CN216968291U

CN216968291U - Jig for cutting wafer

Info

Publication number: CN216968291U
Application number: CN202220109225.0U
Authority: CN
Inventors: 李科
Original assignee: Shenzhen Godview Technology Co ltd
Current assignee: Shenzhen Godview Technology Co ltd
Priority date: 2022-01-17
Filing date: 2022-01-17
Publication date: 2022-07-15
Anticipated expiration: 2032-01-17

Abstract

The utility model relates to the technical field of wafer processing, and particularly discloses a wafer slitting jig which comprises a tray, wherein the surface of the tray is detachably connected with a positioning mechanism, the positioning mechanism comprises a connecting plate, the surface of the connecting plate is provided with a fixing ring, the edge of the fixing ring is vertically provided with an annular groove, the inside of the fixing ring is transversely provided with a wire guide groove penetrating through the annular groove, the inner side of the annular groove is detachably connected with a wafer, and the edge of the connecting plate is provided with a fixing component for fixing the wafer in the annular groove. According to the jig for cutting the wafer, the wafer cannot shake in the cutting process, the cutting efficiency is high, the wire guiding groove can be used for guiding and positioning the cutter, the thickness of the obtained product is the same, and the quality of the product is better.

Description

Jig for cutting wafer

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a jig for wafer slitting.

Background

The main processing modes of the wafer are wafer processing and batch processing, namely 1 or more wafers are processed simultaneously, a whole cylindrical wafer can be cut into a plurality of wafers with the same thickness through cutting equipment, and the wafers need to be fixed when being cut.

The prior art is through gluing direct to cut on gluing the tray of equipment with the raw materials, and this kind of fixed mode can increase the process, and the section yields is good controls, in addition, demolishs and wastes time and energy, leads to machining efficiency low.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a wafer dicing jig to solve the problems of the related art.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a wafer is cut and is used tool, includes the tray, the surface of tray can be dismantled and is connected with positioning mechanism, positioning mechanism includes the connecting plate, the surface of connecting plate is provided with the retainer plate, the vertical ring channel of having seted up in edge of retainer plate, the wire casing that runs through the ring channel is transversely seted up to the inside of retainer plate, the inboard of ring channel can be dismantled and be connected with the wafer, the edge of connecting plate is provided with fixes the fixed subassembly at the inside of ring channel with the wafer.

Preferably, the fixing assembly comprises an elastic sheet, a fixing screw is connected between the elastic sheet and the connecting plate, and the elastic sheet is mounted on the outer surface of the connecting plate through the fixing screw.

Preferably, one end of the upper part of the elastic sheet is fixedly connected with an elastic pad, and the surface of one end of the upper part of the elastic pad is in contact with the outer surface of the lower part of the wafer.

Preferably, the surface of the connecting plate is provided with a sliding groove, the elastic pad is connected inside the sliding groove in a sliding manner, and the size of the elastic pad is matched with that of the sliding groove.

Preferably, the connecting plate is installed on the surface of the tray through an M6 screw, and the connecting plate and the fixing ring are both circular.

Preferably, the number of the annular grooves is multiple, the annular grooves are arranged in a circular array on the edge of the fixing ring, one end of each annular groove is provided with an opening, and the wafer is placed in the annular groove through the openings.

Preferably, the number of the annular grooves is at least two, and the annular grooves are arranged at equal intervals.

Compared with the prior art, the utility model has the beneficial effects that: put into the inside of ring channel through the opening with the wafer, fix the shell fragment on the surface of connecting plate through the fixed screw, can make the cushion of shell fragment upper portion one end support the surface at the wafer, and then can fix the wafer in the ring channel, the fixed ratio of wafer is more firm, the cutter stretches into the wire casing inside and cuts the wafer, the wafer can not rock at the cutting in-process, and the tray can drive the wafer and rotate when the cutting, once can cut the wafer of a week, cutting efficiency is higher, in addition, the wire casing can carry out wire and location to the cutter, make the product thickness that obtains the same, can guarantee the quality of product, and it is more convenient to dismantle.

Drawings

FIG. 1 is a schematic view of an overall structure of a wafer dicing jig according to the present invention;

FIG. 2 is a schematic view of a partial structure of a wafer dicing jig according to the present invention;

FIG. 3 is an enlarged schematic view of a fixing assembly of the wafer dicing jig according to the present invention;

fig. 4 is a partially enlarged view of a positioning mechanism of a wafer dicing jig according to the present invention.

In the figure: 1. a tray; 2. a positioning mechanism; 21. a connecting plate; 22. a stationary ring; 23. an annular groove; 24. a wire guide groove; 3. a wafer; 4. a fixing assembly; 41. a spring plate; 42. an elastic pad; 43. fixing screws; 44. a chute.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 4, the utility model provides a wafer dicing jig, which includes a tray 1, a positioning mechanism 2 detachably connected to a surface of the tray 1, the positioning mechanism 2 including a connecting plate 21, a fixing ring 22 disposed on a surface of the connecting plate 21, an annular groove 23 vertically disposed on an edge of the fixing ring 22, a wire guide 24 transversely disposed in the fixing ring 22 and penetrating through the annular groove 23, a wafer 3 detachably connected to an inner side of the annular groove 23, and a fixing assembly 4 disposed on an edge of the connecting plate 21 and fixing the wafer 3 in the annular groove 23.

In this embodiment, the fixing assembly 4 includes a spring plate 41, a fixing screw 43 is connected between the spring plate 41 and the connecting plate 21, and the spring plate 41 is mounted on the outer surface of the connecting plate 21 through the fixing screw 43.

Specifically, the fixing screws 43 are convenient for mounting and dismounting the elastic sheets 41, and the wafer 3 can be clamped through the elastic sheets 41.

In this embodiment, an elastic pad 42 is fixedly connected to one end of the upper portion of the elastic sheet 41, and a surface of one end of the upper portion of the elastic pad 42 contacts with an outer surface of the lower portion of the wafer 3.

Specifically, the wafer 3 can be protected while being fixed by the elastic pad 42, so that the surface of the wafer 3 is prevented from being scratched by the elastic sheet 41.

In this embodiment, the surface of the connecting plate 21 is provided with a sliding groove 44, the elastic pad 42 is slidably connected inside the sliding groove 44, and the size of the elastic pad 42 is matched with that of the sliding groove 44.

In particular, the sliding groove 44 can limit the position of the elastic pad 42.

In this embodiment, the connecting plate 21 is mounted on the surface of the tray 1 by M6 screws, and both the connecting plate 21 and the fixing ring 22 are circular.

Specifically, the M6 screw is convenient for the disassembly and replacement of the positioning mechanism 2, and the positioning mechanisms 2 of different models can be replaced conveniently.

In this embodiment, the number of the annular grooves 23 is plural, the plurality of annular grooves 23 are arranged in a circular array at the edge of the fixing ring 22, one end of the annular groove 23 is an opening, and the wafer 3 is placed in the annular groove 23 through the opening.

Specifically, the wafer 3 can be supported through the annular groove 23, the annular groove 23 can guide the falling position of the wafer 3 after the wafer is cut, the wafer 3 is prevented from falling onto the rack in the instant of cutting and being damaged due to other unnecessary collisions, in addition, the annular groove 23 provides a transverse acting point when the wafer 3 is cut, and the edge breakage phenomenon when the cutting of the wafer 3 is about to be completed can be effectively avoided.

In this embodiment, the number of the annular grooves 23 is at least two, and the annular grooves 23 are arranged at equal intervals.

Specifically, the wire guide 24 can guide the cutter routing stroke, and the thickness of the obtained product is the same.

The working principle is as follows: during the use, fix connecting plate 21 on tray 1 surface through the M6 screw, tray 1 is installed on external rotating device, put into the inside of ring channel 23 through the opening with wafer 3, fix shell fragment 41 on the surface of connecting plate 21 through set screw 43, can make the cushion 42 of shell fragment 41 upper portion one end support the surface at wafer 3, and then can fix wafer 3 in ring channel 23, make outside cutter stretch into inside the wire casing 24 through tray 1 lateral shifting and rotation and cut wafer 3.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer is cut and is used tool, includes tray (1), its characterized in that, the surface of tray (1) can be dismantled and is connected with positioning mechanism (2), positioning mechanism (2) are including connecting plate (21), the surface of connecting plate (21) is provided with retainer plate (22), ring channel (23) have vertically been seted up at the edge of retainer plate (22), wire casing (24) that run through ring channel (23) are transversely seted up to the inside of retainer plate (22), the inboard of ring channel (23) can be dismantled and be connected with wafer (3), the edge of connecting plate (21) is provided with fixes wafer (3) at fixed subassembly (4) inside ring channel (23).

2. A wafer cutting jig according to claim 1, characterized in that the fixing component (4) comprises a spring plate (41), a fixing screw (43) is connected between the spring plate (41) and the connecting plate (21), and the spring plate (41) is installed on the outer surface of the connecting plate (21) through the fixing screw (43).

3. A jig for wafer dicing according to claim 2, wherein an elastic pad (42) is fixedly connected to one end of the upper portion of the elastic sheet (41), and a surface of one end of the upper portion of the elastic pad (42) is in contact with an outer surface of the lower portion of the wafer (3).

4. A wafer cutting jig according to claim 3, characterized in that the surface of the connecting plate (21) is provided with a sliding groove (44), the elastic pad (42) is slidably connected inside the sliding groove (44), and the size of the elastic pad (42) is matched with that of the sliding groove (44).

5. A wafer cutting jig according to claim 1, characterized in that the connecting plate (21) is mounted on the surface of the tray (1) through M6 screws, and the connecting plate (21) and the fixing ring (22) are both circular.

6. A wafer slitting jig according to claim 1, characterized in that the number of the ring grooves (23) is multiple, the ring grooves (23) are arranged in a circular array at the edge of the fixing ring (22), one end of the ring groove (23) is an opening, and the wafer (3) is placed in the ring groove (23) through the opening.

7. A wafer slitting jig according to claim 1, characterized in that the number of the ring grooves (23) is at least two, and the ring grooves (23) are arranged at equal intervals.