CN219750223U - Chip loading, conveying and sucking structure - Google Patents

Abstract

The utility model discloses a wafer loading, conveying and sucking structure which comprises a supporting plate, wherein a connecting pipe is inserted into the supporting plate, a first magnetic block is fixedly connected to the outer wall of the circumference of the connecting pipe, a supporting plate is fixedly connected to the top end of the connecting pipe, an electric telescopic rod is fixedly connected to the bottom of the supporting plate, the electric telescopic rod is fixed to the supporting plate, a sucker is fixedly connected to the bottom end of the connecting pipe, a plurality of second sliding grooves are formed in the supporting plate, a clamping plate frame is connected to the second sliding grooves in a sliding mode, and a second guide rod is fixedly connected to one side of each second sliding groove. The utility model can not only stably move the wafer through the clamping plate frame and improve the using effect of the device, but also protect the bottom of the wafer through the auxiliary receiving mechanism so as to further avoid the wafer from falling off, and can also avoid the wafer abrasion caused by the direct contact of the clamping plate frame and the wafer through the rubber pad.

Description

Chip loading, conveying and sucking structure

Technical Field

The utility model relates to the technical field of wafer loading and conveying, in particular to a wafer loading, conveying and sucking structure.

Background

The wafer is one of the most important raw materials of the LED, the quality of the wafer directly determines the performance of the LED, and the wafer needs to be transferred from a machine to a conveying device by using a suction mechanism before conveying.

Through searching, chinese patent with publication number CN201770318U discloses a silicon wafer loading and conveying suction cup structure, which comprises a suction cup fixing plate, and is characterized in that the suction cup fixing plate is fixedly connected on a lifting cylinder, and the silicon wafer loading and conveying suction cup structure is used on automatic loading equipment of silicon wafers, so that the automatic loading of silicon wafers can be safely and rapidly completed, and the following defects still exist, that is, the suction cup is only used for adsorbing, and when the suction force is insufficient, the wafer can fall down, and damage is caused.

Disclosure of Invention

The utility model aims to solve the defects in the prior art and provides a chip loading, conveying and sucking structure.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a structure is absorbed in chip loading transport, includes the backup pad, peg graft in the inside of backup pad has the connecting pipe, the first magnetic path of circumference outer wall fixedly connected with of connecting pipe, the top fixedly connected with supporting disk of connecting pipe, the bottom fixedly connected with electric telescopic handle of supporting disk, and electric telescopic handle is fixed mutually with the backup pad, the bottom fixedly connected with sucking disc of connecting pipe, a plurality of second spouts have been seted up to the inside of backup pad, sliding connection has splint frame in the second spout, one side fixedly connected with second guide bar of second spout, and splint frame and second guide bar sliding connection, the second spring has been cup jointed in the outside of second guide bar, and the both ends of second spring are fixed mutually with splint frame and second spout respectively, the top fixedly connected with second magnetic path of splint frame, and first magnetic path contacts with the second magnetic path, the bottom of backup pad is equipped with supplementary receiving mechanism.

As a still further scheme of the utility model, the auxiliary receiving mechanism comprises a plurality of first sliding grooves, the plurality of first sliding grooves are all arranged in the supporting plate, a protection frame is connected in a sliding manner in the first sliding grooves, one side of the protection frame is fixedly connected with a first spring, and the first spring is fixed with the first sliding grooves.

As a still further proposal of the utility model, a plurality of wedge blocks are fixedly connected with the circumferential outer wall of the connecting pipe, and the wedge blocks are contacted with the protective frame.

As a still further scheme of the utility model, one side of the first sliding groove is fixedly connected with a first guide rod, the first guide rod is in sliding connection with the protection frame, and the first spring is sleeved on the outer side of the first guide rod.

As a still further scheme of the utility model, the bottom end of the protection frame is fixedly connected with a buffer cushion.

As a still further proposal of the utility model, the bottom end of the splint frame is fixedly connected with a rubber pad.

As a still further proposal of the utility model, the upper surface of the supporting disk is fixedly connected with two fixing ribs which are fixed with the connecting pipe.

As a still further proposal of the utility model, the sides of the supporting plate are provided with mounting holes.

The beneficial effects of the utility model are as follows:

1. through the setting of splint frame, the connecting pipe drives the wafer on the sucking disc and upwards moves, and the connecting pipe removes simultaneously and makes first magnetic path produce the appeal to the second magnetic path to attract second magnetic path and first magnetic path contact, splint frame is along the inboard removal of second spout this moment, and the second spring shrink, and then makes splint frame support the bottom of wafer, makes the wafer remove that it can be stable, avoids it to drop easily, has improved the result of use of device.

2. Through the setting of supplementary receiving mechanism, the connecting pipe upward movement makes wedge upward movement, and wedge and protection frame separate gradually this moment, and first spring rebound stretches to make the protection frame move to the inboard along first spout, and then make the protection frame protect the bottom of wafer, further avoid the wafer to drop, improved the protection effect of device.

3. Through the setting of rubber pad, the rubber pad can protect the wafer, avoids splint frame direct and wafer contact to cause the wafer wearing and tearing easily, has improved the practicality of device.

Drawings

FIG. 1 is a schematic view of an upper side three-dimensional structure of a wafer loading, transporting and sucking structure according to the present utility model;

FIG. 2 is an enlarged schematic view of the portion A of a wafer loading, transporting and sucking structure according to the present utility model;

FIG. 3 is a schematic view of a lower side three-dimensional structure of a wafer loading, transporting and sucking structure according to the present utility model;

fig. 4 is an enlarged schematic view of a B-section of a chip mounting, transporting and sucking structure according to the present utility model.

In the figure: 1. a connecting pipe; 2. a support plate; 3. a protective frame; 4. a mounting hole; 5. a support plate; 6. a first guide bar; 7. a first spring; 8. a first chute; 9. an electric telescopic rod; 10. wedge blocks; 11. fixing ribs; 12. a first magnetic block; 13. a second chute; 14. a second guide bar; 15. a second spring; 16. a second magnetic block; 17. a suction cup; 18. a rubber pad; 19. a cushion pad; 20. and a clamping plate frame.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model, and all other embodiments obtained by those skilled in the art without making any inventive effort are within the scope of the present utility model.

Referring to fig. 1-4, a wafer dress piece carries and absorbs structure, which comprises a supporting plate 5, the inside grafting of backup pad 5 has connecting pipe 1, the circumference outer wall of connecting pipe 1 has first magnetic path 12 through the bolt fastening, the top welding of connecting pipe 1 has supporting disk 2, electric telescopic handle 9 is passed through to the bottom of supporting disk 2, and electric telescopic handle 9 is fixed mutually with backup pad 5, the bottom bonding of connecting pipe 1 has sucking disc 17, a plurality of second spouts 13 have been seted up to the inside of backup pad 5, sliding connection has splint frame 20 in second spout 13, one side of second spout 13 has second guide bar 14 through the bolt fastening, and splint frame 20 and second guide bar 14 sliding connection, second guide bar 14 can lead splint frame 20, make splint frame 20 can be stable remove, second spring 15 has been cup jointed in the outside of second guide bar 14, and the both ends of second spring 15 are fixed mutually with splint frame 20 and second spout 13 respectively, the top of splint frame 20 has second magnetic path 16 through the bolt fastening, and first magnetic path 12 is with second magnetic path 16 contacts second magnetic path 16, electric telescopic handle 9 sliding connection has splint frame 20, thereby second magnetic path 16 is gone up to the second magnetic path 16 is contacted to the second magnetic path 16, make the second magnetic path 16 move to the second magnetic path 16 and make the second magnetic path 16 move to the second magnetic path 1, thereby make the second magnetic path 16 move to the bottom plate 1, and make the second magnetic path 16 move to the bottom plate 16 and make the bottom plate more stable, and then the magnetic path is more stable to the bottom than the second guide plate 1, and can make the second guide plate 16 moves to the bottom plate 1, and then moves to the supporting plate 16, and thereby can make the bottom plate 16 moves to the bottom plate mechanism and can move to the bottom plate is easy.

In the utility model, the auxiliary receiving mechanism comprises a plurality of first sliding grooves 8, the plurality of first sliding grooves 8 are all arranged in the supporting plate 5, a protective frame 3 is connected in a sliding manner in the first sliding grooves 8, a first spring 7 is welded on one side of the protective frame 3, the first spring 7 is fixed with the first sliding grooves 8, a plurality of wedge blocks 10 are fixed on the circumferential outer wall of the connecting pipe 1 through bolts, the wedge blocks 10 are contacted with the protective frame 3, the connecting pipe 1 moves upwards to enable the wedge blocks 10 to move upwards, at the moment, the wedge blocks 10 are gradually separated from the protective frame 3, the first spring 7 is in rebound extension, so that the protective frame 3 moves inwards along the first sliding grooves 8, the bottom of a wafer is protected by the protective frame 3, and the wafer is further prevented from falling, one side of the first chute 8 is fixedly provided with a first guide rod 6 through a bolt, the first guide rod 6 is in sliding connection with the protection frame 3, a first spring 7 is sleeved on the outer side of the first guide rod 6, the first guide rod 6 can guide the protection frame 3, the protection frame 3 can stably move, the bottom end of the protection frame 3 is adhered with a buffer pad 19, the bottom end of the clamping plate frame 20 is adhered with a rubber pad 18, the rubber pad 18 can protect wafers, the clamping plate frame 20 is prevented from being directly contacted with the wafers, the wafers are easily worn, the upper surface of the supporting disc 2 is fixedly provided with two fixing ribs 11 through bolts, the fixing ribs 11 are fixed with the connecting pipe 1, the connecting pipe 1 is firmly connected with the supporting disc 2 through the fixing ribs 11, and the multiple sides of the supporting plate 5 are all provided with mounting holes 4.

Working principle: when the wafer needs to be sucked, the connecting pipe 1 is communicated with an external air pump, suction force is generated by the air pump to enable the sucking disc 17 to suck the wafer, then the electric telescopic rod 9 is started, the electric telescopic rod 9 stretches to enable the supporting disc 2 to drive the sucking disc 17 on the connecting pipe 1 to move upwards, meanwhile, the connecting pipe 1 moves to enable the first magnetic block 12 to move upwards to a proper position to enable the second magnetic block 16 to generate suction force, so that the second magnetic block 16 is attracted to be contacted with the first magnetic block 12, at the moment, the clamping plate frame 20 moves inwards along the second sliding groove 13, the second spring 15 contracts, the clamping plate frame 20 supports the bottom of the wafer, the wafer is enabled to move stably, meanwhile, the connecting pipe 1 moves upwards to enable the wedge block 10 to move upwards, at the moment, the wedge block 10 is gradually separated from the protection frame 3, the first spring 7 stretches to enable the protection frame 3 to move inwards along the first sliding groove 8, the protection frame 3 is enabled to protect the bottom of the wafer, and the wafer is further prevented from falling in a rebound mode.

Furthermore, the terms "mounted," "configured," "provided," "connected," "coupled," and "sleeved" are to be construed broadly. For example, a fixed connection; may be a mechanical connection; either directly or indirectly via an intermediary. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Claims (8)

1. The utility model provides a structure is absorbed in chip loading transport, includes backup pad (5), its characterized in that, the inside grafting of backup pad (5) has connecting pipe (1), and first magnetic path (12) of circumference outer wall fixedly connected with of connecting pipe (1), top fixedly connected with supporting disk (2) of connecting pipe (1), the bottom fixedly connected with electric telescopic handle (9) of supporting disk (2), and electric telescopic handle (9) are fixed mutually with backup pad (5), the bottom fixedly connected with sucking disc (17) of connecting pipe (1), a plurality of second spouts (13) have been seted up to the inside of backup pad (5), and sliding connection has splint frame (20) in second spout (13), one side fixedly connected with second guide bar (14) of second spout (13), and splint frame (20) and second guide bar (14) sliding connection, the outside of second guide bar (14) cup joints second spring (15), and the both ends of second spring (15) are fixed mutually with frame (20) and second spout (13) respectively, splint frame (16) are connected with second magnetic path (16), and second magnetic path (16) are equipped with supplementary material (16).

2. The wafer loading, conveying and sucking structure according to claim 1, wherein the auxiliary receiving mechanism comprises a plurality of first sliding grooves (8), the plurality of first sliding grooves (8) are formed in the supporting plate (5), the first sliding grooves (8) are slidably connected with a protection frame (3), one side of the protection frame (3) is fixedly connected with a first spring (7), and the first spring (7) is fixed with the first sliding grooves (8).

3. The wafer loading, conveying and sucking structure according to claim 2, wherein a plurality of wedge blocks (10) are fixedly connected to the circumferential outer wall of the connecting pipe (1), and the wedge blocks (10) are in contact with the protection frame (3).

4. The wafer loading, conveying and sucking structure according to claim 3, wherein a first guide rod (6) is fixedly connected to one side of the first chute (8), the first guide rod (6) is slidably connected with the protection frame (3), and the first spring (7) is sleeved on the outer side of the first guide rod (6).

5. The wafer loading, conveying and sucking structure according to claim 2, wherein a cushion pad (19) is fixedly connected to the bottom end of the protection frame (3).

6. The wafer loading, transporting and sucking structure according to claim 1, wherein a rubber pad (18) is fixedly connected to the bottom end of the clamping plate frame (20).

7. The wafer loading, conveying and sucking structure according to claim 1, wherein two fixing ribs (11) are fixedly connected to the upper surface of the supporting plate (2), and the fixing ribs (11) are fixed with the connecting pipe (1).

8. The wafer loading, conveying and sucking structure according to claim 1, wherein the supporting plate (5) is provided with mounting holes (4) on multiple sides.