CN219686174U - Fixing device for multi-line slicing and multi-line slicing device - Google Patents
Fixing device for multi-line slicing and multi-line slicing device Download PDFInfo
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- CN219686174U CN219686174U CN202320553300.7U CN202320553300U CN219686174U CN 219686174 U CN219686174 U CN 219686174U CN 202320553300 U CN202320553300 U CN 202320553300U CN 219686174 U CN219686174 U CN 219686174U
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- 238000004804 winding Methods 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 229910052594 sapphire Inorganic materials 0.000 claims description 7
- 239000010980 sapphire Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- -1 but not limited to Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims description 2
- 238000003723 Smelting Methods 0.000 description 6
- 101100008049 Caenorhabditis elegans cut-5 gene Proteins 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 3
- 230000032900 absorption of visible light Effects 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present disclosure relates to a fixing device for multi-line slicing and a multi-line slicing device, the fixing device for multi-line slicing comprising: a mounting base; the fixing pieces are at least two, and at least two fixing pieces are arranged on one side of the mounting seat at intervals; and the processing jig is detachably arranged on the fixing piece and used for installing the object to be cut. The mounting of this disclosure sets up on the mount pad, and the mounting is equipped with two at least, can cut a plurality of thing of waiting to cut simultaneously like this, improves work efficiency, and a plurality of mounting interval settings can be used for cutting the great thing of waiting to cut of size, leave the interval between the mounting so that the thing of waiting to cut of installing on the mounting can not touching each other, waits to cut the thing and set up on the mounting through processing tool, and processing tool can dismantle with the mounting and be connected, conveniently changes, can install the processing tool that is suitable for the not unidimensional thing of waiting to cut simultaneously.
Description
Technical Field
The disclosure relates to the technical field of cutting devices, in particular to a fixing device for multi-line slicing and a multi-line slicing device.
Background
Sapphire is generally used as a substrate material for semiconductors, and has the advantages of good chemical stability, no absorption of visible light, moderate price and relatively mature manufacturing technology. Because of the very high hardness of sapphire, processing is difficult, especially when cutting sapphire boules into wafers. At present, a multi-wire cutting method is generally adopted for slicing, in the actual production process, a slicing machine is usually provided with only one cutting head assembly, and only one crystal bar can be processed at a time, so that the slicing efficiency is limited, and if the slicing capacity is improved by increasing the number of the slicing machines, the occupied area is increased, and the production cost of enterprises is increased.
Disclosure of Invention
It is an object of the present disclosure to provide a fixing device for multi-line slicing and a multi-line slicing device, which can solve the above-mentioned problems.
To achieve the above object, the present disclosure provides a fixing device for multi-line slicing, comprising: a mounting base; the fixing pieces are at least two, and at least two fixing pieces are arranged on one side of the mounting seat at intervals; and the processing jig is detachably arranged on the fixing piece and used for installing the object to be cut.
Optionally, the top surface of mounting with the bottom surface of mount pad is connected, the bottom surface of mount pad is the horizontal plane, the top surface of mounting and this horizontal plane parallel arrangement, the mounting is followed the axial extension of mount pad and at least two the mounting is parallel arrangement each other.
Optionally, the processing tool extends from one end to the other end of the fixing piece and is connected to the bottom of the fixing piece through a clamping device, and the object to be cut is installed at the bottom of the processing tool.
Optionally, the clamping device comprises a C-shaped clamping groove arranged at the bottom of the fixing piece and with a downward opening end, and convex strips arranged at two sides of the top of the processing jig, wherein the convex strips are inserted into the C-shaped clamping groove.
Optionally, the object to be cut is configured as a cylindrical structure, the cylindrical structure and the processing jig extend in the same direction and are adhered to the bottom of the processing jig, an arc-shaped groove corresponding to the cylindrical structure is arranged at the bottom of the processing jig, and the processing jig is a resin jig.
Alternatively, the object to be cut is made of a hard brittle material including, but not limited to, sapphire, silicon carbide or silicon.
The present disclosure also provides a multi-line slicing apparatus comprising: the fixing device for multi-line slicing; the feeding mechanism is arranged above the fixing device and drives the fixing device to move up and down; and the multi-wire cutting device is arranged below the fixing device and is used for cutting the object to be cut.
Optionally, the multi-wire cutting device comprises two winding rollers which are opposite and parallel to each other and a plurality of wire saws which are sleeved on the two winding rollers and are parallel to each other, and the wire saws are perpendicular to the axial direction of the object to be cut.
Optionally, the distance between the inner sides of the two winding rollers is larger than the distance between the outer sides of the objects to be cut on the two fixing pieces arranged on the outermost sides.
Optionally, the multi-wire slicing device further comprises a nozzle for spraying a cutting coolant to the multi-wire slicing device.
Through above-mentioned technical scheme, in the fixing device for multi-line slicing that this disclosure provided, the mounting sets up on the mount pad, the mounting is equipped with two at least, can cut a plurality of objects that wait to cut simultaneously like this, improve work efficiency, a plurality of mounting interval settings can be used for cutting the great thing that waits to cut of size, leave the interval between the mounting so that the object that waits to cut of installing on the mounting can not touch each other, wait to cut the thing and set up on the mounting through processing smelting tool, processing smelting tool can dismantle with the mounting and be connected, convenient change can install the processing smelting tool that is suitable for the different sizes and waits to cut the thing simultaneously.
Additional features and advantages of the present disclosure will be set forth in the detailed description which follows.
Drawings
The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification, illustrate the disclosure and together with the description serve to explain, but do not limit the disclosure. In the drawings:
FIG. 1 is a schematic view of a structure of a fixing device of the present disclosure;
FIG. 2 is a schematic view of a structure of a clamping device in the present disclosure;
fig. 3 is a schematic diagram of a multi-wire slicing apparatus of the present disclosure.
Description of the reference numerals
1. A frame; 2. a mounting base; 3. a fixing member; 4. a processing jig; 5. a material to be cut; 6. a clamping device; 61. a C-shaped clamping groove; 62. a convex strip; 7. a multi-wire cutting device; 71. winding a roller; 72. a wire saw; 8. a feeding mechanism; 9. and (3) a nozzle.
Detailed Description
Specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the disclosure, are not intended to limit the disclosure.
In this disclosure, unless otherwise indicated, terms of orientation such as "upper, lower, top, bottom" are used to generally refer to the gravitational direction of the respective component in the use state, and "inner, outer" are used to refer to the inner, outer relative to the contour of the component or structure itself. In addition, it should be noted that terms such as "first, second", etc. are used to distinguish one element from another element without order or importance. In addition, in the description with reference to the drawings, the same reference numerals in different drawings denote the same elements.
As shown in fig. 1-2, the present disclosure provides a fixture for multi-line slicing, comprising: a mounting base 2; the fixing pieces 3 are at least two, and the at least two fixing pieces 3 are arranged on one side of the mounting seat 2 at intervals; and a processing jig 4 detachably provided on the fixing member 3 for mounting the object 5 to be cut.
Through above-mentioned technical scheme, in the fixing device for multi-line slicing that this disclosure provided, mounting 3 sets up on mount pad 2, mounting 3 is equipped with two at least, can cut a plurality of thing 5 of waiting to cut simultaneously like this, improve work efficiency, a plurality of mounting 3 interval settings can be used for cutting the great thing 5 of waiting to cut of size, leave the interval between the mounting 3 so that the thing 5 of waiting to cut of installing on mounting 3 can not touching each other, wait to cut thing 5 and set up on mounting 3 through processing smelting tool 4, processing smelting tool 4 can dismantle with mounting 3 and be connected, the convenient change, simultaneously can install the processing smelting tool 4 that is suitable for the thing 5 of waiting to cut of different sizes.
As an alternative embodiment, as shown in fig. 1-2, the top surface of the fixing member 3 is connected with the bottom surface of the mounting seat 2, the bottom surface of the mounting seat 2 is a horizontal plane, the top surface of the fixing member 3 is parallel to the horizontal plane, the fixing member 3 extends along the axial direction of the mounting seat 2, at least two fixing members 3 are parallel to each other, that is, the fixing members 3 are horizontally arranged, and the fixing members 3 are parallel to each other, so that the object 5 to be cut is ensured to be horizontally arranged and parallel to each other, and cutting is facilitated.
Optionally, processing tool 4 extends to the other end by the one end of mounting 3 and connects in the bottom of mounting 3 through joint device 6, wait to cut thing 5 and install in the bottom of processing tool 4, processing tool 4 and mounting 3 syntropy extension and length are the same, namely the bottom of mounting 3 is whole to be covered with processing tool 4, so that wait to cut thing 5 total length all installs on mounting 3 through processing tool 4, wait to cut thing 5 fixed more firmly, can not displacement when multi-line slicing, mount pad 2, mounting 3, processing tool 4 and wait to cut thing 5 set gradually, guarantee to wait to cut thing 5 and be in the bottom and cut, joint device 6 makes processing tool 4 detachably connect on mounting 3, be convenient for change.
Wherein, as shown in fig. 2, the clamping device 6 includes a C-shaped clamping groove 61 disposed at the bottom of the fixing member 3 and with a downward opening end, and a convex strip 62 disposed at two sides of the top of the processing tool 4, the convex strip 62 is inserted into the C-shaped clamping groove 61, the top of the processing tool 4 is inserted and moved from one side of the C-shaped clamping groove 61 to the other side to fix the processing tool 4, and the C-shaped clamping groove 61 can fix the processing tool 4 and facilitate disassembly when cutting due to the fact that the cutting is up and down and the cutting is along the direction perpendicular to the axial direction of the object 5 to be cut. In other embodiments, a slot may be formed in the bottom of the fixing member 3, and the top of the processing tool 4 is inserted into the slot and fastened by a bolt disposed on the side.
Optionally, the to-be-cut object 5 is configured into a cylindrical structure, the cylindrical structure and the processing jig 4 extend in the same direction and are adhered to the bottom of the processing jig 4, an arc-shaped groove corresponding to the cylindrical structure is formed in the bottom of the processing jig 4, the to-be-cut object 5 is installed in the arc-shaped groove to enable the to-be-cut object 5 to be fixed more firmly, the processing jig 4 is a resin jig, a part of the processing jig 4 is cut simultaneously in order to completely cut the cylindrical to-be-cut object 5 during cutting, the resin material is easy to cut, a cutting device is not damaged, after multi-line cutting is completed, the to-be-cut object 5 is adhered to the bottom of the processing jig 4 in a sheet shape, due to the fact that the sheet shape is thinner, the contact area with the processing jig 4 is small, the sheet-shaped to-be-cut object 5 can be easily detached, after cutting is completed, the processing jig 4 is detached and replaced, and due to the fact that the processing jig 4 needs to be replaced frequently, the detachable connection is more convenient.
The object to be cut 5 is made of a hard brittle material including, but not limited to, sapphire, silicon carbide or silicon, for example, quartz glass, ceramics, etc., and illustratively, in the present disclosure, the object to be cut 5 is configured as a sapphire crystal, which is generally used as a substrate material of a semiconductor, and has advantages of good chemical stability, non-absorption of visible light, moderate price, and relatively mature manufacturing technology.
As shown in fig. 3, the present disclosure further provides a multi-line slicing apparatus, comprising: the fixing device for multi-line slicing; the feeding mechanism 8 is arranged above the fixing device and drives the fixing device to move up and down; and a multi-wire cutting device 7, which is disposed below the fixing device and is used for cutting the object 5 to be cut, wherein the object 5 to be cut is disposed at the bottom of the fixing device, the feeding mechanism 8 drives the fixing device to move up and down to contact with the multi-wire cutting device 7 disposed below the fixing device, and the feeding mechanism 8 may be an electric telescopic rod or a hydraulic telescopic rod, for example.
Optionally, the multi-wire cutting device 7 includes two opposite and parallel winding rollers 71 and a plurality of wire saws 72 sleeved on the two winding rollers 71 and arranged in parallel, the winding rollers 71 are provided with clamping grooves for limiting the wire saws 72, the distance between the two wire saws 72 is the thickness of a wafer, the plurality of wire saws 72 can simultaneously cut the crystal bar into a plurality of wafers at one time, the wire saws 72 are perpendicular to the axial direction of the object 5 to be cut, for example, the wire saws 72 are diamond wires, the diamond wires reciprocate under a certain tension and speed, and the plurality of crystal bars can be cut into wafers simultaneously as the fixing device slowly descends.
Wherein, the interval between the inner sides of the two winding rollers 71 is larger than the interval between the outer sides of the objects to be cut 5 arranged on the two fixing pieces 3 at the outermost sides, namely, the distance between the winding rollers 71 is larger than the distance between the two objects to be cut 5 at the outermost sides, so that all the objects to be cut 5 are ensured to be positioned between the two winding rollers 71 to be contacted with the wire saw 72 for cutting.
As an alternative embodiment, as shown in fig. 3, the multi-wire slicing device further comprises a nozzle 9 for spraying cutting cooling liquid to the multi-wire slicing device 7, the nozzle 9 is positioned obliquely above the multi-wire slicing device 7 and faces the cutting portion of the wire saw 72, the nozzle 9 is positioned outside the multi-wire slicing device 7 without affecting the lifting of the fixing device, one end of the nozzle 9 is connected with a containing bottle containing the cutting cooling liquid, and the cutting cooling liquid is used for cooling the wire saw 72.
During practical use, the feeding mechanism 8 is arranged at the top of the frame 1, the fixing device is arranged at the bottom of the feeding mechanism 8, the object 5 to be cut is adhered to the bottom of the processing jig 4, the processing jig 4 is clamped on the fixing piece 3, the nozzle 9 is connected with a containing bottle, the nozzle 9 is arranged at the position of the frame 1 above the multi-wire cutting device 7, the multi-wire cutting device 7 is arranged below the fixing device, the multi-wire cutting device 7 and the feeding mechanism 8 are started to cut, the cut wafer is taken down after the cutting is finished, the original processing jig 4 is replaced when the cutting is needed again, and a new processing jig 4 is installed again.
The preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings, but the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solutions of the present disclosure within the scope of the technical concept of the present disclosure, and all the simple modifications belong to the protection scope of the present disclosure.
In addition, the specific features described in the foregoing embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, the present disclosure does not further describe various possible combinations.
Moreover, any combination between the various embodiments of the present disclosure is possible as long as it does not depart from the spirit of the present disclosure, which should also be construed as the disclosure of the present disclosure.
Claims (10)
1. A fixture for multi-wire slicing, comprising:
a mounting base;
the fixing pieces are at least two, and at least two fixing pieces are arranged on one side of the mounting seat at intervals; and
the processing jig is detachably arranged on the fixing piece and used for installing objects to be cut.
2. The fixture for multi-wire slicing according to claim 1, wherein the top surface of the fixture is connected to the bottom surface of the mounting base, the bottom surface of the mounting base is a horizontal plane, the top surface of the fixture is disposed parallel to the horizontal plane, the fixture extends along the axial direction of the mounting base, and at least two of the fixtures are disposed parallel to each other.
3. The fixture for multi-wire slicing according to claim 2, wherein the processing jig extends from one end of the fixture to the other end and is connected to the bottom of the fixture by a clamping device, and the object to be cut is mounted on the bottom of the processing jig.
4. The fixing device for multi-wire slicing according to claim 3, wherein the clamping device comprises a C-shaped clamping groove arranged at the bottom of the fixing piece and with a downward opening end, and convex strips arranged at two sides of the top of the processing jig, and the convex strips are inserted into the C-shaped clamping groove.
5. A fixture for multi-wire slicing according to claim 3 wherein said object to be sliced is constructed in a cylindrical configuration extending in the same direction as said tooling and bonded to the bottom of said tooling, said tooling having arcuate slots corresponding to said cylindrical configuration at the bottom thereof, said tooling being a resin tooling.
6. A fixture for multi-wire slicing according to claim 1 wherein the object to be sliced is made of a hard brittle material including, but not limited to, sapphire, silicon carbide or silicon.
7. A multi-wire slicing apparatus, comprising:
the fixture for multi-line slicing according to any one of claims 1-6;
the feeding mechanism is arranged above the fixing device and drives the fixing device to move up and down; and
the multi-wire cutting device is arranged below the fixing device and used for cutting the object to be cut.
8. The multi-wire slicing device of claim 7, wherein the multi-wire slicing device comprises two opposing parallel rollers and a plurality of wire saws sleeved on the two rollers and disposed parallel to each other, the wire saws being disposed perpendicularly to an axial direction of the object to be sliced.
9. The multi-wire slicing apparatus of claim 8, wherein a distance between inner sides of two of said winding rollers is larger than a distance between outer sides of said objects to be sliced provided on two of said fixing members on an outermost side.
10. The multi-wire slicing device of claim 7, further comprising a nozzle for spraying a cutting coolant to the multi-wire slicing device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202320553300.7U CN219686174U (en) | 2023-03-15 | 2023-03-15 | Fixing device for multi-line slicing and multi-line slicing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202320553300.7U CN219686174U (en) | 2023-03-15 | 2023-03-15 | Fixing device for multi-line slicing and multi-line slicing device |
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Publication Number | Publication Date |
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CN219686174U true CN219686174U (en) | 2023-09-15 |
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CN202320553300.7U Active CN219686174U (en) | 2023-03-15 | 2023-03-15 | Fixing device for multi-line slicing and multi-line slicing device |
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Country | Link |
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CN (1) | CN219686174U (en) |
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- 2023-03-15 CN CN202320553300.7U patent/CN219686174U/en active Active
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