CN219761429U - Waterproof and dustproof PCB - Google Patents
Waterproof and dustproof PCB Download PDFInfo
- Publication number
- CN219761429U CN219761429U CN202321086333.1U CN202321086333U CN219761429U CN 219761429 U CN219761429 U CN 219761429U CN 202321086333 U CN202321086333 U CN 202321086333U CN 219761429 U CN219761429 U CN 219761429U
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- CN
- China
- Prior art keywords
- substrate
- waterproof
- layer
- base plate
- dustproof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000000428 dust Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- -1 moisture Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
The utility model discloses a waterproof and dustproof PCB (printed circuit board), which comprises a first substrate and a second substrate, wherein the first substrate comprises a first base layer and first circuit layers arranged on two opposite end surfaces of the first base layer; a plurality of first through holes are formed in the first substrate and the second substrate, connecting columns are installed in the first through holes and are electrically connected with the first circuit layer and the second circuit layer, and pressing pieces are installed at two ends of each connecting column. According to the utility model, the first waterproof layer and the second waterproof layer are arranged, so that the waterproof and dustproof effects of the PCB can be realized, the pressing piece can press the first substrate and the second substrate, the first waterproof layer and the second waterproof layer are prevented from falling off, the first substrate and the second substrate are prevented from being separated, and the service life of the PCB is prolonged.
Description
Technical Field
The utility model relates to the technical field of PCB boards, in particular to a waterproof and dustproof PCB board.
Background
The circuit board is generally waterproof and dustproof by coating waterproof glue, and the circuit board is protected from severe environmental impact such as various chemicals, moisture, dust, high and low temperature and the like. For the circuit board with the structure that the waterproof glue on the upper surface and the waterproof glue on the lower surface are not integrated, the waterproof glue is easy to fall off after long-term use, especially under the high-temperature condition, and the waterproof and dustproof performances of the PCB are affected; for a multi-layer PCB, if the bonding is not firm, or under the high-temperature condition, the PCB can generate different expansion coefficients after absorbing heat, so that corresponding internal stress is formed, and the bonding force of the bonding material and the copper foil is insufficient to resist the internal stress to generate delamination, so that the PCB is delaminated, and the use is influenced.
Disclosure of Invention
The utility model provides a waterproof and dustproof PCB (printed Circuit Board) to solve the problems in the prior art.
The technical problems solved by the utility model are realized by adopting the following technical scheme:
the waterproof and dustproof PCB comprises a first substrate and a second substrate, wherein the first substrate comprises a first base layer and first circuit layers arranged on two opposite end surfaces of the first base layer, a first waterproof layer is wrapped on the periphery of the first substrate, the second substrate comprises a second base layer and second circuit layers arranged on two opposite end surfaces of the second base layer, a second waterproof layer is wrapped on the periphery of the second substrate, and the first substrate and the second substrate are connected in an adhesive mode; a plurality of first through holes are formed in the first substrate and the second substrate, connecting columns are installed in the first through holes and are electrically connected with the first circuit layer and the second circuit layer, pressing pieces are installed at two ends of each connecting column, and the pressing pieces provide force for enabling the first substrate and the second substrate to be close to each other.
Preferably, the connecting column is internally provided with an internal threaded hole, the compressing piece comprises a screw rod part and a compressing part, the screw rod part is in threaded connection with the internal threaded hole, and the compressing part is fixedly connected with the screw rod part.
Preferably, the connecting column is provided with external threads, the pressing piece comprises internal threads which are matched with the external threads, and the internal threads are in threaded connection with the external threads.
Preferably, the connecting column is further sleeved with two pressing pieces, and the pressing piece presses the second waterproof layer through the pressing pieces.
Preferably, the first substrate and the second substrate are provided with a plurality of second through holes, the second through holes are communicated with the first substrate and the second substrate, and the first waterproof layer and the second waterproof layer are connected in the second through holes.
Preferably, the upper end surface of the first waterproof layer is in an arc surface structure or a spherical surface structure.
Preferably, the connection post includes a conductive layer disposed at an outer side thereof, and the conductive layer is electrically connected with the first circuit layer and the second circuit layer.
The utility model has the beneficial effects that: through setting up first waterproof layer and second waterproof layer, can realize the waterproof dustproof of PCB board, prevent electric leakage and short circuit, through setting up the spliced pole, can make first circuit layer and second circuit layer electricity be connected, compress tightly the piece and can compress tightly first base plate and second base plate, avoid first waterproof layer and second waterproof layer to drop, avoid first base plate and second base plate to separate mutually simultaneously, guarantee the fixed effect of PCB board, improve the life of PCB board.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from them without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic structural diagram of embodiment 1 of the present utility model;
FIG. 2 is a schematic structural diagram of embodiment 2 of the present utility model;
FIG. 3 is a schematic structural diagram of embodiment 3 of the present utility model;
FIG. 4 is a schematic structural diagram of embodiment 4 of the present utility model;
FIG. 5 is a schematic structural diagram of embodiment 5 of the present utility model;
in the figure, 1, a first substrate; 11. a first base layer; 12. a first circuit layer; 2. a second substrate; 21. a second base layer; 22. a second circuit layer; 3. a first waterproof layer; 4. a second waterproof layer; 5. a first through hole; 6. a connecting column; 61. an internal threaded hole; 62. a conductive layer; 7. a pressing member; 71. a screw portion; 72. a pressing part; 8. tabletting; 9. and a second through hole.
Detailed Description
The utility model is further described with reference to the following detailed drawings in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the implementation of the utility model easy to understand.
Example 1
Referring to fig. 1, a waterproof and dustproof PCB board comprises a first substrate 1 and a second substrate 2, wherein the first substrate 1 comprises a first base layer 11 and first circuit layers 12 arranged on opposite end surfaces of the first base layer 11, circuits are arranged on the first circuit layers 12, a first waterproof layer 3 is wrapped around the first substrate 1, the first waterproof layer 3 can protect the circuits on the first circuit layers 12, the second substrate 2 comprises a second base layer 21 and second circuit layers 22 arranged on opposite end surfaces of the second base layer 21, circuits are arranged on the second circuit layers 22, a second waterproof layer 4 is wrapped around the second substrate 2, the second waterproof layer 4 can protect the circuits on the second circuit layers 22, and the first substrate 1 and the second substrate 2 are connected in an adhesive manner; a plurality of first through holes 5 are formed in the first substrate 1 and the second substrate 2, connecting columns 6 are installed in the first through holes 5, the connecting columns 6 are electrically connected with the first circuit layer 12 and the second circuit layer 22, pressing pieces 7 are installed at two ends of the connecting columns 6, and the pressing pieces 7 provide force for enabling the first substrate 1 and the second substrate 2 to be close to each other. The first waterproof layer 3 and the second waterproof layer 4 are formed of an insulating material, and the first wiring layer 12 and the second wiring layer 22 can be kept insulated from each other, and electrically connected only by the connection post 6. Specifically, the first waterproof layer 3 and the second waterproof layer 4 are formed by spraying waterproof glue for a circuit board, and the waterproof glue for the circuit board is prepared from resin and waterproof additives in the prior art, has the advantages of waterproof, dustproof, nontoxic, pollution-free, ageing-resistant and the like, can form waterproof insulating protective glue, and can form protective films on the first substrate 1 and the second substrate 2 to prevent electric leakage and short circuit. The pressing piece 7 can press the first substrate 1 and the second substrate 2, so that the first waterproof layer 3 and the second waterproof layer 4 are prevented from falling off, and the first substrate 1 and the second substrate 2 are prevented from being separated.
Specifically, the connecting column 6 is provided with external threads, and the compressing member 7 comprises internal threads which are matched with the external threads and are in threaded connection with the external threads. The compressing element 7 is of a hollow nut structure, can be conveniently installed on the external thread of the connecting column 6 through the internal thread, and axially moves on the connecting column 6 so as to compress the first substrate 1 and the second pressing plate.
In order to improve the conductive effect of the connection post 6 and the first and second circuit layers 12 and 22, reduce the resistance, and ensure the strength of the connection post 6, the connection post 6 includes a conductive layer 62 disposed on the outer side thereof, and the conductive layer 62 is electrically connected with the first and second circuit layers 12 and 22. The conductive layer 62 is made of copper or silver with good conductivity; by providing the conductive layer 62, the first circuit layer 12 and the second circuit layer 22 are electrically connected. The material of the body of the connecting column 6 can be a high-strength insulating material, such as ceramic.
Example 2
Referring to fig. 2, this embodiment is substantially the same as embodiment 1, except that, on the basis of embodiment 1, two pressing pieces 8 are further sleeved on the connecting post 6 of this embodiment, and the pressing pieces 7 press the first substrate 1 and the second substrate 2 through the pressing pieces 8. For compressing tightly piece 7, add preforming 8 can increase the area of contact with first base plate 1, second base plate 2, improve and compress tightly fixed effect, further improve the stability of PCB board.
Example 3
Referring to fig. 3, this embodiment is substantially the same as embodiment 2, except that an internally threaded hole 61 is provided in the connecting post 6, the pressing member 7 includes a screw portion 71 and a pressing portion 72, the screw portion 71 is screwed with the internally threaded hole 61, and the pressing portion 72 is fixedly connected with the screw portion 71. The connecting column 6 is a hollow column, and the inner wall of the inner cavity of the column is provided with the internal threaded hole 61, so that the screw rod portion 71 can be conveniently connected by threads, and the pressing portion 72 can move relative to the connecting column 6, so that the first substrate 1 and the second substrate 2 can be pressed.
Example 4
Referring to fig. 4, this embodiment is substantially the same as embodiment 2, except that on the basis of embodiment 2, this embodiment further has the following features:
a plurality of second through holes 9 are formed in the first substrate 1 and the second substrate 2, the second through holes 9 penetrate through the bonding layer, the second through holes 9 are communicated with the first substrate 1 and the second substrate 2, and the first waterproof layer 3 and the second waterproof layer 4 are connected in the second through holes 9. Through setting up second through-hole 9 for first waterproof layer 3 and second waterproof layer 4 fuse in second through-hole 9, form an organic wholely, thereby improve the adhesion ability of first waterproof layer 3 and second waterproof layer 4, avoid first waterproof layer 3 and second waterproof layer 4 to drop.
Example 5
Referring to fig. 5, this embodiment is substantially the same as embodiment 4, except that on the basis of embodiment 4, this embodiment further has the following features:
the upper end surface of the first waterproof layer 3 is in a cambered surface structure, and in other embodiments, the upper end surface of the first waterproof layer can also be in a spherical surface structure. The upper end face of the first waterproof layer 3 is the upper end face of the PCB, and the upper end face of the first waterproof layer 3 is of an arc surface structure or a spherical surface structure and can play a role in water repellency.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a waterproof dirt-proof PCB board, includes first base plate (1) and second base plate (2), its characterized in that, first base plate (1) includes first basic unit (11) and sets up first circuit layer (12) on the opposite both ends face of first basic unit (11), and first waterproof layer (3) are wrapped up in first base plate (1) periphery, and second base plate (2) include second basic unit (21) and set up second circuit layer (22) on the opposite both ends face of second basic unit (21), and second base plate (2) periphery parcel has second waterproof layer (4), and bonding connection between first base plate (1) and second base plate (2); a plurality of first through holes (5) are formed in the first substrate (1) and the second substrate (2), connecting columns (6) are arranged in the first through holes (5), the connecting columns (6) are electrically connected with the first circuit layer (12) and the second circuit layer (22), pressing pieces (7) are arranged at two ends of the connecting columns (6), and the pressing pieces (7) provide force for enabling the first substrate (1) to be close to the second substrate (2).
2. The waterproof and dustproof PCB board according to claim 1, characterized in that the connecting post (6) is internally provided with an internal threaded hole (61), the pressing piece (7) comprises a screw portion (71) and a pressing portion (72), the screw portion (71) is in threaded connection with the internal threaded hole (61), and the pressing portion (72) is fixedly connected with the screw portion (71).
3. The waterproof and dustproof PCB board according to claim 1, characterized in that the connecting post (6) is provided with external threads, the pressing piece (7) comprises internal threads adapted to the external threads, and the internal threads are in threaded connection with the external threads.
4. A water and dust resistant PCB board according to claim 2 or 3, characterized in that the connecting post (6) is further sleeved with two pressing pieces (8), and the pressing piece (7) presses the second waterproof layer (4) through the pressing pieces (8).
5. The waterproof and dustproof PCB board according to claim 1, wherein the first substrate (1) and the second substrate (2) are provided with a plurality of second through holes (9), the second through holes (9) are communicated with the first substrate (1) and the second substrate (2), and the first waterproof layer (3) and the second waterproof layer (4) are connected in the second through holes (9).
6. The waterproof and dustproof PCB board according to claim 1, characterized in that the upper end surface of the first waterproof layer (3) is in a cambered surface structure or a spherical surface structure.
7. The waterproof and dustproof PCB board according to claim 1, characterized in that the connection post (6) comprises a conductive layer (62) disposed on the outer side thereof, the conductive layer (62) being electrically connected with the first circuit layer (12) and the second circuit layer (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321086333.1U CN219761429U (en) | 2023-05-09 | 2023-05-09 | Waterproof and dustproof PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321086333.1U CN219761429U (en) | 2023-05-09 | 2023-05-09 | Waterproof and dustproof PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219761429U true CN219761429U (en) | 2023-09-26 |
Family
ID=88087839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321086333.1U Active CN219761429U (en) | 2023-05-09 | 2023-05-09 | Waterproof and dustproof PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219761429U (en) |
-
2023
- 2023-05-09 CN CN202321086333.1U patent/CN219761429U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |