CN219522631U

CN219522631U - Wire cutting device

Info

Publication number: CN219522631U
Application number: CN202223600338.XU
Authority: CN
Inventors: 仇健
Original assignee: Qingdao Gaoce Technology Co Ltd
Current assignee: Qingdao Gaoce Technology Co Ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-08-15
Anticipated expiration: 2032-12-30

Abstract

The embodiment of the utility model discloses a wire cutting device. The linear cutting device comprises a base, a material carrying platform and a cutting mechanism arranged above the base, wherein the material carrying platform comprises an X-axis platform arranged on the base, and the X-axis platform extends along the X-axis direction; the Y-axis platform is arranged on the X-axis platform and can move along the X-axis direction, the Y-axis platform extends along the Y-axis direction, and the X-axis direction is perpendicular to the Y-axis direction; and the working platform can be movably arranged on the Y-axis platform along the Y-axis direction and is used for bearing and clamping materials to be processed. After the scheme of the embodiment of the utility model is adopted, the application scene of diamond wire cutting is effectively expanded, interpolation motion can be carried out through two-axis linkage, redundant materials are removed by cutting a curved surface workpiece through a diamond wire, the redundant materials are not required to be removed layer by layer, and finally, the expected machining profile is obtained through a specific feed path, so that the machining efficiency and the machining quality are obviously improved.

Description

Wire cutting device

Technical Field

The utility model relates to the technical field of diamond wire cutting, in particular to a wire cutting device.

Background

At present, in the field of space curved surfaces and numerical control machining, for part machining of space curved surfaces, milling machining is one of the most commonly used machining methods in machining, but when a numerical control machine tool is adopted for milling the space curved surfaces, a cutter needs to remove materials to be machined layer by layer from the outermost layer to the inside according to a machining route to obtain curved surface contours, and the machining efficiency of the process is low.

In the field of cutting photovoltaic crystalline silicon and semiconductors, a cutting machine head with single-wire and multi-wire diamond wires is often used for cutting off, squaring and slicing silicon materials and the like, so that the processing efficiency is high, however, the cutting machine head in the scheme generally only has a single feeding direction, and can meet the processing requirement of the silicon materials, but if the cutting machine head is applied to the processing of parts with space curved surfaces, the requirements are difficult to meet.

How to combine the advantages of different schemes in the technical level, realizing the rapid and efficient space curved surface processing, and the technical scheme needs to be solved by the technicians in the field.

Disclosure of Invention

Therefore, the embodiment of the utility model provides a wire cutting device, which is convenient for removing materials by adopting diamond wire cutting and realizes efficient processing of multi-dimensional special-shaped complex curved surfaces.

The wire cutting device comprises a base, a material carrying platform and a cutting mechanism, wherein the cutting mechanism is arranged above the base, the material carrying platform comprises an X-axis platform arranged on the base, and the X-axis platform extends along the X-axis direction; the Y-axis platform is arranged on the X-axis platform and can move along the X-axis direction, the Y-axis platform extends along the Y-axis direction, and the X-axis direction is perpendicular to the Y-axis direction; and the working platform can be movably arranged on the Y-axis platform along the Y-axis direction and is used for bearing and clamping materials to be processed.

Further, a tool for bearing and clamping the material to be processed is arranged on the working platform.

Further, a first slideway is arranged at the top of the X-axis platform, a first sliding block part is arranged at the bottom of the Y-axis platform, and the first sliding block part is in sliding fit with the first slideway.

Further, a second slideway is arranged at the top of the Y-axis platform, a second sliding block part is arranged at the bottom of the working platform, and the second sliding block part is in sliding fit with the second slideway.

Further, the material carrying platform further comprises an X-axis driving mechanism arranged between the X-axis platform and the Y-axis platform and a Y-axis driving mechanism arranged between the Y-axis platform and the working platform.

Further, the material carrying platform comprises a lifting mechanism, the lifting mechanism can drive the working platform to move along the direction of a C axis, and the direction of the C axis is perpendicular to the direction of the X axis and the direction of the Y axis.

Further, the cutting mechanism is arranged above the base through the upright post.

Further, a Z-axis sliding groove is formed in the upright post, the cutting mechanism is in sliding fit with the Z-axis sliding groove through a sliding plate, and the linear cutting device further comprises a lifting adjusting mechanism arranged between the upright post and the sliding plate.

Further, the cutting mechanism comprises a mounting frame, a cutting wheel mechanism used for winding a cutting line is arranged on the mounting frame, and the cutting wheel mechanism comprises a first cutting wheel, a second cutting wheel, a tension wheel and a driving wheel which are arranged on the mounting frame at intervals.

Further, the diamond wire is single or multiple.

After the scheme of the embodiment of the utility model is adopted, the application scene of the original diamond wire cutting is effectively expanded, namely the multi-axis linkage processing of the space curved surface can be realized, the diamond wire is directly cut into the material to be processed, the material is not required to be removed layer by layer, the expected processing molded surface is finally obtained by utilizing a specific feed path, and the processing efficiency and the processing quality are obviously improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:

fig. 1 is a schematic structural diagram of a core part of a wire cutting device according to an embodiment of the present utility model;

FIG. 2 is another view of FIG. 1;

fig. 3 is a further view of fig. 1.

Reference numerals:

100 material carrying platform

200 materials to be processed

300 cutting mechanism

400 stand

500 base

101 working platform

102Y-axis platform

103X-axis platform

104 tool

301 mounting frame

302 skateboard

303 first cutting wheel

304 second cutting wheel

305 tension pulley

306 driving wheel

401Z-axis chute

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by a person of ordinary skill in the art without undue creative effort, are within the scope of protection of the present utility model based on the embodiments in the present utility model. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be arbitrarily combined with each other.

The wire cutting apparatus according to the embodiment of the present utility model will be described in detail with reference to fig. 1, 2 and 3. As shown in the figure, the wire cutting apparatus according to the embodiment of the present utility model may include a loading platform 100, a cutting mechanism 300, a column 400, and a base 500. Wherein, stand 400 sets up in the first position of base 500, and cutting mechanism 300 sets up on stand 400, and loading platform 100 sets up in the second position of base 500.

The material loading platform 100 may include a working platform 101, a Y-axis platform 102 extending along a Y-axis direction, and an X-axis platform 103 extending along an X-axis direction, where the bottom of the X-axis platform 103 is disposed at a second position of the base 500, the Y-axis platform 102 is movably disposed on the X-axis platform 103 along the X-axis direction, the working platform 101 is movably disposed on the Y-axis platform 102 along the Y-axis direction, and the working platform 101 is used for loading and clamping the material 200 to be processed. Wherein the X-axis direction is perpendicular to the Y-axis direction. In a specific implementation process, the working platform 101 may be provided with a tool 104, so as to facilitate carrying and clamping of the material 200 to be processed.

In the working process, the position of the working platform 101 on the Y-axis platform 101 and the position of the working platform 101 on the X-axis platform 103 can be adjusted, so that the material 200 to be processed on the working platform 101 approaches to the diamond wire cutting part of the cutting mechanism 300 in a preset feeding route and angle, and the anisotropic curved surface processing of the material 200 to be processed is realized. In the specific implementation, the workpiece (corresponding to the material 200 to be cut) can move relatively to the diamond wire of the cutter head under the linkage drive of the X axis and the Y axis, so that the movement of planning a cutting path is realized, the processing of the special-shaped curved surface can be realized through the path planning of the effective cutting section of the diamond wire, the diamond wire moves on the plane of the gear train of the cutting mechanism in the whole cutting process, so that the wiring movement relative to the workpiece (corresponding to the material 200 to be cut) is obtained, and when the workpiece moves relative to the effective cutting section of the diamond wire, the diamond wire removes the workpiece material, so that the cutting of the special-shaped surface is realized through the planning path.

According to the technical scheme, a numerical control machine tool machining mode is adopted for the special-shaped curved surface, when a large surface is machined into a small surface, the workpiece needs to be removed layer by layer, and machining efficiency is low. In addition, the scheme of the embodiment of the utility model effectively expands the applicable scene of diamond wire cutting.

In the implementation process, in order to better realize the motion performance of the X-axis platform 103 and the Y-axis platform 102, a first slide way can be arranged at the top of the X-axis platform 103, and correspondingly, a first slide block part is arranged at the bottom of the Y-axis platform 102 and is in sliding fit with the first slide way; in addition, a second slide way may be disposed at the top of the Y-axis platform 102, and a second slider portion may be disposed at the bottom of the working platform 101, where the second slider portion is in sliding fit with the second slide way. In order to realize the adjustment control of the X-axis and Y-axis movements, the material loading platform can further comprise an X-axis driving mechanism arranged between the X-axis platform 103 and the Y-axis platform 102 and a Y-axis driving mechanism arranged between the Y-axis platform 103 and the working platform 101, and the axial driving mechanism can be realized in a screw-nut lead screw mode.

As a preferred option, the loading platform may be provided with a corresponding lifting mechanism for driving the working platform, so that the working platform can be lifted along a C-axis direction, and the C-axis direction is perpendicular to the aforementioned X-axis direction and Y-axis direction, i.e. parallel to the Z-axis hereinafter. When the lifting mechanism is specifically implemented, the lifting mechanism can be in the form of a telescopic mechanism of an oil cylinder type or in the form of sliding fit of a slideway sliding block, and can independently drive the working platform to lift and integrally drive the X-axis platform, the Y-axis platform and the working platform to lift. Therefore, the similar effect of the motion of the cutting mechanism along the Z axis can be realized, and the C axis lifting and lowering of the material carrying platform can be realized to realize the corresponding effect under the condition that the cutting mechanism does not have the Z axis motion function or is inconvenient to control to realize the Z axis motion.

On this basis, in order to further improve the processability and flexibility of the wire cutting device, the cutting mechanism 300 may have a Z-axis movement function, specifically, a Z-axis chute 401 may be formed on the upright 400, the (mounting frame 301 of the) cutting mechanism 300 is slidably matched with the Z-axis chute 401 through a slide plate 302, and a lifting adjustment mechanism (not shown in the drawing) is further disposed between the upright 400 and the slide plate 302, so as to realize that the cutting mechanism 300 can lift on the upright 400 in the Z-axis axial direction, and the lifting adjustment mechanism may also adopt a screw-screw manner. After the scheme is adopted, the cutting mechanism 300 can be adjusted along the Z direction through the Z-axis movement without being matched with various tools, the processing height can be flexibly adjusted, the processing position is matched to the maximum extent, and the influence of the wire bow on the processing precision is reduced to the minimum.

In addition, in the implementation process, the cutting mechanism 300 may adopt different cutter head schemes, as an example, as shown in the figure, the cutting mechanism 300 may include a mounting frame 301, and a cutting wheel mechanism for winding a cutting line is disposed on the mounting frame 301, where the cutting wheel mechanism includes a first cutting wheel 303, a second cutting wheel 304, a tension wheel 305, and a driving wheel 306. The first cutting wheel 303, the second cutting wheel 304, the tension wheel 305 and the driving wheel 306 are sequentially arranged on the mounting frame 301 at intervals, and diamond wires (not shown) sequentially bypass the wheel edges to form annular wires respectively, and the mounting frame 301 is arranged on the upright post 400 through the sliding plate 302. In use, the drive wheel 306 is used to power the wire web to drive the wire web to move to provide cutting force for cutting, the first cutting wheel 303 and the second cutting wheel 304 are respectively used to support the wire web to cut the workpiece along the feeding direction, the wire segment of the wire web between the two cutting wheels is the effective cutting line length, and the tension wheel 305 is used to provide guarantee for maintaining stable cutting tension for tensioning the wire web. In addition, each wheel edge can comprise a plurality of wheels, so that the diamond wire can be used for cutting multiple wires only by a single wire or a plurality of wires.

While preferred embodiments of the present utility model have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the utility model.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims

1. The linear cutting device is characterized by comprising a base, a material carrying platform and a cutting mechanism arranged above the base, wherein the material carrying platform comprises an X-axis platform arranged on the base, and the X-axis platform extends along the X-axis direction;

the Y-axis platform is arranged on the X-axis platform and can move along the X-axis direction, the Y-axis platform extends along the Y-axis direction, and the X-axis direction is perpendicular to the Y-axis direction;

and the working platform can be movably arranged on the Y-axis platform along the Y-axis direction and is used for bearing and clamping materials to be processed.

2. The wire cutting device according to claim 1, wherein a tool for carrying and clamping a material to be processed is provided on the work platform.

3. The wire cutting device according to claim 1, wherein a first slide is provided at the top of the X-axis platform, a first slider portion is provided at the bottom of the Y-axis platform, and the first slider portion is slidably engaged with the first slide.

4. The wire cutting device according to claim 3, wherein a second slide way is arranged at the top of the Y-axis platform, a second slide block part is arranged at the bottom of the working platform, and the second slide block part is in sliding fit with the second slide way.

5. The wire cutting apparatus of claim 1, wherein the loading platform further comprises an X-axis drive mechanism disposed between the X-axis platform and the Y-axis platform, and a Y-axis drive mechanism disposed between the Y-axis platform and the work platform.

6. The wire cutting device according to any one of claims 1 to 5, wherein the loading platform comprises a lifting mechanism, the lifting mechanism can drive the working platform to move along a C-axis direction, and the C-axis direction is perpendicular to the X-axis direction and the Y-axis direction.

7. The wire cutting apparatus according to any one of claims 1 to 5, wherein the cutting mechanism is disposed above the base by a post.

8. The wire cutting device of claim 7, wherein the upright post is provided with a Z-axis chute, the cutting mechanism is in sliding fit with the Z-axis chute through a sliding plate, and the wire cutting device further comprises a lifting adjustment mechanism arranged between the upright post and the sliding plate.

9. The wire cutting apparatus of claim 7, wherein the cutting mechanism comprises a mounting frame on which a cutting wheel mechanism for winding a cutting wire is provided, the cutting wheel mechanism comprising a first cutting wheel, a second cutting wheel, a tension wheel, and a driving wheel arranged at intervals.

10. The wire cutting device of claim 9, further comprising a diamond wire that sequentially bypasses the first cutting wheel, the second cutting wheel, the tension wheel, and the drive wheel to form a loop wire, the diamond wire being single or multiple.