CN114157780B

CN114157780B - Video camera

Info

Publication number: CN114157780B
Application number: CN202111356893.XA
Authority: CN
Inventors: 张�浩; 周斌
Original assignee: Hangzhou Hikvision Digital Technology Co Ltd
Current assignee: Hangzhou Hikvision Digital Technology Co Ltd
Priority date: 2021-11-16
Filing date: 2021-11-16
Publication date: 2024-05-28
Anticipated expiration: 2041-11-16
Also published as: CN114157780A

Abstract

The application provides a camera, which comprises a first shell, a second shell, a control panel component and a lens component. The first housing is assembled with the second housing and forms a receiving cavity. The second housing is provided with a window, and the control board assembly and the lens assembly are assembled in the accommodating cavity and are positioned in the second housing. The lens assembly is assembled on the control panel assembly and extends from the control panel assembly to the window. The second shell is a double-color injection molding shell, the double-color injection molding shell comprises a shell inner layer made of heat conduction plastic and a shell outer layer made of engineering plastic, the shell outer layer is wrapped on the outer surface of the shell inner layer, and the control panel component is in heat conduction with the shell inner layer. The second shell is arranged to be a double-color injection molding shell, and the heat dissipation requirement is met by the inner shell layer made of heat conducting plastic, so that the heat dissipation performance of the product is improved, and the service scene of the camera is enlarged.

Description

Video camera

Technical Field

The application relates to the technical field of cameras, in particular to a camera.

Background

With the increase of intelligent and multifunctional demands of cameras, the forms of the cameras are more and more, and the heating value is also more and more. The current camera products cannot meet the heat dissipation requirement, and the use of the camera is limited.

Disclosure of Invention

The application provides a camera meeting the heat dissipation requirement of a product.

The present application provides a camera, comprising: the lens assembly is assembled in the control board assembly and extends from the control board assembly to the window;

The second shell is a double-shot injection shell, the double-shot injection shell comprises a shell inner layer made of heat-conducting plastic and a shell outer layer made of engineering plastic, the shell outer layer is wrapped on the outer surface of the shell inner layer, and the control panel component is in heat conduction with the shell inner layer.

Optionally, the camera further comprises a heat dissipation component, and the heat dissipation component is arranged in the accommodating cavity; the heat dissipation assembly is assembled with the double-shot molding shell and is connected with the shell inner layer, the control panel assembly is assembled with the heat dissipation assembly, and heat conduction is conducted between the heat dissipation assembly and the shell inner layer.

Optionally, the radiating component includes the radiating main board and with radiating portion that radiating main board's edge is connected, control panel subassembly assemble in radiating main board, radiating portion follow radiating main board's edge is to being close to the direction bending type of control panel subassembly, just radiating portion's lateral surface with the internal surface butt of shell inlayer.

Optionally, the heat dissipating motherboard includes a first heat dissipating surface, and the control board assembly is assembled on the first heat dissipating surface; the control panel assembly comprises a circuit main board and a circuit device which is arranged on the surface of the circuit main board in a protruding way towards the first radiating surface; a distance is arranged between the surface of the circuit device and the first radiating surface.

Optionally, the camera further includes a first heat conductive member compressively filled between the surface of the circuit device and the first heat dissipating surface; wherein the first heat conductive member is compressed to completely cover the surface of the circuit device.

Optionally, the camera further includes a second heat conductive member compressively filled between an outer side surface of the heat dissipation portion and an inner surface of the case inner layer; the second heat conduction piece is compressed and then completely covers the outer side face of the heat dissipation part.

Optionally, the camera further includes a light plate, the light plate is assembled to the second housing, and a surface of the light plate is attached to an inner surface of the inner layer of the housing.

Optionally, the control panel subassembly with the lamp plate is in at least part stagger setting in the radial direction of second shell, the radiating subassembly includes the heat dissipation mainboard and locates the edge of heat dissipation mainboard and with the radiating portion of shell inlayer butt, radiating portion follow the edge of heat dissipation mainboard, to the heat dissipation mainboard sets up one side of control panel subassembly is buckled, radiating portion for the lamp plate is in the radial direction of second shell is closer to the setting of control panel subassembly.

Optionally, the inner surface of the shell inner layer is provided with a mounting groove, the lamp panel is mounted in the mounting groove, and a gap is formed between the edge of the lamp panel and the side wall of the mounting groove.

Optionally, the heat dissipation assembly is disposed at an opening where the second housing and the first housing are in butt joint, and the heat dissipation assembly at least partially covers the opening.

Optionally, the camera includes the power strip, the heat dissipation subassembly includes relative first cooling surface and second cooling surface, control panel subassembly equipment in first cooling surface, the power strip assemble in the second cooling surface, just the power strip is located in the first shell, the power strip with the control panel subassembly electricity is connected.

According to the camera provided by the embodiment of the application, the second housing is arranged as the double-color injection molding housing, and the inner layer of the housing made of the heat conducting plastic meets the heat dissipation requirement, so that the heat dissipation performance of a product is improved, and the service scene of the camera is enlarged.

Drawings

Fig. 1 is a schematic structural view of an embodiment of the video camera of the present application.

Fig. 2 is a schematic top view of the camera of fig. 1.

Fig. 3 shows an exploded view of the camera shown in fig. 1.

Fig. 4 is a schematic cross-sectional view of the camera of fig. 1.

Fig. 5 is a schematic diagram illustrating a structure of an embodiment of a double-shot molded case of the camera shown in fig. 1.

Fig. 6 is a schematic view showing a part of a structure of a double-shot molded case of the camera shown in fig. 5.

Fig. 7 is a schematic diagram showing the structure of an embodiment of the first housing of the camera shown in fig. 1.

Fig. 8 is a schematic cross-sectional view of a first housing of the camera shown in fig. 7.

Fig. 9 is a schematic diagram showing an assembled structure of a control board assembly, a lens assembly, a heat dissipation assembly, and a power board of the video camera shown in fig. 1.

Fig. 10 is a partial enlarged view of the camera A1 shown in fig. 9.

Fig. 11 is a schematic view showing a part of the structure of the video camera shown in fig. 1.

Fig. 12 is a schematic view showing a part of the structure of the video camera shown in fig. 1.

Fig. 13 is a layout enlarged view at A2 of the video camera shown in fig. 12.

Fig. 14 is a schematic top view of the control board assembly of the camera of fig. 1.

Fig. 15 is a schematic view showing a part of the structure of the video camera shown in fig. 1.

Fig. 16 is a graph showing a ratio of total heat conduction resistance of the inner layer of the case of the camera shown in fig. 1 to the heat dissipation area of the heat dissipation part.

Fig. 17 is a schematic structural diagram illustrating an assembly of the heat dissipation assembly, the first heat conduction member, and the second heat conduction member of the camera shown in fig. 1.

Fig. 18 is an exploded view showing the assembly of the heat dissipating assembly, the first heat conducting member, and the second heat conducting member of the camera shown in fig. 17.

Fig. 19 is a schematic structural view of another view of the assembly of the heat dissipation assembly, the first heat conduction member, and the second heat conduction member of the camera shown in fig. 17.

Fig. 20 is a schematic structural diagram of still another view of the assembly of the heat dissipating assembly, the first heat conducting member, and the second heat conducting member of the camera shown in fig. 17.

Fig. 21 is a schematic view showing a part of the structure of the video camera shown in fig. 1.

Fig. 22 is a schematic view showing a part of the structure of the video camera shown in fig. 1.

Fig. 23 is a schematic diagram showing the structure at A3 of the video camera shown in fig. 22.

Fig. 24 is a schematic view showing a part of the structure of the video camera shown in fig. 22.

Fig. 25 is a schematic view showing the structure of a lamp panel of the video camera shown in fig. 21.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the application. Rather, they are merely examples of apparatus and methods consistent with aspects of the application as detailed in the accompanying claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The terms "first," "second," and the like in the description and in the claims, are not used for any order, quantity, or importance, but are used for distinguishing between different elements. Likewise, the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" or "several" means at least two. Unless otherwise indicated, the terms "front," "rear," "lower," and/or "upper" and the like are merely for convenience of description and are not limited to one location or one spatial orientation. The word "comprising" or "comprises", and the like, means that elements or items appearing before "comprising" or "comprising" are encompassed by the element or item recited after "comprising" or "comprising" and equivalents thereof, and that other elements or items are not excluded. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.

The camera comprises a first shell, a second shell, a control panel component and a lens component. The first housing is assembled with the second housing and forms a receiving cavity. The second housing is provided with a window, and the control board assembly and the lens assembly are assembled in the accommodating cavity and are positioned in the second housing. The lens assembly is assembled on the control panel assembly and extends from the control panel assembly to the window. The second shell is a double-color injection molding shell, the double-color injection molding shell comprises a shell inner layer made of heat conduction plastic and a shell outer layer made of engineering plastic, the shell outer layer is wrapped on the outer surface of the shell inner layer, and the control panel component is in heat conduction with the shell inner layer.

Through the use of the double-shot molding shell, the heat dissipation requirement is met by the shell inner layer made of heat conducting plastic, and the appearance and structural mechanical property requirements are met by the shell outer layer made of engineering plastic. Therefore, the requirements of heat dissipation, appearance and structural mechanical properties of the product can be met simultaneously, and the use scene of the camera is enlarged.

The application provides a camera. The camera of the present application will be described in detail with reference to the accompanying drawings. The features of the examples and embodiments described below may be combined with each other without conflict.

Fig. 1 is a schematic diagram showing the structure of an embodiment of a video camera 1 of the present application. Fig. 2 is a schematic plan view of the video camera 1 shown in fig. 1. Fig. 3 shows an exploded view of the camera 1 shown in fig. 1. Fig. 4 shows a schematic cross-sectional view of the camera 1 shown in fig. 1. As shown in fig. 1 to 4, the camera 1 may be a different type of camera. In the present embodiment, the camera 1 may be a conch camera, and is not limited in the present application.

Specifically, the video camera 1 includes a first housing 11, a second housing 12, a control board assembly 13, a lens assembly 14, a heat dissipation assembly 15, a power board 16, and a lamp board 17. Wherein the first housing 11 is assembled with the second housing 12 and forms a receiving cavity 18. The control board assembly 13, the lens assembly 14, the heat dissipation assembly 15, the power board 16 and the lamp board 17 are all assembled in the accommodating cavity 18. The lens assembly 14 is assembled to the control board assembly 13 to be electrically connected to the control board assembly 13. The control board assembly 13 is used to drive and control the operation of the lens assembly 14. The control board assembly 13 is electrically connected with the lamp panel 17, and the control board assembly 13 is used for driving and controlling the lamp panel 17 to operate. The control board assembly 13 is electrically connected to a power board 16, and the power board 16 is used to supply power to the control board assembly 13.

Fig. 5 shows a schematic structural diagram of an exemplary embodiment of a two-shot housing 19 of the camera 1 shown in fig. 1. Fig. 6 is a schematic view showing a part of the structure of the double-shot molded case 19 of the camera 1 shown in fig. 5. As shown in fig. 5 and 6, at least one of the first housing 11 and the second housing 12 is a double-shot molded housing 19. The double-shot molded outer shell 19 comprises an inner shell layer 20 made of a thermally conductive plastic and an outer shell layer 21 made of an engineering plastic. The thermally conductive plastic and the engineering plastic are molded by a two-shot molding process such that the thermally conductive plastic and the engineering plastic are permanently bonded or adhered to each other to form a two-shot molded housing 19 of an integral structure. Because of the good heat dissipation properties of the thermally conductive plastic, the material is brittle, may not be well fixed as the shell outer layer 21, and is not smooth and unsightly. Therefore, the heat dissipation requirement and the appearance and structural mechanical performance requirements of the product are simultaneously met. The outer shell layer 21 is wrapped on the outer surface of the inner shell layer 20 by using a double-shot molding process, so that the heat-conducting plastic is fully contacted with the engineering plastic. The heat dissipation requirement of the camera 1 can be met because the heat dissipation of the heat conducting plastic is uniform. Because engineering plastics are high in rigidity, stable in mechanical performance and high in strength, convenient to fix, and the engineering plastics are smooth in surface and glossy, the appearance requirements can be met, and the use scene of the camera 1 can be enlarged. The double-shot molding process is to form an integral double-shot molded housing 19 by two separate shots of the thermally conductive plastic and the engineering plastic.

In some embodiments, the first housing 11 and the second housing 12 are both two-shot housings 19. The inner surfaces of the first housing 11 and the second housing 12 are both of a thermally conductive plastic. The accommodating cavity 18 formed in the first housing 11 and the second housing 12 may be a convection heat dissipation cavity, so that the heat dissipation area of the accommodating cavity 18 may be increased, and the heat dissipation performance of the camera 1 may be improved.

In some embodiments, one of the first housing 11 and the second housing 12 is a two-shot molded housing 19. So can locate this double-shot molding shell with camera 1 mainly produced thermal subassembly in, under the circumstances that gives attention to camera 1's heat dissipation demand, can effectively reduce product cost, promote camera 1's market competition.

In this embodiment, the second housing 12 is a two-shot molded housing 19. The outer shell 21 of the double-shot molded outer shell 19 is made of engineering plastics, so that the appearance of the camera 1 is consistent with that of a conventional camera. The inner shell layer 20 of the bicolour injection molded housing 19 is made of a thermally conductive plastic. Compared with engineering plastics, the heat conducting plastic has better heat conducting property. The heat conduction performance of the heat conduction plastic is mainly measured by the heat conduction coefficient. In some embodiments, the thermally conductive plastic may have a thermal conductivity of 1-5 w/(m.k). In some embodiments, the thermal conductivity of the thermally conductive plastic may be 1 w/(m.k) or2 w/(m.k) or 3 w/(m.k) or 4 w/(m.k) or 5 w/(m.k), with a preferred value of 3 w/(m.k). Where "K" is the absolute temperature unit, which can be replaced by a temperature of "W" means the thermal power unit and "m" means the length unit meter.

In some embodiments, the maximum thickness L1 of the shell outer layer 21 is at least 2.2mm to meet the minimum strength requirements of the second outer shell 12. In some embodiments, the maximum thickness L2 of the shell inner layer 20 does not exceed 1.8mm. The maximum thickness L2 of the shell inner layer 20 is not too large nor too small. Setting too large reduces the heat dissipation space inside the housing chamber 18, which is not conducive to heat dissipation. The setting is too small to meet the heat dissipation requirement. Therefore, the maximum thickness L2 of the shell inner layer 20 is set to be 1.8mm at maximum, and the cost can be reduced under the condition of meeting the heat dissipation requirement, so that the heat dissipation device has good economic benefit.

In some embodiments, camera 1 also includes a seal 22 (shown in fig. 3). The upper edge of the shell inner layer 20 is lower than the upper edge of the shell outer layer 21, forming a step 23 (shown in fig. 6). The sealing member 22 is assembled to the step 23, and the sealing member 22 is used to seal the gap between the first housing 11 and the second housing 12. The upper edge of the inner shell layer 20 is lower than the upper edge of the outer shell layer 21, so that the production is facilitated, the step 23 is formed, the sealing piece 22 is conveniently assembled between the first shell 11 and the second shell 12, the sealing performance in the accommodating cavity 18 is ensured, and the sealing performance of the whole camera 1 can be improved. In some embodiments, the seal 22 may be a seal ring. The sealing ring has good elasticity and rebound resilience, good sealing performance and lower cost.

In some embodiments, the height of the shell inner layer 20 may be in the range of 1mm-5mm with respect to the height of the shell outer layer 21 by a dimension L3. In some embodiments, the dimension L3 of the height reduction of the shell inner layer 20 compared to the height of the shell outer layer 21 may be 1mm or 2mm or 3mm or 4mm or 5mm, with a preferred value of 3mm. The dimensions of the seal 22 are adapted to the height reduction dimension L3. When the seal 22 is assembled to the second housing 12, the upper edge of the seal 22 is slightly higher than the upper edge of the housing outer layer 21. When the first housing 11 and the second housing 12 are assembled, the sealing member 22 is compressed, and the sealing member 22 is in interference fit with the first housing 11, so that better sealing performance between the first housing 11 and the second housing 12 is ensured.

In some embodiments, the thermally conductive plastic utilizes a thermally conductive filler to uniformly fill the polymeric matrix material to enhance its thermal conductivity. Compared with common plastics, the plastic material has obviously improved heat conducting performance. In some embodiments, the engineering plastic may be polycarbonate. The present application is not limited thereto.

Fig. 7 is a schematic diagram showing the structure of an embodiment of the first housing 11 of the video camera 1 shown in fig. 1. Fig. 8 is a schematic cross-sectional view of the first housing 11 of the camera 1 shown in fig. 7. As shown in fig. 7 and 8, the material of the first housing 11 is engineering plastic. The engineering plastic may be polycarbonate. The shape of which is similar to the shape of the housing of a conventional camera. In the present embodiment, the first housing 11 and the second housing 12 are each of a spherical structure. The first housing 11 is adapted to the second housing 12. Through the cooperation of the first shell 11 made of engineering plastics and the second shell 12 made of double-shot molding technology, the product cost is effectively reduced and the market competitiveness of the camera 1 is improved under the condition of considering the heat dissipation requirement of the camera 1.

By providing the second housing 12 as a two-shot molded housing 19. The heat generated in the first housing 11 and the second housing 12 is mostly dissipated by the inner layer 20 of the double-molded housing 19. A convection heat dissipation chamber is formed in the housing chamber 18 between the inner surface of the first housing 11 and the inner surface of the inner shell layer 20 of the double-molded housing 19. A part of the heat is radiated to the inner wall of the first housing 11 by convection and then transferred to the outer wall of the first housing 11 by heat conduction of the first housing 11. Therefore, the flatness of the first housing 11 also affects the heat transfer. Therefore, the flatness of the first housing 11 is set to 0.1mm at the maximum, so that the inner wall of the first housing 11 is flattened, the contact thermal resistance with the housing inner layer 20 of the second housing 12 is reduced, and the heat transfer to the first housing 11 is facilitated.

In some embodiments, the maximum thickness L11 of the first housing 11 is at least 2mm. The maximum thickness of the first housing 11 is obtained by the calculation formula (1) of the heat conduction and heat exchange resistance of the first housing 11. For example, in the case where the size of the first housing 11 is not changed, the heat conduction thermal resistance of the first housing 11 is calculated as follows:

it follows that the thermal resistance R is positively correlated with the wall thickness d1 of the first housing 11. In order to reduce the thermal resistance R, the maximum thickness of the first housing 11 is set to at least 2mm under the condition that the structural strength performance and the hardness performance are satisfied, so that the hardness and the rigidity requirements of the first housing 11 can be ensured, and the first housing can be prevented from falling.

In the embodiment shown in fig. 1 to 8, the camera 1 further comprises a fixing member 24, the edge of the first housing 11 facing the second housing 12 being provided with a first fixing hole 25. The edge of the second housing 12 facing the first housing 11 is provided with a second fixing hole 26. The first housing 11 is assembled and fixed with the second housing 12 by passing the fixing member 24 through the first fixing hole 25 and the second fixing hole 26 in sequence (as shown in fig. 1 and 2). In some embodiments, the fasteners 24 may be bolts. Simple structure, low cost, stability and reliability. In some embodiments, the fixing member 24, the first fixing hole 25 and the second fixing hole 26 may be provided in plurality, and the positions thereof are provided corresponding to the number. The present application is not limited thereto.

In some embodiments, the top of the first housing 11 is provided with perforations 27 (as shown in fig. 2, 7 and 8). The through hole 27 is used for penetrating an external power line or control line (not shown) to electrically connect the power board 16 and the control board assembly 13 disposed in the housing cavity 18. In some embodiments, the second housing 12 is provided with a window 28, and the lens assembly 14 is assembled to the control board assembly 13 and extends from the control board assembly 13 to the window 28. The lens assembly 14 captures an external image through the viewing window 28. The window 28 may also be provided with glass for protecting the lens assembly 14.

Fig. 9 is a schematic diagram showing an assembled structure of the control board assembly 13, the lens assembly 14, the heat dissipation assembly 15, and the power board 16 of the video camera 1 shown in fig. 1. Fig. 10 is a partial enlarged view of the camera 1 A1 shown in fig. 9. As shown in fig. 3, 4, 9 and 10, the power board 16 and the control board assembly 13 are both provided to the heat dissipation assembly 15. In the present embodiment, the power board 16 and the control board assembly 13 are respectively disposed on two sides of the heat dissipation assembly 15. Wherein the power board 16 is located in the first housing 11, and the control board assembly 13 and the lens assembly 14 are both located in the second housing 12.

In some embodiments, the heat dissipating assembly 15 is disposed at an opening 29 where the second housing 12 interfaces with the first housing 11, and the heat dissipating assembly 15 at least partially covers the opening 29 (as shown in fig. 4). In the axial direction Y of the second housing 12, the size of the opening 29 where the first housing 11 and the second housing 12 are butted is the largest, the heat dissipation assembly 15 is assembled at the opening 29, and the maximum heat dissipation surface of the heat dissipation assembly 15 is ensured, so that the maximum contact area between the power panel 16 and the control panel assembly 13 and the heat dissipation assembly 15 is ensured, and the heat dissipation effect of the power panel 16 and the control panel assembly 13 is improved. After the heat dissipation assembly 15 is assembled to the second housing 12, the housing chamber 18 is partitioned into a first housing chamber 30 and a second housing chamber 31. The heat dissipation assembly 15 and the first housing 11 enclose a first accommodating cavity 30, and the power board 16 is disposed in the first accommodating cavity 30. The power panel 16 radiates heat through the convection heat radiation space formed by the heat radiation component 15 and the inner wall of the first housing 11. The heat dissipation assembly 15 and the second housing 12 enclose a second accommodating cavity 31, and the control board assembly 13 and the lens assembly 14 are disposed in the second accommodating cavity 31. The control board assembly 13 and the lens assembly 14 radiate heat through a convection heat radiation space formed by the heat radiation assembly 15 and the inner wall of the second housing 12.

For the entire video camera 1, the control board assembly 13, the lens assembly 14, and the power board 16 all generate heat, which is mainly generated by the control board assembly 13 and the lens assembly 14. Thus, the second housing 12 is provided as a two-shot housing. The heat sink assembly 15 is assembled with the two-shot molded outer shell 19 and is connected to the inner shell 20. The power board 16 and the control board assembly 13 are both connected to the case inside layer 20 and conduct heat through the case inside layer 20. The control board assembly 13 is assembled to the heat dissipation assembly 15, and is thermally conductive to the inner shell layer 20 through the heat dissipation assembly 15. The heat generated by the control board assembly 13 and the lens assembly 14 is transferred to the case inner layer 20 through the heat dissipation assembly 15, which is thermally conducted by the thermally conductive plastic of the case inner layer 20. The power panel 16 is assembled to the heat dissipation assembly 15, and may also be connected to the inner shell layer 20 through the heat dissipation assembly 15. The heat in the first accommodating cavity 30 is transferred, so that the heat dissipation performance of the camera 1 can be improved, and the service life of the camera 1 can be prolonged. Under this application scenario, the first housing 11 may not need to be improved, and under the circumstance of considering the heat dissipation requirement of the camera 1, the product cost is effectively reduced, and the market competitiveness of the camera 1 is improved.

Fig. 11 is a schematic view showing a part of the structure of the video camera 1 shown in fig. 1. Fig. 12 is a schematic view showing a part of the structure of the video camera 1 shown in fig. 1. Fig. 13 is a layout enlarged view at A2 of the video camera 1 shown in fig. 12. Fig. 14 is a schematic top view of the control board assembly 13 of the video camera 1 shown in fig. 1. Fig. 15 is a schematic view showing a part of the structure of the video camera 1 shown in fig. 1. Fig. 16 is a diagram showing a ratio of the total heat conduction resistance of the case inner layer 20 of the camera 1 shown in fig. 1 to the heat dissipation area of the heat dissipation portion 33. Fig. 17 is a schematic diagram showing an assembled structure of the heat dissipating assembly 15, the first heat conducting member 38, and the second heat conducting member 39 of the camera 1 shown in fig. 1. Fig. 18 is an exploded view showing the assembly of the heat dissipation assembly 15, the first heat conduction member 38, and the second heat conduction member 39 of the camera 1 shown in fig. 17. Fig. 19 is a schematic structural view of the camera 1 shown in fig. 17 from another view angle, in which the heat dissipating assembly 15, the first heat conducting member 38, and the second heat conducting member 39 are assembled. Fig. 20 is a schematic structural diagram of still another view of the assembly of the heat dissipating assembly 15, the first heat conducting member 38, and the second heat conducting member 39 of the camera 1 shown in fig. 17.

As shown in connection with fig. 9 to 20, the heat dissipating assembly 15 includes a heat dissipating main board 32 and a heat dissipating part 33 connected to an edge of the heat dissipating main board 32. The heat dissipation portion 33 is provided at an edge of the heat dissipation main plate 32 and abuts against the case inner layer 20. In some embodiments, the control board assembly 13 is assembled to the heat dissipating motherboard 32. The heat dissipation portion 33 is bent from the edge of the heat dissipation main plate 32 in a direction approaching the control board assembly 13, and the outer side surface of the heat dissipation portion 33 is abutted against the inner surface of the case inner layer 20. Because the heat dissipating main board 32 has a larger area, the control board assembly 13 mainly dissipates heat by the heat dissipating main board 32, and transfers part of the heat to the inner shell layer 20 through the heat dissipating part 33 provided at the edge thereof, and dissipates heat by the heat conducting plastic of the inner shell layer 20. The heat dissipation assembly 15 is connected with the inner shell layer 20, and heat dissipation is performed by using the heat dissipation assembly 15 and the inner shell layer 20, so that the heat dissipation performance of the camera 1 can be enhanced.

In some embodiments, the heat dissipating motherboard 32 includes a first heat dissipating surface 34 and a second heat dissipating surface 35 disposed opposite each other. The first heat dissipating surface 34 faces the control board assembly 13 and is spaced from the control board assembly 13, so that a heat dissipating space is formed between the control board assembly 13 and the first heat dissipating surface 34. In some embodiments, the second heat dissipating surface 35 faces the power panel 16 and is spaced apart from the power panel 16 such that a heat dissipating space is provided between the power panel 16 and the second heat dissipating surface 35.

In some embodiments, the control board assembly 13 is assembled to the first cooling surface 34. The control board assembly 13 includes a circuit board 36 and a circuit device 37 protruding from the surface of the circuit board 36 toward the first heat dissipating surface 34. There is a distance between the surface of the circuit device 37 and the first heat dissipating surface 34. The distance may be a safe distance. The distance L4 between the surface of the circuit device 37 and the first heat radiation surface 34 is in the range of not less than 0.5mm. The proper distance is set between the surface of the circuit device 37 and the first heat dissipation surface 34, so that the surface of the circuit device 37 is prevented from being contacted with the first heat dissipation surface 34, the safety distance is met, and under the condition that the safety distance is met, the heat generated by the circuit device 37 can be quickly absorbed by the first heat dissipation surface 34, and the heat dissipation performance is improved.

In the present embodiment, the heat dissipation assembly 15 is disposed between the control board assembly 13 and the power board 16. The distance L5 between the heat sink assembly 15 and the control board assembly 13 may be maintained at about 3.5mm. In this embodiment, the highest height of the control board assembly 13 is set to 3mm, and the gap between the surface of the control board assembly 13 and the first heat dissipating surface 34 is set to at least 0.5mm. Thus, the gap between the first cooling surface 34 and the control board assembly 13 is set at least 3.5mm. In the present embodiment, the thickness L6 of the circuit device 37 may be 1mm. In general, the thickness L6 of the circuit device 37 is about 1mm, but is not limited thereto. The gap between the surface of the circuit device 37 and the heat sink 15 may be 2.5mm (the difference between L5 and L6 may be obtained).

In some embodiments, the camera 1 further comprises a first heat conducting member 38, the first heat conducting member 38 being compressively filled between the surface of the circuit device 37 and the first heat dissipating surface 34. Wherein, before the first heat conduction member 38 is compressed, the dimension of the first heat conduction member 38 in the axial direction Y of the second housing 12 is larger than the distance between the surface of the circuit device 37 and the first heat radiation surface 34. The axial direction Y of the second housing 12 may be the longitudinal axis direction. The surface of the circuit device 37 can be fully contacted with the first radiating surface 34 through the first heat conducting member 38, so that the contact area is increased, the thermal resistance is reduced, and the radiating effect is improved.

In some embodiments, the first thermally conductive member 38 partially covers the surface of the circuit device 37 (as shown in fig. 14) before the first thermally conductive member 38 is compressed. After the first heat conductive member 38 is compressed, the first heat conductive member 38 completely covers the surface of the circuit device 37. Since the volume of the first heat conducting member 38 before and after compression is not changed, the cross-sectional area of the first heat conducting member 38 is set smaller than the surface of the circuit device 37, and the waste of the first heat conducting member 38 is not caused and the cost is reduced under the condition that the first heat conducting member 38 can completely cover the surface of the circuit device 37 after the first heat conducting member 38 is compressed.

In some embodiments, a thermally conductive interface material is filled between the surface of the circuit device 37 and the first heat dissipating surface 34, and the thermally conductive interface material is compressed to completely cover the surface of the circuit device 37. The thermal interface material is filled, and the thickness of the thermal interface material can be 3mm. To ensure that the surface of the circuit device 37 is completely covered after the thermally conductive interface material is compressed, the thickness of the thermally conductive interface material is set higher than the gap between the upper surface of the circuit device 37 and the first heat dissipating surface 34, thus ensuring that the upper surface of the circuit device 37 is in sufficient contact with the thermally conductive interface material.

In the present embodiment, the circuit device 37 may be a square device. The side length L4 may be 10mm. According to the principle of mass conservation, when the heat conductive interface material is compressed and then completely covers the circuit device 37, the side length of the heat conductive interface material is calculated by the following formula (2) as compared with the side length of the circuit device 37. The specific calculation process is as follows:

In this example, the reduction k1 is 0.4mm, i.e. the side length of the thermally conductive interface material is 9.2mm. Typically, the cross-sectional area of the thermally conductive interface material before it is uncompressed is less than the cross-sectional area of the circuit device 37. By the arrangement, the waste of heat conduction interface materials is avoided and the cost is reduced under the condition that the surface of the circuit device 37 is completely covered. In other embodiments, the quantized volumetric ratio calculation may also be utilized, without limitation in this scenario.

In some embodiments, the thermally conductive interface material may be silicone rubber. In some embodiments, the compression ratio of the thermally conductive interface material ranges from 10% to 30%. The compression ratio is too large and is also poor, and according to thermal stress analysis, the compression ratio of the heat conduction interface material is too large and is easily subjected to too large thermal stress, so that the circuit device 37 and the heat dissipation main board 32 which are arranged up and down are deformed. Therefore, the compressibility of the thermal interface material is set appropriately, so that the contact area between the surface of the circuit device 37 and the first heat dissipation surface 34 is effectively increased, the contact thermal resistance is reduced, and the heat dissipation performance is optimized.

In some embodiments, the first thermally conductive member 38 may be silicone rubber. The silicone rubber has stable performance. In some embodiments, the compression ratio of the first thermally conductive member 38 ranges from 10% to 30%. The material of the first heat conducting member 38 may be the above heat conducting interface material, and specific setting parameters, setting positions and functions thereof may be referred to above, and will not be described herein.

In some embodiments, the camera 1 further includes a second heat conducting member 39, and the second heat conducting member 39 is compressively filled between the outer side surface of the heat dissipating part 33 and the inner surface of the case inner layer 20 (as shown in fig. 12). Wherein, before the second heat conduction member 39 is compressed, the dimension of the second heat conduction member 39 in the radial direction X of the second housing 12 is larger than the gap between the outer side surface of the heat radiation portion 33 and the inner side surface of the second housing 12 in the radial direction of the second housing 12. The radial direction X of the second housing 12 may be in the transverse direction. By this arrangement, the outer side surface of the heat radiating portion 33 can be sufficiently contacted with the inner side surface of the second housing 12 via the second heat conductive member 39, thereby increasing the contact area, reducing the thermal resistance, and improving the heat radiating effect.

In some embodiments, the second heat conducting member 39 partially covers the outer side wall of the heat dissipating portion 33 before the second heat conducting member 39 is compressed. After the second heat conducting member 39 is compressed, the second heat conducting member 39 completely covers the outer side wall of the heat dissipating portion 33. Since the volume of the second heat conducting member 39 before and after compression is not changed, the cross-sectional area of the second heat conducting member 39 is smaller than the cross-sectional area of the outer side surface of the heat dissipation portion 33, and the second heat conducting member 39 is compressed, so that the outer side surface of the heat dissipation portion 33 can be completely covered by the second heat conducting member 39, waste of the second heat conducting member 39 is avoided, and the cost is reduced.

In some embodiments, a thermal interface material is filled between the outer side of the heat sink 33 and the inner side of the second housing 12, and the thermal interface material is compressed to completely cover the outer side of the heat sink 33. For example, the thermally conductive interface material may be 25mm in length and 12mm in width. In order to reduce the thermal conductivity, a distance L7 between the outer side surface of the heat sink 33 and the inner side surface of the second housing 12 is set to 1mm, and a thickness L8 of the thermal conductivity interface material filled therebetween may be set to 1.2mm. The compressibility of the heat conduction interface material can be 20%, so that sufficient contact is ensured, and the contact thermal resistance is reduced. When assembling the heat sink assembly 15, the heat-conductive interface material is first disposed on the outer side surface of the heat sink 33, and then the heat sink 33 is assembled on the inner side surface of the second housing 12 together with the heat-conductive interface material on the outer side surface thereof. So set up, guarantee not easy dislocation when the equipment takes place, guarantee the lateral surface of radiating portion 33 and the medial surface of second shell 12 fully contact, and closely laminate to reduce thermal resistance, improve the radiating effect.

In some embodiments, the material of the second heat conductive member 39 may be silicone rubber. The silicone rubber has stable performance. In some embodiments, the second thermally conductive member 39 has a compressibility in the range of 10% to 30%, with a preferred value of 20%. The material of the second heat conducting element 39 may be the above heat conducting interface material, and specific setting parameters, setting positions and functions thereof may be referred to above, and will not be described herein.

In some embodiments, the power board 16 includes a power motherboard 40 and a power device 41 (as shown in fig. 9) protruding from a surface of the power motherboard 40 toward the second heat dissipation surface 35. There is a distance between the surface of the power supply device 41 and the second heat radiating surface 35. The distance may be a safe distance. The proper distance is set between the surface of the power device 41 and the second heat dissipation surface 35, so that the contact between the surface of the power device 41 and the second heat dissipation surface 35 can be prevented, the safety distance is met, and under the condition that the safety distance is met, the heat generated by the power device 41 can be quickly absorbed by the second heat dissipation surface 35, and the heat dissipation performance is improved.

In some embodiments, the power board 16 further includes other power devices 47 protruding from the second heat dissipating surface 35 and disposed on the power motherboard 40, the other power devices 47 are disposed in the first housing 11, heat generated by the power board 16 is dissipated into the internal air of the camera 1 through convection, the heat in the internal air is transferred to the first housing 11 and the second housing 12 through convection, the ratio between the two is adjusted according to the design requirement, and the second housing 12 dissipates the heat into the environment through convection of the environment, so as to achieve the purpose of removing the heat generated inside the camera 1. The other power supply devices 47 have a larger volume than the power supply device 41, and the other power supply devices 47 having a larger volume are provided in the first housing 11, so that the heat dissipation space inside the first housing 11 is effectively utilized for heat dissipation. The smaller power device 41 is arranged on the side close to the second radiating surface 35, so that the heat is effectively absorbed by the heat dissipating main board 32. On the one hand, the space layout is effectively utilized, so that the layout of the power supply main board 40 is more compact; on the other hand, the power devices on the upper side and the lower side of the power main board 40 can quickly dissipate heat, and the heat dissipation effect is improved.

In the present embodiment, the power board 16 uses convection heat dissipation between the heat dissipation main board 32 and the first housing 11. The distance L9 between the second heat dissipating surface 35 and the surface of the power main board 40 is greater than the distance between the surface of the power device 41 and the second heat dissipating surface 35 (as shown in fig. 9) in order to increase the strength of convective heat transfer. The distance between the surface of the power device 41 and the second heat radiating surface 35 thereof is obtained by the following formula (3). The specific calculation process is as follows:

In this embodiment, δ may be 7.1mm, rounded up to a setting of L9 of 7.5mm, thus ensuring that the gap is greater than the boundary layer thickness.

In some embodiments, the inner surface of the shell inner layer 20 is a cooling surface of the second outer shell 12. The outer side surface of the heat dissipation portion 33 is a heat dissipation surface of the heat dissipation portion 33, and the area ratio of the inner surface of the case inner layer 20 to the outer side surface of the heat dissipation portion 33 is not less than 1:3. as shown in fig. 15 and 16, the heat dissipation area of the second housing 12 is divided into three parts, and the area between 121-122 mainly dissipates the heat of the lamp panel 17, and the areas 121-123 and 122-123 mainly dissipate the heat of the control board assembly 13 that is led out through the heat dissipation assembly 15. Taking the area 121-123 As an example, the surface area of the second housing 12 in this area may be 900mm ², and the contact area As of the inner surface of the second housing 12 with the second heat conductive member 39 is determined by the total heat conduction resistance in the area 121-123. The total heat conduction resistance consists of the following two parts:

Ra=rc (thermal resistance of normal phase) +rsp (thermal resistance of diffusion)

The diffusion thermal resistance is a thermal conduction thermal resistance generated by the non-consistency of the heat source surface and the heat radiating surface, so that the temperature of the heat radiating surface is unevenly distributed, the temperature of the heat source surface is high, and the temperature of the periphery is low.

Wherein the normal thermal conduction resistance is obtained by the following formula (4). The specific calculation process is as follows:

Rc＝D/(k*Ap) (4)

wherein the diffusion thermal resistance is obtained by the following formula (5). The specific calculation process is as follows:

Wherein the method comprises the steps of K is the thermal conductivity of the second housing 12, i.e. the thermal conductivity of the thermally conductive plastic is 3 w/(m.k), D is the thickness of the second housing 12, i.e. 1.8mm, and the contact area As is the heat dissipating surface area of the 121-123 area, i.e. 900mm ². In order to improve the heat dissipation performance, the cost performance of the total heat conduction resistance Ra needs to be better, and As can be seen from the change curve of the total heat conduction resistance along with the contact area, the larger the contact area As is, the lower the total heat conduction resistance Ra is, and when the contact area As reaches 300mm ², the reduction amplitude of the total heat conduction resistance Ra along with the increase of the contact area As is smaller, so that the contact area As is comprehensively considered to be 300mm ². As shown in FIG. 16, the abscissa of the curve of the total thermal resistance of heat conduction As a function of contact area is the contact area As in mm ². The ordinate is the total thermal resistance Ra in w/(m.k). After the contact area As is 300mm ², the total thermal resistance Ra of the heat conduction decreases more slowly. Therefore, in order to ensure that the material is not wasted, the contact area As is 300mm ², so that the above parameters can achieve the effect of faster heat dissipation under the condition of not wasting the material. The aspect ratio of the thermally conductive interface material corresponds to the area surface of the second housing 12 in the area 121-123. But is not limited thereto.

As shown in fig. 11 to 13 and 17 to 20, the inner surface of the case inner layer 20 has a cambered surface. The outer side of the heat dissipation portion 33 is a cambered surface. The outer surface of the heat sink 33 is bonded to the inner surface of the case inner layer 20. And the second heat conducting piece 39 is filled between the outer side surface of the heat dissipating part 33 and the inner surface of the inner shell layer 20, so that the outer side surface of the heat dissipating part 33 is in full contact with the inner surface of the inner shell layer 20, and therefore, the heat conducted by the heat dissipating main board 32 can be mostly conducted to the inner shell layer 20 through the heat dissipating part 33, and the heat conducting plastic of the inner shell layer 20 is utilized for conducting heat dissipation, so that the heat dissipating performance of the camera 1 is improved.

In some embodiments, the heat dissipating motherboard 32 is integrally formed with the heat dissipating portion 33. The integrated into one piece, heat conduction is faster, simple structure, equipment is convenient. In some embodiments, the heat sink 33 is claw-shaped. The heat dissipation portion 33 is formed in a claw shape because it is not bent over the entire surface. In order to ensure the heat radiation effect, the number of claws is set to 4 in the present embodiment, but may be set to other numbers. But too much should not be provided nor too little should be provided. Because the claw-shaped heat dissipation portion 33 is too thin to achieve the heat dissipation effect, too thick and not good to bend. Therefore, the device can be set according to actual requirements, and is not limited in the application.

The claw-like heat sink 33 is provided with the above-mentioned heat conductive interface material before the heat sink member 15 is mounted, so that tight bonding between the outer side surface of the heat sink 33 and the inner surface of the second housing 12 is ensured. The arrangement is convenient to install and is not easy to misplace. The length and width of the heat dissipation portion 33 are not too large, too small, and waste is not easy to occur, and the heat dissipation effect cannot be achieved too small, which can be referred to the calculation result. And will not be described in detail herein. In some embodiments, the heat dissipation assembly 15 is made of aluminum alloy. The model number can be AL5052.AL5052 has good forming processability and heat conduction property.

Fig. 21 is a schematic view showing a part of the structure of the video camera 1 shown in fig. 1. Fig. 22 is a schematic diagram showing a partial structure of the video camera 1 shown in fig. 1. Fig. 23 is a schematic diagram showing the structure at A3 of the video camera 1 shown in fig. 22. Fig. 24 is a schematic view showing a part of the structure of the video camera 1 shown in fig. 22. Fig. 25 is a schematic diagram showing the structure of the lamp panel 17 of the video camera 1 shown in fig. 21. The lamp panel 17 is assembled to the second housing 12. In this embodiment, the lamp panel 17 is assembled to the inner surface of the case inner layer 20. The surface of the lamp panel 17 is adhered to the inner surface of the case inner layer 20. The lamp panel 17 mainly radiates heat through the surface of the inner shell layer 20.

In some embodiments, the camera further includes a positioning member 42. The lamp panel 17 is provided with a through hole 43 matched with the positioning piece 42. The inner surface of the shell inner layer 20 is provided with positioning holes 44 corresponding to the positions of the through holes 43. The lamp panel 17 is assembled on the inner surface of the shell inner layer 20 through the matching of the positioning piece 42, the through hole 43 and the positioning hole 44. The locating piece 42 is used for fixing the lamp panel 17, the fixing effect is better, more surface contact between the surface of the lamp panel 17 and the surface of the shell inner layer 20 is guaranteed, and the heat dissipation effect is improved.

In some embodiments, the bottom wall of the second housing 12 is provided with a mounting groove 45, and the positioning hole 44 is provided at the bottom of the mounting groove 45. The lamp panel 17 is assembled in the mounting groove 45, and the surface of the lamp panel 17 is attached to the bottom of the mounting groove 45. The mounting groove 45 is provided with positioning holes 44 corresponding to the positions of the through holes 43. The lamp panel 17 is assembled in the mounting groove 45 through the matching of the positioning piece 42, the through hole 43 and the positioning hole 44. The inner surface of the case inner layer 20 is provided with the mounting groove 45, the lamp panel 17 is mounted in the mounting groove 45, and a gap is formed between the edge of the lamp panel 17 and the side wall of the mounting groove 45. In some embodiments, the distance between the edge of the light panel 17 and the side wall of the mounting groove 45 is no less than 0.3mm. Generally, when the lamp panel 17 is installed, a gap of 0.1mm is reserved at the edge of the lamp panel, so that the lamp panel is convenient to install; on the other hand, in order to avoid contact with the edge of the mounting groove 45, in order to ensure that the edge of the lamp panel 17 is not in contact with the edge of the mounting groove 45, the conduction effect of heat of the lamp panel 17 in the transverse direction is reduced. Therefore, the distance between the edge of the lamp panel 17 and the side wall of the mounting groove 45 is set to at least 0.3mm. Therefore, the lamp panel 17 has a length of 0.6mm and a width of 0.6mm in the longitudinal direction of the lamp panel 17 and the mounting groove 45. The present application is not limited thereto.

In some embodiments, the locating holes 44 extend through the shell inner layer 20 and to the shell outer layer 21, with the depth of the locating holes 44 being greater than the maximum thickness of the shell inner layer 20. Because the material of the inner shell layer 20 is heat-conducting plastic, the heat-conducting plastic is brittle, and the hole depth of the positioning hole 44 is larger than the maximum thickness of the inner shell layer 20, so that the positioning piece 42 is fixed with the outer shell layer 21, and the surface of the lamp panel 17 is more attached to the surface of the inner shell layer 20. Since the lamp panel 17 is in direct contact with the case inner layer 20, the material of the lamp panel 17 is set to epoxy resin. Compared with the related art, the epoxy resin has weaker heat conduction effect and lower cost. Because the lamp panel 17 is in direct contact with the shell inner layer 20, heat is mainly dissipated through the shell inner layer 20, and the cost can be reduced by selecting the epoxy resin plate under the condition of ensuring that the heat dissipation effect is not influenced, so that the cost of the whole camera 1 is reduced.

In some embodiments, the retainer 42 may be a bolt. The lamp panel 17 is fixed on the outer shell 21 by bolts, and the threads arranged inside the positioning holes 44 of the outer shell 21 are not less than two circles, so that the depth of the positioning holes 44 is at least greater than the thickness of the inner shell 20, for example, can be 1.8mm, in order to enable the lamp panel 17 to be tightly attached to the surface of the outer shell 21. So set up, when fixing lamp plate 6 and shell skin 21 through the bolt, guarantee that the bolt closely laminates with lamp plate 17 to make lamp plate 17 hug closely with shell skin 21, increase the pressure of the contact surface of lamp plate 17 and shell skin 21, reduce thermal resistance, increase the roughness, improve the radiating effect.

In some embodiments, the control board assembly 13 is at least partially offset from the light panel 17 in the radial direction X of the second housing 12. The heat sink 33 is disposed closer to the control board assembly 13 in the radial direction of the second housing 12 with respect to the lamp panel 17. Since the control board assembly 13 is assembled to the heat dissipating assembly 15, the heat generated by the control board assembly 13 is transferred to the inner shell layer 20 through the heat dissipating main board 32 and the heat dissipating portion 33 for heat conduction. The lamp panel 17 is assembled on the surface of the shell inner layer 20, the lamp panel 17 is attached to the surface of the shell inner layer 20, and heat generated by the lamp panel 17 is directly transferred to the shell inner layer 20 contacted with the lamp panel, and mainly dissipates heat through the surface of the shell inner layer 20. So set up, effectively utilize the inner space of double-shot moulding shell 19, it utilizes the different sides of shell inlayer 20 to dispel the heat, does not need to increase extra radiator unit, under the circumstances of guaranteeing the radiating effect, can reduce cost, promotes the economic benefits of product.

In some embodiments, the lamp panel 17 is provided with lamp beads 46, and the lamp beads 46 are symmetrically arranged in the length direction and/or the width direction of the lamp panel 17. In some embodiments, the beads 46 are symmetrically disposed along the length of the light panel 17. In other embodiments, the beads 46 are symmetrically disposed in the width direction of the lamp panel 17. In the present embodiment, the lamp beads 46 are symmetrically arranged in the longitudinal direction and the width direction of the lamp panel 17. So arranged, on the one hand, meets the appearance requirements of the lamp panel 17; on the other hand, the wiring of the circuit which is convenient to be connected with the lamp beads 46 is convenient, and the process requirement is reduced, so that the cost is reduced.

In some embodiments, the width maximum dimension W of the light panel 17 is at least 3 times the maximum dimension W1 of the light beads 46. In some embodiments, the maximum length dimension L10 of the light panel 17 is at least 3 times the maximum width dimension W of the light panel 17.

In this embodiment, the lamp panel 17 may be made of FR4 material, and the heat conductivity coefficient λ of FR4 material has a convective heat dissipation performance determined by the convective heat transfer coefficient h. The convective heat transfer coefficient h of the lamp panel 17 is obtained by the following formula (6). The specific calculation process is as follows:

Where W represents the width of the lamp panel 17. As can be seen from the above formula (6), in order to maximize the heat dissipation performance, the width W of the lamp panel 17 needs to be reduced to increase the heat convection coefficient h. The width W is limited by the actual safety margin requirements to a minimum of 1-fold the width of each bead 46. For example, the width of the lamp panel 17 is 12mm, and the total length of the lamp panel 17 is 3 times the width of 36mm. Specifically, the present application can be designed according to practical needs, and is not limited thereto.

In the above scheme, the camera 1 meets the temperature rise requirement of the product through the optimal design of the heat dissipation scheme, the heat dissipation effect of the camera is equivalent to that of the metal shell, and compared with the shell of the die casting, the cost of the product is effectively reduced, the camera has better economic benefit, and the market competitiveness of the camera is improved.

The application also provides a camera 1, which comprises a shell inner layer 20 made of heat-conducting plastic, a shell outer layer 21 made of plastic, a heat dissipation assembly 15 and a lens assembly 14. Wherein the shell outer layer 21 encloses the shell inner layer 20 to form a receiving cavity having an opening, the shell inner layer 20 being defined as: at the open end face, the end face of the shell outer layer 21 is higher than the end face of the shell inner layer 20. The heat dissipation assembly 15 includes a heat dissipation main board 32 and a heat dissipation portion 33 extending along the heat dissipation main board 32; the lens assembly 14 is supported by the heat dissipating motherboard 32 of the heat dissipating assembly 15, and the lens assembly 14 and the heat dissipating assembly 15 are disposed in the accommodating cavity, so that the heat dissipating portion 33 of the heat dissipating assembly 15 is in surface contact with the inner surface of the inner shell layer 20, and the heat generated by the lens assembly 14 flows through the heat dissipating motherboard 32, the heat dissipating portion 33, the inner shell layer 20 and the outer shell layer 21 in sequence.

In some embodiments, the extending direction of the heat dissipating portion 33 is the same as the optical axis direction of the lens assembly 14, and the extending direction of the heat dissipating portion 33 is away from the opening of the accommodating cavity. In some embodiments, a first heat conducting member 38 is filled between the lens assembly 14 and the heat dissipating motherboard 32, the first heat conducting member 38 being defined as: the first heat conductive member 38 is compressed by the clamping force of the lens assembly 14 and the heat dissipating main plate 32. In some embodiments, a second heat conducting member 39 is filled between the heat dissipating portion 33 and the inner surface of the shell inner layer 20, the second heat conducting group being defined as: the second heat conductive member 39 is compressed by the clamping force constituted by the heat radiating portion 33 and the inner surface of the case inner layer 20, and the compression ratio of the second heat conductive member 39 is not less than that of the first heat conductive member 38.

The application also provides a camera 1 comprising a shell inner layer 20 of a heat conducting plastic material, a shell outer layer 21 of a plastic material and a lamp panel 17. Wherein the shell outer layer 21 encloses the shell inner layer 20 to form a receiving cavity having an opening. And the sides of the shell inner layer 20 and the shell outer layer 21, which are away from the opening, are respectively provided with a light supplementing through hole with an adaptive shape. The lamp panel 17 is disposed in the accommodating cavity and covers the light supplementing through hole, so that heat generated by the lamp panel 17 flows through the inner shell layer 20 and the outer shell layer 21 in sequence. The size of the lamp panel 17 is defined to satisfy: the width of the lamp panel 17 is not less than 3 times the width of the lamp beads arranged on the lamp panel 17, and the length of the lamp panel 17 is not less than 3 times the width of the lamp panel 17.

The application also provides a camera 1, which comprises a shell component, an electronic device and a heat dissipation component 15, wherein the shell component comprises a containing cavity 18, a shell outer layer 21 made of plastic and a shell inner layer 20 made of heat conduction plastic, the shell outer layer 21 is positioned on the outer side of the shell inner layer 20, and the shell inner layer 20 and the shell outer layer 21 are kept relatively fixed through a connecting structure. The heat dissipation assembly 15 and the electronic device are accommodated in the accommodating cavity 18, and the heat dissipation assembly 15 is in thermal conduction with the electronic device and the inner shell layer 20 for transferring heat generated by the electronic device to the inner shell layer 20.

In some embodiments, the connection structure includes a recess and a protrusion with a shape matching that one of the inner shell layer 20 and the outer shell layer 21 is provided with a recess, and the other is provided with a protrusion, which is provided in the recess. In some embodiments, the housing assembly has a central axis, and the connection structure is provided in a plurality of groups, the plurality of groups being disposed on the inner housing layer 20 and the outer housing layer 21 at intervals about the central axis. In some embodiments, along the direction of the central axis, the inner surface of the shell outer layer 21 forms an inner abrupt surface with unequal radial dimensions, and the outer surface of the shell inner layer 20 forms an outer abrupt surface with unequal radial dimensions, one of the concave portion and the convex portion is disposed on the inner abrupt surface, and the other is disposed on the outer abrupt surface. In some embodiments, the recess is provided as a U-shaped groove and the projection is provided as a U-shaped protrusion, the opening of the U-shaped groove facing the front end of the lens assembly 14.

In some embodiments, the end of the heat dissipation component 15 contacting the second heat conduction member 39 forms a plurality of branch metal plates side by side and spaced apart from each other, and the shape of the plurality of branch metal plates matches the shape of the inner shell layer 20. In some embodiments, the shell outer layer 21 includes a securing post for securing the inner member, and the shell inner layer 20 includes a reinforcing enclosure wall that wraps or partially wraps around the outside of the securing post. In some embodiments, the shell outer layer 21 is integrally formed with the shell outer layer 21 by two-shot molding.

In some embodiments, the housing assembly includes a first housing 11 and a second housing 12 that are separately provided, the second housing 12 is provided with a window 28 that is directly opposite the lens assembly 14, and the electronics are disposed within the second housing 12, with the inner housing layer 20 attached to the inner surface of the second housing 12. In some embodiments, the outer surface of the inner shell 20 is shaped to conform to the shape of the inner surface of the second outer shell 12 and to conform to each other. In some embodiments, the second housing 12 includes a joint surface in sealing engagement with the first housing 11, and the end of the inner housing layer 20 adjacent the first housing 11 is provided with a height differential from the joint surface to form a gap for receiving a seal 22 that seals the second housing 12 to the first housing 11. The electronic device may be a control board assembly and a lens assembly as described in the embodiments of fig. 1 to 25.

The application also provides a housing assembly for a camera 1 comprising a housing inner layer 20 of a thermally conductive plastic material, a second housing 12 of a plastic material. Wherein the second outer shell 12 encloses the inner shell layer 20 to form a second receiving cavity 31 having an opening, the inner shell layer 20 being defined as: at the end face of the open end, the end face of the second outer shell 12 is higher than the end face of the inner shell layer 20. The inner surface of the second housing 12 is provided with a first connection structure and the outer surface of the inner housing layer 20 is provided with a second connection structure, the first connection structure receiving the second connection structure such that the outer surface of the inner housing layer 20 and the inner surface of the second housing 12 form a heat conducting channel.

In some embodiments, one of the first and second connection structures is provided with a recess, the other one is provided with a protrusion that mates with the recess, and the recess receives the protrusion. In some embodiments, the first connection structure is a protrusion and the second connection structure is a recess, the recess receiving the protrusion.

In some embodiments, the housing inner layer 20 is integrally double molded with the second housing 12. In some embodiments, the difference in height between the end face of the second housing 12 and the end face of the housing inner layer 20 is greater than 3mm. In some embodiments, the depth height W of the shell inner layer 20 is defined to satisfy: the depth height is inversely related to the convective heat transfer coefficient of the housing assembly of the camera 1.

In some embodiments, the depth height W of the shell inner layer 20 is defined to satisfy:

Wherein h is a convective heat transfer coefficient; g is gravity acceleration; alpha _V is the body expansion coefficient; v is the dynamic viscosity coefficient; Δt is the excess temperature; alpha is the thermal diffusivity.

In some embodiments, the housing assembly further comprises a first housing 11, the end face of the second housing 12 being provided with a step 23, the step 23 being for placing the seal 22 such that the second housing 12 is in sealing engagement with the first housing 11.

The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather to enable any modification, equivalent replacement, improvement or the like to be made within the spirit and principles of the application.

Claims

1. A video camera, characterized in that,

Comprising the following steps:

The lens assembly is assembled in the control board assembly and extends from the control board assembly to the window, wherein a first fixing hole is formed in the edge of the first shell, a second fixing hole is formed in the edge of the second shell, facing the first shell, of the second shell, and the first fixing hole and the second fixing hole are used for enabling the first shell to be assembled and fixed with the second shell through fixing pieces;

The second shell is a double-shot injection shell, the double-shot injection shell comprises a shell inner layer made of heat-conducting plastic and a shell outer layer made of engineering plastic, the shell outer layer is wrapped on the outer surface of the shell inner layer, and the control panel component is in heat conduction with the shell inner layer;

The camera also comprises a heat dissipation component which is arranged in the accommodating cavity; the heat dissipation component is assembled with the double-shot molding shell and is connected with the shell inner layer, the control panel component is assembled with the heat dissipation component, and heat conduction is carried out between the heat dissipation component and the shell inner layer;

The camera further includes a seal, an upper edge of the inner shell layer being lower than an upper edge of the outer shell layer, forming a step that receives the seal such that the seal seals a gap between the first and second shells;

Wherein the depth height W of the shell inner layer is defined to satisfy:

Wherein h is a convective heat transfer coefficient, g is a gravitational acceleration, alpha _v is a physical expansion coefficient, v is a dynamic viscosity coefficient, Δt is an excess temperature, lambda is a thermal conductivity coefficient, and alpha is a thermal diffusion coefficient.

2. The camera of claim 1, wherein the camera is configured to,

The seal is compressed when the first housing and the second housing are assembled, the seal having an interference fit with the first housing.

3. The camera of claim 2, wherein the camera is configured to,

The heat dissipation assembly comprises a heat dissipation main board and a heat dissipation part connected with the edge of the heat dissipation main board, the control board assembly is assembled on the heat dissipation main board, the heat dissipation part bends from the edge of the heat dissipation main board to the direction close to the control board assembly, and the outer side face of the heat dissipation part is abutted against the inner surface of the shell inner layer.

4. A camera according to claim 3, wherein,

The heat dissipation main board comprises a first heat dissipation surface, and the control board assembly is assembled on the first heat dissipation surface; the control panel assembly comprises a circuit main board and a circuit device which is arranged on the surface of the circuit main board in a protruding way towards the first radiating surface; a distance is arranged between the surface of the circuit device and the first radiating surface.

5. The camera of claim 4, wherein the camera is configured to,

The camera further comprises a first heat conducting member compressively filled between the surface of the circuit device and the first heat radiating surface; wherein the first heat conductive member is compressed to completely cover the surface of the circuit device.

6. A camera according to claim 3, wherein,

The camera further comprises a second heat conduction member compressively filled between the outer side surface of the heat radiation portion and the inner surface of the shell inner layer; the second heat conduction piece is compressed and then completely covers the outer side face of the heat dissipation part.

7. The camera of claim 2, wherein the camera is configured to,

The camera also comprises a lamp panel which is assembled on the second housing, and the surface of the lamp panel is attached to the inner surface of the inner layer of the housing.

8. The camera of claim 7, wherein the camera is configured to,

The control panel assembly and the lamp panel are at least partially staggered in the radial direction of the second shell, the heat dissipation assembly comprises a heat dissipation main board and a heat dissipation part which is arranged at the edge of the heat dissipation main board and is in butt joint with the inner shell layer, the heat dissipation part is bent from the edge of the heat dissipation main board to one side of the heat dissipation main board, where the control panel assembly is arranged, and the heat dissipation part is arranged closer to the control panel assembly relative to the lamp panel in the radial direction of the second shell; and/or

The inner surface of the shell inner layer is provided with a mounting groove, the lamp panel is mounted in the mounting groove, and a gap is reserved between the edge of the lamp panel and the side wall of the mounting groove.

9. The camera of claim 2, wherein the camera is configured to,

The heat dissipation assembly is arranged at an opening where the second shell is in butt joint with the first shell, and at least partially covers the opening.

10. The camera according to claim 2 or 9, wherein,

The camera comprises a power panel, the heat dissipation assembly comprises a first heat dissipation surface and a second heat dissipation surface which are opposite to each other, the control panel assembly is assembled on the first heat dissipation surface, the power panel is assembled on the second heat dissipation surface, the power panel is located in the first shell, and the power panel is electrically connected with the control panel assembly.