CN217210969U - Temperature vibration sensor - Google Patents
Temperature vibration sensor Download PDFInfo
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- CN217210969U CN217210969U CN202220593477.5U CN202220593477U CN217210969U CN 217210969 U CN217210969 U CN 217210969U CN 202220593477 U CN202220593477 U CN 202220593477U CN 217210969 U CN217210969 U CN 217210969U
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- circuit board
- temperature
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- piezoelectric accelerometer
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Abstract
The utility model relates to a temperature vibration sensor, it includes the shell, the top of shell sets up the upper cover and connects, and the bottom sets up the base and connects, the inside of shell is equipped with circuit board, piezoelectric accelerometer, insulating material and temperature sensor, temperature sensor sets up the top of base, and close to the shell fixed, one side of temperature sensor is equipped with piezoelectric accelerometer, sets up insulating material and fixes on the base through insulating material below piezoelectric accelerometer; a circuit board is arranged above the piezoelectric accelerometer and is connected with an upper cover above the circuit board through a silica gel wire; the temperature sensor is connected with the circuit board through a silica gel line. The utility model discloses compact structure, rationally distributed, occupation space is little, adopts different cable conductor to supply power, avoids signal interference, and the reinforcing signal improves signal acquisition's efficiency.
Description
Technical Field
The utility model relates to a temperature and vibration monitoring technology field especially relate to a temperature vibration sensor.
Background
The rotating equipment is machinery which mainly depends on rotation to complete specific functions, typical rotating equipment comprises a steam turbine, a gas turbine, a centrifugal compressor, an axial flow compressor, a fan, a pump, a water turbine, a generator, an aero-engine and the like, the rotating equipment is widely applied to departments such as electric power, petrifaction, metallurgy, aerospace and the like, main vibration faults of the rotating equipment comprise unbalance, misalignment, friction, looseness and the like, and then a vibration temperature measuring device is required to be used for measuring the rotating equipment.
The miniature wireless temperature and vibration sensors are mounted on rotating equipment such as a common motor, a speed reducer, a water pump, a fan and the like, the temperature and vibration data of the equipment are collected, the temperature and vibration overrun alarm signals are uploaded in time, and the temperature and vibration change is analyzed, so that the scheme of judging whether the equipment is good or not is more reliable, simpler and more economic.
Most of rotating equipment can provide a sensor installation device, the space is limited, two sensors are needed to be installed when signals such as temperature and vibration need to be collected, and due to the fact that the positions of the sensors are not installed at the same time, the sensor installation device needs to be operated separately when monitoring is carried out on the equipment with limited space, time is wasted, and efficiency is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome the aforesaid not enough, provide a temperature vibration sensor, rational arrangement, integrated temperature and vibration signal gather, improve collection efficiency.
The purpose of the utility model is realized like this:
a temperature vibration sensor comprises a shell, wherein the top end of the shell is provided with an upper cover for connection, the bottom end of the shell is provided with a base for connection, a circuit board, a piezoelectric accelerometer, an insulating material and a temperature sensor are arranged inside the shell, the temperature sensor is arranged above the base and is fixed close to the shell, one side of the temperature sensor is provided with the piezoelectric accelerometer, and the insulating material is arranged below the piezoelectric accelerometer and is fixed on the base through the insulating material; a circuit board is arranged above the piezoelectric accelerometer and is connected with an upper cover above the circuit board through a silica gel wire; the temperature sensor is connected with the circuit board through a silica gel line.
Furthermore, the bottom of the piezoelectric accelerometer is provided with a switching nut which is fixed with the insulating material.
Further, the shell is a metal shell, and the base is a metal base.
Furthermore, the temperature sensor is powered by a constant voltage source, and the piezoelectric accelerometer is powered by a constant current source.
Further, the core body of the piezoelectric accelerometer is rigidly connected with the base back to back.
Further, epoxy filling is used within the housing.
Compared with the prior art, the beneficial effects of the utility model are that:
the temperature vibration sensor of the utility model is used for monitoring the temperature and the vibration of rotating equipment such as a fan, wherein, the sensor is internally provided with an integrated voltage type temperature monitoring chip and a piezoelectric acceleration vibration sensor for monitoring the temperature and the vibration of the fan; temperature sensor and vibration sensor (being piezoelectric accelerometer) are integrated in the temperature vibration sensor, compact structure, rationally distributed, occupation space is little, and temperature sensor and vibration sensor adopt different cable core to supply power, and temperature sensor adopts the power supply of constant voltage source, and vibration sensor adopts the constant current source power supply, avoids two kinds of sensor power mutual influence of temperature and vibration, avoids interfering, and the reinforcing signal improves signal acquisition's efficiency.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of the application of the present invention.
Fig. 3 is a schematic cross-sectional view of the present invention.
Fig. 4 is a schematic structural diagram of the transmitter of the present invention.
Fig. 5 is a front view of the transmitter of the present invention.
Fig. 6 is a schematic circuit diagram of the front and back sides of the first circuit board according to the present invention.
Fig. 7 is a schematic circuit diagram of the front and back sides of the second circuit board according to the present invention.
Fig. 8 is a schematic circuit diagram of the front and back of the third circuit board according to the present invention.
Fig. 9 is a schematic circuit diagram of the front and back of the fourth circuit board according to the present invention.
Wherein:
Detailed Description
For a better understanding of the technical aspects of the present invention, reference will now be made in detail to the accompanying drawings. It should be understood that the following specific examples are not intended to limit the specific embodiments of the present invention, but are merely exemplary embodiments that may be employed in the present invention. It should be noted that the description of the positional relationship of the components, such as the component a is located above the component B, is based on the description of the relative positions of the components in the drawings, and is not intended to limit the actual positional relationship of the components.
Example 1:
referring to fig. 1, the utility model relates to a temperature vibration sensor, it includes temperature vibration sensor 1, aviation plug 3 is connected to temperature vibration sensor 1's one end, and the other end passes through shielded cable 2 and connects changer 4.
The temperature sensor 17 is fixed close to the shell 12, the core body of the piezoelectric accelerometer 14 is firstly connected with the sensor mounting base in a back-to-back rigid mode, and then the shell is filled with epoxy, so that the sensor has high overall measurement accuracy.
The plug of the aviation plug 3 is matched with a special cable for use, and the protection grade can reach IP 66.
The housing 12 and the base 18 are both made of metal material to provide shielding protection for the sensor and are grounded through the fan housing at the installation site.
In order to further improve the anti-interference performance of the vibration sensor, the core body of the piezoelectric accelerometer is shielded by an independent metal shell and is fixed on a base of the probe shell through an insulating material, and the core body shell is connected with a signal ground of the sensor to prevent field environment noise from entering a vibration signal end.
Shielded cable 2 adopts four-core shielded cable, is equipped with 5 cable pins: the shielding layer is grounded at the signal processing card piece; in order to avoid mutual influence of temperature and vibration sensor power supplies, the sensors adopt different cable cores for power supply, the temperature sensor adopts a constant voltage source for power supply, and the acceleration sensor (namely, a piezoelectric accelerometer) adopts a constant current source for power supply.
The temperature sensor adopts an LM35 series small-sized high-precision integrated circuit, has low output impedance, linear output and high-precision internal calibration function, and has a linear direct relation between the output voltage and the temperature.
The vibration sensor (namely the piezoelectric accelerometer) adopts an IEPE two-wire piezoelectric acceleration sensor, is powered by a constant current source output by a transmitter, and has lower power consumption; the precise charge amplifier is integrated in the sensor, so that a high-resistance anti-vibration charge signal of the piezoelectric material can be converted into a low-resistance voltage signal, the signal transmission distance is effectively increased, and the electrical interference sensitivity is reduced.
Changer 4 includes metal casing 41, metal casing 41's top surface is equipped with panel 42, and the bottom surface is equipped with plastic base 43, and metal casing 41, panel 42 and plastic base 43 form airtight space, be equipped with first circuit board 44, second circuit board 45, third circuit board 46 and fourth circuit board 47 from top to bottom in the metal casing 41, first circuit board 44, second circuit board 45, third circuit board 46 and fourth circuit board 47 pass through hexagonal support 48 fixed connection, form the circuit board subassembly, metal casing 41's inner wall is equipped with the step, supports the circuit board subassembly for the circuit board subassembly does not contact with plastic base 43.
The bottom surface of the plastic base 43 is provided with a clamp spring 49 which supports guide rail type installation and bolt and screw installation, and the plastic base 43 is designed to be widened, so that the size of the plastic base is larger than the end surface of the metal shell 41, and the plastic base is convenient to install.
The circuit board assembly of the transmitter 4 comprises a power supply, a signal conditioning unit, a data processing unit, a current output unit and a communication functional unit; a state indicator lamp, a Mini USB interface, a buffer output interface, a gear selection and vibration filtering frequency selection gear are arranged on the top surface of the first circuit board 44; the top surface of the second circuit board 45 is a signal conditioning unit and is provided with a signal output interface, a vibration conditioning circuit, a constant current source circuit, a buffer output circuit, a temperature conditioning circuit and a signal and power supply input interface, and the bottom surface of the second circuit board is a current output unit and is provided with a 4-20mA current circuit; the third circuit board 46 is a communication function unit and a data processing unit, the top surface of the third circuit board is provided with an RS485 communication unit, a CPU processing unit and an analog/digital conversion circuit, and the bottom surface of the third circuit board is provided with a Flash storage unit; the fourth circuit board 47 is a power supply unit, and the top surface thereof is provided with a power supply EMC anti-interference circuit and the bottom surface thereof is provided with a working power supply circuit.
The power supply unit uses a DC-DC isolation direct current module power supply to provide 3.3V, 5V and +/-15V working voltage and sensor power supplies for other functional circuits; in order to improve the reliability of products, the front stage of the DC-DC main power supply uses a transient absorption tube, a common mode inductor, an X capacitor, a Y capacitor and other protection filter elements to provide lightning protection and EMC protection for a signal processing card.
The signal conditioning unit buffers and filters the input temperature and the vibration signal; the temperature signal is a slowly-varying process quantity signal which is filtered and directly sent to a post-stage circuit for sampling; the vibration signal is instantaneous dynamic data, high-frequency noise is superposed on the vibration signal, and the vibration signal is subjected to four-order anti-aliasing filtering and then is sent to a post-stage circuit for sampling.
The digital signal processing unit consists of a 16-bit high-speed synchronous sampling analog-to-digital converter and a high-performance STM32F4 series microcontroller; the analog-to-digital converter converts the temperature and vibration analog signals into digital signals.
The analog-digital speed converter uses a high-speed 16-bit four-channel synchronous sampling ADC to synchronously sample temperature process quantity signals, fault voltage of a vibration sensor, vibration acceleration and vibration signals, and the ADC can work in an oversampling mode to improve the sampling signal-to-noise ratio and the effective number of the ADC.
The STM32F4 microcontroller is the core of the signal processing card, and the built-in DSP function can carry out digital filtering and FFT conversion on the digital signal output by the ADC; the microcontroller controls the ADC sampling rate by using a high-precision timer and can process digital signals according to configuration parameters; the microcontroller can detect the sensor fault according to the bias voltage of the vibration sensor and carry out system self-check by using functional modules such as built-in CRC (cyclic redundancy check) and power supply monitoring.
The microcontroller completes digital signal processing according to the configuration parameters, converts the processed temperature and vibration values into PWM duty ratio signals, transmits the PWM duty ratio signals to the current output unit after optical coupling isolation, and the module circuit outputs corresponding temperature and vibration values by using a precise 4-20mA current source.
The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (6)
1. A temperature vibration sensor, characterized by: the temperature sensor comprises a shell (12), wherein an upper cover (11) is arranged at the top end of the shell (12) for connection, a base (18) is arranged at the bottom end of the shell for connection, a circuit board (13), a piezoelectric accelerometer (14), an insulating material (16) and a temperature sensor (17) are arranged in the shell (12), the temperature sensor (17) is arranged above the base (18) and is fixed by abutting against the shell (12), the piezoelectric accelerometer (14) is arranged on one side of the temperature sensor (17), and the insulating material (16) is arranged below the piezoelectric accelerometer (14) and is fixed on the base (18) through the insulating material (16); a circuit board (13) is arranged above the piezoelectric accelerometer (14), and the circuit board (13) is connected with an upper cover (11) above through a silica gel line; the temperature sensor (17) is connected with the circuit board (13) through a silica gel line.
2. A temperature vibration sensor according to claim 1, wherein: the bottom of the piezoelectric accelerometer (14) is provided with a switching nut (15) which is fixed with an insulating material (16) through the switching nut (15).
3. A temperature vibration sensor according to claim 1, wherein: the shell (12) is a metal shell, and the base (18) is a metal base.
4. A temperature vibration sensor according to claim 1, wherein: the temperature sensor (17) is powered by a constant voltage source, and the piezoelectric accelerometer (14) is powered by a constant current source.
5. A temperature vibration sensor according to claim 1, wherein: the core body of the piezoelectric accelerometer (14) is rigidly connected with the base (18) back to back.
6. A temperature vibration sensor according to claim 1, wherein: the interior of the housing (12) is filled with epoxy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220593477.5U CN217210969U (en) | 2022-03-18 | 2022-03-18 | Temperature vibration sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220593477.5U CN217210969U (en) | 2022-03-18 | 2022-03-18 | Temperature vibration sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217210969U true CN217210969U (en) | 2022-08-16 |
Family
ID=82754766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220593477.5U Active CN217210969U (en) | 2022-03-18 | 2022-03-18 | Temperature vibration sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217210969U (en) |
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2022
- 2022-03-18 CN CN202220593477.5U patent/CN217210969U/en active Active
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