CN216721157U - Semiconductor device module and frequency converter - Google Patents

Abstract

The application belongs to the technical field of semiconductors, provides a semiconductor device module and converter, and the semiconductor device module includes: a substrate; the semiconductor device comprises a tube core arranged on one side of the substrate and three pins arranged on the tube core at intervals; the protective cover covers one side of the substrate, which is provided with the tube core, and is detachably connected with the substrate; the tube core is arranged between the protective cover and the substrate; the protective cover is provided with a plurality of first avoiding holes at intervals, and each pin penetrates through each first avoiding hole; the first clamping hook is arranged on one side, back to the substrate, of the protective cover and clamped with an external driving plate. The frequency converter comprises a semiconductor device module. Through adopting above-mentioned technical scheme, saved the required bolt quantity of semiconductor device module assembly in the semiconductor device module assembling process, on the drive plate assembles to the semiconductor device module for semiconductor device possesses better dismouting convenience, helps improving semiconductor device's maintenance convenience.

Description

Semiconductor device module and frequency converter

Technical Field

The application belongs to the technical field of semiconductors, and more particularly relates to a semiconductor device module and a frequency converter.

Background

In a frequency converter, a plurality of semiconductor devices, such as MOS transistors, are generally required to be mounted in the following manner: firstly, arranging a plurality of MOS tubes on a substrate at intervals, arranging a pressing strip on two or three MOS tubes, and fixing each pressing strip on the substrate by adopting a bolt so that the pressing strips press the MOS tubes on the substrate; and then, fixing the drive plate on the substrate by adopting a bolt, so that pins of the MOS tube are inserted into the drive plate.

In general, one pressing bar and one driving plate can be fixed only by at least two bolts, and when the number of MOS (metal oxide semiconductor) tubes is large, more bolts are needed; so, too much use of bolt for semiconductor device's installation operation when the installation is very loaded down with trivial details, makes semiconductor device's dismouting convenience relatively poor, is unfavorable for semiconductor device's maintenance work.

SUMMERY OF THE UTILITY MODEL

One of the purposes of the embodiment of the application is as follows: the utility model provides a semiconductor device module, aims at solving among the prior art, and the semiconductor device uses too much bolt to lead to its dismouting convenience poor technical problem when the installation.

In order to solve the technical problem, the embodiment of the application adopts the following technical scheme:

provided is a semiconductor device module including:

a substrate;

the semiconductor device comprises a tube core arranged on one side of the substrate and three pins arranged on the tube core at intervals;

the protective cover is covered on one side of the substrate, which is provided with the tube core, and is detachably connected with the substrate; the tube core is arranged between the substrate and the protective cover; the protective cover is provided with a plurality of first avoiding holes at intervals, and each pin penetrates through each first avoiding hole;

the first clamping hook is arranged on one side, back to the substrate, of the protective cover to be clamped with an external driving plate.

In one embodiment, the protective cover comprises a cover plate and a second clamping hook arranged on the cover plate, and the cover plate is arranged on the base plate in a covering mode; the base plate is provided with a clamping groove, and the second clamping hook is clamped in the clamping groove.

In one embodiment, the protective cover further includes a guard rail disposed around the cover plate and extending to the substrate, and the die is accommodated in a space defined by the guard rail, the second hook, the cover plate and the substrate.

In one embodiment, the protective cover is provided with first fixing holes which are distributed at intervals with the first avoiding holes, and the substrate is provided with second fixing holes which are distributed at intervals with the tube cores; the first fixing hole corresponds to the second fixing hole, and a fixing piece is locked in the first fixing hole and the second fixing hole.

In one embodiment, at least two blocking pieces are arranged on one side of the protective cover opposite to the substrate at intervals, and each blocking piece is arranged between two adjacent first avoiding holes to separate three pins of the semiconductor device.

In one embodiment, a plurality of first protruding columns are arranged on one side of the protective cover opposite to the substrate at intervals, each first avoiding hole penetrates through each first protruding column, and the blocking piece is arranged between two adjacent first protruding columns and exceeds the first protruding columns.

In one embodiment, the substrate includes a board body and a thermally conductive and insulating pad disposed on the board body, the die and the thermally conductive and insulating pad are disposed on the same side of the board body, and the die is disposed on the thermally conductive and insulating pad.

In one embodiment, the semiconductor device module further comprises a temperature control device, the temperature control device comprises a main body part and a solder leg arranged on the main body part, and the main body part and the die are arranged on the same side of the substrate; the protective cover is provided with second avoidance holes which are distributed at intervals with the first avoidance holes, and the welding feet penetrate through the second avoidance holes.

In one embodiment, a side of the protective cover facing away from the substrate is provided with second protruding pillars spaced apart from the first avoiding holes, and the second avoiding holes penetrate through the second protruding pillars.

The embodiment also provides a frequency converter which comprises the semiconductor device module.

The semiconductor device module provided by the embodiment of the application has the beneficial effects that: compared with the prior art, in the application, the tube core is fixed on one side of the substrate, the protective cover cap is arranged on one side of the substrate, which is provided with the tube core, and is detachably connected with the substrate, so that the tube core is limited and protected between the substrate and the protective cover, and the semiconductor device is mounted in the semiconductor device module, therefore, a plurality of pressing strips are not needed to be arranged when the semiconductor device is mounted, the use of bolts is facilitated to be reduced, and the operation time required by the mounting of the semiconductor device is reduced; and, be equipped with first trip on the protection casing, then protection casing accessible first trip joint in outside drive plate to form with the drive plate and be connected, at this moment, semiconductor device's pin can pass keeps away the position hole and insert and connect to the drive plate, like this, has also saved the use of bolt, and has simplified the grafting operation between semiconductor device and the drive plate. Therefore, the semiconductor device module provided by the embodiment reduces the use of bolts, so that the semiconductor device has better disassembly and assembly convenience, and the maintenance convenience of the semiconductor device is improved. Correspondingly, the converter that this embodiment provided also has the advantage that the dismouting is convenient, the maintenance is convenient.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic view of a semiconductor device module provided in an embodiment of the present application in cooperation with a driving board;

fig. 2 is a schematic diagram of a semiconductor device module according to an embodiment of the present disclosure;

FIG. 3 is an exploded view of FIG. 2;

fig. 4 is a schematic view of a protective cover of the semiconductor device module provided in fig. 2;

FIG. 5 is an enlarged view of a portion of FIG. 4 at A;

FIG. 6 is a partial schematic view of the semiconductor device module provided in FIG. 2;

fig. 7 is a partially enlarged view of fig. 3 at B.

Wherein, in the figures, the respective reference numerals:

1-a substrate; 101-a card slot; 102-a second fixing hole; 11-a plate body; 12-a thermally conductive insulating pad; 2-a semiconductor device; 21-die; 22-pin; 3-a protective cover; 301-a first clearance hole; 302-a first fixation hole; 303-second avoidance holes; 31-a cover plate; 32-a second hook; 33-a guard rail; 34-a baffle plate; 35-a first boss; 36-a second post; 4-a first hook; 5-a temperature control device; 51-a body portion; 52-solder feet; 6-driving the board.

Detailed Description

Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative and intended to explain the present application and should not be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be considered as limiting.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise, wherein two or more includes two.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

The following detailed description is made with reference to the accompanying drawings and examples:

referring to fig. 1 to 3, a semiconductor device module according to an embodiment of the present disclosure includes a substrate 1, a semiconductor device 2, a protective cover 3, and a first hook 4. The semiconductor device 2 comprises a tube core 21 and three pins 22 arranged on the tube core 21 at intervals, wherein the tube core 21 is fixed on one side of the substrate 1; wherein, optionally, the die 21 is fixed on one side of the substrate 1 by a hot pressing process. The protective cover 3 is covered on one side of the substrate 1 provided with the tube core 21 and is detachably connected with the substrate 1, and the tube core 21 is arranged between the protective cover 3 and the substrate 1; it will be appreciated that the shield 3 covers all of the dies 21 and is fixed relative to the substrate 1, so as to provide a spacing and protection for the dies 21 between the shield 3 and the substrate 1. The protective cover 3 is provided with a plurality of first avoiding holes 301 distributed at intervals, and each pin 22 penetrates through each first avoiding hole 301. The first hook 4 is arranged on one side of the protective cover 3, which faces away from the substrate 1, so as to form a clamping connection with an external driving plate 6.

It should be noted that, in this embodiment, a preset number of die 21 of the semiconductor device 2 may be fixed on one side of the substrate 1, and then the protective cover 3 is covered on the side of the substrate 1 where the die 21 is disposed and is detachably connected to the substrate 1, so that all the die 21 are disposed between the protective cover 3 and the substrate 1, and at this time, each pin 22 of each die 21 is inserted into each first avoiding hole 301, thereby completing the assembly of the semiconductor device module; therefore, the tube cores 21 of the preset number of semiconductor devices 2 are fixed on one side of the substrate 1, the tube cores 21 are fixed, one protective cover 3 is covered on the substrate 1, all the tube cores 21 are arranged between the protective cover 3 and the substrate 1, namely, the protective cover 3 covers all the tube cores 21, on the basis that the tube cores 21 are fixed on the substrate 1, the tube cores 21 are limited and protected between the substrate 1 and the protective cover 3 again, the tube cores 21 are installed on the whole semiconductor device module, a plurality of pressing strips do not need to be arranged, bolts do not need to be used in batches for being matched with the plurality of pressing strips, the use of the bolts is saved, and the assembly operation of the semiconductor device module is simplified. Wherein when a plurality of semiconductor devices 2 are disposed on the substrate 1, the dies 21 of the plurality of semiconductor devices 2 are spaced apart.

It should be added that, when the semiconductor device 2 is fixed by using the pressing bar in the conventional scheme, a bolt is usually required to be arranged at a position between two adjacent die 21 of the pressing bar, so that the space between two adjacent semiconductor devices 2 needs to be set to be larger, which reduces the space utilization rate of the semiconductor device module, and correspondingly, when the number of the semiconductor devices 2 is determined, the volume of the semiconductor device module is increased; in this embodiment, the protective cover 3 covers the substrate 1, and a bolt does not need to be arranged between the two adjacent tube cores 21, so that the distance between the two adjacent semiconductor devices 2 does not need to be specially increased to match with the use of the bolt, the distribution of the plurality of semiconductor devices 2 can be more reasonable, the space utilization rate of the semiconductor device module is improved, and the size of the semiconductor device module is correspondingly reduced.

It should be further noted that, after the semiconductor device module is assembled, the first hook 4 is clamped with the driving board 6 to realize the connection between the protective cover 3 and the driving board 6, and correspondingly, the semiconductor device 2 and the driving board 6 are relatively fixed; at this time, the pins 22 of the semiconductor device 2 may be inserted into the driving board 6 to form an electrical connection with the driving board 6. Therefore, in the embodiment, the driving plate 6 and the protective cover 3 are clamped through the first clamping hook 4 without bolts, so that the number of the bolts is saved again; and, form the joint through first trip 4 and drive plate 6 for the installation operation of drive plate 6 on the semiconductor device module is very simple, quick, and just the setting of first trip 4 does benefit to the dismantlement between drive plate 6 and the semiconductor device module, so be convenient for semiconductor device 2's dismantlement and maintenance work.

In practical applications, the substrate 1 may be a heat sink substrate of a heat sink.

Alternatively, the semiconductor device 2 may be configured as a MOS transistor (abbreviated as a mosfet), an insulated gate bipolar transistor, or the like.

Alternatively, the number of the first hooks 4 may be one or at least two, and may be specifically determined according to the requirement of the connection strength between the protective cover 3 and the driving plate 6.

In the embodiment of the application, the tube core 21 is fixed on one side of the substrate 1, the protective cover 3 is covered on one side of the substrate 1, which is provided with the tube core 21, and is detachably connected with the substrate 1, so that the tube core 21 is limited and protected between the substrate 1 and the protective cover 3, and the semiconductor device 2 is mounted in the semiconductor device module, therefore, a plurality of pressing strips are not needed to be arranged when the semiconductor device 2 is mounted, the use of bolts is facilitated to be reduced, and the time required by the mounting of the semiconductor device 2 is reduced; and, be equipped with first trip 4 on the protection casing 3, then protection casing 3 accessible first trip 4 joint in outside drive plate 6 to form with drive plate 6 and be connected, at this moment, the pin 22 of semiconductor device 2 can pass first aversion hole 301 and insert and connect to drive plate 6, and like this, the use of bolt has also been saved in the setting of first trip 4, has still simplified the connection between semiconductor device 2 and the drive plate 6 simultaneously. Therefore, the semiconductor device module provided by the embodiment reduces the use of bolts, so that the semiconductor device 2 has better disassembly and assembly convenience, and the maintenance convenience of the semiconductor device 2 is improved.

In one embodiment, referring to fig. 3 and fig. 4, the protective cover 3 includes a cover plate 31 and a second hook 32 disposed on the cover plate 31, the cover plate 31 is disposed on a side of the substrate 1 where the die 21 is disposed, so that the die 21 is limited and protected between the cover plate 31 and the substrate 1; the substrate 1 is provided with a clamping groove 101, and the second clamping hook 32 is clamped in the clamping groove 101, so that the protection cover 3 and the substrate 1 are relatively fixed. By adopting the technical scheme, when the semiconductor device module is assembled, the tube core 21 is fixed on the substrate 1, then only the second clamping hook 32 is required to be aligned to the clamping groove 101, and the cover plate 31 of the protective cover 3 is covered on the substrate 1, so that the second clamping hook 32 can be clamped into the clamping groove 101 to realize the relative fixation of the protective cover 3 and the substrate 1, and thus, the mounting operation of the protective cover 3 and the substrate 1 is very convenient and quick, correspondingly, the disassembly between the protective cover 3 and the substrate 1 is also facilitated, and the disassembly and maintenance of the semiconductor device 2 are facilitated; in addition, the use of bolts is saved, and the space utilization rate of the semiconductor device module is improved.

In one embodiment, referring to fig. 2 to 4, the protective cover 3 further includes a guard rail 33 disposed around the cover plate 31 and extending to the substrate 1, and the die 21 is accommodated in a space defined by the guard rail 33, the second hook 32, the cover plate 31 and the substrate 1. By adopting the technical scheme, the protection effect on the semiconductor device 2 is realized, and external water vapor or dust is prevented from falling into the semiconductor device 2, so that the semiconductor device 2 is prevented from being short-circuited and the like due to dust accumulation and moisture.

In one embodiment, referring to fig. 1 to 4, the protective cover 3 has a first fixing hole 302 spaced apart from the first avoiding hole 301, and the substrate 1 has a second fixing hole 102 spaced apart from the die 21; the first fixing hole 302 corresponds to the second fixing hole 102, and a fixing member (not shown) is locked in the first fixing hole 302 and the second fixing hole 102. By adopting the above technical scheme, the fixing member sequentially penetrates through the first fixing hole 302 and the second fixing hole 102 and is locked in the first fixing hole 302 and the second fixing hole 102, thereby realizing the relative fixation between the substrate 1 and the protective cover 3.

Alternatively, the fixing member may be provided as a fixing structure such as a screw or a bolt.

It should be noted that in this embodiment, as long as the second fixing holes 102 are distributed at intervals with the tube cores 21, the fixing element can fix the protective cover 3 and the substrate 1, and there is no need to form a fixing hole between two adjacent tube cores 21 on the substrate 1; it can be understood that after the plurality of dies 21 are reasonably arranged on the substrate 1, only the second fixing holes 102 are formed in positions on the substrate 1 where the dies 21 are not arranged, and the first fixing holes 302 are formed in positions of the protective cover 3 corresponding to the second fixing holes 102, so that the reasonable distribution of the dies 21 is facilitated, and the space utilization rate of the semiconductor device module is improved. In addition, in this embodiment, on the basis that one protection cover 3 covers all the tube cores 21 and the protection cover 3 is connected to the substrate 1 through the second hook 32 and the clamping groove 101, the number of bolts can be greatly reduced, and thus, the connection strength between the protection cover 3 and the substrate 1 can be further improved through the use of the fixing member.

In one embodiment, referring to fig. 2 to 4, at least two blocking pieces 34 are disposed at intervals on a side of the shield 3 facing away from the substrate 1, and each blocking piece 34 is disposed between two adjacent first avoiding holes 301 to separate the three pins 22 of the semiconductor device 2. By adopting the above technical scheme, the separation effect between the three pins 22 of each semiconductor device 2 is realized by the arrangement of the baffle sheets 34, which is helpful for improving the safety performance of each semiconductor device 2, so that the safety of the semiconductor device module is improved.

It should be noted that, in the present embodiment, the two blocking pieces 34 form a group of blocking pieces 34, and the group of blocking pieces 34 corresponds to one semiconductor device 2, that is, the group of blocking pieces 34 is used for separating three pins 22 of one semiconductor device 2; each blocking piece 34 is disposed between two adjacent first avoiding holes 301, so that when each pin 22 passes through each first avoiding hole 301, the blocking pieces 34 separate the two adjacent pins 22, so that one group of blocking pieces 34 separates the three pins 22 of one semiconductor device 2, thereby increasing the creepage distance between the two adjacent pins 22 and ensuring the safety performance of the semiconductor device 2.

It should be further noted that when the driving board 6 is clamped to the protective cover 3, the blocking piece 34 can be inserted into the driving board 6, so that when the pins 22 pass through the first avoiding hole 301 and are inserted into the driving board 6, the blocking piece 34 can still achieve the effect of separating two adjacent pins 22 on the driving board 6; the extension, based on separation blade 34 and drive plate 6 formation grafting, the direction grafting effect can be realized to the jack that corresponds on separation blade 34 and the drive plate 6, so help guaranteeing quick, accurate connection between protection casing 3 and the drive plate 6, do benefit to the dismouting operation of drive plate 6 and semiconductor device module.

In one embodiment, referring to fig. 2 and fig. 5, a plurality of first protruding pillars 35 are disposed at intervals on a side of the protective cover 3 facing away from the substrate 1, and the plurality of first protruding pillars 35 and the plurality of first avoiding holes 301 are disposed in a one-to-one correspondence manner; each first avoiding hole 301 penetrates through each first convex column 35, and the blocking piece 34 is arranged between two adjacent first convex columns 35; flap 34 extends beyond first boss 35. It can be understood that, when the protective cover 3 is covered on the die 21, the pin 22 on the die 21 passes through the first avoiding hole 301 to pass through the first pillar 35; each flap 34 separates two adjacent leads 22.

By adopting the technical scheme, when the driving plate 6 is installed, the driving plate 6 can be supported on the first convex column 35, and the baffle piece 34 and the driving plate 6 are in insertion fit; moreover, the first avoiding hole 301 penetrates through the first convex column 35, and the position of the first avoiding hole 301 is raised by the first convex column 35, so that the alignment distance between the welding hole of the driving plate 6 and the pin 22 penetrating out of the first avoiding hole 301 is shortened, the assembly difficulty of the driving plate 6 and the semiconductor device 2 is reduced, and the assembly efficiency of the semiconductor device module and the driving plate 6 is improved.

In one embodiment, referring to fig. 4, the substrate 1 includes a board body 11 and a heat conducting insulating pad 12 attached on the board body 11, the die 21 and the heat conducting insulating pad 12 are disposed on the same side of the board body 11, and the die 21 is disposed on the heat conducting insulating pad 12. By adopting the technical scheme, the heat generated by the semiconductor device 2 during working can be conducted through the heat-conducting insulating pad 12, and the heat-radiating effect of the semiconductor device 2 is favorably ensured.

Optionally, the plate body 11 is provided as an aluminum plate, so that the aluminum plate can effectively dissipate heat on the thermal insulation pad 12, which helps to further improve the heat dissipation effect of the semiconductor device 2.

Alternatively, both the second fixing hole 102 and the card slot 101 may penetrate through both the plate body 11 and the thermally conductive insulating pad 12.

In one embodiment, referring to fig. 2, fig. 3 and fig. 7, the semiconductor device module further includes a temperature control device 5, the temperature control device 5 includes a main body 51 and a solder tail 52 disposed on the main body 51, the main body 51 and the die 21 are fixed on the same side of the substrate 1; the protective cover 3 is provided with second avoiding holes 303 spaced from the first avoiding holes 301, and the solder legs 52 penetrate through the second avoiding holes 303. By adopting the technical scheme, when the protective cover 3 covers one side of the substrate 1 provided with the semiconductor device 2, the protective cover 3 covers the semiconductor device 2 and the temperature control device 5 at the same time, so that the temperature control device 5 is limited and protected between the substrate 1 and the protective cover 3; meanwhile, the solder leg 52 of the temperature control device 5 passes through the second avoiding hole 303 to be connected with the driving board 6; the temperature control device 5 is arranged, so that the semiconductor device module provided by the embodiment has a function of detecting the temperature of the substrate 1, and is beneficial to monitoring the service condition of the substrate 1; in this embodiment, the solder leg 52 penetrates through the second avoiding hole 303 to be soldered to the driving board 6, so as to transmit signals, and replace the original mode of monitoring by cable connection, so that the temperature monitoring of the substrate 1 is more stable.

In one embodiment, referring to fig. 2 and fig. 7, a second protrusion 36 is disposed on a side of the protective cover 3 opposite to the substrate 1, the second protrusion 36 and the first avoiding hole 301 are distributed at an interval, and the second avoiding hole 303 penetrates through the second protrusion 36. By adopting the above technical scheme, the arrangement of the second convex column 36 enables the solder leg 52 of the temperature control device 5 to pass through the second convex column 36 to be connected with the driving plate 6, so as to realize the guiding function of the solder leg 52; in addition, the second protruding columns 36 are arranged to raise the positions of the second avoiding holes 303, so that the aligning distance between the welding holes of the driving plate 6 and the welding feet 52 penetrating out of the second avoiding holes 303 is shortened, and the assembling difficulty of the driving plate 6 is reduced.

Based on the above concept, the present embodiment also provides a frequency converter including the semiconductor device module. The semiconductor device module in this embodiment is the same as the semiconductor device module in the previous embodiment, and specific reference is made to the description of the semiconductor device module in the previous embodiment, which is not repeated herein. Through adopting above-mentioned semiconductor device module, saved in the semiconductor device module assembling process, required bolt quantity on the semiconductor device module of drive plate 6 assembly for semiconductor device 2 possesses better dismouting convenience, helps improving semiconductor device 2's maintenance convenience.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A semiconductor device module, comprising:

a substrate;

the semiconductor device comprises a tube core arranged on one side of the substrate and three pins arranged on the tube core at intervals;

the protective cover is covered on one side of the substrate, which is provided with the tube core, and is detachably connected with the substrate; the tube core is arranged between the substrate and the protective cover; the protective cover is provided with a plurality of first avoiding holes at intervals, and each pin penetrates through each first avoiding hole;

the first clamping hook is arranged on one side, back to the substrate, of the protective cover to be clamped with an external driving plate.

2. The semiconductor device module of claim 1, wherein the protective cover comprises a cover plate and a second hook disposed on the cover plate, the cover plate covering the substrate; the base plate is provided with a clamping groove, and the second clamping hook is clamped in the clamping groove.

3. The semiconductor device module of claim 2, wherein the protective cover further comprises a guard rail disposed around the cover plate and extending to the substrate, and the die is received in a space defined by the guard rail, the second hook, the cover plate and the substrate.

4. The semiconductor device module as claimed in claim 1, wherein the protective cover defines first fixing holes spaced apart from the first avoiding holes, and the substrate defines second fixing holes spaced apart from the die; the first fixing hole corresponds to the second fixing hole, and a fixing piece is locked in the first fixing hole and the second fixing hole.

5. The semiconductor device module as claimed in claim 1, wherein at least two blocking pieces are spaced apart from one side of the protective cover facing away from the substrate, and each blocking piece is disposed between two adjacent first avoiding holes to separate three pins of the semiconductor device.

6. The semiconductor device module as claimed in claim 5, wherein the protective cover has a plurality of first posts spaced apart from one side thereof facing away from the substrate, each first avoiding hole extends through each first post, and the blocking piece is disposed between two adjacent first posts and extends beyond the first posts.

7. The semiconductor device module of any one of claims 1-6, wherein the substrate comprises a board body and a thermally conductive and insulating pad disposed on the board body, the die and the thermally conductive and insulating pad being disposed on a same side of the board body, and the die being disposed on the thermally conductive and insulating pad.

8. The semiconductor device module of any of claims 1-6, further comprising a temperature control device, the temperature control device comprising a body portion and a fillet disposed on the body portion, the body portion and the die disposed on a same side of the substrate; the protective cover is provided with second avoidance holes which are distributed at intervals with the first avoidance holes, and the welding feet penetrate through the second avoidance holes.

9. The semiconductor device module as claimed in claim 8, wherein a side of the protective cover facing away from the substrate is formed with second posts spaced apart from the first avoiding holes, and the second avoiding holes penetrate the second posts.

10. A frequency converter comprising the semiconductor device module according to any one of claims 1 to 9.

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