CN219107992U

CN219107992U - Electronic device, photovoltaic repeater and photovoltaic module

Info

Publication number: CN219107992U
Application number: CN202223239233.6U
Authority: CN
Inventors: 杨玉福; 谭显伟; 何晖; 刘振阳
Original assignee: Longi Green Energy Technology Co Ltd
Current assignee: Longi Green Energy Technology Co Ltd
Priority date: 2022-12-02
Filing date: 2022-12-02
Publication date: 2023-05-30
Anticipated expiration: 2032-12-02

Abstract

The disclosure relates to an electronic device, a photovoltaic repeater and a photovoltaic module, wherein the electronic device comprises a shell and a circuit board arranged in the shell, a support ring for bearing the circuit board and a fence circumferentially arranged outside the support ring are arranged in the shell, and the height of the fence is larger than that of the support ring in the thickness direction of the electronic device; and a cavity is formed among the support ring, the circuit board and the bottom wall of the shell, and the cavity is used for accommodating components mounted on the circuit board. The rail is arranged on the outer side of the circuit board, the supporting ring for the circuit board is arranged inside the rail, the circuit board can be effectively supported and limited, unnecessary displacement of the circuit board is prevented, and the size of the electronic equipment is further reduced while the limitation is met. Under the condition that the surface of the circuit board is coated with the adhesive layer, the adhesive layer can be prevented from overflowing between the shell and the cavity of the circuit board under the action of gravity before being solidified. The material cost can be reduced, the curing time of glue can be reduced, and the production efficiency can be improved.

Description

Electronic device, photovoltaic repeater and photovoltaic module

Technical Field

The present disclosure relates to the field of photovoltaic devices, and in particular, to an electronic device, a photovoltaic repeater, and a photovoltaic module.

Background

In a photovoltaic power generation system, installation of a plurality of electronic devices, such as an intelligent photovoltaic optimizer, an inverter, a converter, a repeater, and the like, is involved. The repeater is a key element of the intelligent assembly, and the main functions of the repeater are signal amplification, signal attenuation compensation and the like, so that the power generation capacity of a product can be improved, the income of a customer is improved, and the repeater requires a certain IP (Ingress Protection) protection requirement to realize waterproof and dustproof functions because the repeater works outdoors for a long time.

In the related art, taking the repeater as an example, a layer of glue is required to be coated inside the repeater to prevent water vapor from entering the inside of the product, and the glue layer is required to be coated in the whole shell, so that the defects of overhigh cost, too much glue, long curing time, low production efficiency and the like exist, and the product structure of the repeater on the market at present is complex.

Disclosure of Invention

The purpose of the present disclosure is to provide an electronic device, a photovoltaic repeater and a photovoltaic module, so as to solve the problems of complex structure, too much glue consumption, low generation efficiency and the like of the electronic device in the related art.

In order to achieve the above object, the present disclosure provides an electronic apparatus including a housing and a circuit board disposed in the housing, a support ring for carrying the circuit board and a rail circumferentially disposed outside the support ring being disposed in the housing, wherein,

the height of the fence is larger than that of the supporting ring in the thickness direction of the electronic equipment; and is also provided with

And a cavity is formed among the support ring, the circuit board and the bottom wall of the shell, and the cavity is used for accommodating components mounted on the circuit board.

Optionally, the rail is arranged at intervals on the periphery of the supporting ring, and on a plane perpendicular to the thickness direction of the electronic device, the edge of the circuit board extends beyond the supporting ring and abuts against the inner wall of the rail.

Optionally, the fence is closely attached to the periphery of the supporting ring, and forms a step structure, and the circuit board is lapped on the end face of the supporting ring.

Optionally, the rail and the support ring are of an integral step structure, and the edge of the circuit board is abutted against the inner wall of the rail.

Optionally, a glue layer is coated on a surface of the circuit board far from the support ring, and in a thickness direction of the electronic device, a height difference between the fence and the support ring is not smaller than a sum of thicknesses of the circuit board and the glue layer.

Optionally, a contact portion abutting against an end face of the support ring is disposed on an outer edge of a surface of the circuit board facing the support ring, and the contact portion is adapted to a shape of the support ring and is disposed around the support ring.

Optionally, at least one positioning piece is disposed on the housing and located in the supporting ring, through holes with the same number as the positioning pieces are formed in the circuit board, the through holes correspond to the positioning pieces one by one, and a stop portion is disposed at the free end of the positioning piece and used for limiting the circuit board.

Optionally, the positioning piece has a supporting section and a connecting section, the shaft diameter of the supporting section is larger than that of the connecting section, and in the thickness direction of the electronic device, the height of the supporting section is equal to that of the supporting ring.

Optionally, the surface of the circuit board far away from the support ring is coated with a glue layer, the free end of the connecting section extends out of the circuit board and the glue layer, and the connecting section is made of a hot melt material and is used for forming the stop part.

Optionally, the free end of the connection section extends to pass through the circuit board, a threaded hole is arranged in the connection section, and a fastener matched with the threaded hole through the through hole is formed into the stop part.

Optionally, the electronic device further includes a cover detachably connected to the housing, and the cover covers the opening of the housing and encloses the circuit board in the accommodating cavity of the housing.

According to a second aspect of the present disclosure, there is provided a photovoltaic repeater, which is the above-described electronic device.

According to a third aspect of the present disclosure, there is provided a photovoltaic module comprising the photovoltaic repeater described above.

Through above-mentioned technical scheme, through setting up the rail in the circuit board outside, set up the holding ring to the circuit board in the rail is inside, can effectively support and spacing the circuit board, prevent that the circuit board from taking place unnecessary displacement, reduce the use of other mounting inside the electronic equipment, further reduce electronic equipment's volume when satisfying the circuit board spacing. Under the condition that the surface of the circuit board is coated with the adhesive layer, the adhesive layer can be prevented from overflowing between the shell and the cavity of the circuit board under the action of gravity before being solidified. When the circuit board is placed on the support ring, the distance that the rail is higher than the surface of the circuit board is smaller, so that the IP protection requirement of the product can be met under the condition that electronic equipment only needs to be lightly glued. The material cost can be reduced, the curing time of the adhesive is shortened, the production efficiency is improved, and obvious benefits can be brought to customers.

Additional features and advantages of the present disclosure will be set forth in the detailed description which follows.

Drawings

The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification, illustrate the disclosure and together with the description serve to explain, but do not limit the disclosure. In the drawings:

fig. 1 is a schematic diagram of an electronic device according to one embodiment of the present disclosure.

Fig. 2 is a schematic view of the cover of fig. 1 with the cover removed.

Fig. 3 is a schematic illustration of the cable and glue line removed from fig. 2.

Fig. 4 is a schematic diagram of a housing of an electronic device according to one embodiment of the present disclosure.

Fig. 5 is a schematic diagram of a circuit board of an electronic device according to one embodiment of the present disclosure.

Fig. 6 is a front view of an electronic device according to one embodiment of the present disclosure.

Fig. 7 is a section A-A of fig. 6.

Fig. 8 is a partial enlarged view of a portion B in fig. 7.

Fig. 9 is a schematic view of the positioning section after hot melting based on fig. 8.

Description of the reference numerals

1-a housing; 11-fencing; 12-a support ring; 13-positioning pieces; 131-a support section; 132-connecting segments; 2-a circuit board; 21-contact; 22-through holes; 3-an adhesive layer; 4-a cover; 5-cable.

Detailed Description

Specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the disclosure, are not intended to limit the disclosure.

In this disclosure, unless otherwise indicated, terms of orientation such as "inner" and "outer" are used herein as defined with respect to the actual profile of the part. Furthermore, in the following description, when referring to the drawings, the same reference numerals in different drawings denote the same or similar elements unless otherwise explained.

In the related art, taking a repeater as an example, a circuit board needs to be installed in a cavity of a housing of the repeater in the manufacturing process of the repeater, and in order to ensure the performance and the service life of the circuit board, an adhesive layer needs to be coated on the surface of the circuit board to play roles of water insulation, heat insulation and the like. However, in the existing repeater in the market, the circuit board is often directly placed in the cavity of the housing of the repeater, and the unnecessary displacement of the circuit board is caused by the position-free device in the cavity of the housing, or other limiting parts are required to be additionally arranged to press the circuit board between the limiting parts and a layer of housing. However, such a construction often requires too many stoppers, which results in increased costs. In addition, the glue layer is coated under the structure, and the glue layer is in a flowable state before being uncured, so that a limit structure for fluid glue is not provided, and at the moment, a large amount of glue is easily filled in the cavity of the shell during coating, so that the cost of the glue is too high. The curing time of the glue is too long due to the fact that a large amount of glue is coated, and the subsequent production efficiency is affected.

According to an embodiment of the present disclosure, there is provided an electronic apparatus, as shown in fig. 1 to 9, which may include a housing 1 and a circuit board 2 disposed in the housing 1, a support ring 12 for carrying the circuit board 2 and a rail 11 circumferentially disposed outside the support ring 12 are disposed in the housing 1, wherein in a thickness direction (as shown in fig. 7) of the electronic apparatus, a height of the rail 11 is greater than a height of the support ring 12, and a cavity for accommodating components (not shown in the drawing) mounted on the circuit board 2 is formed between the support ring 12, the circuit board 2 and a bottom wall of the housing 1.

The rails 11 are arranged at intervals on the outer periphery of the support ring 12 on a plane perpendicular to the thickness direction of the electronic device, wherein the circuit board 2 is placed inside the rails 11, and the edge of the circuit board 2 may also extend beyond the support ring 12 and abut against the inner wall of the rails 11. It should be noted that, the circuit board 2 herein may be a printed circuit board assembly (Printed Circuit Board Assembly, abbreviated as PCBA) or a printed circuit board (Printed Circuit Board, abbreviated as PCB, which is a part of PCBA), which is not limited in this disclosure. The groove can be formed between the fence 11 and the support ring 12 when the circuit board 2 is coated with glue, if residual glue overflows, the residual glue can overflow between the fence 11 and the support ring 12, and can be prevented from flowing into a cavity between the shell 1 and the circuit board 2 through the action of gravity, so that the glue consumption is reduced.

Through above-mentioned technical scheme, through set up rail 11 in the circuit board 2 outside, set up the support ring 12 to circuit board 2 in rail 11 inside, can effectively support and spacing circuit board 2, prevent that circuit board 2 from taking place unnecessary displacement, reduce the use of other mounting in the electronic equipment, further reduce electronic equipment's volume when satisfying circuit board 2 spacing. In the case of coating the surface of the circuit board 2 with the adhesive layer 3, the adhesive layer 3 is prevented from overflowing between the housing 1 and the cavity of the circuit board 2 by gravity before being cured. When the circuit board 2 is placed on the support ring 12, the distance that the fence 11 is higher than the surface of the circuit board 2 is smaller, so that the IP protection requirement of a product can be met under the condition that electronic equipment only needs to be lightly glued. The material cost can be reduced, the curing time of the adhesive is shortened, the production efficiency is improved, and obvious benefits can be brought to customers.

Further, as shown in fig. 2 to 9, the fence 11 may be closely attached to the periphery of the support ring 12 and form a step structure, where the step structure may be an integral step structure or two separate structures that are attached together, and the circuit board 2 is lapped on the end face of the support ring 12. The structure of the support ring 12 for supporting the circuit board 2 is more stable, and the circuit board 2 is prevented from relative displacement caused by the gap between the support ring 12 and the fence 11. In addition, under the condition that the circuit board 2 is coated with the adhesive layer 3, the step structure formed by integrating the support ring 12 and the fence 11 can also prevent glue from overflowing into a gap between the support ring 12 and the fence 11 during filling, so that the glue consumption is reduced. In addition, in the embodiment of the integral step structure, the edge of the circuit board 2 may be abutted against the inner wall of the fence 11, and the fence 11 and the supporting ring 12 may be a plastic integral structure, which is not limited in this disclosure.

According to one embodiment of the present disclosure, as shown in fig. 2, 8 and 9, the surface of the circuit board 2 away from the support ring 12 may be coated with the adhesive layer 3, and the height difference between the rail 11 and the support ring 12 in the thickness direction of the electronic device is not less than the sum of the thicknesses of the circuit board 2 and the adhesive layer 3. In the embodiment of the circuit board 2 placed behind the support ring 12 and filled, the fence 11 can effectively prevent the uncured adhesive layer 3 from overflowing to the outside, and the support ring 12 can also effectively prevent the uncured adhesive layer 3 from flowing into the inner cavities of the circuit board 2 and the support ring 12, so that the adhesive dosage of the adhesive layer 3 is reduced, the cost is reduced, and in addition, the curing time of the adhesive layer 3 is also reduced due to the reduction of the adhesive dosage of the adhesive layer 3, and the production efficiency can be effectively improved. In addition, the adhesive layer 3 may be a waterproof adhesive layer, a potting adhesive, a heat insulating adhesive layer or a photo-cured UV adhesive layer, which is not limited in this disclosure.

According to one embodiment of the present disclosure, as shown in fig. 5 and 8, the outer edge of the surface of the circuit board 2 facing the support ring 12 is provided with a contact portion 21 that abuts against the end surface of the support ring 12, and the contact portion 21 is adapted to the shape of the support ring 12 and is arranged around. The contact portion 21 is used for contacting with the end face of the support ring 12, so that the uncured adhesive layer 3 is prevented from overflowing into the inner cavities of the circuit board and the support ring when being filled, and the adhesive consumption is reduced. The contact portion 21 does not place an electronic component, and the contact portion 21 may be a circle of limiting structure, or may form a matching structure of a protrusion or a groove with the end surface of the support ring 12, which is not limited in this disclosure.

According to one embodiment of the disclosure, as shown in fig. 2 to 9, at least one positioning member 13 may be disposed in the support ring 12 on the housing 1, the circuit board 2 is formed with through holes 22 with the same number as the positioning members 13, the through holes 22 are in one-to-one correspondence with the positioning members 13, and a free end of the positioning member 13 has a stop portion for limiting the circuit board 2. The positioning members 13 and the through holes 22 correspond to each other, so that the mounting position of the circuit board 2 can be defined, thereby facilitating the rapid mounting of the circuit board 2, saving the mounting time, in the preferred embodiment of the present disclosure, three positioning members 13 may be provided, and the three positioning members 13 are not collinear, and meanwhile, three through holes 22 formed on the circuit board 2 correspond to the positioning members 13 respectively, thereby defining the mounting position of the circuit board 2 more precisely, and further saving the mounting time.

Further, as shown in fig. 8 and 9, the positioning member 13 may have a supporting section 131 and a connecting section 132, the supporting section 131 having a larger shaft diameter than the connecting section 132, and the supporting section 131 having a height equal to that of the supporting ring 12 in the thickness direction of the electronic device, so that an effective support is formed for the circuit board 2 inside the supporting ring 12 while securing the mounting position of the circuit board 2.

Further, as shown in fig. 8 and 9, the surface of the circuit board 2 far from the supporting ring 12 is coated with a glue layer 3, the free end of the connecting section 132 may extend out of the circuit board 2 and the glue layer 3 and be higher than the surface of the circuit board 2, and the connecting section 132 is made of a hot melt material and is used for forming a stop portion. After the circuit board 2 is mounted on the support ring 12 by the positioning member 13, the end of the connection section 132 may be thermally melted so that the maximum diameter of the end is larger than the diameter of the through hole 22, and as shown in fig. 9, the end of the connection section 132 is thermally melted to form a stop portion to limit the circuit board 2 in the thickness direction of the electronic device.

According to another embodiment of the present disclosure, the free end of the connection section 132 may also extend to only pass through the circuit board 2 and the adhesive layer 3 above the circuit board 2, a threaded hole is provided in the connection section 132, and a fastener that passes through the through hole 22 and mates with the threaded hole is formed as a stop portion to limit the circuit board 2, so that only the fastener needs to be removed when the circuit board 2 is overhauled or replaced later.

According to one embodiment of the disclosure, as shown in fig. 1 and 2, the electronic device may further include a cover 4, where the cover 4 is detachably connected to the housing 1, so as to facilitate immediate disassembly for overhauling or replacing parts inside the electronic device, and the cover 4 is covered at an opening of the housing 1 and seals the circuit board 2 in a receiving cavity of the housing 1. The electronic device may further comprise a cable 5, the cable 5 may be arranged between the circuit board 2 and the cover 4. In addition, the cover body 4 may be formed with a receiving cavity, the housing 1 may be a flat plate structure, the housing 1 and the cover body 4 may be aluminum die castings, plastic injection molding materials may be used, or PPO engineering plastics may be selected, which is not limited in this disclosure.

On the basis of the scheme, the disclosure further provides a photovoltaic repeater, which can be the electronic equipment, and has all the beneficial effects of the electronic equipment, and the description is omitted here.

On the basis of the scheme, the disclosure further provides a photovoltaic module, the photovoltaic module comprises the photovoltaic repeater, and the photovoltaic module has all the beneficial effects of the photovoltaic repeater, and is not repeated here.

The preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings, but the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solutions of the present disclosure within the scope of the technical concept of the present disclosure, and all the simple modifications belong to the protection scope of the present disclosure.

In addition, the specific features described in the foregoing embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, the present disclosure does not further describe various possible combinations.

Moreover, any combination between the various embodiments of the present disclosure is possible as long as it does not depart from the spirit of the present disclosure, which should also be construed as the disclosure of the present disclosure.

Claims

1. An electronic device characterized by comprising a shell and a circuit board arranged in the shell, wherein a supporting ring used for bearing the circuit board and a fence arranged on the outer side of the supporting ring in a surrounding way are arranged in the shell,

2. The electronic device of claim 1, wherein the rail is arranged at intervals on the periphery of the support ring, and an edge of the circuit board extends beyond the support ring and abuts against an inner wall of the rail on a plane perpendicular to a thickness direction of the electronic device.

3. The electronic device of claim 1, wherein the rail is closely attached to the periphery of the support ring and forms a step structure, and the circuit board is overlapped on the end surface of the support ring.

4. The electronic device of claim 3, wherein the rail and the support ring are of an integral stepped structure, and an edge of the circuit board abuts against an inner wall of the rail.

5. The electronic device according to claim 1, wherein a surface of the circuit board remote from the support ring is coated with a glue layer, and a height difference between the rail and the support ring in a thickness direction of the electronic device is not smaller than a sum of thicknesses of the circuit board and the glue layer.

6. The electronic device according to claim 1, characterized in that an outer edge of the surface of the circuit board facing the support ring is provided with a contact portion abutting against an end face of the support ring, the contact portion being adapted to the shape of the support ring and being arranged circumferentially around.

7. The electronic device according to any one of claims 1 to 6, wherein at least one positioning member is provided on the housing in the supporting ring, the circuit board is provided with through holes the number of which is the same as that of the positioning members, the through holes are in one-to-one correspondence with the positioning members, and a stop portion is provided at a free end of the positioning member for limiting the circuit board.

8. The electronic device according to claim 7, wherein the positioning member has a support section and a connection section, an axial diameter of the support section is larger than an axial diameter of the connection section, and a height of the support section is equal to a height of the support ring in a thickness direction of the electronic device.

9. The electronic device of claim 8, wherein a surface of the circuit board remote from the support ring is coated with a glue layer, free ends of the connection segments extend out of the circuit board and the glue layer, and the connection segments are made of a hot melt material and are used for forming the stop portions.

10. The electronic device of claim 8, wherein the free end of the connection section extends through the circuit board, a threaded hole is provided in the connection section, and a fastener that mates with the threaded hole through the through hole is formed as the stop.

11. The electronic device of claim 1, further comprising a cover detachably connected to the housing, the cover covering the opening of the housing and enclosing the circuit board within the housing cavity.

12. A photovoltaic repeater, characterized in that it is an electronic device according to any one of claims 1-11.

13. A photovoltaic module comprising the photovoltaic repeater of claim 12.