommodating cavity and positioned in the second shell, and the lens assembly is assembled on the control board assembly and extends from the control board assembly to the window;

the second shell is a double-color injection molding shell, the double-color injection molding shell comprises a shell inner layer made of heat-conducting plastics and a shell outer layer made of engineering plastics, the shell outer layer wraps the outer surface of the shell inner layer, and the control board assembly is in heat conduction with the shell inner layer.

Optionally, the camera further includes a heat dissipation assembly disposed in the accommodating cavity; the heat dissipation assembly is assembled with the double-shot injection molding shell and connected with the shell inner layer, and the control panel assembly is assembled with the heat dissipation assembly and conducts heat with the shell inner layer through the heat dissipation assembly.

Optionally, the heat dissipation assembly includes a heat dissipation main board and a heat dissipation portion connected to an edge of the heat dissipation main board, the control board assembly is assembled to the heat dissipation main board, the heat dissipation portion is bent from the edge of the heat dissipation main board to a direction close to the control board assembly, and an outer side surface of the heat dissipation portion abuts against an inner surface of the shell inner layer.

Optionally, the heat dissipation main board includes a first heat dissipation surface, and the control board assembly is assembled on the first heat dissipation surface; the control board assembly comprises a circuit main board and a circuit device which is arranged on the surface of the circuit main board in a protruding mode and faces the first heat dissipation surface; the surface of the circuit device is spaced from the first heat dissipation surface.

Optionally, the camera further comprises a first heat-conducting member, wherein the first heat-conducting member is compressed and filled between the surface of the circuit device and the first heat dissipation surface; wherein the first thermally conductive member is compressed to completely cover a surface of the circuit device.

Optionally, the camera further comprises a second heat-conducting member, wherein the second heat-conducting member is compressed and filled between the outer side surface of the heat dissipation part and the inner surface of the shell inner layer; wherein the second heat-conducting member is compressed to completely cover the outer side of the heat-dissipating portion.

Optionally, the camera further includes a lamp panel, the lamp panel is assembled to the second housing, and the surface of the lamp panel is attached to the inner surface of the housing inner layer.

Optionally, the control panel assembly with the lamp plate is in at least part setting of staggering in the radial direction of second shell, radiator unit includes the heat dissipation mainboard and locates the edge of heat dissipation mainboard and with the heat dissipation portion of shell inlayer butt, the heat dissipation portion is followed the edge of heat dissipation mainboard, to the heat dissipation mainboard sets up a lateral buckling of control panel assembly, the heat dissipation portion for the lamp plate is in more be close to in the radial direction of second shell in the control panel assembly setting.

Optionally, the internal surface of shell inlayer is equipped with the mounting groove, the lamp plate install in the mounting groove, just the edge of lamp plate with the clearance has between the lateral wall of mounting groove.

Optionally, the heat dissipation assembly is disposed at an opening where the second housing is butted with the first housing, and the heat dissipation assembly at least partially covers the opening.

Optionally, the camera includes a power board, the heat dissipation assembly includes a first heat dissipation surface and a second heat dissipation surface opposite to each other, the control board assembly is assembled to the first heat dissipation surface, the power board is assembled to the second heat dissipation surface, the power board is located in the first housing, and the power board is electrically connected to the control board assembly.

The camera of this application embodiment sets up the second shell into the double-colored shell of moulding plastics, and the shell inlayer made by thermal conductive plastic satisfies the heat dissipation demand to promote product heat dispersion, increase camera's use scene.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of a camera according to the present application.

Fig. 2 is a schematic top view of the camera shown in fig. 1.

Fig. 3 shows an exploded view of the camera shown in fig. 1.

Fig. 4 shows a schematic cross-sectional view of the camera shown in fig. 1.

Fig. 5 is a schematic structural view of one embodiment of the two-shot molded housing of the camera of fig. 1.

Fig. 6 is a schematic view of a part of the two-color injection-molded housing of the video camera shown in fig. 5.

Fig. 7 is a schematic structural view of an embodiment of the first housing of the video camera shown in fig. 1.

Fig. 8 is a schematic cross-sectional view of the first housing of the camera shown in fig. 7.

Fig. 9 is a schematic diagram illustrating an assembly structure of the control board assembly, the lens assembly, the heat dissipation assembly and the power board of the camera shown in fig. 1.

Fig. 10 shows a close-up view at a1 of the camera shown in fig. 9.

Fig. 11 is a schematic view showing a part of the structure of the video camera shown in fig. 1.

Fig. 12 is a schematic view showing a part of the structure of the video camera shown in fig. 1.

Fig. 13 shows an enlarged view of the layout at a2 of the camera shown in fig. 12.

Fig. 14 is a schematic top view of the control panel assembly of the camera of fig. 1.

Fig. 15 is a schematic view showing a part of the structure of the video camera shown in fig. 1.

Fig. 16 is a graph showing a relationship between a total thermal resistance of heat conduction of the inner layer of the case of the video camera shown in fig. 1 and a heat dissipation area of the heat dissipation portion.

Fig. 17 is a schematic structural view illustrating an assembly of the heat dissipation assembly, the first heat conduction member, and the second heat conduction member of the camera shown in fig. 1.

Fig. 18 is an exploded view of the heat sink assembly, first heat conductive member, and second heat conductive member of the camera of fig. 17 assembled.

Fig. 19 is a structural diagram of the camera shown in fig. 17, showing another perspective of the assembly of the heat sink assembly, the first heat-conducting member, and the second heat-conducting member.

Fig. 20 is a schematic structural view of the camera shown in fig. 17 from a further perspective showing the assembly of the heat sink assembly, the first heat-conducting member, and the second heat-conducting member.

Fig. 21 is a schematic view showing a part of the structure of the video camera shown in fig. 1.

Fig. 22 is a schematic view showing a part of the structure of the video camera shown in fig. 1.

Fig. 23 shows a schematic view of the camera of fig. 22 at a 3.

Fig. 24 is a schematic view showing a part of the structure of the video camera shown in fig. 22.

Fig. 25 is a schematic structural view of a lamp panel of the video camera shown in fig. 21.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the description and in the claims does not indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" or "a number" means at least two. Unless otherwise indicated, "front", "rear", "lower" and/or "upper" and the like are for convenience of description and are not limited to one position or one spatial orientation. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

The camera of the embodiment of the application comprises a first shell, a second shell, a control board assembly and a lens assembly. The first shell and the second shell are assembled to form an accommodating cavity. The second shell is provided with a window, and the control board assembly and the lens assembly are assembled in the accommodating cavity and are positioned in the second shell. The lens assembly is assembled on the control board assembly and extends from the control board assembly to the window. The second shell is a double-color injection molding shell, the double-color injection molding shell comprises a shell inner layer made of heat-conducting plastics and a shell outer layer made of engineering plastics, the shell outer layer wraps the outer surface of the shell inner layer, and the control board assembly is in heat conduction with the shell inner layer.

By using the double-color injection molding shell, the shell inner layer made of the heat-conducting plastic meets the heat dissipation requirement, and the shell outer layer made of the engineering plastic meets the requirements of appearance and structural mechanical properties. Therefore, the heat dissipation requirement of the product, the appearance requirement and the structural mechanical performance requirement can be met simultaneously, and the use scene of the camera is enlarged.

The present application provides a camera. The camera of the present application will be described in detail below with reference to the accompanying drawings. The features of the following examples and embodiments may be combined with each other without conflict.

Fig. 1 is a schematic structural diagram of an embodiment of a video camera 1 according to the present application. Fig. 2 is a schematic top view of the camera 1 shown in fig. 1. Fig. 3 shows an exploded view of the camera 1 shown in fig. 1. Fig. 4 shows a schematic cross-sectional view of the camera 1 shown in fig. 1. As shown in fig. 1 to 4, the camera 1 may be a different type of camera. In the present embodiment, the camera 1 may be a conch camera, which is not limited in the present application.

Specifically, the video camera 1 includes a first housing 11, a second housing 12, a control board assembly 13, a lens assembly 14, a heat dissipation assembly 15, a power board 16, and a lamp panel 17. Wherein, the first housing 11 and the second housing 12 are assembled to form a receiving cavity 18. The control panel assembly 13, the lens assembly 14, the heat dissipation assembly 15, the power panel 16 and the lamp panel 17 are all assembled in the accommodating cavity 18. The lens assembly 14 is assembled to the control board assembly 13 to be electrically connected to the control board assembly 13. The control board assembly 13 is used for driving and controlling the lens assembly 14 to operate. Control panel assembly 13 is connected with lamp plate 17 electricity, and control panel assembly 13 is used for drive and control lamp plate 17 operation. The control board assembly 13 is electrically connected to a power board 16, and the power board 16 is used for supplying power to the control board assembly 13.

Fig. 5 is a schematic structural view of an embodiment of the two-color injection molded housing 19 of the video camera 1 shown in fig. 1. Fig. 6 is a schematic view showing a partial structure of the two-color molded housing 19 of the video camera 1 shown in fig. 5. As shown in fig. 5 and 6, at least one of the first housing 11 and the second housing 12 is a two-shot molded housing 19. The two-color injection molded outer shell 19 comprises an inner shell layer 20 made of a thermally conductive plastic and an outer shell layer 21 made of an engineering plastic. The thermally conductive plastic and the engineering plastic are molded by a two-shot molding process such that the thermally conductive plastic and the engineering plastic are permanently bonded or adhered to each other to form a two-shot molded housing 19 of an integral structure. Since the heat conductive plastic has good heat dissipation properties and is brittle, it may not be well fixed as the case outer layer 21, and has low smoothness and a poor appearance. Therefore, the heat dissipation requirement of the product and the requirements of appearance and structural mechanical performance are met at the same time. The outer shell layer 21 is wrapped on the outer surface of the inner shell layer 20 by a two-color injection molding process, so that the heat-conducting plastic is fully contacted with the engineering plastic. Because the heat conducting plastic has even heat dissipation, the heat dissipation requirement of the camera 1 can be met. Because engineering plastics rigidity is big, mechanical properties is stable and intensity is high, convenient fixed, and engineering plastics surface is smooth, and is glossy, can satisfy the outward appearance demand, so can increase the use scene of camera 1. The double-color injection molding process is to form an integral double-color injection molding shell 19 by respectively injecting the heat-conducting plastic and the engineering plastic twice.

In some embodiments, the first housing 11 and the second housing 12 are both two-shot molded housings 19. The inner surfaces of the first and

second housings

11 and 12 are both thermally conductive plastic. The accommodating cavities 18 formed in the first housing 11 and the second housing 12 may be convection heat dissipation cavities, so that the heat dissipation area of the accommodating cavities 18 can be increased, and the heat dissipation performance of the camera 1 can be improved.

In some embodiments, one of the first housing 11 and the second housing 12 is a two-shot molded housing 19. Therefore, the assembly which mainly generates heat of the camera 1 can be arranged in the double-color injection molding shell, the product cost can be effectively reduced under the condition of considering the heat dissipation requirement of the camera 1, and the market competitiveness of the camera 1 is improved.

In this embodiment, the second housing 12 is a two-shot molded housing 19. The outer shell layer 21 of the double-color injection-molded shell 19 is made of engineering plastics, so that the appearance of the camera 1 is consistent with that of a conventional camera. The inner shell layer 20 of the two-color injection molded outer shell 19 is made of a thermally conductive plastic. Compared with engineering plastics, the heat-conducting plastic has better heat-conducting property. The thermal conductivity of a thermally conductive plastic is mainly measured by thermal conductivity. In some embodiments, the thermally conductive plastic may have a thermal conductivity of 1-5 w/(m.k). In some embodiments, the thermal conductivity of the thermally conductive plastic may be 1w/(m.k) or 2w/(m.k) or 3w/(m.k) or 4w/(m.k) or 5w/(m.k), with a preferred value of 3 w/(m.k). Wherein "K" is an absolute temperature unit and can be replaced by "C", "W" means a thermal power unit, and "m" means a length unit of meter.

In some embodiments, the maximum thickness L1 of the shell outer layer 21 is at least 2.2mm in order to meet the strength minimum requirements of the second outer shell 12. In some embodiments, the maximum thickness L2 of the shell inner layer 20 is no more than 1.8 mm. The maximum thickness L2 of the shell inner layer 20 is preferably neither too large nor too small. The arrangement is too large to reduce the heat dissipation space inside the housing chamber 18, which is not favorable for heat dissipation. Too small to meet heat dissipation requirements. Therefore, the maximum thickness L2 of the shell inner layer 20 is set to be 1.8mm at most, so that the cost can be reduced under the condition of meeting the heat dissipation requirement, and the shell inner layer has better economic benefit.

In some embodiments, the camera 1 further comprises a seal 22 (as shown in fig. 3). The upper edge of the shell inner layer 20 is lower than the upper edge of the shell outer layer 21, forming a step 23 (shown in fig. 6). The sealing member 22 is assembled to the step 23, and the sealing member 22 is used to seal the gap between the first housing 11 and the second housing 12. The upper edge of the case inner layer 20 is set lower than the upper edge of the case outer layer 21, so that the production is facilitated to form the step 23, the assembling of the sealing member 22 between the first case 11 and the second case 12 is facilitated to ensure the sealing property in the housing chamber 18, and the sealing property of the entire camera 1 can be improved. In some embodiments, the seal 22 may be a gasket. The sealing ring has good elasticity and rebound resilience, good sealing performance and lower cost.

In some embodiments, the reduced height dimension L3 of shell inner layer 20 compared to the height of shell outer layer 21 may range from 1mm to 5 mm. In some embodiments, the reduced height dimension L3 of shell inner layer 20 compared to the height of shell outer layer 21 may be 1mm or 2mm or 3mm or 4mm or 5mm, with a preferred value of 3 mm. The size of seal 22 is adapted to the reduced height dimension L3 described above. When the seal 22 is assembled to the second housing 12, the upper edge of the seal 22 is slightly higher than the upper edge of the housing outer layer 21. When the first housing 11 and the second housing 12 are assembled, the sealing member 22 is compressed, and the sealing member 22 is in interference fit with the first housing 11, so that better sealing performance between the first housing 11 and the second housing 12 is ensured.

In some embodiments, the thermally conductive plastic is uniformly filled with the polymer matrix material with the thermally conductive filler to improve the thermal conductivity thereof. Compared with common plastics, the heat-conducting property of the plastic material is obviously improved. In some embodiments, the engineering plastic may be polycarbonate. And are not limited in this application.

Fig. 7 is a schematic structural view of an embodiment of the first housing 11 of the video camera 1 shown in fig. 1. Fig. 8 shows a schematic cross-sectional view of the first housing 11 of the camera 1 shown in fig. 7. As shown in fig. 7 and 8, the material of the first housing 11 is engineering plastic. The engineering plastic may be polycarbonate. The shape of which is similar to the shape of the housing of a normal camera. In the present embodiment, the first housing 11 and the second housing 12 are each a sphere structure. The first housing 11 is adapted to the second housing 12. Through the cooperation of the first shell 11 made by engineering plastics and the second shell 12 made by double-shot moulding technology, under the heat dissipation demand's of compromise camera 1 circumstances, effectively reduce product cost, promote camera 1's market competition.

By providing the second housing 12 as a two-shot molded housing 19. The heat generated in the first and

second housings

11 and 12 is mostly dissipated through the housing inner layer 20 of the two-color injection molded housing 19. In addition, a convection heat dissipation chamber is formed in the accommodation chamber 18 by the inner surface of the first housing 11 and the inner surface of the housing inner layer 20 of the two-color injection molded housing 19. A part of the heat is radiated to the inner wall of the first housing 11 by convection and then transferred to the outer wall of the first housing 11 by the heat conduction of the first housing 11. Therefore, the flatness of the first housing 11 also affects the transfer of heat. Therefore, setting the flatness of the first housing 11 to 0.1mm at maximum flattens the inner wall of the first housing 11, reduces the contact thermal resistance with the housing inner layer 20 of the second housing 12, and facilitates the heat transfer to the first housing 11.

In some embodiments, the maximum thickness L11 of the first housing 11 is at least 2 mm. The maximum thickness of the first housing 11 can be obtained by the calculation formula (1) of the heat conduction and heat exchange resistance of the first housing 11. For example, in the case where the size of the first housing 11 is not changed, the thermal conductive resistance of the first housing 11 is calculated as follows:

it follows that the thermal resistance R is positively correlated with the wall thickness d1 of the first housing 11. In order to reduce the thermal resistance R, the maximum thickness of the first housing 11 is set to at least 2mm while satisfying the structural strength property and the hardness property, so that the requirements on the hardness and the rigidity of the first housing 11 can be ensured, and the drop can be prevented.

In the embodiment shown in fig. 1 to 8, the camera 1 further comprises a fixing member 24, and the edge of the first housing 11 facing the second housing 12 is provided with a first fixing hole 25. The edge of the second housing 12 facing the first housing 11 is provided with a second fixing hole 26. The first housing 11 is assembled and fixed with the second housing 12 by the fixing member 24 sequentially passing through the first fixing hole 25 and the second fixing hole 26 (as shown in fig. 1 and 2). In some embodiments, the fastener 24 may be a bolt. Simple structure, low cost, stability and reliability. In some embodiments, the fixing member 24, the first fixing hole 25 and the second fixing hole 26 may be provided in plural numbers, and the positions thereof are provided corresponding to the numbers. And are not limited in this application.

In some embodiments, the top of the first housing 11 is provided with perforations 27 (as shown in fig. 2, 7 and 8). The through hole 27 is used for passing an external power line or a control line (not shown) to electrically connect the power board 16 and the control board assembly 13 disposed in the housing cavity 18. In some embodiments, the second housing 12 is provided with a viewing window 28, and the lens assembly 14 is assembled to the control board assembly 13 and extends from the control board assembly 13 towards the viewing window 28. The lens assembly 14 captures an image of the exterior through the viewing window 28. The window 28 may also be provided with glass for protecting the lens assembly 14.

Fig. 9 is a schematic view showing an assembly structure of the control board assembly 13, the lens assembly 14, the heat dissipating assembly 15, and the power board 16 of the video camera 1 shown in fig. 1. Fig. 10 shows a partial enlarged view of the camera 1 shown in fig. 9 at a 1. As shown in fig. 3, 4, 9 and 10, the power board 16 and the control board assembly 13 are both disposed on the heat sink assembly 15. In the present embodiment, the power board 16 and the control board assembly 13 are respectively provided on both side surfaces of the heat sink assembly 15. Wherein the power panel 16 is located within the first housing 11 and the control panel assembly 13 and the lens assembly 14 are both located within the second housing 12.

In some embodiments, the heat sink assembly 15 is disposed at an opening 29 where the second housing 12 interfaces with the first housing 11, and the heat sink assembly 15 at least partially covers the opening 29 (as shown in fig. 4). In the axial direction Y of the second housing 12, the size of the opening 29 where the first housing 11 and the second housing 12 are butted is the largest, and the heat dissipation assembly 15 is assembled at the opening 29, so as to ensure that the heat dissipation surface of the heat dissipation assembly 15 is the largest, thus ensuring that the contact area between the power panel 16 and the control panel assembly 13 and the heat dissipation assembly 15 is the largest, and further improving the heat dissipation effect of the power panel 16 and the control panel assembly 13. After the heat sink 15 is assembled to the second housing 12, the housing chamber 18 is divided into a first housing chamber 30 and a second housing chamber 31. The heat dissipation assembly 15 and the first housing 11 enclose a first accommodating cavity 30, and the power board 16 is disposed in the first accommodating cavity 30. The power board 16 dissipates heat through a convection heat dissipation space formed by the heat dissipation member 15 and the inner wall of the first housing 11. The heat sink assembly 15 and the second housing 12 enclose a second accommodating cavity 31, and the control board assembly 13 and the lens assembly 14 are disposed in the second accommodating cavity 31. The control board assembly 13 and the lens assembly 14 dissipate heat through a convection heat dissipation space formed by the heat dissipation assembly 15 and the inner wall of the second housing 12.

The control board assembly 13, the lens assembly 14, and the power supply board 16 all generate heat for the entire video camera 1, which is mainly generated by the control board assembly 13 and the lens assembly 14. Thus, the second housing 12 is provided as a two-shot molded housing. The heat sink assembly 15 is assembled with a two-shot molded outer shell 19 and connected to a shell inner layer 20. The power board 16 and the control board assembly 13 are both connected to the case inner layer 20 and thermally conducted through the case inner layer 20. The control board assembly 13 is assembled to the heat sink assembly 15, and is thermally conducted to the case inner layer 20 through the heat sink assembly 15. The heat generated by the control board assembly 13 and the lens assembly 14 is transferred to the case inner layer 20 through the heat dissipation assembly 15, which is thermally conducted by the thermally conductive plastic of the case inner layer 20. The power board 16 is assembled on the heat sink 15, and may also be connected to the case inner layer 20 through the heat sink 15. The heat in the first accommodating cavity 30 is transferred, so that the heat dissipation performance of the camera 1 can be improved, and the service life of the camera 1 can be prolonged. Under this application scenario, first shell 11 may not need to be improved, and under the condition of considering the heat dissipation demand of camera 1, product cost is effectively reduced, and the market competitiveness of camera 1 is promoted.

Fig. 11 is a schematic view of a part of the structure of the video camera 1 shown in fig. 1. Fig. 12 is a schematic view of a part of the structure of the video camera 1 shown in fig. 1. Fig. 13 shows an enlarged view of the layout at a2 of the video camera 1 shown in fig. 12. Fig. 14 is a schematic top view of the control board assembly 13 of the video camera 1 shown in fig. 1. Fig. 15 is a schematic view of a part of the structure of the video camera 1 shown in fig. 1. Fig. 16 is a graph showing a proportional relationship between the total thermal resistance of heat conduction of the case inner layer 20 and the heat dissipation area of the heat dissipation portion 33 of the video camera 1 shown in fig. 1. Fig. 17 is a schematic structural view illustrating the assembly of the heat sink assembly 15, the first heat-conducting member 38, and the second heat-conducting member 39 of the camera 1 shown in fig. 1. Fig. 18 is an exploded view showing the assembly of the heat dissipating member 15, the first heat conductive member 38, and the second heat conductive member 39 of the video camera 1 shown in fig. 17. Fig. 19 is a schematic structural view of the camera 1 shown in fig. 17, showing another view of the assembly of the heat dissipation assembly 15, the first heat conduction member 38, and the second heat conduction member 39. Fig. 20 is a schematic structural view of another perspective of the assembly of the heat sink assembly 15, the first heat-conducting member 38, and the second heat-conducting member 39 of the camera 1 shown in fig. 17.

As shown in fig. 9 to 20, the heat dissipation assembly 15 includes a heat dissipation main plate 32 and a heat dissipation portion 33 connected to an edge of the heat dissipation main plate 32. The heat dissipation portion 33 is provided at an edge of the heat dissipation main plate 32 and abuts against the case inner layer 20. In some embodiments, the control board assembly 13 is assembled to the heat dissipation motherboard 32. The heat dissipation portion 33 is bent from the edge of the heat dissipation main board 32 in a direction toward the control board assembly 13, and the outer side surface of the heat dissipation portion 33 is in contact with the inner surface of the case inner layer 20. Since the area of the heat dissipation main board 32 is large, the control board assembly 13 mainly dissipates heat by using the heat dissipation main board 32, transfers part of the heat to the case inner layer 20 through the heat dissipation portion 33 provided at the edge thereof, and dissipates heat by using the heat conductive plastic of the case inner layer 20. The heat radiation performance of the camera 1 can be enhanced by connecting the heat radiation member 15 with the case inner layer 20 and radiating heat using the heat radiation member 15 and the case inner layer 20.

In some embodiments, the heat dissipating motherboard 32 includes a first heat dissipating surface 34 and a second heat dissipating surface 35 disposed opposite each other. The first heat dissipation surface 34 faces the control board assembly 13 and is spaced from the control board assembly 13, so that a heat dissipation space is formed between the control board assembly 13 and the first heat dissipation surface 34. In some embodiments, the second heat dissipation surface 35 faces the power board 16 and is spaced apart from the power board 16, so that a heat dissipation space is formed between the power board 16 and the second heat dissipation surface 35.

In some embodiments, the control board assembly 13 is assembled to the first heat dissipation surface 34. The control board assembly 13 includes a circuit board 36 and a circuit device 37 protruding from the surface of the circuit board 36 toward the first heat dissipation surface 34. The surface of the circuit device 37 is distanced from the first heat dissipation surface 34. The distance may be a safe distance. The distance L4 between the surface of the circuit device 37 and the first heat dissipation surface 34 ranges not less than 0.5 mm. An appropriate distance is set between the surface of the circuit device 37 and the first heat dissipation surface 34, so that the surface of the circuit device 37 can be prevented from contacting the first heat dissipation surface 34, a safety distance is satisfied, and under the condition that the safety distance is satisfied, heat generated by the circuit device 37 can be quickly absorbed by the first heat dissipation surface 34, and the heat dissipation performance is improved.

In the present embodiment, the heat dissipation assembly 15 is disposed between the control board assembly 13 and the power supply board 16. The distance L5 between the heat sink assembly 15 and the control board assembly 13 can be kept at about 3.5 mm. In the present embodiment, the maximum height of the control board assembly 13 is set to 3mm, and the gap between the surface of the control board assembly 13 and the first heat dissipation surface 34 is set to at least 0.5 mm. Thus, the gap between the first heat dissipation surface 34 and the control board assembly 13 is set to be at least 3.5 mm. In the present embodiment, the thickness L6 of the circuit device 37 may be 1 mm. The thickness L6 of the circuit device 37 is generally about 1mm, but is not limited thereto. The gap between the surface of circuit device 37 and heat sink assembly 15 may be 2.5mm (the difference between L5 and L6 is available).

In some embodiments, the camera 1 further comprises a first thermal conductive member 38, the first thermal conductive member 38 being compressively filled between the surface of the circuit device 37 and the first heat dissipation surface 34. Wherein, before the first heat-conducting member 38 is compressed, the dimension of the first heat-conducting member 38 in the axial direction Y of the second housing 12 is larger than the distance between the surface of the circuit device 37 and the first heat-dissipating surface 34. The axial direction Y of the second housing 12 may be a longitudinal axis direction. The surface of the circuit device 37 can be fully contacted with the first heat dissipation surface 34 through the first heat conduction member 38, so that the contact area is increased, the thermal resistance is reduced, and the heat dissipation effect is improved.

In some embodiments, the first thermal conduction member 38 partially covers the surface of the circuit device 37 (as shown in fig. 14) before the first thermal conduction member 38 is compressed. After the first heat-conducting member 38 is compressed, the first heat-conducting member 38 completely covers the surface of the circuit device 37. Since the volume of the first heat-conducting member 38 before and after compression is not changed, the sectional area of the first heat-conducting member 38 is set smaller than the surface of the circuit device 37, and after the first heat-conducting member 38 is compressed, the first heat-conducting member 38 is ensured to completely cover the surface of the circuit device 37 without wasting the first heat-conducting member 38, thereby reducing the cost.

In some embodiments, the surface of circuit device 37 and first heat dissipation surface 34 are filled with a thermal interface material that completely covers the surface of circuit device 37 after being compressed. The heat conducting interface material is adopted for filling, and the thickness of the heat conducting interface material can be 3 mm. To ensure that the surface of circuit device 37 is completely covered after compressing the thermal interface material, the thickness of the thermal interface material is set to be higher than the gap between the upper surface of circuit device 37 and first heat dissipation surface 34, so as to ensure that the upper surface of circuit device 37 is in sufficient contact with the thermal interface material.

In the present embodiment, the circuit device 37 may be a square device. Its side length L4 may be 10 mm. According to the principle of conservation of mass, when the thermal interface material is compressed and completely covers the circuit device 37, the side length of the thermal interface material is compared with the side length of the circuit device 37, and the one-sided reduction amount k1 can be calculated by the following formula (2). The specific calculation process is as follows:

in the present embodiment, the reduction value k1 is 0.4mm, i.e. the side length of the thermal interface material is 9.2 mm. Typically, the cross-sectional area of the thermal interface material before it is uncompressed is less than the cross-sectional area of circuit device 37. With such an arrangement, it is ensured that no waste of the heat conducting interface material is caused and the cost is reduced under the condition that the surface of the circuit device 37 is completely covered. In other embodiments, the quantized volume ratio calculation may also be used, and is not limited in this embodiment.

In some embodiments, the thermally conductive interface material may be silicone rubber. In some embodiments, the compressibility of the thermal interface material ranges from 10% to 30%. The compression ratio is too large and too low, and according to thermal stress analysis, the compression ratio of the heat-conducting interface material is too large, so that too large thermal stress is easily applied, and the circuit device 37 and the heat dissipation main board 32 which are arranged up and down are deformed. Therefore, the compression ratio of the heat conducting interface material is set to be appropriate, the contact area between the surface of the circuit device 37 and the first heat dissipation surface 34 is effectively increased, the contact thermal resistance is reduced, and the heat dissipation performance is optimized.

In some embodiments, the first thermal conduction member 38 may be silicon rubber. The silicon rubber has stable performance. In some embodiments, the compressibility of the first thermally conductive member 38 ranges from 10% to 30%. The material of the first heat conducting member 38 may be the above-mentioned heat conducting interface material, and specific setting parameters, setting positions and functions thereof are referred to above and will not be described herein again.

In some embodiments, the camera 1 further includes a second heat-conducting member 39, and the second heat-conducting member 39 is compressively filled between the outer side surface of the heat-dissipating portion 33 and the inner surface of the case inner layer 20 (as shown in fig. 12). Before the second heat-conducting member 39 is compressed, the dimension of the second heat-conducting member 39 in the radial direction X of the second housing 12 is larger than the gap between the outer side surface of the heat-radiating portion 33 and the inner side surface of the second housing 12 in the radial direction of the second housing 12. The radial direction X of the second housing 12 may be in the direction of the transverse axis. So set up, can make the lateral surface of heat dissipation portion 33 pass through the medial surface full contact of second heat-conducting member 39 with second casing 12 to increase area of contact, reduce the thermal resistance, promote the radiating effect.

In some embodiments, the second heat-conducting member 39 partially covers the outer sidewalls of the heat sink 33 before the second heat-conducting member 39 is compressed. After the second heat-conductive member 39 is compressed, the second heat-conductive member 39 completely covers the outer side wall of the heat-dissipating portion 33. Because the volume of the second heat-conducting member 39 is not changed before and after compression, the sectional area of the second heat-conducting member 39 is set to be smaller than the sectional area of the outer side surface of the heat dissipation part 33, and the second heat-conducting member 39 is compressed, so that the second heat-conducting member 39 can completely cover the outer side surface of the heat dissipation part 33, the waste of the second heat-conducting member 39 is avoided, and the cost is reduced.

In some embodiments, a heat conducting interface material is filled between the outer side of the heat dissipation part 33 and the inner side of the second housing 12, and the heat conducting interface material completely covers the outer side of the heat dissipation part 33 after being compressed. For example, the thermal interface material may have a length of 25mm and a width of 12 mm. In order to reduce the thermal conductive resistance, the distance L7 between the outer side of the heat dissipation part 33 and the inner side of the second housing 12 is set to 1mm, and the thickness L8 of the thermal conductive interface material filled therebetween may be 1.2 mm. The compression rate of the heat-conducting interface material can be 20%, so that sufficient contact is ensured, and the contact thermal resistance is reduced. When assembling the heat sink assembly 15, the heat conductive interface material is first provided on the outer side surface of the heat sink member 33, and then the heat sink member 33 is assembled to the inner side surface of the second housing 12 together with the heat conductive interface material on the outer side surface. So set up, guarantee difficult emergence dislocation when the equipment, guarantee that the lateral surface of heat dissipation portion 33 and the medial surface of second shell 12 fully contact, and closely laminate to reduce the thermal resistance, improve the radiating effect.

In some embodiments, the material of the second heat-conducting member 39 may be silicon rubber. The silicon rubber has stable performance. In some embodiments, the compressibility of the second heat-conducting member 39 ranges from 10% to 30%, with a preferred value of 20%. The material of the second heat conducting member 39 may be the above-mentioned heat conducting interface material, and specific setting parameters, setting positions and functions may be referred to above, and are not described herein again.

In some embodiments, the power board 16 includes a power board 40 and a power device 41 protruding from the surface of the power board 40 toward the second heat dissipation surface 35 (as shown in fig. 9). The surface of the power supply device 41 has a distance to the second heat dissipation surface 35. The distance may be a safe distance. An appropriate distance is provided between the surface of the power device 41 and the second heat dissipation surface 35, so that the surface of the power device 41 can be prevented from contacting the second heat dissipation surface 35, a safety distance is satisfied, and the heat generated by the power device 41 can be quickly absorbed by the second heat dissipation surface 35 under the condition that the safety distance is satisfied, thereby improving the heat dissipation performance.

In some embodiments, the power board 16 further includes another type of power device 47 protruding from the second heat dissipation surface 35 to the power motherboard 40, the other type of power device 47 is disposed in the first housing 11, heat generated by the power board 16 is dissipated into the air inside the camera 1 through convection, the heat in the air is transferred to the first housing 11 and the second housing 12 through convection, a ratio between the two is adjusted according to design requirements, and the second housing 12 dissipates the heat into the environment through convection of the environment, so as to achieve a purpose of removing the heat generated inside the camera 1. The other power supply device 47 is larger in size than the power supply device 41, and the other power supply device 47 having a large size is provided in the first housing 11, thereby effectively utilizing the heat dissipation space inside the first housing 11 to dissipate heat. The power supply device 41 having a small size is provided on the side close to the second heat dissipation surface 35, and the heat is absorbed by the heat dissipation main board 32 effectively. On one hand, the space layout is effectively utilized, so that the layout of the power supply main board 40 is more compact; on the other hand, the power devices on the upper side and the lower side of the power main board 40 can quickly dissipate heat, and the heat dissipation effect is improved.

In the present embodiment, the power board 16 employs convection heat dissipation between the heat dissipation main board 32 and the first housing 11. Limited space convection is provided between the heat dissipation main board 32, and in order to increase the strength of convection heat transfer, the distance L9 between the second heat dissipation surface 35 and the surface of the power main board 40 is greater than the distance between the surface of the power device 41 and the second heat dissipation surface 35 (as shown in fig. 9). The distance between the surface of the power supply device 41 and the second heat dissipation surface 35 thereof is obtained by the following formula (3). The specific calculation process is as follows:

in this embodiment, δ may be 7.1mm, with rounding-up setting L9 at 7.5mm, thus ensuring that the gap is greater than the boundary layer thickness.

In some embodiments, the inner surface of the shell inner layer 20 is a heat dissipating surface of the second outer shell 12. The outer side surface of the heat dissipation portion 33 is a heat dissipation surface of the heat dissipation portion 33, and the area ratio of the inner surface of the case inner layer 20 to the outer side surface of the heat dissipation portion 33 is not less than 1: 3. as shown in fig. 15 and 16, the heat dissipation area of the second housing 12 is divided into three parts, the area between 121 and 122 mainly dissipates the heat of the lamp panel 17, and the area between 121 and 123 and the area between 122 and 123 mainly dissipate the heat conducted by the control panel assembly 13 through the heat dissipation assembly 15. Taking the area 121-123 as an example, the surface area of the second housing 12 in the area may be 900mm²The contact area As of the inner surface of the second casing 12 and the second heat-conducting member 39 is defined by the area 121-123The total thermal resistance of the heat conduction is determined. The total heat conduction thermal resistance consists of the following two parts:

ra ═ Rc (normal thermal conductive resistance) + Rsp (diffusion thermal resistance)

The thermal diffusion resistance is thermal conduction resistance generated by the inconsistency of the heat source surface and the heat dissipation surface, so that the temperature distribution of the heat dissipation surface is uneven, the position temperature of the heat source surface is high, and the ambient temperature is low.

Wherein the normal thermal conduction resistance is obtained by the following formula (4). The specific calculation process is as follows:

Rc＝D/(k*Ap) (4)

wherein the diffusion thermal resistance is obtained by the following formula (5). The specific calculation process is as follows:

wherein

k is the thermal conductivity of the second housing 12, i.e. the thermal conductivity of the thermal conductive plastic is 3w/(m.k), D is the thickness of the second housing 12, i.e. 1.8mm, and the contact area As is the area of the heat dissipation surface in the area of 121-². In order to improve the heat dissipation performance, the heat conduction total thermal resistance Ra needs to have a better cost performance, and a curve of the heat conduction total thermal resistance along with the change of the contact area shows that the larger the contact area As is, the lower the heat conduction total thermal resistance Ra is, and when the contact area As reaches 300mm²In the process, the reduction range of the heat conduction total thermal resistance Ra along with the increase of the contact area As is smaller, so that the contact area As is comprehensively considered to be 300mm². As shown in FIG. 16, the abscissa of the curve of the total thermal resistance of heat conduction with the contact area is the contact area As in mm². The ordinate is the total thermal conductivity resistance Ra in w/(m.k). 300mm is used As the contact area As²Later, the heat conduction total thermal resistance Ra decreases more slowly. Therefore, to ensure no material waste, 300mm is used for the contact area As²The contact area of the heat sink can achieve the effect of fast heat dissipation under the condition of not wasting materials. The heat-conducting interface materialIs in accordance with the area surface of the second housing 12 in the area 121-123. But is not limited thereto.

As shown in fig. 11 to 13 and 17 to 20, the inner surface of the case inner layer 20 has a curved surface. The outer side surface of the heat dissipation portion 33 is an arc surface. The outer side surface of the heat dissipation portion 33 is attached to the inner surface of the case inner layer 20. And through filling second heat-conducting member 39 between the lateral surface of heat dissipation portion 33 and the internal surface of shell inlayer 20, make the contact of the lateral surface of heat dissipation portion 33 and the internal surface of shell inlayer 20 more abundant to make the heat that heat dissipation mainboard 32 heat-conduction came over most conduct to shell inlayer 20 through heat dissipation portion 33, and utilize the heat-conducting plastics of shell inlayer 20 to carry out heat-conduction heat dissipation, so promote the heat dispersion of camera 1.

In some embodiments, the heat dissipating motherboard 32 is integrally molded with the heat dissipating portion 33. The integrated into one piece, heat-conduction is faster, simple structure, the equipment is convenient. In some embodiments, the heat dissipating portions 33 are claw-shaped. The heat dissipation portion 33 is not easily bent over the entire surface, and is therefore provided in a claw shape. In order to ensure the heat dissipation effect, in this embodiment, the number of the claws is set to 4, and may be set to other numbers. But not too much or too little. The claw-like heat dissipating portions 33 are too thin to achieve a heat dissipating effect, and too thick to be bent. Therefore, the method can be set according to actual requirements and is not limited in the application.

The claw-like heat dissipating portion 33 is provided with the above-described heat conductive interface material before the heat dissipating member 15 is mounted, thus ensuring a tight bond between the outer side surface of the heat dissipating portion 33 and the inner surface of the second housing 12. So set up, can easy to assemble, difficult emergence dislocation. In addition, the length and width of the heat dissipation portion 33 should not be set too large, too small, too large for waste, and too small for achieving the heat dissipation effect, and the above calculation results may be referred to. And will not be described in detail herein. In some embodiments, the heat dissipation assembly 15 is made of aluminum alloy. Its model may be AL 5052. AL5052 has good forming processability and heat conductivity.

Fig. 21 is a schematic view of a part of the structure of the video camera 1 shown in fig. 1. Fig. 22 is a schematic partial structural view of the video camera 1 shown in fig. 1. Fig. 23 is a schematic diagram showing the structure at a3 of the video camera 1 shown in fig. 22. Fig. 24 is a schematic view showing a part of the structure of the video camera 1 shown in fig. 22. Fig. 25 is a schematic structural view of lamp panel 17 of video camera 1 shown in fig. 21. Lamp panel 17 is assembled to second housing 12. In this embodiment, lamp panel 17 is assembled to the inner surface of housing inner layer 20. The surface of lamp panel 17 is laminated with the inner surface of shell inner layer 20. Lamp panel 17 dissipates heat primarily through the surface of housing inner layer 20.

In some embodiments, the camera further includes a locator 42. Lamp panel 17 is provided with a through hole 43 matching with positioning member 42. The inner surface of the case inner 20 is provided with positioning holes 44 corresponding to the positions of the through holes 43. Lamp panel 17 is assembled to the inner surface of housing inner 20 by fitting positioning member 42 to through hole 43 and positioning hole 44. Be used for fixed lamp plate 17 through setting element 42, its fixed effect is better, and guarantees that the surface of lamp plate 17 and the surface contact of shell inlayer 20 are more, promotes the radiating effect.

In some embodiments, the bottom wall of the second housing 12 is provided with a mounting groove 45, and the positioning hole 44 is provided at the bottom of the mounting groove 45. Lamp plate 17 assembles in mounting groove 45, and the tank bottom of lamp plate 17's surface and mounting groove 45 laminates mutually. The mounting groove 45 is provided with a positioning hole 44 corresponding to the through hole 43. Lamp panel 17 is assembled in mounting groove 45 through the cooperation of locating piece 42, through-hole 43, locating hole 44. The internal surface of shell inlayer 20 is equipped with above-mentioned mounting groove 45, and lamp plate 17 installs in mounting groove 45, and has the clearance between the edge of lamp plate 17 and the lateral wall of mounting groove 45. In some embodiments, the distance between the edge of the lamp panel 17 and the side wall of the mounting groove 45 is not less than 0.3 mm. In general, when the lamp panel 17 is installed, a gap of 0.1mm is reserved at each edge of the lamp panel, so that convenience is brought to installation; on the other hand is in order to dodge, avoid with the edge contact of mounting groove 45, for the edge contactless of guaranteeing lamp plate 17's edge and mounting groove 45, reduces the heat conduction effect of lamp plate 17 in horizontal. Therefore, the distance between the edge of the lamp panel 17 and the side wall of the mounting groove 45 is set to be at least 0.3 mm. Therefore, in the length direction of the lamp panel 17, the avoiding length of the lamp panel 17 and the installation groove 45 is 0.6mm, and the width is 0.6 mm. And are not limited in this application.

In some embodiments, alignment holes 44 extend through shell inner layer 20 and to shell outer layer 21, and alignment holes 44 have a hole depth greater than the maximum thickness of shell inner layer 20. Because the material of shell inlayer 20 is thermal conductive plastic, thermal conductive plastic is more fragile, so with the hole depth of locating hole 44 greater than the maximum thickness of shell inlayer 20, make locating piece 42 and shell outer 21 fixed, make the surface of lamp plate 17 and the surface of shell inlayer 20 more laminate. Because lamp plate 17 and shell inlayer 20 direct contact, consequently set up lamp plate 17's material into epoxy. Compared with the related technology, the epoxy resin has weaker heat conduction effect and lower cost. Because lamp plate 17 and shell inlayer 20 direct contact, it mainly dispels the heat through shell inlayer 20, under the circumstances of guaranteeing not to influence the radiating effect, chooses for use epoxy board reduce cost to reduce the cost of whole camera 1.

In some embodiments, the positioning member 42 may be a bolt. Lamp plate 17 passes through the bolt fastening on outer 21 of shell, and its screw thread of locating hole 44 inside of locating shell outer 21 is no less than two circles, and in order to make lamp plate 17 hug closely in the surface of outer 21 of shell, the degree of depth of locating hole 44 is greater than the thickness of shell inlayer 20 at least, can be 1.8mm for example. So set up, when through bolt fastening lamp plate 6 and shell outer 21, guarantee bolt and the inseparable laminating of lamp plate 17 to make lamp plate 17 hug closely with shell outer 21, increase the pressure of lamp plate 17 and shell outer 21's contact surface, reduce the thermal resistance, increase the roughness, improve the radiating effect.

In some embodiments, control panel assembly 13 is at least partially offset from light panel 17 in a radial direction X of second housing 12. The heat dissipation portion 33 is provided closer to the control board assembly 13 in the radial direction of the second housing 12 with respect to the lamp panel 17. Since the control board assembly 13 is assembled to the heat sink assembly 15, heat generated by the control board assembly 13 is transferred to the case inner layer 20 through the heat dissipation main board 32 and the heat dissipation portion 33 for heat conduction. Lamp plate 17 assembles in the surface of shell inlayer 20, and lamp plate 17 sets up the surface laminating with shell inlayer 20, and the heat that lamp plate 17 produced directly transmits shell inlayer 20 rather than the contact, mainly through the surface heat dissipation of shell inlayer 20. So set up, effectively utilize the double-colored inner space of moulding plastics shell 19, its different sides that utilize shell inlayer 20 dispel the heat, need not increase extra radiator unit, under the circumstances of guaranteeing the radiating effect, can reduce cost, promote the economic benefits of product.

In some embodiments, lamp panel 17 is provided with lamp beads 46, and lamp beads 46 are symmetrically arranged in the length direction and/or the width direction of lamp panel 17. In some embodiments, the lamp beads 46 are symmetrically arranged in the length direction of the lamp panel 17. In other embodiments, the lamp beads 46 are symmetrically arranged in the width direction of the lamp panel 17. In this embodiment, the lamp beads 46 are symmetrically arranged in the length direction and the width direction of the lamp panel 17. With such arrangement, on one hand, the appearance requirement of the lamp panel 17 is met; on the other hand, the circuit connected with the lamp bead 46 is convenient to run, the process requirement is reduced, and therefore the cost is reduced.

In some embodiments, the width maximum dimension W of lamp panel 17 is at least 3 times the maximum dimension W1 of lamp bead 46. In some embodiments, length maximum dimension L10 of light panel 17 is at least 3 times the maximum width dimension W of light panel 17.

In this embodiment, the lamp panel 17 may be made of FR4 material or FR4 material with a thermal conductivity λ, and the convection heat dissipation performance is determined by the convection heat transfer coefficient h. The convective heat transfer coefficient h of lamp panel 17 is obtained by the following formula (6). The specific calculation process is as follows:

where W represents the width of lamp panel 17. From above formula (6), for the maximize promotes heat dispersion, increases convection heat transfer coefficient h, need reduce the width W of lamp plate 17. Limited by the requirement of actual safety margin, the width W of the lamp beads 46 which are expanded by 1 time is required to be minimum. For example, the width of lamp panel 17 is 12mm, and the total length of lamp panel 17 is 3 times the width of 36 mm. The design can be specifically designed according to actual needs, and is not limited in the application.

In the above scheme, camera 1 has satisfied the temperature rise requirement of product through the optimal design of heat dissipation scheme, and its radiating effect is equivalent with the metal material shell, compares with the shell of die casting, has reduced product cost effectively, has better economic benefits, promotes camera market competition.

The present application also provides a camera 1 comprising a shell inner layer 20 having a thermally conductive plastic material, a shell outer layer 21 having a plastic material, a heat sink assembly 15, and a lens assembly 14. Wherein, the shell outer layer 21 covers the shell inner layer 20 to form a containing cavity with an opening, and the shell inner layer 20 is defined as: at the open end face, the end face of the shell outer layer 21 is higher than the end face of the shell inner layer 20. The heat dissipation assembly 15 includes a heat dissipation main plate 32 and a heat dissipation portion 33 extending along the heat dissipation main plate 32; the lens assembly 14 is supported by the heat dissipation main board 32 of the heat dissipation assembly 15, and both the lens assembly 14 and the heat dissipation assembly 15 are disposed in the accommodating cavity, so that the heat dissipation portion 33 of the heat dissipation assembly 15 forms a surface contact with the inner surface of the housing inner layer 20, and heat generated by the lens assembly 14 flows through the heat dissipation main board 32, the heat dissipation portion 33, the housing inner layer 20 and the housing outer layer 21 in sequence.

In some embodiments, the extending direction of the heat dissipating portion 33 is the same as the optical axis direction of the lens assembly 14, and the extending direction of the heat dissipating portion 33 is away from the opening of the accommodating cavity. In some embodiments, a first thermal conductive member 38 is filled between the lens assembly 14 and the heat dissipating motherboard 32, the first thermal conductive member 38 being defined as: the first thermal conductive member 38 is compressed by the clamping force created by the lens assembly 14 and the heat sink main plate 32. In some embodiments, the heat sink portion 33 and the inner surface of the case inner layer 20 are filled with a second heat conductive member 39, a second heat conductive group being defined as: the second heat-conductive member 39 is compressed by the clamping force of the heat-radiating portion 33 and the inner surface of the case inner 20, and the compression rate of the second heat-conductive member 39 is not less than that of the first heat-conductive member 38.

The application also provides a camera 1, including shell inlayer 20 that has heat-conducting plastic material, shell outer 21 and lamp plate 17 that have plastic material. Wherein, the shell outer layer 21 covers the shell inner layer 20 to form a containing cavity with an opening. And light filling through holes with adaptive shapes are formed in one sides of the shell inner layer 20 and the shell outer layer 21, which are far away from the opening. Lamp panel 17 sets up and establishes the light filling through hole in accommodating the intracavity and covering to make the heat that lamp panel 17 produced flow through shell inlayer 20 and shell skin 21 in proper order. The size of lamp panel 17 is defined to satisfy: the width of lamp plate 17 is not less than 3 times the width of the lamp beads arranged on lamp plate 17, and the length of lamp plate 17 is not less than 3 times the width of lamp plate 17.

The present application further provides a camera 1, including shell subassembly, electron device and radiator unit 15, the shell subassembly is including accepting the shell skin 21 of chamber 18, plastic material and the shell inlayer 20 of heat conduction plastic material, and shell skin 21 is located the outside of shell inlayer 20, and shell inlayer 20 and shell skin 21 pass through connection structure and keep relatively fixed. The heat dissipation assembly 15 and the electronic device are accommodated in the accommodating cavity 18, and the heat dissipation assembly 15 is in thermal communication with the electronic device and the shell inner layer 20 and is used for transferring heat generated by the electronic device to the shell inner layer 20.

In some embodiments, the connecting structure comprises a shape-fitting recess and a protrusion, one of the shell inner layer 20 and the shell outer layer 21 is provided with a recess, and the other is provided with a protrusion, and the protrusion is provided in the recess. In some embodiments, the housing assembly has a central axis and the connection structures are provided in sets, the sets being disposed at intervals around the central axis between the housing inner layer 20 and the housing outer layer 21. In some embodiments, the inner surface of the shell outer layer 21 is formed with inner abrupt surfaces having different radial dimensions along the direction of the central axis, the outer surface of the shell inner layer 20 is formed with outer abrupt surfaces having different radial dimensions, one of the concave portion and the convex portion is provided on the inner abrupt surface, and the other is provided on the outer abrupt surface. In some embodiments, the recess is provided as a U-shaped groove and the projection is provided as a U-shaped projection, the opening of the U-shaped groove facing the front end of the lens assembly 14.

In some embodiments, the end of the heat sink assembly 15 contacting the second heat conducting member 39 forms a plurality of branch plates spaced apart from each other and arranged side by side, and the shape of the branch plates matches with the shape of the inner shell 20. In some embodiments, the outer shell 21 includes a fixing post for fixing the inner component, and the inner shell 20 includes a reinforcing surrounding wall, which covers or partially covers the outside of the fixing post. In some embodiments, the case outer layer 21 is integrally molded with the case outer layer 21 by two-shot molding.

In some embodiments, the housing assembly includes a first housing 11 and a second housing 12 that are separately disposed, the second housing 12 is provided with a window 28 that faces the lens assembly 14, and the electronics are disposed within the second housing 12, and the housing inner layer 20 is attached to an inner surface of the second housing 12. In some embodiments, the outer surface of the shell inner layer 20 conforms to the shape of the inner surface of the second outer shell 12 and conforms to each other. In some embodiments, the second outer shell 12 includes an engagement surface for sealing engagement with the first outer shell 11, and an end of the shell inner 20 adjacent to the first outer shell 11 is provided with a height difference from the engagement surface to form a gap for receiving a sealing member 22 for sealing the second outer shell 12 with the first outer shell 11. The electronic device may be the control board assembly and the lens assembly described above with respect to the embodiments of fig. 1-25.

The present application also provides a housing assembly of a camera 1 comprising a housing inner layer 20 of a thermally conductive plastic material, a second housing 12 of a plastic material. Wherein, the second housing 12 covers the housing inner layer 20 to form a second receiving cavity 31 with an opening, and the housing inner layer 20 is defined as: at the end face of the open end, the end face of the second outer shell 12 is higher than the end face of the shell inner layer 20. The inner surface of the second outer case 12 is provided with a first connection structure, and the outer surface of the case inner 20 is provided with a second connection structure, which the first connection structure receives, so that the outer surface of the case inner 20 and the inner surface of the second outer case 12 constitute a thermal conduction path.

In some embodiments, one of the first and second connecting structures is provided with a recess and the other is provided with a projection that fits into the recess, the recess receiving the projection. In some embodiments, the first connecting structure is a projection and the second connecting structure is a recess, the recess receiving the projection.

In some embodiments, the housing inner layer 20 is injection molded in one piece with the second outer housing 12. In some embodiments, the difference in height between the end face of the second outer shell 12 and the end face of the shell inner layer 20 is greater than 3 mm. In some embodiments, the depth height W of the shell inner layer 20 is defined to satisfy: the depth height is inversely related to the convective heat transfer coefficient of the housing assembly of the camera 1.

In some embodiments, the depth height W of the shell inner layer 20 is defined to satisfy:

wherein h is the convective heat transfer coefficient; g is the acceleration of gravity; alpha is alpha_VIs the coefficient of bulk expansion; v is the dynamic viscosity coefficient; delta t is the excess temperature; α is thermal diffusivity.

In some embodiments, the housing assembly further comprises the first housing 11, the end face of the second housing 12 being provided with a step 23, the step 23 being used to place a seal 22 to bring the second housing 12 into sealing engagement with the first housing 11.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A camera, comprising: the lens module comprises a first shell, a second shell, a control board assembly and a lens assembly, wherein the first shell and the second shell are assembled to form an accommodating cavity, the second shell is provided with a window, the control board assembly and the lens assembly are both assembled in the accommodating cavity and positioned in the second shell, and the lens assembly is assembled on the control board assembly and extends from the control board assembly to the window;

2. The camera of claim 1, further comprising a heat sink assembly disposed within the receiving cavity; the heat dissipation assembly is assembled with the double-shot injection molding shell and connected with the shell inner layer, and the control panel assembly is assembled with the heat dissipation assembly and conducts heat with the shell inner layer through the heat dissipation assembly.

3. The camera according to claim 2, wherein the heat dissipation assembly includes a heat dissipation main board and a heat dissipation portion connected to an edge of the heat dissipation main board, the control board assembly is assembled to the heat dissipation main board, the heat dissipation portion is bent from the edge of the heat dissipation main board to a direction close to the control board assembly, and an outer side surface of the heat dissipation portion abuts against an inner surface of the inner layer of the housing.

4. The camera of claim 3, wherein the heat-dissipating motherboard includes a first heat-dissipating surface, the control board assembly being assembled to the first heat-dissipating surface; the control board assembly comprises a circuit main board and a circuit device which is arranged on the surface of the circuit main board in a protruding mode and faces the first heat dissipation surface; the surface of the circuit device is spaced from the first heat dissipation surface.

5. The camera of claim 4, further comprising a first thermally conductive member compressively filled between the surface of the circuit device and the first heat dissipating surface; wherein the first thermally conductive member is compressed to completely cover a surface of the circuit device.

6. The camera of claim 3, further comprising a second thermally conductive member compressively filled between an outer side of the heat sink portion and an inner surface of the shell inner layer; wherein the second heat-conducting member is compressed to completely cover the outer side of the heat-dissipating portion.

7. The camera of claim 2, further comprising a lamp panel assembled to the second housing, wherein a surface of the lamp panel is attached to an inner surface of the inner housing layer.

8. The camera according to claim 7, wherein the control board assembly and the lamp board are at least partially arranged in a staggered manner in a radial direction of the second housing, the heat dissipation assembly includes a heat dissipation main board and a heat dissipation portion arranged at an edge of the heat dissipation main board and abutted against the inner layer of the housing, the heat dissipation portion is bent from the edge of the heat dissipation main board to a side of the heat dissipation main board where the control board assembly is arranged, and the heat dissipation portion is arranged closer to the control board assembly in the radial direction of the second housing relative to the lamp board; and/or

The internal surface of shell inlayer is equipped with the mounting groove, the lamp plate install in the mounting groove, just the edge of lamp plate with the clearance has between the lateral wall of mounting groove.

9. The camera of claim 2, wherein the heat sink assembly is disposed at an opening where the second housing is mated with the first housing, the heat sink assembly at least partially covering the opening.

10. The camera of claim 2 or 9, wherein the camera includes a power strip, the heat dissipation assembly includes a first heat dissipation surface and a second heat dissipation surface opposite to the first heat dissipation surface, the control board assembly is assembled to the first heat dissipation surface, the power strip is assembled to the second heat dissipation surface, the power strip is located in the first housing, and the power strip and the control board assembly are electrically connected.