CN219737769U - Ultrasonic sensor with high structural integration level - Google Patents
Ultrasonic sensor with high structural integration level Download PDFInfo
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- CN219737769U CN219737769U CN202321204065.9U CN202321204065U CN219737769U CN 219737769 U CN219737769 U CN 219737769U CN 202321204065 U CN202321204065 U CN 202321204065U CN 219737769 U CN219737769 U CN 219737769U
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Abstract
The utility model discloses an ultrasonic sensor with high structural integration, which integrates a control part, a power part, a transmitter and a receiver, in particular to an integrated switching value and analog output, integrates a signal excitation, receiving and temperature compensation structure in a structure, improves measurement precision and tightness, and comprises the following components: the system comprises a plurality of ultrasonic probes, a radar box, a radar probe bracket and cables; the radar box is internally provided with a 12V isolation power supply module which is connected with the RS-485 and a power supply module of the probe, the external 12V power supply is connected with the 12V isolation power supply module through a filter circuit after being accessed, the MCU is communicated with the isolation RS-485 circuit, and the isolation RS-485 circuit is communicated with an external communication module; the whole probe shell is made of stainless steel, and an O-shaped ring and threads are enveloped and fixed at the front end.
Description
Technical Field
The utility model belongs to the technical field of ultrasonic sensors, and particularly relates to an ultrasonic sensor with high structural integration level.
Background
The ultrasonic sensor is a sensor formed by utilizing the characteristics of ultrasonic waves, takes the ultrasonic waves as a detection means, specifically completes distance measurement by generating and receiving the ultrasonic waves, and mainly comprises an ultrasonic probe, wherein the ultrasonic transducer is the core. Typically integrated ultrasonic transducers will integrate the transmitting and receiving parts of the ultrasonic wave together, such as an ultrasonic probe consisting of a piezoelectric wafer, the core of which is the piece of piezoelectric wafer in its plastic or metal casing. The main materials of the ultrasonic sensor are piezoelectric crystals (electrostriction) and nickel-iron-aluminum alloys (magnetostriction).
The integrated ultrasonic sensor integrates the transmitting and receiving parts, an ultrasonic pulse emitted by the transmitter is applied to the surface of the object, after a period of time, the reflected sound wave (echo) returns to the receiver again, and the distance between the ultrasonic sensor and the reflecting object can be calculated according to the sound velocity and the time. The integrated ultrasonic sensor mainly has two shapes, namely a cuboid plastic shell and a threaded pipe shape, and the two shapes are provided with two signal output types of switching value and analog value.
However, the current integrated ultrasonic sensor cannot integrate a control part, a power supply part, a transmitting sensor (or called a wave transmitter) and a receiving sensor (or called a wave receiver), particularly cannot integrate switching value and analog output, and a signal excitation, receiving and compensation structure cannot be integrated in one structure, so that the current ultrasonic sensor occupies a large space, and the interference and real-time synchronism of signal processing are poor, so that the protection characteristic and sealing performance of the whole sensor and the accuracy of signal detection are reduced.
Thus, the above-mentioned prior art does have to propose a better solution.
Disclosure of Invention
The utility model aims to provide an ultrasonic sensor with high structural integration, wherein a control part, a power supply part, a transmitter and a receiver are integrated together, particularly, switching value and analog output are integrated, and a signal excitation, receiving and temperature compensation structure is integrated in a structure, so that the installation space of the ultrasonic sensor is greatly reduced, the integration degree is high, the interference and real-time synchronism of signal processing are greatly improved, and the protection characteristic and sealing performance of the whole sensor and the accuracy of signal detection are optimized.
The utility model provides an ultrasonic sensor with high structural integration level, which comprises:
the system comprises a plurality of ultrasonic probes, a radar box, a radar probe bracket and cables; the radar box is internally provided with a 12V isolation power supply module which is connected with the RS-485 and a power supply module of the probe, the external 12V power supply is connected with the 12V isolation power supply module through a filter circuit, the MCU is mutually communicated with the isolation RS-485 circuit, and the isolation RS-485 circuit is communicated with an external communication module; the whole probe shell (5) is made of stainless steel, an O-shaped ring (2) and threads are enveloped and fixed at the front end, and the probe shell can be fixed through the O-shaped ring (2) when the hole-type ultrasonic probe is installed; when the ultrasonic probe is installed by using the radar probe bracket, the O-shaped ring (2) can be wrapped by the spacer bush, and then the locking nut is used for fastening installation.
Preferably, the ultrasonic probe consists of an ultrasonic transducer (1), an O-shaped ring (2), a transduction plate (3), a communication plate (4), a probe shell (5) and a signal wire (7) which are integrated in a cavity, the rear end of the cavity is closed by a rear cover (6), and the cable is connected through a through hole on the rear cover (6); wherein the ultrasonic transducer (1) comprises a transmitter and a receiver, which are integrated in the cavity.
Preferably, the ultrasonic probe further comprises a power conversion circuit and an ultrasonic probe communication module, wherein the ultrasonic probe communication module is integrated on the communication board (4), and the power conversion circuit is integrated on the transduction board (3).
Preferably, the ultrasonic probe communication module comprises an RS485 communication chip, the RS485 communication chip comprises a front end UART serial port and a rear end communication interface, wherein the automatic 485 receiving and transmitting function without independent control is realized by connecting triode control through the front end UART serial port, the rear end communication interface uses a TVS tube to carry out transient protection on the interface, and a terminal matching resistor is reserved for subsequent bus networking.
Preferably, the power conversion circuit comprises a DC-DC buck chip and a peripheral voltage division circuit, so that conversion of DC12V into DC5V is realized, and the output part is connected in parallel by adopting 0.1uF and 22uF capacitors.
Preferably, the radar box consists of a radar box shell (8), a radar box plate (9), a radar box power supply connector (10), a radar probe connector (11) and an upper cover (12); the radar box board (9) is integrated with a power supply module, a radar box communication module, a signal processing and converting circuit and a probe signal receiving and power supply circuit; the power supply module comprises a power isolation circuit, a power conversion circuit and an anti-interference circuit; the communication module is realized based on the RS-485 communication module.
Preferably, the radar box shell (8) is integrally machined, and the joint of the upper cover (12) and the radar box shell (8) is fixedly connected by adopting 12M 2 screws; the radar box shell (8) is made of 6061 aluminum alloy, and the whole shell is subjected to conductive oxidation treatment.
Preferably, the radar probe connector (11) is 6 four-core sensor sockets mounted on the front panel of the radar box for connection with the ultrasonic probe cable.
Preferably, the radar box power connector (10) is a back panel mounted 1 electrical connector for connection to and power of a host device.
Preferably, the anti-interference circuit comprises a self-recovery fuse, a Transient Voltage Suppression (TVS), a filter, and associated inductor and capacitor circuits.
The working principle of the obstacle ranging method based on the ultrasonic sensor with high structural integration level comprises the following steps:
s1, an ultrasonic sensor transmits an ultrasonic signal to a space designated direction through a transmitter and starts timing at the same time, and the ultrasonic signal returns and is received by a receiver after contacting an obstacle;
s2, the ultrasonic probe finishes timing after receiving the returned ultrasonic signal, and transmits the ultrasonic signal to the radar box;
s3, the radar box gathers ultrasonic signals received by the ultrasonic probes through the built-in circuit;
s4, performing temperature compensation on the collected ultrasonic signals, analyzing and processing the ultrasonic signals into distances from obstacles based on an ultrasonic ranging calculation formula, and performing corresponding response operation on the radar box if the radar box receives an instruction from a host through RS-485 communication;
the formula of the temperature compensation is formula (2):
wherein:
t is the temperature in degrees Celsius, units: the temperature is lower than the temperature;
the ultrasonic ranging calculation formula is formula (1):
S＝(C×Δt) (1)
wherein:
s is the detection distance, unit: m;
c is the speed of sound at the current temperature in units of: m/s;
Δt is the time interval from the transmission of the ultrasonic signal to the reception, in units of: s.
The sensor and the measuring method thereof provided by the utility model have the following beneficial technical effects:
(1) The control part, the power supply part, the transmitter and the receiver are integrated together, particularly, the switching value and the analog output are integrated, and the excitation, receiving and temperature compensation structure of the signal is integrated in one structure, so that the installation space of the ultrasonic sensor is greatly reduced, the integration degree is high, the interference and the real-time synchronism of signal processing are greatly improved, and the protection characteristic and the sealing performance of the whole sensor and the accuracy of signal detection are optimized;
(2) The power supply part of the ultrasonic radar box adopts an isolated power supply conversion module, and a front-end filter circuit and other strong EMC interference resistance designs are added, so that the isolated conversion treatment of external power supply is completed, power is supplied to the ultrasonic radar box and an ultrasonic probe, and the integration level is improved;
(3) The isolation of the whole power supply of the detection module and an external power supply is realized through the isolation power supply module, so that the anti-interference capability of the power supply of the detection module is improved; the detection module realizes isolation of external 485 communication by using an isolator chip and an independent power supply circuit, so that the anti-interference capability of the detection module is greatly improved;
(4) The number of work required for detection is reduced under the condition of high integration level: under the power supply of rated value 12V, the current of the ultrasonic radar probe is about 0.01A in the silence state, the internal current of the radar box board is about 0.1A, the current of an external 485 communication circuit is about 0.01A, and the comprehensive calculation is carried out, namely, the self power consumption of the detection module in the silence state is 12V 0.17A and about 2W; the current of the ultrasonic radar probe is about 0.03A in the working state, the internal current of the radar box board is about 0.2A, the current of the external 485 communication circuit is about 0.01A, the comprehensive calculation is carried out, namely, the power consumption of the detection module in the silence state is 12V 0.39A approximately equal to 4.8W, and the power consumption of the detection module meets the requirement of not more than 10W.
Drawings
FIG. 1 is a schematic view of an ultrasonic sensor according to a preferred embodiment of the present utility model;
fig. 2 is a schematic view showing the structural composition of an ultrasonic probe according to a preferred embodiment of the present utility model;
fig. 3 is a schematic view showing the operation principle of an ultrasonic probe according to a preferred embodiment of the present utility model;
fig. 4 is a schematic view showing the constitution of a radar box according to a preferred embodiment of the present utility model;
fig. 5 is a schematic diagram showing the operation principle of the radar box according to the preferred embodiment of the present utility model;
fig. 6 is a schematic structural view of an embodiment of an electronic device according to the preferred embodiment of the present utility model.
Detailed Description
The following describes in further detail the embodiments of the present utility model with reference to the drawings and examples. The following examples are illustrative of the utility model and are not intended to limit the scope of the utility model.
Referring to fig. 1, the present embodiment provides an ultrasonic sensor with high structural integration, including:
the system comprises a plurality of ultrasonic probes, a radar box, a radar probe bracket and cables; the multiple ultrasonic probes and the radar box are connected through cables and integrated in a cavity, the multiple ultrasonic probes and the radar box are supported on the radar probe support, the ultrasonic probes are set to be 6 identical in the embodiment and are all composed of a transducer, a transduction plate and a communication plate, a power conversion device is arranged in the radar box and used for sequentially converting external 12V power supply into 5V and then into 3.3V for MCU, a 12V isolation power supply module is arranged in the radar box and connected with the RS-485 and the power supply module of the probes, the external 12V power supply is connected with the 12V isolation power supply module through a filter circuit, the MCU is mutually communicated with an isolation RS-485 circuit, and the isolation RS-485 circuit is communicated with the external communication module.
Referring to fig. 1-2, the ultrasonic probe is composed of an ultrasonic transducer 1, an O-ring 2, a transduction plate 3, a communication plate 4, a probe housing 5 and a signal wire 7 which are integrated in a cavity, wherein the rear end of the cavity is closed by a rear cover 6, and the cable is connected through a through hole in the rear cover 6. The ultrasonic transducer 1 comprises a transmitter and a receiver which are integrated in a cavity, and is provided with a special chip for the ultrasonic transducer, so that object detection in the space range of 0.4m-5m is realized. The special chip of the ultrasonic sensor is matched with a pulse transformer to generate the driving voltage required by the ultrasonic sensor, which is usually 150Vp-p@40KHz, and the detection distance of 0.4m to 5m and the detection precision of not more than 0.2m are achieved by adjusting the sizes of the tuning capacitor and the damping resistor.
As a preferred embodiment, the whole probe shell 5 is made of stainless steel, and the front end is enveloped and fixed with an O-shaped ring 2 and threads, so that the probe can be fixed through the O-shaped ring 2 when the hole-type ultrasonic probe is installed; when the ultrasonic probe is installed by using the radar probe bracket, the O-shaped ring 2 can be wrapped by the spacer bush, and then the locking nut is used for fastening installation. The front end of the ultrasonic probe is provided with a triangular arrow mark for indicating the installation direction of the probe. During installation, the triangular arrow mark points to the vertical upward direction, so that the situation of correct installation can be achieved.
As a preferred embodiment, the ultrasonic probe further comprises a power conversion circuit and an ultrasonic probe communication module, the ultrasonic probe communication module is integrated on the communication board 4, and the power conversion circuit is integrated on the transducer board 3.
As a preferred embodiment, the ultrasonic probe communication module comprises an RS485 communication chip, the RS485 communication chip comprises a front end UART serial port and a rear end communication interface, wherein the automatic 485 receiving and transmitting function without independent control is realized by connecting triode control through the front end UART serial port, the rear end communication interface uses a TVS tube to carry out transient protection on the interface, and a 120 omega terminal matching resistor is reserved for subsequent bus networking.
Referring to fig. 3, an operation schematic diagram of the ultrasonic probe is shown, in which the power conversion circuit is used for converting 12V power supply of the radar box after passing through the filter circuit into 5V for 485 communication circuit of the back-end communication board and the front-end transduction board. The circuit uses a DC-DC voltage reduction chip and is matched with a peripheral voltage division circuit, so that DC12V is converted into DC5V, and the output part is connected in parallel by adopting 0.1uF and 22uF capacitors, so that high-frequency and low-frequency interference can be effectively filtered. In addition, the filter circuit is non-isolated, so GND_O and VGND are common ground, thereby meeting the requirement of common ground for 485 communication.
Referring to fig. 4, a radar box assembly structure is shown. As a preferred embodiment, the radar box is composed of a radar box housing 8, a radar box plate 9, a radar box power connector 10, a radar probe connector 11 and an upper cover 12. Wherein, the radar box board 9 is integrated with a power supply module, a radar box communication module, a signal processing and converting circuit and a probe signal receiving and power supply circuit. In this embodiment, the power supply module includes a power isolation circuit, a power conversion circuit, and an anti-interference circuit; the communication module is realized based on the RS-485 communication module.
The maximum dimensions of the radar box were 153±2mm×105±2mm×47±2mm (without the radar box power connector 10 and the radar probe connector 11). The radar box shell 8 is integrally machined, and the joint of the upper cover 12 and the radar box shell 8 is fixedly connected by 12M 2 screws; the radar box shell 8 is made of 6061 aluminum alloy, the whole shell is subjected to conductive oxidation treatment, and the surface of the radar box is painted after the treatment.
The radar probe connector 11 is 6 four-core sensor sockets mounted on the front panel of the radar box and is used for being connected with an ultrasonic probe cable. The signal is defined as 12V, GND, RS485_A and RS485_B respectively, and is used for supplying power (12 VDC), digital ground, an RS485A terminal and an RS485B terminal respectively.
The radar box power connector 10 is a rear panel mounted 1 electrical connector for connection with and power to a superordinate apparatus. The signal is defined as 12V, GND, RS485_A and RS485_B respectively, and is used for supplying power (12 VDC), digital ground, an RS485A terminal and an RS485B terminal respectively.
Referring to fig. 5, a schematic diagram of the operation of the radar box is shown. Wherein:
(1) The radar box power supply circuit is mainly designed to realize the filtering of 12V external power supply, and one path of the filtered 12V power supply is converted into isolated 12V power supply for the internal use of the radar box and the use of a probe through an isolated power supply module; the other path is converted into 5V for the use in the radar box, and the circuit design mainly considers the stability, the filtering characteristic, the short circuit prevention and the peak surge prevention of the power supply;
(2) The anti-interference circuit is used for electromagnetic inhibition and protection of the power supply, and on one hand, the anti-interference circuit uses a self-recovery safety to prevent damage of overcurrent on the radar box board under the conditions of short circuit and the like of the power supply, and the self-recovery safety can be recovered to achieve the effect of multiple use; the second aspect uses a Transient Voltage Suppression (TVS) to prevent damage to subsequent circuits from spike surges; the third aspect uses a filter and associated inductor and capacitor circuits to achieve electromagnetic interference suppression.
The working principle of ultrasonic sensor based on high structure integrated level carries out obstacle ranging includes:
s1, an ultrasonic sensor transmits an ultrasonic signal to a space designated direction through a transmitter and starts timing at the same time, and the ultrasonic signal returns and is received by a receiver after contacting an obstacle;
s2, the ultrasonic probe finishes timing after receiving the returned ultrasonic signal, and transmits the ultrasonic signal to the radar box;
s3, the radar box gathers ultrasonic signals received by a plurality of ultrasonic probes (6 in the embodiment) through a built-in circuit;
s4, performing temperature compensation on the collected ultrasonic signals, analyzing and processing the ultrasonic signals into distances from obstacles based on an ultrasonic ranging calculation formula, and performing corresponding response operation on the radar box if the radar box receives an instruction from a host through RS-485 communication;
the sound velocity in the air is affected by the temperature, so that the temperature compensation is performed, and the formula of the temperature compensation is shown as formula (2):
wherein:
t is the temperature in degrees Celsius, units: the temperature is lower than the temperature;
the ultrasonic ranging calculation formula is formula (1):
S＝(C×Δt) (1)
wherein:
s is the detection distance, unit: m;
c is the speed of sound at the current temperature in units of: m/s;
Δt is the time interval from the transmission of the ultrasonic signal to the reception, in units of: s.
The utility model also provides a memory storing a plurality of instructions for implementing the method according to the first embodiment.
As shown in fig. 6, the present utility model further provides an electronic device, which includes a processor 301 and a memory 302 connected to the processor 301, where the memory 302 stores a plurality of instructions, and the instructions may be loaded and executed by the processor, so that the processor can execute a measurement method corresponding to the sensor according to the embodiment.
While preferred embodiments of the present utility model have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the utility model. It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. An ultrasonic sensor of high structural integrity, comprising:
the system comprises a plurality of ultrasonic probes, a radar box, a radar probe bracket and cables; the radar box is internally provided with a 12V isolation power supply module which is connected with the RS-485 and a power supply module of the probe, the external 12V power supply is connected with the 12V isolation power supply module through a filter circuit, the MCU is mutually communicated with the isolation RS-485 circuit, and the isolation RS-485 circuit is communicated with an external communication module; the whole probe shell (5) is made of stainless steel, an O-shaped ring (2) and threads are enveloped and fixed at the front end, and the probe shell can be fixed through the O-shaped ring (2) when the hole-type ultrasonic probe is installed; when the ultrasonic probe is installed by using the radar probe bracket, the O-shaped ring (2) can be wrapped by the spacer bush, and then the locking nut is used for fastening installation.
2. The high-structure-integration ultrasonic sensor according to claim 1, wherein the ultrasonic probe consists of an ultrasonic transducer (1), an O-ring (2), a transducer plate (3), a communication plate (4), a probe housing (5) and a signal wire (7) which are integrated in a cavity, the rear end of the cavity is closed by a rear cover (6), and the cable is connected through a through hole on the rear cover (6); wherein the ultrasonic transducer (1) comprises a transmitter and a receiver, which are integrated in the cavity.
3. The high-structure-integration ultrasonic sensor according to claim 2, wherein the ultrasonic probe further comprises a power conversion circuit and an ultrasonic probe communication module, the ultrasonic probe communication module being integrated on the communication board (4), the power conversion circuit being integrated on the transducer board (3).
4. The ultrasonic sensor with high structural integration according to claim 3, wherein the ultrasonic probe communication module comprises an RS485 communication chip, the RS485 communication chip comprises a front end UART serial port and a rear end communication interface, wherein the automatic 485 receiving and transmitting function without independent control is realized by connecting a triode through the front end UART serial port, the rear end communication interface uses a TVS tube to carry out transient protection on the interface, and a terminal matching resistor is reserved for subsequent bus networking.
5. The ultrasonic sensor with high structural integration according to claim 4, wherein the power conversion circuit comprises a DC-DC buck chip and a peripheral voltage division circuit, so as to convert DC12V into DC5V, and the output part is connected in parallel by adopting 0.1uF and 22uF capacitors.
6. The ultrasonic sensor of high structural integrity according to claim 5, wherein said radar box consists of a radar box housing (8), a radar box plate (9), a radar box power connector (10), a radar probe connector (11) and an upper cover (12); the radar box board (9) is integrated with a power supply module, a radar box communication module, a signal processing and converting circuit and a probe signal receiving and power supply circuit; the power supply module comprises a power isolation circuit, a power conversion circuit and an anti-interference circuit; the communication module is realized based on the RS-485 communication module.
7. The ultrasonic sensor with high structural integration according to claim 6, wherein the radar box shell (8) is integrally machined, and the joint of the upper cover (12) and the radar box shell (8) is fixedly connected by 12M 2 screws; the radar box shell (8) is made of 6061 aluminum alloy, and the whole shell is subjected to conductive oxidation treatment.
8. The high-structure-integration ultrasonic sensor according to claim 7, wherein the radar probe connector (11) is 6 four-core sensor sockets mounted to the front panel of the radar box for cable connection with the ultrasonic probe.
9. The high-structure integrated ultrasonic sensor according to claim 8, wherein the radar box power connector (10) is 1 electrical connector mounted to the rear panel for connection and power supply with the upper device.
10. The high-structure integrated ultrasonic sensor of claim 9, wherein the anti-interference circuit comprises a self-restoring fuse, a transient voltage suppression tube, a filter, and associated inductive and capacitive circuits.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116299485A (en) * | 2023-05-16 | 2023-06-23 | 航天极创物联网研究院(南京)有限公司 | Ultrasonic sensor with high structural integration level |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116299485A (en) * | 2023-05-16 | 2023-06-23 | 航天极创物联网研究院(南京)有限公司 | Ultrasonic sensor with high structural integration level |
| CN116299485B (en) * | 2023-05-16 | 2023-12-26 | 航天极创物联网研究院(南京)有限公司 | Ultrasonic sensor with high structural integration level |
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