CN219716969U

CN219716969U - Semiconductor radiator

Info

Publication number: CN219716969U
Application number: CN202320119609.5U
Authority: CN
Inventors: 雷胜
Original assignee: Wuxi Yuannuo Electronic Technology Co ltd
Current assignee: Wuxi Yuannuo Electronic Technology Co ltd
Priority date: 2023-01-31
Filing date: 2023-01-31
Publication date: 2023-09-19
Anticipated expiration: 2033-01-31

Abstract

The utility model discloses a semiconductor radiator, which comprises a heat conduction component, wherein the heat conduction component comprises a heat conduction plate attached to the back surface of a mobile phone, a heat conduction copper plate is arranged on the heat conduction plate, a shell is arranged on the heat conduction plate, a heat dissipation component is arranged in the shell, the shell comprises a shell body arranged on the heat conduction plate, a connecting plate is arranged on the inner side of the shell body, a semiconductor refrigerating sheet is arranged on the lower side of the heat dissipation component, a control circuit component is arranged on the outer side of the semiconductor refrigerating sheet on the shell body, the heat dissipation component comprises a plurality of annular heat dissipation fin groups, and a heat dissipation fan is arranged in one annular heat dissipation fin group. According to the utility model, through the cooperation of the shell and the heat dissipation component, the air inlet and ventilation are performed by using the diversion holes and the ventilation holes on the inclined side surfaces which are distributed in a ring shape, and the ventilation holes and the diversion holes are not on the same plane, so that the blocking is difficult, and the damage to the electronic element guide member caused by overhigh temperature can be avoided.

Description

Semiconductor radiator

Technical Field

The utility model relates to the technical field of semiconductor radiators, in particular to a semiconductor radiator.

Background

Because of the reasons such as battery or hardware of the mobile phone, the mobile phone is easy to heat and scald after long-time use, the mobile phone is easy to damage, a radiator is arranged outside the mobile phone generally, the equipment solves the problem that the mobile phone is used for long-term treatment of high-energy heating under an abnormal working state and applies a semiconductor refrigerating piece, so as to realize high-energy refrigeration, thereby ensuring normal work of the mobile phone and game machine. The semiconductor radiator is characterized in that a semiconductor refrigerating sheet is generally adopted to cool the mobile phone, a high-speed fan is arranged at a heat radiating air inlet at the hot end to drive airflow to flow so as to radiate the heat radiating fins, but because the heat radiating air inlets are positioned on the same plane, the possibility of careless blocking of operators exists in the use process, the heat radiating effect is influenced, the internal temperature of the electronic element is increased, and the electronic element is burnt.

Disclosure of Invention

The present utility model is directed to a semiconductor heat sink, which solves the above-mentioned problems.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor radiator, includes the heat conduction subassembly, be provided with the shell on the heat conduction subassembly, be provided with the radiator unit in the shell, the downside of radiator unit is provided with the semiconductor refrigeration piece, the outside of semiconductor refrigeration piece is provided with control circuit assembly on the shell, the radiator unit includes a plurality of annular fin group, one be provided with radiator fan in the annular fin group.

Preferably, the heat conduction assembly comprises a heat conduction plate attached to the back of the mobile phone, a heat conduction copper plate is arranged on the heat conduction plate, and a shell is arranged on the heat conduction plate.

Preferably, the shell comprises a shell body arranged on the heat conducting plate, a connecting plate is arranged on the inner side of the shell body, the heat radiating component is arranged on the inner side of the connecting plate, a plurality of vent holes are formed in the shell body, and a partition plate is arranged on the upper side of the connecting plate on the shell body.

Preferably, the control circuit assembly is arranged on the connecting plate, and the control circuit assembly consists of a controller and a temperature sensor.

Preferably, the annular radiating fin groups are composed of radiating fins distributed in a plurality of annular shapes, the inner sides of two adjacent annular radiating fin groups are provided with heat conducting annular plates, and the two outermost annular radiating fin groups are provided with heat conducting fins.

Preferably, a spacer ring is arranged on the inner side of the innermost annular radiating fin group, the radiating fan is arranged on the spacer ring, a plurality of diversion holes are formed in the upper side of the heat conducting ring plate, and the lower side of the heat conducting ring plate is fixedly connected with the partition plate.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, through the cooperation of the shell and the heat dissipation component, the air inlet and ventilation are performed by using the diversion holes and the ventilation holes on the inclined side surfaces which are distributed in a ring shape, and as the ventilation holes and the diversion holes are not on the same plane, the blocking is not easy, and the overhigh temperature can be avoided;

2. the utility model can control the work of the semiconductor refrigerating sheet and the cooling fan correspondingly by the cooperation of the semiconductor refrigerating sheet, the control circuit component and the cooling fan, thereby realizing automatic temperature regulation and control and avoiding overhigh temperature.

Drawings

FIG. 1 is a perspective view of a first view of the present utility model;

FIG. 2 is a schematic view of a second perspective view of the present utility model;

FIG. 3 is a perspective view of a third perspective view of the present utility model;

fig. 4 is an exploded view of a fourth view of the present utility model.

In the figure: 1. a heat conducting component; 11. a heat conductive plate; 12. a thermally conductive copper plate; 2. a housing; 21. a housing; 22. a connecting plate; 23. a partition plate; 3. a heat dissipation assembly; 31. a heat radiation fin; 32. a heat conducting annular plate; 33. a heat conductive sheet; 34. a spacer ring; 4. a semiconductor refrigeration sheet; 5. a control circuit assembly; 6. a heat radiation fan; 7. a deflector aperture; 8. and (3) a vent hole.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides a technical solution: the semiconductor radiator comprises a heat conduction component 1, wherein a shell 2 is arranged on the heat conduction component 1, a heat radiation component 3 is arranged in the shell 2, a semiconductor refrigerating sheet 4 is arranged on the lower side of the heat radiation component 3, a control circuit component 5 is arranged on the outer side of the semiconductor refrigerating sheet 4 on the shell 2, the heat radiation component 3 comprises a plurality of annular heat radiation fin groups, and a heat radiation fan 6 is arranged in one annular heat radiation fin group;

the heat conduction assembly 1 comprises a heat conduction plate 11 attached to the back of the mobile phone, a heat conduction copper plate 12 is arranged on the heat conduction plate 11, and a shell 2 is arranged on the heat conduction plate 11; the shell 2 comprises a shell 21 which is arranged on the heat-conducting plate 11 through bolts, a connecting plate 22 is arranged on the inner side of the shell 21 through bolts, the heat radiation component 3 is arranged on the inner side of the connecting plate 22, a plurality of vent holes 8 are formed in the shell 21, and a separation plate 23 is arranged on the upper side of the connecting plate 22 on the shell 21 through bolts; the control circuit assembly 5 is arranged on the connecting plate 22, the control circuit assembly 5 consists of a controller and a temperature sensor, and the controller consists of STM32 series core plates, a power supply module and other units; the three annular radiating fin groups are composed of a plurality of radiating fins 31 which are distributed annularly, the inner sides of the two adjacent annular radiating fin groups are provided with heat conducting annular plates 32, and the two outermost annular radiating fin groups are provided with heat conducting fins 33; the separation ring 34 is arranged on the inner side of the innermost annular radiating fin group, the radiating fan 6 is arranged on the separation ring 34, a plurality of diversion holes 7 are formed in the upper side heat conducting annular plate 32, and the lower side heat conducting annular plate 32 is welded with the separation plate 23.

Working principle: when the semiconductor cooling fin device is used, the working temperature is set by the controller, the temperature sensor is used for measuring the temperature, the corresponding semiconductor cooling fin 4 and the cooling fan 6 are controlled to work, the automatic temperature regulation and control are realized, when the temperature is abnormal, the semiconductor cooling fin 4 stops working, the cooling fan 6 continuously works, damage to electronic elements caused by overhigh temperature is avoided, when the semiconductor cooling fin device works, the semiconductor cooling fin 4 refrigerates, the heat conducting plate 11 exchanges heat, the mobile phone is cooled, the heat generated by the semiconductor cooling fin 4 is transferred to the heat radiating component 3, the cooling fan 6 works, the air flow is driven to carry out the ventilation hole 8 and the diversion hole 7, the heat conducting annular plate 32 and the heat conducting fin 33 are used for radiating, and the annular distributed diversion hole 7 and the ventilation hole 8 are used for carrying out air intake and ventilation.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor heat sink comprising a thermally conductive assembly (1), characterized in that: the heat conduction device is characterized in that a shell (2) is arranged on the heat conduction component (1), a heat dissipation component (3) is arranged in the shell (2), a semiconductor refrigerating sheet (4) is arranged on the lower side of the heat dissipation component (3), a control circuit component (5) is arranged on the outer side of the semiconductor refrigerating sheet (4) on the shell (2), the heat dissipation component (3) comprises a plurality of annular heat dissipation fin groups, and a heat dissipation fan (6) is arranged in each annular heat dissipation fin group.

2. A semiconductor heat sink according to claim 1, wherein: the heat conduction assembly (1) comprises a heat conduction plate (11) attached to the back of the mobile phone, a heat conduction copper plate (12) is arranged on the heat conduction plate (11), and a shell (2) is arranged on the heat conduction plate (11).

3. A semiconductor heat sink according to claim 2, wherein: the shell (2) comprises a shell (21) arranged on the heat-conducting plate (11), a connecting plate (22) is arranged on the inner side of the shell (21), the heat radiating component (3) is arranged on the inner side of the connecting plate (22), a plurality of ventilation holes (8) are formed in the shell (21), and a partition plate (23) is arranged on the upper side of the connecting plate (22) on the shell (21).

4. A semiconductor heat sink according to claim 3, wherein: the control circuit assembly (5) is arranged on the connecting plate (22), and the control circuit assembly (5) consists of a controller and a temperature sensor.

5. A semiconductor heat sink as defined in claim 4, wherein: the three annular radiating fin groups are composed of a plurality of radiating fins (31) which are distributed annularly, the inner sides of two adjacent annular radiating fin groups are provided with heat conducting annular plates (32), and the two outermost annular radiating fin groups are provided with heat conducting fins (33).

6. A semiconductor heat sink as defined in claim 5, wherein: the innermost side the annular fin group inboard is provided with separating ring (34), radiator fan (6) set up on separating ring (34), the upside be provided with a plurality of water conservancy diversion hole (7) on heat conduction annular plate (32), downside heat conduction annular plate (32) and division board (23) fixed connection.