CN219686173U

CN219686173U - Material carrying platform and wire cutting device

Info

Publication number: CN219686173U
Application number: CN202223595479.7U
Authority: CN
Inventors: 仇健
Original assignee: Qingdao Gaoce Technology Co Ltd
Current assignee: Qingdao Gaoce Technology Co Ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-09-15
Anticipated expiration: 2032-12-30

Abstract

The embodiment of the utility model discloses a material carrying platform and a wire cutting device. The linear cutting device comprises a base, a material carrying platform and a cutting mechanism arranged above the base, wherein the material carrying platform comprises an X-axis platform arranged on the base, and the X-axis platform extends along the X-axis direction; the Y-axis platform is arranged on the X-axis platform and can move along the X-axis direction, the Y-axis platform extends along the Y-axis direction, and the X-axis direction is perpendicular to the Y-axis direction; and the C-axis turntable is arranged on the Y-axis platform and can move along the Y axis, the C-axis turntable is used for bearing and clamping materials to be processed, the C-axis turntable can rotate around the C-axis direction, and the C-axis direction is perpendicular to the X-axis direction and the Y-axis direction. By adopting the scheme of the embodiment of the utility model, the application scene of diamond wire cutting is effectively expanded, the multi-axis linkage efficient processing of the space curved surface can be realized, and the processing efficiency and the processing quality are obviously improved.

Description

Material carrying platform and wire cutting device

Technical Field

The utility model relates to the technical field of diamond wire cutting, in particular to a material carrying platform and a wire cutting device.

Background

At present, in the field of space curved surfaces and numerical control machining, for part machining of space curved surfaces, milling machining is one of the most commonly used machining methods in machining, but when a numerical control machine tool is adopted for milling the space curved surfaces, a cutter needs to remove materials to be machined layer by layer from the outermost layer to the inside according to a machining route to obtain curved surface contours, and the machining efficiency of the process is low.

In the field of cutting photovoltaic crystalline silicon and semiconductors, a cutting machine head with single-wire and multi-wire diamond wires is often used for cutting off, squaring and slicing silicon materials and the like, so that the processing efficiency is high, however, the cutting machine head in the scheme generally only has a single feeding direction, and can meet the processing requirement of the silicon materials, but if the cutting machine head is applied to the processing of parts with space curved surfaces, the requirements are difficult to meet.

How to combine the advantages of different schemes in the technical level and realize the rapid and efficient processing of the space curved surface is needed to be solved by the technicians in the field.

Disclosure of Invention

Therefore, the embodiment of the utility model provides a material carrying platform and a wire cutting device, which are convenient for removing materials by adopting diamond wire cutting and realize multi-axis linkage efficient processing of space curved surfaces.

The material carrying platform comprises a base, a material carrying platform and a cutting mechanism arranged above the base, wherein the material carrying platform comprises an X-axis platform arranged on the base, and the X-axis platform extends along the X-axis direction; the Y-axis platform is arranged on the X-axis platform and can move along the X-axis direction, the Y-axis platform extends along the Y-axis direction, and the X-axis direction is perpendicular to the Y-axis direction; and the C-axis turntable is arranged on the Y-axis platform and can move along the Y axis, the C-axis turntable is used for bearing and clamping materials to be processed, the C-axis turntable can rotate around the C-axis direction, and the C-axis direction is perpendicular to the X-axis direction and the Y-axis direction.

Further, a tool for bearing and clamping the material to be processed is arranged on the C-axis turntable.

Further, the material carrying platform further comprises a working platform, the working platform is arranged on the Y-axis platform, and the C-axis turntable is arranged on the working platform.

Further, a first slideway is arranged at the top of the X-axis platform, a first sliding block part is arranged at the bottom of the Y-axis platform, and the first sliding block part is in sliding fit with the first slideway.

Further, a second slideway is arranged at the top of the Y-axis platform, a second sliding block part is arranged at the bottom of the working platform, and the second sliding block part is in sliding fit with the second slideway.

Further, the material carrying platform further comprises an X-axis driving mechanism arranged between the X-axis platform and the Y-axis platform, a Y-axis driving mechanism arranged between the Y-axis platform and the working platform, and a C-axis rotation mechanism arranged between the working platform and the C-axis turntable.

On the other hand, the embodiment of the utility model also provides a wire cutting device, which comprises a base, a cutting mechanism arranged above the base, and a carrying platform according to any one of the above, wherein the carrying platform is arranged corresponding to the cutting mechanism.

Further, the cutting mechanism is arranged above the base through the upright post.

Further, a Z-axis sliding groove is formed in the upright post, the cutting mechanism is in sliding fit with the Z-axis sliding groove through a sliding plate, and the linear cutting device further comprises a lifting adjusting mechanism arranged between the upright post and the sliding plate.

Further, the cutting mechanism comprises a mounting frame, a cutting wheel mechanism used for winding a cutting line is arranged on the mounting frame, and the cutting wheel mechanism comprises a first cutting wheel, a second cutting wheel, a tension wheel and a driving wheel which are arranged on the mounting frame at intervals.

After the scheme of the embodiment of the utility model is adopted, the application scene of the original diamond wire cutting is effectively expanded, namely the multi-axis linkage (at least comprising an X-axis and a Y-axis) processing space curved surface can be realized, the diamond wire is directly cut into the material to be processed by the scheme without being removed layer by layer, and finally the expected processing molded surface is obtained by utilizing a specific feed path, so that the processing efficiency and the processing quality are obviously improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:

fig. 1 is a schematic structural diagram of a core part of a wire cutting device according to an embodiment of the present utility model;

FIG. 2 is a schematic view of the structure of FIG. 1 from another perspective;

fig. 3 is a schematic structural diagram of another view of fig. 1.

Reference numerals:

100 material carrying platform

200 materials to be processed

300 cutting mechanism

400 stand

500 base

101 working platform

102Y-axis platform

103X-axis platform

104 tool

105C-axis turntable

301 mounting frame

302 skateboard

303 first cutting wheel

304 second cutting wheel

305 tension pulley

306 driving wheel

401Z-axis chute

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by a person of ordinary skill in the art without undue creative effort, are within the scope of protection of the present utility model based on the embodiments in the present utility model. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be arbitrarily combined with each other.

The wire cutting device and the loading platform according to the embodiments of the present utility model are described in detail below with reference to fig. 1, 2 and 3. As shown in the figure, the wire cutting apparatus according to the embodiment of the present utility model may include a loading platform 100, a cutting mechanism 300, a column 400, and a base 500. Wherein, the upright post 400 is disposed at a first position on the base 500, the cutting mechanism 300 is disposed on the upright post 400, and the loading platform 100 is disposed at a second position on the base 500.

The loading platform 100 may include a work platform 101, a Y-axis platform 102 extending entirely along the Y-axis direction, an X-axis platform 103 extending entirely along the X-axis direction, and a C-axis turntable 105. The bottom of the X-axis platform 103 is disposed at the second position of the base 500, the Y-axis platform 102 is movably disposed on the X-axis platform 103 along the X-axis direction, the working platform 101 is movably disposed on the Y-axis platform 102 along the Y-axis direction, and the X-axis direction is perpendicular to the Y-axis direction; the C-axis turntable 105 is disposed on the working platform 101 and further disposed on the Y-axis platform 102, the C-axis turntable 105 is configured to carry and clamp a material 200 to be processed, the C-axis turntable 105 can rotate around a C-axis direction, and the C-axis direction is perpendicular to the X-axis direction and the Y-axis direction. In a specific implementation process, the working platform 101 may be provided with a tool 104, so as to facilitate carrying and clamping of the material 200 to be processed.

In the working process, the position of the working platform 101 on the Y-axis platform 101 and the position of the working platform 101 on the X-axis platform 103 are adjusted, and the rotation state of the C-axis turntable 105 is adjusted, so that the material 200 to be processed on the C-axis turntable 105 approaches to the diamond wire cutting position of the cutting mechanism 300 in a preset feeding route and angle, and the anisotropic curved surface processing of the material 200 to be processed is realized. In specific implementation, the workpiece (corresponding to the material 200 to be cut) can move relatively to the diamond wire of the tool bit under the linkage drive of the X axis and the Y axis, and the XYC linkage or the XYZC (see below for a scheme) linkage is adopted, so that the movement of planning a cutting path is realized, the processing of a special-shaped curved surface can be realized through the path planning of an effective cutting section of the diamond wire, the diamond wire moves on the plane of a gear train of a cutting mechanism in the whole cutting process, so that the wiring movement relative to the workpiece (corresponding to the material 200 to be cut) is obtained, and when the workpiece moves relatively to the effective cutting section of the diamond wire, the diamond wire removes the workpiece material, so that the cutting of the special-shaped surface is realized through the planning path.

As can be seen from the foregoing and the conditions of the prior art, in the prior art, a numerical control machine tool machining mode is adopted for the special-shaped curved surface, when a larger surface is machined into a small surface, the workpiece needs to be removed layer by layer, and the machining efficiency is low. Compared with a flexible processing method without adopting a C-axis function, the scheme of the embodiment of the utility model is more flexible in motion, is particularly suitable for processing a revolving body type two-dimensional curved surface, and particularly, although X/Y linkage can be used for processing the molded surfaces of each half circumference on two sides of a tool bit, the tool bit cannot pass through a supporting tool below a workpiece, and the cylindrical molded surface cannot be closed, after the C-axis is additionally arranged, when the X-axis and the Y-axis are linked to a set position and cut into the workpiece, the processing of the cylindrical curved surface can be realized directly through the C-axis revolving motion, and the processed molded surface can be closed and the processed precision can be obtained. In addition, the scheme of the embodiment of the utility model effectively expands the applicable scene of diamond wire cutting.

In the implementation process, in order to better realize the motion performance of the X-axis platform 103 and the Y-axis platform 102, a first slide way can be arranged at the top of the X-axis platform 103, and correspondingly, a first slide block part is arranged at the bottom of the Y-axis platform 102 and is in sliding fit with the first slide way; in addition, a second slide way may be disposed at the top of the Y-axis platform 102, and a second slider portion may be disposed at the bottom of the working platform 101, where the second slider portion is in sliding fit with the second slide way. In order to realize the adjustment control of the X-axis and Y-axis movements and the rotation control of the C-axis platform, the material loading platform can further comprise an X-axis driving mechanism arranged between the X-axis platform 103 and the Y-axis platform 102, a Y-axis driving mechanism arranged between the Y-axis platform 103 and the working platform 101 and a C-axis rotation mechanism arranged between the working platform 101 and the C-axis turntable 105, wherein the axial driving mechanism can be realized in a screw-screw mode, and the C-axis rotation mechanism can be realized in a motor driving mode. As one preferable option, a corresponding lifting mechanism may be disposed on the loading platform, so that the C-axis turntable can be lifted along the C-axis direction, i.e. moved up and down. When the lifting mechanism is specifically implemented, the lifting mechanism can adopt a telescopic mechanism form of an oil cylinder or a sliding fit form of a slideway sliding block, and can independently drive the C-axis turntable to lift and integrally drive the X-axis platform, the Y-axis platform and the C-axis turntable to lift. Therefore, the similar effect of the motion of the cutting mechanism along the Z axis can be realized, and the C axis lifting and lowering of the material carrying platform can be realized to realize the corresponding effect under the condition that the cutting mechanism does not have the Z axis motion function or is inconvenient to control to realize the Z axis motion.

On this basis, in order to further improve the processability and flexibility of the wire cutting device, the cutting mechanism 300 may have a Z-axis movement function, specifically, a Z-axis chute 401 may be formed on the upright 400, the (mounting frame 301 of the) cutting mechanism 300 is slidably matched with the Z-axis chute 401 through a slide plate 302, and a lifting adjustment mechanism (not shown in the drawing) is further disposed between the upright 400 and the slide plate 302, so as to realize that the cutting mechanism 300 can lift on the upright 400 in the Z-axis axial direction, and the lifting adjustment mechanism may also adopt a screw-screw manner. After the scheme is adopted, the cutting mechanism 300 can be adjusted along the Z direction through the Z-axis movement without being matched with various tools, the processing height can be flexibly adjusted, the processing position is matched to the maximum extent, and the influence of the wire bow on the processing precision is reduced to the minimum.

In addition, in the implementation, the cutting mechanism 300 may adopt different cutter head schemes, as an example, as shown in the drawing, the cutting mechanism 300 may include a mounting frame 301, on which a cutting wheel mechanism for winding a cutting line is disposed on the mounting frame 301, and the cutting wheel mechanism includes a first cutting wheel 303, a second cutting wheel 304, a tension wheel 305, and a driving wheel 306. The first cutting wheel 303, the second cutting wheel 304, the tension wheel 305 and the driving wheel 306 are sequentially arranged on the mounting frame 301 at intervals, and diamond wires (not shown) sequentially bypass the wheel edges to form annular wires respectively, and the mounting frame 301 is arranged on the upright post 400 through the sliding plate 302. In use, the drive wheel 306 is used to power the wire web to drive the wire web to move to provide cutting force for cutting, the first cutting wheel 303 and the second cutting wheel 304 are respectively used to support the wire web to cut the workpiece along the feeding direction, the wire segment of the wire web between the two cutting wheels is the effective cutting line length, and the tension wheel 305 is used to provide guarantee for maintaining stable cutting tension for tensioning the wire web.

In addition, in the concrete implementation, the machining can be performed by simultaneous coordinated motion under the control of a Computer Numerical Control (CNC) system, the cutter axis vector of the whole cutting track displaying process of multi-axis linkage can be changed as required, and the C axis is controlled by a X, Y, Z track control axis to realize the gradual material removal, so that the space curved surface machining is finally realized. For the horizontal X-axis, Y-axis orthogonal sliding table and C-axis turntable, curved surface movement can be realized by 3-axis linkage, and for the scheme with Z-axis, the tool bit is matched with the Z-axis for feeding, so that the 4-axis linkage processing of a better linear cutting position can be realized by adjusting the position of a workpiece tangent point at the midpoint of an effective cutting line segment.

While preferred embodiments of the present utility model have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the utility model.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims

1. The material carrying platform is characterized by comprising a base, a material carrying platform and a cutting mechanism arranged above the base, wherein the material carrying platform comprises an X-axis platform arranged on the base, and the X-axis platform extends along the X-axis direction;

the Y-axis platform is arranged on the X-axis platform and can move along the X-axis direction, the Y-axis platform extends along the Y-axis direction, and the X-axis direction is perpendicular to the Y-axis direction;

and the C-axis turntable is arranged on the Y-axis platform and can move along the Y axis, the C-axis turntable is used for bearing and clamping materials to be processed, the C-axis turntable can rotate around the C-axis direction, and the C-axis direction is perpendicular to the X-axis direction and the Y-axis direction.

2. The material loading platform of claim 1, wherein the C-axis turntable is provided with a fixture for carrying and clamping a material to be processed.

3. The loading platform of claim 1, further comprising a work platform disposed on the Y-axis platform, the C-axis turntable disposed on the work platform.

4. A loading platform according to claim 3, wherein a first slide way is provided at the top of the X-axis platform, a first slider portion is provided at the bottom of the Y-axis platform, and the first slider portion is in sliding fit with the first slide way.

5. The material loading platform of claim 4, wherein a second slide way is arranged at the top of the Y-axis platform, a second slide block part is arranged at the bottom of the working platform, and the second slide block part is in sliding fit with the second slide way.

6. The loading platform of claim 5, further comprising an X-axis drive mechanism disposed between the X-axis platform and the Y-axis platform, a Y-axis drive mechanism disposed between the Y-axis platform and the work platform, and a C-axis swing mechanism disposed between the work platform and the C-axis turntable.

7. A wire cutting device, comprising a base, a cutting mechanism arranged above the base, and a carrying platform according to any one of claims 1 to 6, wherein the carrying platform is arranged corresponding to the cutting mechanism.

8. The wire cutting device of claim 7, wherein the cutting mechanism is disposed above the base by a post.

9. The wire cutting device of claim 8, wherein the upright post is provided with a Z-axis chute, the cutting mechanism is in sliding fit with the Z-axis chute through a sliding plate, and the wire cutting device further comprises a lifting adjustment mechanism arranged between the upright post and the sliding plate.

10. The wire cutting device of claim 8, wherein the cutting mechanism includes a mounting frame on which a cutting wheel mechanism for winding a cutting wire is disposed, the cutting wheel mechanism including a first cutting wheel, a second cutting wheel, a tension wheel, and a driving wheel disposed on the mounting frame at intervals.