CN219685141U - Grinding wheel for aerospace packaging electronic precise element - Google Patents
Grinding wheel for aerospace packaging electronic precise element Download PDFInfo
- Publication number
- CN219685141U CN219685141U CN202321051080.4U CN202321051080U CN219685141U CN 219685141 U CN219685141 U CN 219685141U CN 202321051080 U CN202321051080 U CN 202321051080U CN 219685141 U CN219685141 U CN 219685141U
- Authority
- CN
- China
- Prior art keywords
- grinding wheel
- grinding
- heat dissipation
- wheel body
- aerospace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 229910001651 emery Inorganic materials 0.000 claims 4
- 238000000034 method Methods 0.000 abstract description 8
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 229910021538 borax Inorganic materials 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 239000010431 corundum Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000010339 sodium tetraborate Nutrition 0.000 description 2
- 239000004328 sodium tetraborate Substances 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model discloses a grinding wheel for an aerospace packaging electronic precision element, which comprises a grinding wheel body, wherein CBN grinding wheel layers are arranged at the top and the bottom of the grinding wheel body, a first heat dissipation hole is formed in the grinding wheel body, a second heat dissipation hole is formed in an inner ring of the first heat dissipation hole, and a chip removal groove is formed in the edge of the grinding wheel body. According to the utility model, the CBN grinding wheel layers are arranged at the top and the bottom of the grinding wheel body, so that the grinding hardness of the grinding wheel can be effectively improved, the inventor is provided with the first heat dissipation holes and the second heat dissipation holes on the grinding wheel body, so that heat generated in the grinding process of the grinding wheel can be timely dissipated, and the chip removal grooves arranged at the outer edge of the grinding wheel can timely remove chips generated in the grinding process, so that the grinding of the grinding wheel can be ensured to be normally carried out, the grinding efficiency of the grinding wheel is improved, and the service life of the grinding wheel is prolonged.
Description
Technical Field
The utility model belongs to the technical field of aerospace power components, and particularly relates to a grinding wheel for an aerospace packaging electronic precision component.
Background
Aerospace electronic components are components of electronic components and electrical small-sized machines and instruments, and are often composed of a plurality of parts, so that the aerospace electronic components play a vital role in the safe operation of an aerospace vehicle. Before the finished product of the electronic component, finishing and polishing work is needed to be carried out, and redundant parts are polished, but when the electronic component is polished by the existing grinding wheel, the temperature of the grinding wheel can be quickly increased, and the polished fragments are not easy to discharge, so that the polishing efficiency of the grinding wheel is affected by the factors.
Disclosure of Invention
In order to overcome the defects in the prior art, the inventor develops a grinding wheel for aerospace packaging electronic precision elements in long-term practice.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an aerospace encapsulates grinding wheel for electronic precision component, includes the grinding wheel body, grinding wheel body top and bottom are provided with CBN grinding wheel layer, first louvre has been seted up on the grinding wheel body, the second louvre has been seted up to the inner circle in first louvre, chip groove 4 has been seted up at the edge of grinding wheel body.
Further, the CBN grinding wheel layer comprises CBN grinding materials, ceramic bond, white corundum and resin powder; the raw materials for preparing the ceramic bond comprise silicon dioxide, borax, aluminum oxide, titanium dioxide and barium oxide.
Further, the chip removal groove is semicircular.
Further, the heat dissipation holes are rectangular, and the first heat dissipation holes and the second heat dissipation holes are annularly distributed on the grinding wheel body.
Further, the thickness of the grinding wheel body is 8mm to 15mm.
Compared with the prior art, the utility model has the beneficial effects that: according to the utility model, the CBN grinding wheel layers are arranged at the top and the bottom of the grinding wheel body, so that the grinding hardness of the grinding wheel can be effectively improved, the inventor is provided with the first heat dissipation holes and the second heat dissipation holes on the grinding wheel body, so that heat generated in the grinding process of the grinding wheel can be timely dissipated, and the chip removal grooves arranged at the outer edge of the grinding wheel can timely remove chips generated in the grinding process, so that the grinding of the grinding wheel can be ensured to be normally carried out, the grinding efficiency of the grinding wheel is improved, and the service life of the grinding wheel is prolonged.
Drawings
Fig. 1 is a schematic view of a grinding wheel.
Fig. 2 is a cross-section of the grinding wheel.
Reference numerals: 1. the CBN grinding wheel comprises a CBN grinding wheel layer, 2, a first heat dissipation hole, 3, a second heat dissipation hole, 4, a chip removal groove, 5 and a grinding wheel body.
Description of the embodiments
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model; all other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1-2, the grinding wheel for the aerospace packaging electronic precision element comprises a grinding wheel body 5, wherein CBN grinding wheel layers 1 are arranged at the top and the bottom of the grinding wheel body 5, a first heat dissipation hole 2 is formed in the grinding wheel body 5, a second heat dissipation hole 3 is formed in an inner ring of the first heat dissipation hole 2, and a chip groove 4 is formed in the edge of the grinding wheel body 5.
In this embodiment, the CBN grinding wheel layer 1 includes CBN grinding material, ceramic bond, white corundum and resin powder; the raw materials for preparing the ceramic bond comprise silicon dioxide, borax, aluminum oxide, titanium dioxide and barium oxide.
In this embodiment, the junk slots 4 are semicircular.
In this embodiment, the heat dissipation holes are rectangular, and the first heat dissipation holes 2 and the second heat dissipation holes 3 are all distributed on the grinding wheel body 5 in a ring shape.
In this embodiment, the thickness of the grinding wheel body 5 is 8mm to 15mm.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides an aerospace encapsulates grinding wheel for electronic precision component which characterized in that: including the emery wheel body, emery wheel body top and bottom are provided with the CBN grinding wheel layer, first louvre has been seted up on the emery wheel body, the second louvre has been seted up to the inner circle in first louvre, the junk slot has been seted up at the edge of emery wheel body.
2. The grinding wheel for aerospace packaging electronic precision components according to claim 1, wherein: the chip removal groove is semicircular.
3. The grinding wheel for aerospace packaging electronic precision components according to claim 1, wherein: the heat dissipation holes are rectangular, and the first heat dissipation holes and the second heat dissipation holes are annularly distributed on the grinding wheel body.
4. The grinding wheel for aerospace packaging electronic precision components according to claim 1, wherein: the thickness of the grinding wheel body is 8mm to 15mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321051080.4U CN219685141U (en) | 2023-05-05 | 2023-05-05 | Grinding wheel for aerospace packaging electronic precise element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321051080.4U CN219685141U (en) | 2023-05-05 | 2023-05-05 | Grinding wheel for aerospace packaging electronic precise element |
Publications (1)
Publication Number | Publication Date |
---|---|
CN219685141U true CN219685141U (en) | 2023-09-15 |
Family
ID=87941094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202321051080.4U Active CN219685141U (en) | 2023-05-05 | 2023-05-05 | Grinding wheel for aerospace packaging electronic precise element |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN219685141U (en) |
-
2023
- 2023-05-05 CN CN202321051080.4U patent/CN219685141U/en active Active
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