CN219728607U - Novel base disc arranging machine - Google Patents

Novel base disc arranging machine Download PDF

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Publication number
CN219728607U
CN219728607U CN202320537862.2U CN202320537862U CN219728607U CN 219728607 U CN219728607 U CN 219728607U CN 202320537862 U CN202320537862 U CN 202320537862U CN 219728607 U CN219728607 U CN 219728607U
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China
Prior art keywords
module
base
wafer
plate
righting
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Active
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CN202320537862.2U
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Chinese (zh)
Inventor
唐志强
劳家杰
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Shaoxing Aomei Electronic Technology Co ltd
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Shaoxing Aomei Electronic Technology Co ltd
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Priority to CN202320537862.2U priority Critical patent/CN219728607U/en
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Abstract

The utility model discloses a novel base disc arranging machine, which comprises a vibration disc mechanism, an XY axis carrying mechanism and a feeding mechanism, wherein the feeding mechanism comprises a reciprocating swing module and a base righting module, wafer bases on the vibration disc mechanism are continuously swung and conveyed one by one through the reciprocating swing module, and are transferred to the XY axis carrying mechanism after righting adjustment of the base righting module, so that automatic disc arrangement of the wafer bases is realized. The utility model not only can realize the continuous conveying of the wafer bases one by one, but also can correct the wafer bases, and improves the swaying efficiency of the wafer bases.

Description

Novel base disc arranging machine
Technical Field
The utility model relates to a novel base disc arranging machine.
Background
With the development of electronic information, such as mobile phone accessories and 5G accessories, the sorting, clamping, loading and sorting of parts (such as needles or strips) of electronic products are a big challenge for automated production. Therefore, the mechanical arm is generally adopted to carry out the procedures, but the mechanical arm has low sorting efficiency (smaller parts), is single in transportation of products, cannot be suitable for parts with different lengths or for trays with different sizes, and is expensive in price and unfavorable for popularization of mechanical equipment.
Current 3225SMD base wobble plate procedure: when the base is cleaned, 5 thousands of plastic tweezers are used for manually placing 3225SMD bases on the carrying disc in a specified direction each time by an operator, and only 3225SMD bases placed in the specified direction can be put into the next glue dispensing process, and the plastic tweezers are used for manually placing 3225SMD bases, so that the efficiency is low, and the production requirement is difficult to meet. And when personnel operate, the direction of the base electrode needs to be distinguished by naked eyes, the phenomenon that the base is put reversely often occurs, and the post-engineering is caused to be defective due to the base put reversely.
Disclosure of Invention
The utility model aims to provide a novel technical scheme of a base tray arranging machine, which aims at overcoming the defects of the prior art, not only can realize continuous conveying of wafer bases one by one, but also can correct the wafer bases, and improves the tray arranging efficiency of the wafer bases.
In order to solve the technical problems, the utility model adopts the following technical scheme:
a novel base disc arranging machine comprises
A vibration plate mechanism for arranging the wafer susceptors;
and an XY axis carrying mechanism for accommodating the wafer susceptor;
the method is characterized in that:
the wafer substrates on the vibration disc mechanism are continuously swung and conveyed one by one through the reciprocating swing module, and are transferred to the XY-axis carrying mechanism after being adjusted by the position adjustment of the base position module, so that the automatic disc loading of the wafer substrates is realized; through the design of the structure, not only can the wafer bases be continuously conveyed one by one, but also the wafer bases can be righted, and the swaying efficiency of the wafer bases is improved.
Further, the reciprocating swing module comprises a motor, a transmission assembly, a swing arm, a swing strip and at least two groups of suction nozzle assemblies, the suction nozzle assemblies are arranged on the swing strip, the swing strip is connected with the transmission assembly through the swing arm, the transmission assembly is connected with the motor, the transmission assembly is driven to reciprocate through the motor, the swing arm drives the suction nozzle assemblies to reciprocate through the swing strip, continuous swing conveying of wafer bases one by one is achieved, forward and reverse movement of the transmission assembly is achieved through forward and reverse rotation of the motor, further reciprocating movement of the swing arm can be driven, and the swing strip drives the wafer bases to continuously move one by one through the suction nozzle assemblies, so that automatic control is achieved.
Further, the base righting module comprises a first top plate and a righting component, the righting component is arranged on the first top plate, the righting component and the suction nozzle component are located on the same side, the stability and reliability of the righting component installation are improved by the first top plate, the conveying requirements of the wafer base are met by the righting component and the suction nozzle component on the same side, and the efficiency of the swinging plate is improved.
Further, the normal position subassembly includes the cylinder, two at least normal position boards, two at least first slide rails and two at least normal position pieces, first slide rail is located on the first roof, normal position board is connected in first slide rail through first slider, be equipped with normal position piece on the normal position board, the cylinder is provided with the push rod, drive the push rod through the cylinder and remove, make normal position board drive normal position piece and remove, realize carrying out normal position adjustment to the wafer base, drive the push rod through the cylinder and remove, adjust normal position board's interval, satisfy the normal position requirement of different size wafer bases, treat that normal position board removes to the settlement position after, fix through normal position piece, stability and reliability that normal position board and normal position piece removed have been improved to first slide rail and first slider.
Further, the vibration dish mechanism includes first base, vibrator, vibration dish and linear conveyor, and the vibration dish passes through the vibrator and connects in first base, and the discharge end of vibration dish is located to linear conveyor, drives vibration dish vibration through the vibrator, realizes arranging the wafer base through linear conveyor.
Further, XY axle carrier mechanism includes first slip module, the second slide rail, first movable plate, second movable plate and wobble plate, first movable plate passes through second slider sliding connection in the second slide rail, first movable plate connects first slip module, the wobble plate is located on the second movable plate, the second movable plate passes through the third slider and connects in the second slip module, second slip module is located on the first movable plate, can realize through first slip module and second slip module that the wobble plate moves along X axis direction and Y axis direction, satisfy the requirement of carrying to the wobble plate, stability and reliability when first movable plate and second movable plate move have been improved to the second slide rail, second slider and third slider.
Further, still include basket elevating system, basket elevating system includes basket, push pedal and top pushing module, pushes away the module and connects in the basket, pushes away the push pedal and connect the top pushing module, drives the push pedal through the top pushing module and remove, realizes pushing away the wobble plate in the basket, is convenient for drive the wobble plate through pushing away the push pedal through the top pushing module and along vertical movement, makes the wobble plate place on the spacing groove of different height, is convenient for carry the wobble plate.
Further, a limiting groove is arranged on the inner side surface of the lifting basket and used for placing the swinging plate.
Further, still include camera detection mechanism, camera detection mechanism includes the CCD camera, CCD light source fixed block, mounting panel and stand, the CCD camera passes through the lifter block and connects in the mounting panel, the CCD light source fixed block is connected in the mounting panel, and be located the below of CCD camera, the mounting panel passes through the mounting block and connects in the stand, carry out the formation of image through the light source on CCD camera and the CCD light source fixed block to the wafer base on the linear conveyor, be convenient for carry out the righting through the base righting module to the wafer base, the height position of CCD camera can be adjusted to the lifter block, mounting panel and stand have improved the stability and the reliability of whole camera detection mechanism installation.
The disc arranging method of the novel base disc arranging machine is characterized by comprising the following steps of:
s1, firstly, placing a wafer base on a vibration disc of a vibration disc mechanism, enabling the wafer base to enter a linear conveyor through a vibrator for arrangement, and then shooting imaging of the wafer base through a camera detection mechanism;
s2, continuously swinging the wafer bases one by one through a reciprocating swing module of the feeding mechanism, and sending the wafer bases into a base righting module for righting adjustment;
s3, continuously swinging the wafer bases subjected to the positioning one by one through a reciprocating swinging module, and sending the wafer bases into a swinging disc of an XY-axis carrying mechanism for storage;
s4, conveying the swinging plate into a lifting mechanism of the basket to realize automatic conveying of the wafer base.
The method for arranging the disc is simple in steps, efficient, time-saving, high in accuracy, stable in operation and capable of effectively reducing labor cost.
Due to the adoption of the technical scheme, the utility model has the following beneficial effects:
1. the utility model not only can realize the continuous conveying of the wafer bases one by one, but also can righting the wafer bases, thereby improving the swaying efficiency of the wafer bases.
2. The motor drives the transmission component to reciprocate, so that the swing arm drives the suction nozzle component to reciprocate through the swing strip, the wafer base is continuously swung and conveyed one by one, the forward and reverse movement of the transmission component is realized by the forward and reverse rotation of the motor, the swing arm can be driven to reciprocate, and the swing strip drives the wafer base to continuously move one by one through the suction nozzle component, so that automatic control is realized.
3. The method for arranging the disc is simple in steps, efficient, time-saving, high in accuracy, stable in operation and capable of effectively reducing labor cost.
Description of the drawings:
the utility model is further described below with reference to the accompanying drawings:
FIG. 1 is an effect diagram of a wobble plate machine in a novel base wobble plate machine according to the present utility model;
FIG. 2 is a schematic diagram of a vibration plate mechanism according to the present utility model;
FIG. 3 is a schematic diagram of a camera detection mechanism according to the present utility model;
FIG. 4 is a schematic structural view of a feeding mechanism in the present utility model;
FIG. 5 is an enlarged view of a portion of the portion I of FIG. 4;
FIG. 6 is a schematic view of the structure of the direction A in FIG. 4;
FIG. 7 is a schematic diagram of the structure of the XY-axis carrying mechanism according to the present utility model;
FIG. 8 is a schematic view of a basket lift mechanism according to the present utility model;
FIG. 9 is a process flow diagram of a wobble plate method according to the present utility model.
In the figure: 1-a panel;
2-a cabinet;
3-a vibrating disk mechanism; 301-a first base; 302-a vibrator; 303-vibrating plate; 304-a linear conveyor;
4-a camera detection mechanism; 401-upright posts; 402-mounting blocks; 403-mounting plate; 404-lifting blocks; 405-CCD camera; 406-a CCD light source fixing block;
5-a feeding mechanism; 501-a second base; 502-a first support plate; 503-a first top plate; 504-wobble bar; 505-a first via; 506-a first swing arm; 507-a second through hole; 508-a bearing; 509-a guideway; 510-an electric motor; 511-support blocks; 512-suction nozzle; 513-splints; 514-cylinder; 515-first push rod; 516-a second pushrod; 517-a first righting plate; 518-a second righting plate; 519-a first slider; 520-a first slide rail; 521-positive plate; 522-a second swing arm; 523-a first drive wheel; 524-a second drive wheel; 525-a drive belt; 526-a pinch roller; 527-a second support plate;
a 6-XY axis carrying mechanism; 601-a first moving plate; 602-a second mobile plate; 603-a first sliding module; 604-a second sliding module; 605-a third support plate; 606-a second slide rail; 607-a second slider; 608-a third slider; 609-wobble plate;
7-a basket lifting mechanism; 701-a third mount; 702-a second top plate; 703-side plates; 704, a limit groove; 705-push plate; 706-pushing module.
Detailed Description
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, shall fall within the scope of the utility model.
It should be noted that the terms "first," "second," and the like in the description and claims of the present utility model and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
Referring to fig. 1 to 8, the novel base wobble plate machine of the present utility model includes a panel 1, a cabinet 2, a wobble plate mechanism 3 and an XY axis carrying mechanism 6, wherein the panel 1 is fixed on the top of the cabinet 2, and the wobble plate mechanism 3 and the XY axis carrying mechanism 6 are mounted on the panel 1.
The vibration disk mechanism 3 is used for arranging wafer pedestals, the vibration disk mechanism 3 comprises a first base 301, a vibrator 302, a vibration disk 303 and a linear conveyor 304, the vibration disk 303 is connected to the first base 301 through the vibrator 302, the linear conveyor 304 is arranged at the discharge end of the vibration disk 303, the vibration disk 303 is driven to vibrate through the vibrator 302, and the wafer pedestals are arranged through the linear conveyor 304.
The XY axis carrying mechanism 6 is used for accommodating a wafer substrate, the XY axis carrying mechanism 6 comprises a first sliding module 603, a second sliding module 604, a second sliding rail 606, a first moving plate 601, a second moving plate 602 and a swinging plate 609, the first moving plate 601 is slidably connected to the second sliding rail 606 through a second sliding block 607, the first moving plate 601 is connected with the first sliding module 603, the first moving plate 601 is driven to horizontally move through the first sliding module 603, the first moving plate 601 can move along the second sliding rail 606, the second sliding rail 606 is fixedly arranged on the panel 1 through a third supporting plate 605, the swinging plate 609 is arranged on the second moving plate 602, the second moving plate 602 is connected to the second sliding module 604 through a third sliding block 608, the swinging plate 609 can move along the X axis direction and the Y axis direction through the first sliding module 603 and the second sliding module 604, the conveying requirement on the swinging plate 609 is met, the second sliding rail 606, the second sliding block and the third sliding block 608 improve the stability and the reliability of the first moving plate 601 and the second moving plate 607 when the second moving plate 602 is moved.
The panel 1 is also provided with a feeding mechanism 5, the feeding mechanism 5 is positioned between the vibrating disc mechanism 3 and the XY-axis carrying mechanism 6, the feeding mechanism 5 comprises a reciprocating swing module and a base righting module, wafer bases on the vibrating disc mechanism 3 are continuously swung and conveyed one by one through the reciprocating swing module, and the wafer bases are transferred to the XY-axis carrying mechanism 6 after being righted through the base righting module, so that the automatic disc loading of the wafer bases is realized; through the design of the structure, not only can the successive conveying of the wafer bases be realized, but also the wafer bases can be righted, and the efficiency of the swinging disc 609 of the wafer bases is improved.
The reciprocating swing module comprises a motor 510, a transmission assembly, a swing arm, a swing strip 504 and at least two groups of suction nozzle assemblies, the suction nozzle assemblies are arranged on the swing strip 504, the swing strip 504 is connected with the transmission assembly through the swing arm, the transmission assembly is connected with the motor 510, the transmission assembly is driven to reciprocate through the motor 510, the swing arm drives the suction nozzle assemblies to reciprocate through the swing strip 504, continuous swing conveying of wafer bases one by one is achieved, forward and reverse movement of the transmission assembly is achieved through forward and reverse rotation of the motor 510, further reciprocating movement of the swing arm can be driven, and the swing strip 504 drives the wafer bases to continuously move one by one through the suction nozzle assemblies, so that automatic control is achieved. The transmission assembly comprises a first transmission wheel 523, a second transmission wheel 524 and a transmission belt 525, wherein the first transmission wheel 523 is connected with an output shaft of a motor 510, the second transmission wheel 524 is connected with a second supporting plate 527 through a mounting shaft, meanwhile, the motor 510 is also mounted on the second supporting plate 527, the first transmission wheel 523 is connected with the second transmission wheel 524 through the transmission belt 525, and the second supporting plate 527 is also provided with a pressing wheel 526 for improving the tension of the transmission belt 525. The swing arm includes first swing arm 506 and second swing arm 522, be equipped with first through-hole 505 on the swing strip 504, be equipped with the second through-hole 507 on first swing arm 506 and the second swing arm 522, the installation axle is connected to the one end of first swing arm 506, the output shaft of motor 510 is connected to the one end of second swing arm 522, all install the catch bar in the second through-hole 507 of first swing arm 506 and second swing arm 522, the catch bar passes through bearing 508 to be connected in the first through-hole 505 on the swing strip 504, drive first drive wheel 523 and second drive wheel 524 through motor 510 and rotate, realize that first swing arm 506 and second swing arm 522 drive swing strip 504 swing in step. The utility model is provided with two groups of suction nozzle assemblies, each group of suction nozzle assemblies comprises a supporting block 511, a suction nozzle 512 and a clamping plate 513, the suction nozzle 512 and the clamping plate 513 are both fixed on the supporting block 511, the supporting block 511 is connected in a guide groove 509 on the swinging strip 504, and the supporting block 511 can move along the guide groove 509 so as to meet the adjustment of the horizontal position of the suction nozzle 512. The second support plate 527 is mounted on the second base 501, and the second base 501 is mounted on the panel 1.
The base righting module comprises a first top plate 503 and a righting component, the righting component is arranged on the first top plate 503, the righting component and the suction nozzle component are positioned on the same side, the stability and reliability of the righting component installation are improved by the first top plate 503, the conveying requirements of the wafer base are met by the righting component and the suction nozzle component on the same side, and the efficiency of the swing plate 609 is improved. The first top plate 503 is fixed on the first support plate 502, and the first support plate 502 is connected to the second base 501.
The righting component comprises an air cylinder 514, at least two righting plates, at least two first sliding rails 520 and at least two righting plates 521, wherein the first sliding rails 520 are arranged on a first top plate 503, the righting plates are connected to the first sliding rails 520 through first sliding blocks 519, the righting plates 521 are provided with righting plates, the air cylinder 514 is provided with pushing rods, the pushing rods are driven by the air cylinder 514 to move, the righting plates 521 are driven by the righting plates to move, righting adjustment of wafer bases is achieved, the pushing rods are driven by the air cylinder 514 to move, the spacing between the righting plates is adjusted, righting requirements of wafer bases with different sizes are met, after the righting plates move to set positions, the righting plates are fixed through the righting plates 521, and the stability and reliability of the movement of the righting plates and the righting plates 521 are improved by the first sliding rails 520 and the first sliding blocks 519. The righting plate comprises a first righting plate 517 and a second righting plate 518, the push rod comprises a first push rod 515 and a second push rod 516, and the first push rod 515 and the second push rod 516 are driven to move through the air cylinder 514, so that the first righting plate 517 and the second righting plate 518 are pushed, and the distance between the two righting plates 521 is adjusted.
The lifting mechanism 7 of the basket is further mounted on the panel 1, the lifting mechanism 7 of the basket is located at the discharge end close to the XY axle carrying mechanism 6, the lifting mechanism 7 of the basket comprises a lifting basket, a pushing plate 705 and a pushing module 706, the pushing module 706 is connected to the lifting basket, the pushing plate 705 is connected with the pushing module 706, the pushing module 706 drives the pushing plate 705 to move, pushing of the swinging plate 609 in the lifting basket is achieved, the pushing module 706 is convenient to drive the swinging plate 609 to move vertically through the pushing plate 705, the swinging plate 609 is placed on limiting grooves 704 of different heights, and conveying of the swinging plate 609 is facilitated. The basket comprises a third base 701, a second top plate 702 and side plates 703, wherein the second top plate 702 is connected to the third base 701 through a left side plate and a right side plate 703, the second top plate 702 is communicated with the front side and the rear side of the third base 701, feeding and discharging of the tray are facilitated, the third base 701 is mounted on the panel 1, and a limiting groove 704 is formed in the inner side face of the basket and used for placing a swinging plate 609.
Still install camera detection mechanism 4 on the panel 1, camera detection mechanism 4 is close to vibration dish mechanism 3, and camera detection mechanism 4 includes CCD camera 405, CCD light source fixed block 406, mounting panel 403 and stand 401, and CCD camera 405 passes through elevating block 404 to be connected in mounting panel 403, and CCD light source fixed block 406 is connected in mounting panel 403, and is located the below of CCD camera 405, and mounting panel 403 passes through mounting block 402 to be connected in stand 401, stand 401 fixed mounting on panel 1. The wafer pedestal on the linear conveyor 304 is imaged by the CCD camera 405 and the light source on the CCD light source fixing block 406, so that the wafer pedestal is conveniently positioned by the pedestal positioning module, the lifting block 404 can adjust the height position of the CCD camera 405, and the mounting plate 403 and the upright post 401 improve the mounting stability and reliability of the whole camera detection mechanism 4.
As shown in fig. 9, the method for swinging a novel base swinging plate of the utility model comprises the following steps:
s1, firstly, placing a wafer pedestal on a vibration plate 303 of a vibration plate mechanism 3, enabling the wafer pedestal to enter a linear conveyor 304 through a vibrator 302 for arrangement, and then shooting an image of the wafer pedestal through a camera detection mechanism 4;
s2, continuously swinging wafer bases one by one through a reciprocating swinging module of a feeding mechanism 5 to send the wafer bases into a base righting module for righting adjustment, driving a transmission assembly to work through a motor 510 when the wafer bases are conveyed, enabling the transmission assembly to drive a first swinging arm 506 and a second swinging arm 522 to synchronously rotate, enabling the whole swinging strip 504 to swing to one side close to a vibrating disc mechanism 3, starting a suction nozzle assembly on one side of the swinging strip 504, which is close to the vibrating disc mechanism 3, after the swinging strip 504 swings in place, sucking the wafer bases on a linear conveyor 304 through the suction nozzle assembly, reversing the motor 510, driving the transmission assembly to reversely move, enabling the first swinging arm 506 and the second swinging arm 522 to reversely swing, driving the swinging strip 504 to swing to one side close to an XY axis carrying mechanism 6 until the swinging strip 504 swings in place, and releasing the wafer bases to the base righting module through the suction nozzle assembly on one side, which is close to the vibrating disc mechanism 3, on the swinging strip 504;
s3, continuously swinging the wafer bases after being positioned one by one through a reciprocating swinging module to be sent to a swinging disc 609 of an XY axis carrying mechanism 6 for storage, when the wafer bases are conveyed, driving a first swinging arm 506 and a second swinging arm 522 to swing through a transmission component, enabling a swinging strip 504 to swing to one side close to a vibrating disc mechanism 3, after the swinging strip 504 swings in place, sucking the wafer bases on a linear conveyor 304 through a suction nozzle component positioned on one side close to the vibrating disc mechanism 3, sucking the wafer bases after being positioned on a base positioning module, reversing the motor 510, driving the transmission component to reversely move, enabling the first swinging arm 506 and the second swinging arm 522 to reversely swing, driving the swinging strip 504 to swing on one side close to the XY axis carrying mechanism 6, enabling two wafer bases to synchronously move in the swinging process, and sending the wafer bases after being positioned to the swinging disc 609 of the XY axis carrying mechanism 6 to be orderly stored, and sending the wafer bases sucked from the linear conveyor 304 to the base positioning module to be positioned, enabling the wafer bases to be synchronously conveyed, so that the wafer bases are sucked and conveyed synchronously, and the wafer bases are continuously conveyed one by one;
s4, then the swing plate 609 is sent into the lifting mechanism 7 of the basket, so that automatic conveying of the wafer base is realized.
The method for arranging the disc 609 is simple in steps, efficient, time-saving, high in accuracy, stable in operation and capable of effectively reducing labor cost.
The above is only a specific embodiment of the present utility model, but the technical features of the present utility model are not limited thereto. Any simple changes, equivalent substitutions or modifications made on the basis of the present utility model to achieve substantially the same technical effects are included in the scope of the present utility model.

Claims (9)

1. A novel base disc arranging machine comprises
A vibration plate mechanism for arranging the wafer susceptors;
and an XY axis carrying mechanism for accommodating the wafer susceptor;
the method is characterized in that:
the wafer tray is characterized by further comprising a feeding mechanism, wherein the feeding mechanism comprises a reciprocating swing module and a base righting module, the wafer bases on the vibration tray mechanism are continuously swung and conveyed one by one through the reciprocating swing module, and the wafer bases are transferred to the XY-axis carrying mechanism after righting adjustment of the base righting module, so that the automatic tray loading of the wafer bases is realized.
2. The novel base wobble plate machine according to claim 1, wherein: the reciprocating swing module comprises a motor, a transmission assembly, a swing arm, a swing strip and at least two groups of suction nozzle assemblies, wherein the suction nozzle assemblies are arranged on the swing strip, the swing strip is connected with the transmission assembly through the swing arm, the transmission assembly is connected with the motor, the motor drives the transmission assembly to reciprocate, so that the swing arm drives the suction nozzle assemblies to reciprocate through the swing strip, and continuous swing conveying of wafer bases one by one is realized.
3. The novel base wobble plate machine according to claim 2, wherein: the base righting module comprises a first top plate and a righting component, wherein the righting component is arranged on the first top plate, and the righting component and the suction nozzle component are positioned on the same side.
4. A novel base wobble plate machine according to claim 3, wherein: the positive position assembly comprises an air cylinder, at least two positive position plates, at least two first sliding rails and at least two positive position plates, wherein the first sliding rails are arranged on the first top plate, the positive position plates are connected to the first sliding rails through first sliding blocks, the positive position plates are provided with push rods, the air cylinder is provided with push rods, and the push rods are driven to move through the air cylinder, so that the positive position plates drive the positive position plates to move, and positive position adjustment of the wafer base is achieved.
5. A novel base wobble plate machine according to any one of claims 1 to 4, characterized in that: the vibration disk mechanism comprises a first base, a vibrator, a vibration disk and a linear conveyor, wherein the vibration disk is connected to the first base through the vibrator, the linear conveyor is arranged at the discharge end of the vibration disk, and the vibration disk is driven to vibrate through the vibrator so as to realize arrangement of the wafer base through the linear conveyor.
6. A novel base wobble plate machine according to any one of claims 1 to 4, characterized in that: XY axle carrier mechanism includes first slip module, second slide rail, first movable plate, second movable plate and wobble plate, first movable plate pass through second slider sliding connection in the second slide rail, first movable plate is connected first slip module, the wobble plate is located on the second movable plate, the second movable plate pass through the third slider connect in the second slip module, the second slip module is located on the first movable plate.
7. The novel base wobble plate machine according to claim 6, wherein: still include basket elevating system, basket elevating system includes basket, push pedal and pushes away the module, push away the module connect in the basket, push pedal connects push away the module, through push away the module drive push pedal removes, realizes to push away in the basket the wobble plate is pushed away.
8. The novel base wobble plate machine as set forth in claim 7, wherein: and a limiting groove is formed in the inner side surface of the lifting basket and used for placing the swinging plate.
9. A novel base wobble plate machine according to any one of claims 1 to 4, characterized in that: still include camera detection mechanism, camera detection mechanism includes CCD camera, CCD light source fixed block, mounting panel and stand, the CCD camera pass through the elevating block connect in the mounting panel, the CCD light source fixed block connect in the mounting panel, and be located the below of CCD camera, the mounting panel pass through the installation piece connect in the stand.
CN202320537862.2U 2023-03-15 2023-03-15 Novel base disc arranging machine Active CN219728607U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320537862.2U CN219728607U (en) 2023-03-15 2023-03-15 Novel base disc arranging machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320537862.2U CN219728607U (en) 2023-03-15 2023-03-15 Novel base disc arranging machine

Publications (1)

Publication Number Publication Date
CN219728607U true CN219728607U (en) 2023-09-22

Family

ID=88029262

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320537862.2U Active CN219728607U (en) 2023-03-15 2023-03-15 Novel base disc arranging machine

Country Status (1)

Country Link
CN (1) CN219728607U (en)

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