CN219716846U - Semiconductor protection frame, semiconductor assembly and frequency converter - Google Patents
Semiconductor protection frame, semiconductor assembly and frequency converter Download PDFInfo
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- CN219716846U CN219716846U CN202320183541.7U CN202320183541U CN219716846U CN 219716846 U CN219716846 U CN 219716846U CN 202320183541 U CN202320183541 U CN 202320183541U CN 219716846 U CN219716846 U CN 219716846U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 121
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000428 dust Substances 0.000 abstract description 5
- 239000002245 particle Substances 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004660 morphological change Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Abstract
The utility model relates to a semiconductor protection frame, a semiconductor assembly and a frequency converter, which comprise a body and a connecting part, wherein the connecting part is fixed at one end of the body, the connecting part is provided with at least two bosses which are arranged at intervals, each boss is provided with a through hole for a pin of a semiconductor device to pass through, and a baffle is arranged between every two adjacent bosses. The semiconductor assembly includes a semiconductor device and a semiconductor protection frame as described above. The frequency converter comprises a circuit board and the semiconductor assembly as described above. Through the setting of boss and baffle of semiconductor protection frame, can guarantee the safety margin between the semiconductor device pin, the structure setting of boss can prevent tiny particle backlog such as dust between the pin, and the setting of baffle can cut off the welding leg, increases the safety margin between the pin, can guarantee the security performance of semiconductor device.
Description
Technical Field
The utility model relates to the technical field of power electronics, in particular to a semiconductor protection frame, a semiconductor component and a frequency converter.
Background
In the frequency converter, a plurality of semiconductor devices, such as an IGBT single tube or a MOS single tube, are generally required, and the single tube has a small size, so that the frequency converter has a large flexibility in operation and is widely used in a low-power frequency converter. In the prior art, a single tube penetrates through a circuit board through pins, the prior single tube basically can meet the requirement of An Guiju separation between adjacent pins of the single tube due to the reduced volume, but in actual use, dust is easy to accumulate between the pins, so that the safety distance between the actual pins is insufficient, the bad problems such as short circuit and the like are caused, and even the potential safety hazard of a frying machine occurs.
Disclosure of Invention
The utility model aims to provide a semiconductor protection frame, a semiconductor component and a frequency converter, which are used for solving the problems of short circuit and the like caused by insufficient safety distance between single-tube pins in the prior art.
To achieve the object, a first aspect of the present utility model provides a semiconductor protection frame, which comprises a body and a connecting portion, wherein the connecting portion is fixed at one end of the body, the connecting portion is provided with at least two bosses which are arranged at intervals, the bosses are provided with through holes for the pins of a semiconductor device to pass through, and a baffle is arranged between every two adjacent bosses.
Further, the body is provided with a limit column, and the limit column is used for being embedded into the positioning hole of the semiconductor device to prevent the semiconductor device from falling off from the semiconductor protection frame.
Further, the connecting portion comprises a first bottom plate, the boss is arranged on one side of the first bottom plate, and the baffle is arranged between adjacent bosses and penetrates through the first bottom plate.
Further, the body includes first base plate and first curb plate, first curb plate encloses first base plate side, and be in first base plate one side forms the cavity, connecting portion first bottom plate connect in the cavity, the boss deviates from first curb plate direction sets up.
Further, the connecting portion comprises a second bottom plate, the boss is arranged on one side of the second bottom plate, the baffle is arranged between adjacent bosses and penetrates through the second bottom plate, one side, deviating from the direction of the boss, of the second bottom plate is provided with an end plate, and the end plate and the baffle enclose to form a cavity.
Further, the body is provided with a second substrate and a second protection plate, the second substrate is connected with the second protection plate to form a containing cavity with two open sides, the second bottom plate of the connecting part is connected with one side opening of the containing cavity, and the cavity is arranged in the containing cavity.
Further, a clamping hook is arranged on the baffle and used for being clamped with an external device.
In a second aspect, a semiconductor assembly is provided, including a semiconductor device and a semiconductor protection frame as described above, where pins of a die of the semiconductor device penetrate through holes of the boss, and the semiconductor device is fixed to the semiconductor protection frame through positioning holes and the limiting columns.
In a third aspect, a frequency converter is provided, including a circuit board and a semiconductor component as described above, where a clearance hole and a clearance groove are provided on the circuit board, pins of the semiconductor component penetrate through the clearance hole, and a baffle of the semiconductor component penetrates through the clearance groove.
Further, the semiconductor device further comprises a heat sink, the semiconductor component is fixed on the heat sink, and the circuit board is fixed on the heat sink.
The utility model has the beneficial effects that: through the setting of boss and baffle of semiconductor protection frame, can guarantee the safety margin between the semiconductor device pin, the structure setting of boss can prevent tiny particle backlog such as dust between the pin, and the setting of baffle can cut off the welding leg, increases the safety margin between the pin, can guarantee the security performance of semiconductor device. Different structures of the protective frames are arranged according to the form change of the single tube, and the protective frame is convenient to install, simple to assemble, compatible with different single tube structures and high in universality.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a semiconductor protection frame according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a semiconductor protection frame connection portion according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of a semiconductor protection frame according to an embodiment of the present utility model;
FIG. 4 is a schematic diagram of a semiconductor device according to an embodiment of the present utility model;
FIG. 5 is a schematic diagram illustrating a structure of a semiconductor protection frame according to another embodiment of the present utility model;
FIG. 6 is a schematic structural diagram of a semiconductor protection frame connecting portion according to another embodiment of the present utility model;
FIG. 7 is a schematic diagram illustrating a structure of a semiconductor protection frame according to another embodiment of the present utility model;
FIG. 8 is a schematic diagram of a semiconductor device according to another embodiment of the present utility model;
fig. 9 is a schematic view showing a structure in which a semiconductor device is mounted to a heat sink according to an embodiment of the present utility model;
fig. 10 is a schematic structural view of a circuit board mounted to a heat sink according to an embodiment of the present utility model.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the utility model.
Furthermore, the terms "first," second, "" third, "" fourth, "and fifth" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying a number of technical features being indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The implementation of the present utility model will be described in detail below with reference to specific embodiments.
Referring to fig. 1-3, in an embodiment of the present utility model, a semiconductor protection frame is provided, a body 1 and a connection portion 2 are provided, the connection portion 2 is fixed at one end of the body 1, the connection portion 2 is provided with at least two bosses 22 arranged at intervals, the bosses 22 are provided with through holes 221 for pins of a semiconductor device to pass through, a baffle plate 23 is provided between adjacent bosses 22, and a hook 231 is provided on the baffle plate 23 for being clamped with an external device. The body 1 and the connecting portion 2 may be integrally formed or may be separately mounted, which is not limited herein. It can be understood that through the setting of boss and baffle, can guarantee the safety distance between the semiconductor device pin, the structure setting of boss can prevent tiny particle backlog such as dust between the pin, and the setting of baffle can cut off the leg, increases the safety distance between the pin, can guarantee the security performance of semiconductor device. The body 1 is also provided with a limit column 11, and the limit column 11 is used for being embedded into a positioning hole of a semiconductor to prevent the semiconductor device from falling off from the semiconductor protection frame.
Alternatively, the semiconductor device may be configured as a MOS transistor (abbreviated as a mosfet), an insulated gate bipolar transistor, or the like, including a die and pins, and the number of bosses is set depending on the number of pins, typically 3 pins per single tube, so that in this embodiment, the number of bosses is set to 3, and the number of bosses may be determined according to the number of pins per single tube, which is not limited herein.
It can be understood that the semiconductor protection frame can be embedded into the positioning hole of the semiconductor device through the limiting post 11, so that the semiconductor device is fixed on the semiconductor protection frame, and the semiconductor is prevented from falling off the semiconductor protection frame. The semiconductor device can be quickly arranged on the semiconductor protection frame to form a semiconductor assembly, and then the semiconductor assembly is arranged on other parts, so that the installation is convenient and simple, and the production and installation efficiency is improved.
In one embodiment, the angle between the die and the lead structure of the single tube is generally different, referring to fig. 4, the angle between the die 10 and the lead 101 is 90 degrees, referring to fig. 2, the connection portion 2 includes a first bottom plate 21, a boss 22 is disposed on one side of the first bottom plate 21, a baffle 23 is disposed between adjacent bosses 22 and penetrates through the first bottom plate 21, and the boss 22 is provided with a through hole 221 for passing the lead of the semiconductor device. The body 1 comprises a first base plate 12 and a first side plate 13, the first side plate 13 is enclosed on the side edge of the first base plate 12, a cavity 14 is formed on one side of the first base plate 12, a first bottom plate 21 of the connecting part 2 is connected to the cavity 14, and a boss 22 is arranged away from the direction of the first side plate 13. The body and the connecting portion may be integrally formed or may be separately installed, which is not limited herein. Referring to fig. 4, the semiconductor device is mounted on the semiconductor protection frame, the pins penetrate through the boss 22, the body 1 covers the die of the semiconductor device, and the limit posts are embedded into the positioning holes of the semiconductor device, so that the semiconductor device is fixed on the semiconductor protection frame, the mounting is convenient and easy, and the mounting production efficiency is improved.
In another embodiment, referring to fig. 8, the angle between the die 20 and the pins 201 is 180 degrees, referring to fig. 5 to 8, the connection portion 4 includes a second bottom plate 41, the boss 42 is disposed on one side of the second bottom plate 31, the baffle 43 is disposed between adjacent bosses 42 and penetrates through the second bottom plate 31, an end plate 44 is disposed on one side of the second bottom plate 41 facing away from the boss 42, and the end plate 44 and the baffle enclose a cavity 45. The boss 42 is provided with a second through hole 421 for the passage of a pin of the semiconductor device. The body 3 is provided with a second base plate 32 and a second protection plate 33, the second base plate 32 and the second protection plate 33 are connected to form a containing cavity 34 with two open sides, a second bottom plate 41 of the connecting part 4 is connected to one open side of the containing cavity 34, and a cavity 45 is arranged in the containing cavity 34. Referring to fig. 8, the semiconductor device is mounted on the semiconductor protection frame, the pins penetrate through the boss, the part of the die is accommodated in the accommodating cavity of the body, and the limit posts are embedded into the positioning holes of the semiconductor device, so that the semiconductor device is fixed on the semiconductor protection frame, the mounting is convenient and easy, and the assembly production efficiency is improved.
It can be understood that the above two embodiments set up the structure of different protection frames according to the morphological change of single tube, and simple to operate, the assembly is simple, can compatible different single tube structures, and the commonality is strong.
The embodiment of the utility model also provides a semiconductor assembly 100, referring to fig. 1-4, which comprises a semiconductor device 10 and the semiconductor protection frame provided by any of the embodiments above, wherein pins of a semiconductor device die penetrate through holes 221 of a boss 22, and the semiconductor device 10 is fixed on the semiconductor protection frame through positioning holes and limiting columns 11.
The utility model also provides a frequency converter, which comprises a circuit board 50 and the semiconductor component 100 provided by any embodiment, wherein the circuit board is provided with a clearance hole 501 and a clearance groove 502, pins of the semiconductor component penetrate through the clearance hole 501, a baffle of the semiconductor component penetrates through the clearance groove 502 and is clamped with the clearance groove 502 through a clamping hook so as to be fixed on the circuit board 50. In this embodiment, the semiconductor device passes through the pin and runs through in keeping away the position hole 501 to with the welding of circuit board realizes electric connection, through setting up keeping away position hole and keeping away the position groove on the circuit board and can fix a position fast, reduces the assembly degree of difficulty of circuit board and semiconductor component, helps improving assembly efficiency.
In one embodiment, the semiconductor package further includes a heat sink 60, and the semiconductor package is fixed to the heat sink 60, and the circuit board 50 is fixed to the heat sink by screws. In this embodiment, the semiconductor device 100 is divided into a corner semiconductor device and a flat semiconductor device according to the bending direction of the leads, and the heat sink is provided with a plurality of corner semiconductor devices and a plurality of flat semiconductor devices 300, which can be specifically set according to practical situations, and is not limited herein.
The radiator base is used for radiating the semiconductor device, the semiconductor device is fixed on the radiator base through the overheat pressing process, the heat conducting insulating film 601 is used between the semiconductor device and the radiator, and the heat conducting insulating film is made of special materials and has the functions of radiating and insulating. The heat sink base is provided with positioning posts 602 which penetrate through the through holes on the circuit board for positioning and are fixed on the heat sink base through screws. The installation is convenient, the universality is strong, and the problem of insufficient safety distance caused by dust accumulation can be effectively solved.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. Any combination of all the embodiments provided in the present utility model is within the protection scope of the present utility model, and will not be described herein.
The semiconductor protection frame, the semiconductor component and the frequency converter provided by the utility model are described in detail above. The principles and embodiments of the present utility model have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present utility model and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the utility model can be made without departing from the principles of the utility model and these modifications and adaptations are intended to be within the scope of the utility model as defined in the following claims.
Claims (10)
1. A semiconductor protection frame, comprising: the semiconductor device comprises a body and a connecting part, wherein the connecting part is fixed at one end of the body, the connecting part is provided with at least two bosses which are arranged at intervals, each boss is provided with a through hole for the pins of the semiconductor device to pass through, and a baffle is arranged between every two adjacent bosses.
2. The semiconductor protection frame according to claim 1, wherein the body is provided with a limit post, and the limit post is used for being embedded into a positioning hole of the semiconductor device to prevent the semiconductor device from falling off the semiconductor protection frame.
3. The semiconductor protection frame according to claim 2, wherein the connection portion comprises a first bottom plate, the boss is disposed on one side of the first bottom plate, and the baffle is disposed between adjacent bosses and penetrates through the first bottom plate.
4. The semiconductor protection frame according to claim 3, wherein the body comprises a first substrate and a first side plate, the first side plate is enclosed on the side of the first substrate, a cavity is formed on the side of the first substrate, the first bottom plate of the connecting portion is connected to the cavity, and the boss is arranged away from the direction of the first side plate.
5. The semiconductor protection frame according to claim 2, wherein the connecting portion comprises a second bottom plate, the boss is arranged on one side of the second bottom plate, the baffle is arranged between adjacent bosses and penetrates through the second bottom plate, an end plate is arranged on one side, away from the boss, of the second bottom plate, and the end plate and the baffle enclose a cavity.
6. The semiconductor protection frame according to claim 5, wherein the body is provided with a second base plate and a second protection plate, the second base plate and the second protection plate are connected to form a containing cavity with two open sides, the second bottom plate of the connecting part is connected to one open side of the containing cavity, and the cavity is arranged in the containing cavity.
7. The semiconductor protection frame according to claim 1, wherein the baffle is provided with a hook for being clamped with an external device.
8. A semiconductor assembly comprising a semiconductor device and a semiconductor protection frame according to any one of claims 1 to 7, wherein pins of the semiconductor device extend through holes of the boss.
9. The frequency converter is characterized by comprising a circuit board and the semiconductor assembly according to claim 8, wherein a clearance hole and a clearance groove are formed in the circuit board, pins of the semiconductor assembly penetrate through the clearance hole, and a baffle of the semiconductor assembly penetrates through the clearance groove.
10. The frequency converter of claim 9, further comprising a heat sink, wherein the semiconductor assembly is secured to the heat sink, and wherein the circuit board is secured to the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320183541.7U CN219716846U (en) | 2023-01-31 | 2023-01-31 | Semiconductor protection frame, semiconductor assembly and frequency converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320183541.7U CN219716846U (en) | 2023-01-31 | 2023-01-31 | Semiconductor protection frame, semiconductor assembly and frequency converter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219716846U true CN219716846U (en) | 2023-09-19 |
Family
ID=88014845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320183541.7U Active CN219716846U (en) | 2023-01-31 | 2023-01-31 | Semiconductor protection frame, semiconductor assembly and frequency converter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219716846U (en) |
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2023
- 2023-01-31 CN CN202320183541.7U patent/CN219716846U/en active Active
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