CN219713433U - Radiating assembly and cooking equipment - Google Patents

Abstract

The embodiment of the utility model provides a heat dissipation assembly and cooking equipment, wherein the heat dissipation assembly comprises: the bearing plate is provided with a bearing area on the first side; the heat conducting structure is arranged on the second side of the bearing plate and is attached to the bearing plate; and the fan is arranged on the second side of the bearing plate and faces the heat conducting structure to exhaust air. According to the technical scheme, the heat conducting structure is attached to the bearing plate, and the fan is controlled to wind out towards the heat conducting structure, so that heat of the bearing plate can be rapidly dissipated outwards through the heat conducting structure, the high-temperature heat dissipation efficiency is improved, and the service life of a product is prolonged.

Description

Radiating assembly and cooking equipment

Technical Field

The utility model relates to the technical field of temperature measuring devices, in particular to a heat dissipation assembly and cooking equipment.

Background

Currently, in the related art, a large amount of heat is generally generated during the operation of the cooking apparatus, and there is a certain requirement for heat resistance of the panel, and if the panel is locally overheated, stress may be generated inside the panel to cause the panel to be broken.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art or related art.

In view of this, embodiments of the first aspect of the present utility model provide a heat dissipating assembly.

Embodiments of the second aspect of the present utility model provide a cooking apparatus.

To achieve the above object, an embodiment of a first aspect of the present utility model provides a heat dissipating assembly, including: the bearing plate is provided with a bearing area on the first side; the heat conducting structure is arranged on the second side of the bearing plate and is attached to the bearing plate; and the fan is arranged on the second side of the bearing plate and faces the heat conducting structure to exhaust air.

According to the heat dissipation assembly provided by the utility model, the heat dissipation assembly mainly comprises the bearing plate, the heat conduction structure and the fan, wherein the bearing plate is used for bearing the cooking utensil, the heat conduction structure is arranged on the inner side of the bearing plate, namely, one side far away from the cooking utensil is particularly used for bearing the cooking utensil, the heat conduction structure is arranged on one side of the inner surface, when the cooking utensil is heated, the heat of the cooking utensil can be transferred to the bearing plate, at the moment, the fan with the heat conduction structure is arranged on the inner side of the bearing plate for promoting heat dissipation, the fan is attached to the bearing plate and is controlled to emit air towards the heat conduction structure, so that the heat of the bearing plate can be rapidly dissipated outwards through the heat conduction structure, the high-temperature heat dissipation efficiency is improved, and the service life of a product is prolonged.

The heat dissipation device comprises a bearing plate, a heat conduction structure, a fan, a heat dissipation device and a heat dissipation device, wherein the heat conduction structure can effectively uniformly disperse heat received on the bearing plate, the possibility of generating internal stress due to overhigh local heat is reduced, the heat dissipation of the fan to the heat conduction structure is increased on the basis, and the heat dissipation efficiency can be further improved.

What needs to be supplemented is that the fan of this scheme sets up in the downside of loading board, and the fan is towards heat conduction structure air-out, can make the heat on heat conduction structure surface can be taken away to the air current that the fan blows out to improve radiating efficiency.

In the above technical solution, further includes: and the wind shielding structure is arranged on a path communicating the fan and the heat conducting structure.

In this technical scheme, be provided with the structure of keeping out the wind on the route that the air was blown to heat conduction structure by the fan, can reduce the air current flow direction other regions, lead to unable normal radiating possibility to heat conduction structure, simultaneously, under the effect of structure of keeping out the wind, still can guarantee to blow to heat conduction structure's wind speed, guarantee radiating efficiency. In addition, the wind shielding structure can reduce interference caused by airflow flowing through other structures, for example, the detection result is influenced for structures such as a temperature sensor and the like.

Further, the wind shielding structure can wrap the heat conducting structure, so that cold air generated by the fan flows through the heat conducting structure, and heat dissipation efficiency is improved.

It can be appreciated that the diversity of the location of the wind shielding structure exists, as long as the wind shielding structure is arranged on a path communicating the fan and the heat conducting structure.

Among the above-mentioned technical scheme, wind shielding structure specifically includes: and the baffle plates are arranged on the second side of the bearing plate, gaps exist between each baffle plate and the heat conducting structure, and the baffle plates extend from the fan to the heat conducting structure.

In the technical scheme, the wind shielding structure is composed of one or more baffles, the wind shielding structure can be flexibly arranged according to the relative positions of the heat conducting structure and the fan and the shape of the heat conducting structure, and only a certain gap is reserved between the baffles and the heat conducting structure, so that air can flow to the heat conducting structure from the fan, and heat on the heat conducting structure is taken away.

Further, one or more baffles may form a strip structure, and are disposed at a side of the air outlet of the fan facing the carrier plate, i.e. at a top side of the air outlet, so as to reduce the possibility that air at the air outlet flows directly to other positions.

It is to be added that the strip structure of this scheme links to each other with the air outlet of fan, can make integrated structure with the fan, also can make assembled split structure.

In the above technical scheme, the heat conductivity coefficient of the heat conducting structure is larger than that of the bearing plate.

In this technical scheme, through prescribing a limit to the heat conduction coefficient of heat conduction structure and loading board, it is bigger to restrict the heat conduction coefficient of heat conduction structure, can make the heat when transferring to the loading board, can be rapid transfer to temperature sensing piece department through heat conduction structure, can prevent effectively through subsequent processing that loading board local overheat from leading to the condition of splitting.

Further, the heat conduction structure is made of aluminum alloy, the heat conduction coefficient is 201W/mk, the bearing plate is made of toughened glass, and the heat conduction coefficient is 1.1W/mk. On this basis, because the coefficient of heat conductivity of loading board is lower in heat conduction structure in comparison with, and the cross-sectional area of loading board is little, and lateral distance increases, leads to the lateral heat conduction very slowly, to the back of certain distance, because with air heat exchange, makes its temperature fluctuation big, detects temperature variation inaccurate also untimely.

In the technical scheme, the heat conducting structure is sheet-shaped; or the heat conduction structure comprises a heat conduction wire, and the heat conduction wire is printed on the second side of the bearing plate.

In this technical scheme, can set up independent heat conduction structure in the second side of loading board, be the slice through restriction heat conduction structure, can realize the laminating of face contact with the loading board, perhaps, can directly form heat conduction structure through the mode of printing in the second side of loading board, heat conduction structure and loading board be a structure promptly, reducible process when the assembly to improve installation effectiveness. It can be appreciated that the second side of the carrier plate is provided with the printing manner, so that the fitting degree can be greatly improved, that is, the contact between the carrier plate and the carrier plate is more sufficient.

In the above technical solution, further includes: the diffusion plate is arranged on the second side of the bearing plate and is attached to the bearing plate; the heat conducting structure is arranged on one side of the diffusion plate, which faces the bearing plate.

In this technical scheme, be provided with independent diffuser plate in the downside of loading board, through laminating diffuser plate and loading board mutually, the heat transfer of usable heat conduction structure on the diffuser plate to diffuser plate department, and then through the operation improvement heat-sinking capability of fan.

It can be understood that the heat of the bearing plate can be smoothly transferred to the heat conducting structure by arranging the heat conducting structure on the upper side of the diffusion plate, namely towards one side of the bearing plate, and the heat dissipation of the heat conducting structure can be realized when the fan operates.

It can be understood that the diffusion plate and the bearing plate are two independent structures, and the diffusion plate is an integral body and has a certain thickness, so that the diffusion plate and the bearing plate are tightly attached to each other, and the smooth heat transfer is ensured.

In the above technical scheme, the heat conductivity coefficient of the diffusion plate is larger than that of the bearing plate, and the projection of the diffusion plate on the bearing plate covers the projection of the heat conducting structure on the bearing plate.

In this technical scheme, through the heat conductivility that prescribes a limit to the diffuser plate better, and the area is bigger, carries out heat dissipation once through the heat conduction structure through the heat, and the rethread diffuser plate carries out secondary heat conduction for heat conduction area increases, improves the heat conduction effect.

In the above technical scheme, the heat conduction structure specifically comprises a plurality of circumferentially arranged heat conduction areas, and air blown by the fan flows through any heat conduction area.

In this technical scheme, to heat conduction structure, including a plurality of heat conduction regions, a plurality of heat conduction regions are the circumference and encircle the setting, through prescribing a limit to the air current path that the fan blows out, can flow through arbitrary heat conduction region to the heat of whichever heat conduction region all can be taken away by the cold wind of fan, thereby realize high-efficient and comprehensive heat dissipation.

Embodiments of the second aspect of the present utility model provide a cooking apparatus comprising: a housing; any one of the heat dissipation assemblies of the first aspect, disposed in the housing; and the heating coil is arranged on one side of the heat conduction structure in the heat dissipation assembly, which is far away from the bearing plate.

The cooking equipment provided by the utility model comprises the shell, the heat radiation component arranged in the shell and the heating coil arranged below the heat radiation component, wherein the shell mainly has a protection effect on internal electronic elements and physical structures, and can have a heating effect on the cooking appliance on the bearing plate under the action of the heating coil.

Since the cooking device includes the heat dissipating component, the cooking device has the beneficial effects of any one of the embodiments of the first aspect, and will not be described herein.

Cooking devices include, but are not limited to, induction cookers, electroceramics, electric cookers, and the like, which require measurement of the temperature of the carrier plate.

In the above technical scheme, the casing specifically includes: a bottom case; the upper cover is detachably connected with the bottom shell, the upper cover is connected with the bottom shell to form a containing cavity, and the heat conducting structure of the heat radiating assembly is arranged in the containing cavity; wherein, the loading board of the heat radiation component is attached to the upper cover.

In this technical scheme, the casing mainly includes drain pan and the upper cover of detachable connection, and two structural connection can form inside and hold the chamber, can place structures such as diffuser plate, control panel in holding the chamber, but the loading board then sets up the opposite side of upper cover to play the effect of bearing cooking utensil.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, or may be learned by practice of the utility model.

Drawings

FIG. 1 illustrates a schematic structural view of a heat dissipating assembly according to one embodiment of the present utility model;

fig. 2 shows a schematic structural view of a carrier plate according to an embodiment of the present utility model;

FIG. 3 illustrates a schematic structural view of a heat dissipating assembly according to one embodiment of the present utility model;

FIG. 4 illustrates a schematic structural view of a diffusion plate according to an embodiment of the present utility model;

FIG. 5 illustrates a schematic diagram of a thermally conductive region according to one embodiment of the utility model;

fig. 6 illustrates a schematic structural view of a cooking apparatus according to an embodiment of the present utility model.

The correspondence between the reference numerals and the component names in fig. 1 to 6 is:

100: a heat dissipation assembly; 102: a carrying plate; 1022: a carrying area; 104: a blower; 106: a thermally conductive structure; 1062: a thermally conductive region; 108: a wind shielding structure; 1082: a baffle; 112: a diffusion plate;

200: a cooking device; 202: a heating coil; 204: a housing; 2042: a bottom case; 2044: and (5) an upper cover.

Detailed Description

In order that the above-recited objects, features and advantages of embodiments of the present utility model can be more clearly understood, a further detailed description of embodiments of the present utility model will be rendered by reference to the appended drawings and detailed description thereof. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, embodiments of the utility model may be practiced otherwise than as described herein, and therefore the scope of the utility model is not limited to the specific embodiments disclosed below.

Some embodiments according to the present utility model are described below with reference to fig. 1 to 6.

As shown in fig. 1 and fig. 2, the heat dissipation assembly 100 provided in this embodiment mainly includes a carrying plate 102, a heat conducting structure 106 and a fan 104, where the carrying plate 102 is provided with a carrying area 1022 for carrying a cooking appliance, by arranging the heat conducting structure 106 on the inner side of the carrying plate 102, specifically, on the side far away from the cooking appliance, that is, the outer surface of the carrying plate 102 is used for carrying the cooking appliance, and on the side of the inner surface, the heat of the cooking appliance is transferred to the carrying plate 102 when the cooking appliance is heated, at this time, in order to promote heat dissipation, a fan 104 of the heat conducting structure 106 is arranged on the inner side of the carrying plate 102, and by attaching the heat conducting structure 106 to the carrying plate 102 and controlling the fan 104 to wind out towards the heat conducting structure 106, the heat of the carrying plate 102 can be rapidly dissipated outwards through the heat conducting structure 106, thereby improving the efficiency of high-temperature heat dissipation and the service life of the product.

The heat may extend along the arrow direction in the figure, and the structure of the heat conducting structure 106 may effectively uniformly disperse the heat received on the carrier plate 102, so as to reduce the possibility of generating internal stress due to excessive local heat, and on this basis, increase the heat dissipation of the heat conducting structure 106 by the fan 104, so as to further improve the heat dissipation efficiency.

It should be added that, the fan 104 of this scheme is disposed at the downside of the carrier plate 102, and the fan 104 is towards the heat conduction structure 106 air-out, can make the air current that the fan 104 blows out take away the heat on heat conduction structure 106 surface to improve radiating efficiency.

It will be appreciated that, as shown in fig. 3, the air flowing direction is shown by the arrow direction in fig. 3, and the wind shielding structure 108 is disposed on the path of the air blown to the heat conducting structure 106 by the fan 104, so that the possibility that the air flows to other areas and the heat conducting structure 106 cannot be radiated normally can be reduced, and meanwhile, the wind speed blown to the heat conducting structure 106 can be ensured under the action of the wind shielding structure 108, and the heat radiation efficiency can be ensured. In addition, the wind shielding structure 108 can reduce interference caused by airflow flowing through other structures, such as a temperature sensor, which can affect the detection result.

Further, the wind shielding structure 108 may encapsulate the heat conducting structure 106, so that cold air generated by the fan 104 flows through the heat conducting structure 106, thereby increasing heat dissipation efficiency.

It will be appreciated that there are a variety of locations where the wind shielding structure 108 is disposed, as long as it is disposed in a path that communicates the blower 104 and the thermally conductive structure 106.

In a specific embodiment, the wind shielding structure 108 is formed by one or more baffles 1082, and the wind shielding structure 108 can be flexibly set according to the relative positions of the heat conducting structure 106 and the fan 104 and the shape of the heat conducting structure 106, and only a certain gap between the baffles 1082 and the heat conducting structure 106 is required to be defined, so that air can flow from the fan 104 to the heat conducting structure 106, and heat on the heat conducting structure 106 can be taken away.

Further, the one or more baffles 1082 may form a strip structure, and be disposed on a side of the air outlet of the fan 104 facing the carrier plate 102, i.e. on a top side of the air outlet, so as to reduce the possibility that air at the air outlet flows directly to other positions.

It should be added that the strip structure of the present solution is connected with the air outlet of the blower 104, and can be made into an integrated structure with the blower 104 or an assembled split structure.

The thermal conductivity of the thermal conductive structure 106 and the carrier plate 102 is limited, and the thermal conductivity of the thermal conductive structure 106 is limited to be larger, so that heat can be quickly transferred to the temperature sensing part through the thermal conductive structure 106 when transferred to the carrier plate 102, and the situation that the carrier plate 102 is cracked due to local overheating can be effectively prevented through subsequent processing.

Further, the heat conducting structure 106 is made of aluminum alloy, the heat conductivity coefficient is 201W/mk, the material of the bearing plate 102 is toughened glass, and the heat conductivity coefficient is 1.1W/mk. On this basis, since the heat conductivity of the carrier plate 102 is lower than that of the heat conducting structure 106, the cross-sectional area of the carrier plate 102 is small, the lateral distance is increased, the lateral heat conduction is very slow, and after a certain distance, the temperature fluctuation is large due to heat exchange with air, and the detection of the temperature change is inaccurate and not timely.

In one embodiment, a separate heat conducting structure 106 may be disposed on the second side of the carrier plate 102, and by restricting the heat conducting structure 106 to be in a sheet shape, the surface contact fit with the carrier plate 102 may be achieved.

In one embodiment, the heat conducting structure 106 may be directly formed on the second side of the carrier plate 102 by printing, that is, the heat conducting structure 106 and the carrier plate 102 are one structure, and the number of steps may be reduced during assembly, thereby improving the installation efficiency. It can be appreciated that the second side of the carrier plate 102 is printed to greatly improve the fitting degree, i.e. the contact between the two is more sufficient

In another embodiment, as shown in fig. 4, a separate diffusion plate 112 is disposed on the lower side of the carrier plate 102, and by attaching the diffusion plate 112 to the carrier plate 102, the heat of the carrier plate 102 can be transferred to the diffusion plate 112 by using the rapid heat-conducting capability of the diffusion plate 112, so as to improve the heat-dissipating capability through the operation of the blower 104.

It can be appreciated that the diffusion plate 112 and the carrier plate 102 are two independent structures, and the diffusion plate 112 is a single body with a certain thickness, and needs to be closely attached to the carrier plate 102, so as to ensure smooth heat transfer.

Further, the heat conducting structure 106 is disposed on the upper side of the diffusion plate 112, i.e. the side facing the carrier plate 102, so that the heat of the carrier plate 102 can be smoothly transferred to the heat conducting structure 106, and the heat dissipation of the heat conducting structure 106 can be realized when the fan 104 operates.

Further, the heat conductivity coefficient of the diffusion plate is larger than that of the bearing plate, and the projection of the diffusion plate on the bearing plate covers the projection of the heat conducting structure on the bearing plate. The heat conduction performance through inject the diffuser plate is better, and the area is bigger, carries out heat dissipation once through the heat conduction structure through the heat, and the rethread diffuser plate carries out secondary heat conduction for heat conduction area increases, improves the heat conduction effect.

On the basis of any of the above embodiments, for the heat conducting structure 106, as shown in fig. 5, the heat conducting structure includes a plurality of heat conducting areas 1062, and the plurality of heat conducting areas 1062 are circumferentially arranged, and by defining the airflow path blown by the fan 104, the heat flows through any heat conducting area 1062, so that the heat of any heat conducting area 1062 can be taken away by the cold air of the fan 104, thereby realizing efficient and comprehensive heat dissipation.

In a specific embodiment, an electromagnetic oven is provided, the panel of the electromagnetic oven is made of high-boron silicon and microcrystalline glass, the heat conductivity coefficient is low, a diffusion plate 112 is arranged at the bottom of the panel, the diffusion plate 112 is made of materials with good heat conductivity coefficient, such as copper, aluminum (201W/mk) and the like, the diffusion plate 112 is closely attached to the back of the panel, after the temperature of a certain point of a single pot is raised, heat is transferred to the panel, the transverse heat transfer of the panel is slow, the longitudinal direction is fast, the heat is transferred to the diffusion plate 112 again, the heat is quickly transferred to the surrounding area due to the good heat conductivity coefficient of the diffusion plate 112, the heat is quickly dissipated under the action of a fan 104, the temperature difference between a high-temperature area and a low-temperature area is maintained in a large range, the heat conductivity is large, so that the temperature of the high-temperature area and the temperature of the periphery form an equilibrium state, the stress is not generated inside the panel, and the panel is prevented from being broken.

On the basis of any of the above embodiments, the carrier plate 102 may be a glass ceramic plate, and the water absorption is almost zero, so that water is not easy to penetrate, and the strength is high and the acid resistance and alkali resistance are high.

As shown in fig. 6, the present embodiment provides a cooking apparatus 200, which includes a housing 204, a heat dissipation assembly 100, and a heating coil 202 disposed below the heat dissipation assembly 100, and can perform a heating effect on a cooking appliance on a carrier plate 102 under the action of the heating coil 202.

Since the cooking apparatus 200 includes the heat dissipating assembly 100, the heat dissipating assembly 100 according to any of the embodiments of the first aspect has the advantages described above, and will not be described herein.

Cooking device 200 includes, but is not limited to, induction cookers, electroceramics, electric cookers, and the like that require measurement of the temperature of carrier plate 102.

Further, as shown in fig. 6, the housing 204 mainly includes a bottom shell 2042 and an upper cover 2044 which are detachably connected, and the two structures are connected to form a receiving cavity therein, and the structures such as a diffusion plate and a control plate can be placed in the receiving cavity, but the bearing plate is disposed on the other side of the upper cover to play a role of bearing the cooking utensil.

According to the heat radiation assembly and the cooking equipment provided by the utility model, the heat conduction structure is attached to the bearing plate, and the fan is controlled to wind out towards the heat conduction structure, so that the heat of the bearing plate can be rapidly radiated outwards through the heat conduction structure, the high-temperature heat radiation efficiency is improved, and the service life of a product is prolonged.

In the present utility model, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more, unless expressly defined otherwise. The terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; "coupled" may be directly coupled or indirectly coupled through intermediaries. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "rear", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or units referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model.

In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (10)

1. A heat dissipating assembly, comprising:

the bearing plate is provided with a bearing area on the first side;

the heat conduction structure is arranged on the second side of the bearing plate and is attached to the bearing plate;

and the fan is arranged on the second side of the bearing plate and faces the heat conduction structure to discharge air.

2. The heat dissipating assembly of claim 1, further comprising:

and the wind shielding structure is arranged on a path which is communicated with the fan and the heat conducting structure.

3. The heat dissipating assembly of claim 2, wherein the wind shielding structure specifically comprises:

and the baffle plates are arranged on the second side of the bearing plate, gaps exist between each baffle plate and the heat conducting structure, and the baffle plates extend from the fan to the heat conducting structure.

4. The heat dissipating assembly of claim 1, wherein the thermal conductivity of the thermally conductive structure is greater than the thermal conductivity of the carrier plate.

5. The heat dissipating assembly of claim 1, wherein said thermally conductive structure is sheet-like; or (b)

The heat conduction structure comprises a heat conduction wire, and the heat conduction wire is printed on the second side of the bearing plate.

6. The heat dissipating assembly of claim 1, further comprising:

the diffusion plate is arranged on the second side of the bearing plate and is attached to the bearing plate;

the heat conducting structure is arranged on one side of the diffusion plate, which faces the bearing plate.

7. The heat dissipating assembly of claim 6, wherein the thermal conductivity of the diffuser plate is greater than the thermal conductivity of the carrier plate, and wherein a projection of the diffuser plate onto the carrier plate covers a projection of the thermally conductive structure onto the carrier plate.

8. The heat dissipating assembly of any of claims 1 to 7, wherein the thermally conductive structure comprises a plurality of circumferentially disposed thermally conductive regions, and wherein air blown by the blower flows through any of the thermally conductive regions.

9. A cooking apparatus, comprising:

a housing;

the heat dissipating assembly of any of claims 1 to 8, disposed within a housing;

and the heating coil is arranged on one side of the heat conduction structure in the heat dissipation assembly, which is far away from the bearing plate.

10. Cooking apparatus according to claim 9, wherein the housing comprises in particular:

a bottom case;

the upper cover is detachably connected with the bottom shell, the upper cover is connected with the bottom shell to form a containing cavity, and the heat conducting structure of the heat radiating assembly is arranged in the containing cavity;

the bearing plate of the heat dissipation assembly is attached to the upper cover.