CN219667631U - Grooved inorganic silicon crystal composite board - Google Patents
Grooved inorganic silicon crystal composite board Download PDFInfo
- Publication number
- CN219667631U CN219667631U CN202320689481.6U CN202320689481U CN219667631U CN 219667631 U CN219667631 U CN 219667631U CN 202320689481 U CN202320689481 U CN 202320689481U CN 219667631 U CN219667631 U CN 219667631U
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- China
- Prior art keywords
- panel
- groove
- inorganic silicon
- silicon crystal
- crystal substrate
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 62
- 239000010703 silicon Substances 0.000 title claims abstract description 62
- 239000013078 crystal Substances 0.000 title claims abstract description 60
- 239000002131 composite material Substances 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 37
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 239000010985 leather Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 5
- 238000005452 bending Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a grooved inorganic silicon crystal composite board, which comprises: the first panel is connected to the upper surface of the inorganic silicon crystal substrate through the bonding layer, and the second panel is connected to the lower surface of the inorganic silicon crystal substrate; the bonding layer is an adhesive which enables the bonding strength of the first panel and the inorganic silicon crystal substrate to be 0.02-0.07 MPa; the two end faces of the inorganic silicon crystal substrate are inclined planes, a first groove, a second groove and a third groove are formed in the substrate, and gaps are formed in the first panel above the first groove, the second groove and the third groove respectively; the first panel is a metal panel, the thickness of the first panel is more than 0.4mm, and the elastic modulus is more than 175GPa; at least one of the two sides of the second panel protrudes out of the edge of the inorganic silicon crystal substrate. The grooved inorganic silicon crystal composite board is convenient to process and manufacture, when the first panel is cut and processed, edge warping phenomenon cannot occur, so that cutting is smooth, the first panel cannot be bent or distorted due to mechanical force of cutting, and operators can easily tear the corresponding panel leather.
Description
Technical Field
The utility model belongs to the field of smoke prevention and exhaust air pipes, relates to an air pipe plate capable of folding a pipe, and in particular relates to a grooved inorganic silicon crystal composite plate.
Background
The smoke-proof air duct is manufactured in two modes, one is formed by splicing and jointing four independent air duct plates, and the other is formed by grooving a whole air duct plate and then folding the pipe. The latter manufacturing mode has good tightness because of only one splice joint, but the processing difficulty is high.
When the wind pipe plate of the foldable folding pipe is manufactured in the past by enterprises, if the whole wind pipe plate is directly grooved, the panel leather is compounded on the wind pipe plate, has certain strength and cannot be directly grooved, the panel leather needs to be cut firstly and the panel leather at the position needing to be grooved is torn off, but the panel leather is firmly adhered and compounded with the base plate, and is difficult to be torn off by operators. If the substrate is grooved and then the panel leather is compounded, the difficulty of gluing and compounding the panel is increased due to the existence of the grooves on the substrate, and the precision of the original machine cannot meet the requirements of gluing and compounding the panel at the moment, so that manual operation is required, and mechanized production cannot be realized.
In the cutting process of the panel leather, the panel leather is often bent or distorted due to the cutting stress, so that the cutting is failed, and the problem of waste reporting of the air duct board is solved.
Disclosure of Invention
Based on the problem that the air duct plate of the foldable pipe is difficult to manufacture, the utility model provides the grooved inorganic silicon crystal composite plate which is convenient to manufacture.
The grooved inorganic silicon crystal composite board comprises a first panel, a second panel and an inorganic silicon crystal substrate, wherein the first panel is connected to the upper surface of the inorganic silicon crystal substrate through a bonding layer, and the second panel is connected to the lower surface of the inorganic silicon crystal substrate; the bonding layer is an adhesive which enables the bonding strength of the first panel and the inorganic silicon crystal substrate to be 0.02-0.07 MPa; in the manufacturing process of the grooved inorganic silicon crystal composite board, the first panel is required to be cut, the first panel skin at the position where the grooves are required to be formed is torn off, the first panel and the inorganic silicon crystal substrate are convenient to tear off the panel skin due to moderate bonding strength, and meanwhile, when the first panel is cut, the phenomenon of edge warping is avoided, and cutting is not smooth due to edge warping.
Specifically, in the manufacturing process, since the step of tearing off the panel skin needs to be performed manually, if the first panel and the inorganic silicon crystal substrate are bonded too firmly, the operator can hardly tear off the first panel in the above area, so that the bonding strength between the first panel and the substrate is set below 0.07MPa, and the operator can easily tear off the corresponding panel skin. Because when using the cutter to carry out cold cutting, first panel if with the base plate bonding insecure, then can take place to come unstuck to warp the limit under the mechanical force effect of cutting, can change the cutting angle of cutter to first panel, make the cutting unsmooth, cut the card and stop even and make first panel take place to warp, consequently set up the bonding strength of first panel and base plate more than 0.02MPa, guarantee to have certain bonding strength between them, can not take place to warp the limit, avoid leading to cutting card to stop because of the limit of raising, can guarantee that the cutting is smooth and easy.
The left end face and the right end face of the inorganic silicon crystal substrate are inclined planes, when the folding pipe is convenient to fold, the butt joint of the two spliced end faces is convenient, the inorganic silicon crystal substrate is further provided with a first groove, a second groove and a third groove, the first groove, the second groove and the third groove are parallel to each other and parallel to the left side edge and the right side edge, the cross sections of the first groove, the second groove and the third groove are all in a V shape, and the first panel is provided with gaps above the first groove, the second groove and the third groove respectively. The grooves are arranged to enable the composite board to be folded during pipe closing.
Preferably, the area of the area on the left side of the first groove is equal to the area of the area between the second groove and the third groove, and the area of the area between the first groove and the second groove is equal to the area of the area on the right side of the third groove. The adaptation of the size can enable the composite board to fold and close the pipe smoothly, and the areas with equal areas can form opposite air duct boards.
Preferably, the first panel is a metal panel, the thickness of the first panel is above 0.4mm, and the elastic modulus is above 175 GPa. The metal panel can provide good surface quality, fireproof performance and mechanical strength for the inorganic silicon crystal composite board, and the metal panel with the thickness and the elastic modulus is selected, so that the metal panel has good bending deformation resistance, and in the manufacturing process of the grooved composite board, the first panel can be further ensured not to be bent or distorted due to the mechanical force of cutting during cutting.
Preferably, the second panel is a flexible panel, and the second panel is one of a color steel plate, a galvanized iron sheet and an aluminum plate. Besides folding and closing the flexible panel when the flexible panel is made into the air duct, the protruding side edge of the flexible panel is more suitable for wrapping the splicing part when the flexible panel is closed.
Further, at least one of the left and right sides of the second panel protrudes from the edge of the inorganic silicon crystal substrate. The edge of the inclined plane is protruded, when the composite board is folded and the pipe is made into the air pipe, the edge wrapping operation can be carried out on the spliced part, an extra edge wrapping strip is not needed, and the air pipe is convenient and quick.
Preferably, the length P of the side edge of the second panel protruding out of the edge of the inorganic silicon crystal substrate is more than or equal to 15mm, and the protruding length can meet the edge wrapping requirement of a splicing part during pipe closing.
Through the technical scheme, the utility model at least comprises the following beneficial effects:
the grooved inorganic silicon crystal composite board can be conveniently and rapidly spliced into the air pipe in a mode of folding the pipe, and the splicing difficulty is low; because the composite board is convenient to fold and fold the pipe, the folded pipe can be folded and folded on a construction site, and the whole board is transported in a whole board mode during transportation, so that the whole board is transported in a mode of not occupying space, and the transportation cost can be reduced.
In the preferred scheme, through the setting of the outstanding outer side of appropriate second panel, when this composite sheet is folding closes the pipe to make the tuber pipe, can carry out the operation of borduring to the concatenation department, need not extra strip of borduring, convenient and fast, after borduring through this outstanding side, the seam of borduring also has only one, and the leakproofness is better.
Importantly, the slotted inorganic silicon crystal composite board is convenient to process and manufacture, and through proper bonding strength of the first panel and the inorganic silicon crystal substrate, edge warping phenomenon can not occur when the first panel is cut, so that cutting is smooth, and when the panel skin on the position to be slotted is torn off, an operator can easily tear off the corresponding panel skin; by selecting the proper first panel, the first panel has better bending deformation resistance, and can further ensure that the first panel cannot bend or twist due to the mechanical force of cutting during cutting processing.
Drawings
FIG. 1 is a schematic view showing the overall structure of a grooved inorganic silicon crystal composite board according to an embodiment of the present utility model
Reference numerals illustrate: 1 a first panel, 2 a second panel, 3 an inorganic silicon crystal substrate, 4 an inclined plane, 21 a first groove, 22 a second groove and 23 a third groove.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings, which are simplified schematic diagrams illustrating the basic structure of the present utility model only by way of illustration, and thus show only the constitution related to the present utility model.
In the description of the present utility model, it should be understood that, if there are terms such as "upper", "lower", "left", "right", "front", "rear", etc., that indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, it is only for convenience of describing the present utility model and simplifying the description, but it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus terms describing the positional relationship in the drawings are merely illustrative and should not be construed as limitations of the present patent, and it is possible for those skilled in the art to understand the specific meanings of the above terms according to specific circumstances.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring to fig. 1, a grooved inorganic silicon crystal composite board comprises a first panel 1, a second panel 2 and an inorganic silicon crystal substrate 3, wherein the first panel 1 is connected to the upper surface of the inorganic silicon crystal substrate 3 through an adhesive layer, and the second panel 2 is connected to the lower surface of the inorganic silicon crystal substrate 3; the bonding layer is an adhesive for enabling the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 to be 0.02-0.07MPa, the adhesive is an organic adhesive or an inorganic fireproof adhesive added with fireproof components, and the adhesive with stable performance on the market can be selected according to the property of the first panel 1 so as to enable the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 to meet the requirements; in the manufacturing process of the grooved inorganic silicon crystal composite board, the first panel 1 needs to be cut, the first panel 1 at the position needing to be grooved is torn off, the first panel 1 and the inorganic silicon crystal substrate 3 have moderate bonding strength, so that the tearing operation of the panel skin is convenient, and meanwhile, the phenomenon of edge warping can not occur when the first panel 1 is cut, and the cutting is not smooth due to edge warping.
Specifically, in the manufacturing process, since the step of peeling the panel skin needs to be performed manually, if the first panel 1 is too firmly bonded to the inorganic silicon crystal substrate 3, it is difficult for the operator to peel the first panel 1 in the above-mentioned region, and therefore, the bonding strength between the first panel 1 and the substrate is set to be 0.07MPa or less, so that the operator can easily peel the corresponding panel skin. Because when using the cutter to carry out cold cutting, first panel 1 if with the base plate bonding weak, then can take place to come unstuck and warp the limit under the mechanical force effect of cutting, can change the cutting angle of cutter to first panel 1, make the cutting unsmooth, cut the card and stop even make first panel 1 take place to warp, consequently set up the bonding strength of first panel 1 and base plate more than 0.02MPa, guarantee to have certain bonding strength between them, can not take place to warp the limit, avoid leading to cutting card to stop because of the limit of raising, can guarantee that the cutting is smooth and easy.
The left end face and the right end face of the inorganic silicon crystal substrate 3 are inclined planes 4, so that when the pipe is folded, the butt joint of the two spliced end faces is facilitated; the inorganic silicon crystal substrate 3 is also provided with a first groove 21, a second groove 22 and a third groove 23, the first groove 21, the second groove 22 and the third groove 23 are parallel to each other and parallel to the left side and the right side, the cross sections of the first groove 21, the second groove 22 and the third groove 23 are all in a V shape, the first panel 1 is provided with gaps above the first groove 21, the second groove 22 and the third groove 23 respectively, and the grooves are convenient for folding the composite board during pipe closing.
The area of the left side of the first groove 21 is equal to the area of the area between the second groove 22 and the third groove 23, the area of the area between the first groove 21 and the second groove 22 is equal to the area of the right side of the third groove 23, and the size is adapted so that the composite board can be smoothly folded to form a pipe, and the areas with equal areas can form opposite air duct boards.
The first panel 1 is a metal panel, the thickness of the first panel 1 is more than 0.4mm, and the elastic modulus is more than 175 GPa. The metal panel can provide good surface quality, fireproof performance and mechanical strength for the inorganic silicon crystal composite board, and the metal panel with the thickness and the elastic modulus is selected, so that the metal panel has good bending deformation resistance, and in the manufacturing process of the grooved composite board, the first panel 1 can be further ensured not to bend or twist due to the mechanical force of cutting during cutting.
The second panel 2 is a flexible panel, and the second panel 2 is one of a color steel plate, a galvanized iron sheet plate and an aluminum plate, in this embodiment, specifically, the color steel plate. The flexible panel can be folded, besides the folding pipe closing when the air pipe is conveniently manufactured, the protruding side edge of the flexible panel is more suitable for the edge wrapping of the splicing part when the pipe is closed.
The left side edge of the second panel 2 protrudes out of the edge of the inorganic silicon crystal substrate 3, namely protrudes out of the outermost edge of the left end inclined plane 4, and when the composite board is folded and the pipe is made into an air pipe, the protruding side edge can also carry out the edge wrapping operation on the spliced part, no extra edge wrapping strip is needed, and the method is convenient and quick; the length P of the side edge of the second panel 2 protruding out of the edge of the inorganic silicon crystal substrate 3 is more than or equal to 15mm, and the protruding length can meet the edge wrapping requirement of the splicing part during pipe closing. Specific lengths P may be 15mm or 18mm or 22mm or 26mm or 30mm; when the joint of the pipe is covered, if the length P is lower than 15mm, the protruding side edges are insufficient in covering width due to insufficient length, and the rivet is not sufficient in width to reinforce, so that the covering is not firm; the length of 15mm or 18mm or 22mm or 26mm or 30mm is set to meet the operation requirement of rivet reinforcement on the wrapping edge, and the wrapping edge is attractive and does not warp.
In the specific scheme of the embodiment, the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 is 0.02MPa, the thickness of the first panel 1 is 0.4mm, and the elastic modulus is 175GPa;
or, the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 is 0.07MPa, the thickness of the first panel 11 is 0.5mm, and the elastic modulus is 181GPa;
or, the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 is 0.05MPa, the thickness of the first panel 1 is 0.6mm, and the elastic modulus is 194GPa;
comprehensively considering the strength of the panel, the cost of the panel and the adhesive, and the weight of the composite board, the preferable scheme is as follows: the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 was 0.03MPa, the thickness of the first panel 1 was 0.5mm, and the elastic modulus was 181GPa
In the manufacturing and processing process, a single-edge spiral milling cutter for cutting is adopted to cut the first panel 1, the spiral milling cutter is made of tungsten steel hard alloy, the specification is M6 x 0.75, and the rotating speed during cutting is 16000r/min; the cutting speed was 1.7m/min-2.5m/min, the first panel 1 was selected for cutting and trial processing with different parameters, the detailed parameters and results are shown in table 1:
in the cutting process of the first panel 1, the cutting angle of the spiral milling cutter to the first panel 1 can be changed when the edge of the panel is warped, so that the cutting is not smooth, the mechanical force applied to the panel is increased, cutting clamping can be caused when the mechanical force is severe, and the panel is bent or distorted; and the greater the cutting speed, the greater the mechanical force to which the panel is subjected, the more susceptible it is to bending or twisting.
In the scheme of this embodiment, the phenomenon of perk or crooked or distortion does not take place for first panel 1 in the cutting process, and the cutting is smooth and easy not blocked, and operating personnel can easily tear the panel skin of waiting the fluting department, the fluting inorganic silicon crystal composite sheet of this embodiment be convenient for process the preparation, the processing manufacturing degree of difficulty is low.
The foregoing description is only illustrative of the preferred embodiments of the present utility model, and various changes and modifications can be made by those skilled in the art without departing from the spirit and principles of the present utility model, and it is intended to cover all such modifications, equivalents, and improvements as fall within the true spirit and scope of the utility model.
Claims (6)
1. The utility model provides a grooved inorganic silicon crystal composite sheet which characterized in that: the solar cell comprises a first panel (1), a second panel (2) and an inorganic silicon crystal substrate (3), wherein the first panel (1) is connected to the upper surface of the inorganic silicon crystal substrate (3) through a bonding layer, and the second panel (2) is connected to the lower surface of the inorganic silicon crystal substrate (3); the bonding layer is an adhesive which enables the bonding strength of the first panel (1) and the inorganic silicon crystal substrate (3) to be 0.02-0.07 MPa;
the left end face and the right end face of the inorganic silicon crystal substrate (3) are inclined planes (4), the inorganic silicon crystal substrate (3) is further provided with a first groove (21), a second groove (22) and a third groove (23), the cross sections of the first groove (21), the second groove (22) and the third groove (23) are all in a V shape, and the first panel (1) is provided with gaps above the first groove (21), the second groove (22) and the third groove (23) respectively.
2. A grooved inorganic silicon crystal composite board according to claim 1, wherein: the area of the left side of the first groove (21) is equal to the area of the area between the second groove (22) and the third groove (23), and the area of the area between the first groove (21) and the second groove (22) is equal to the area of the right side of the third groove (23).
3. A grooved inorganic silicon crystal composite board according to claim 1 or 2, characterized in that: the first panel (1) is a metal panel, the thickness of the first panel (1) is more than 0.4mm, and the elastic modulus is more than 175 GPa.
4. A grooved inorganic silicon crystal composite board according to claim 1 or 2, characterized in that: the second panel (2) is a flexible panel, and the second panel (2) is one of a color steel plate, a galvanized iron sheet plate and an aluminum plate.
5. The grooved inorganic silicon composite board according to claim 4, wherein: at least one of the left side and the right side of the second panel (2) protrudes out of the edge of the inorganic silicon crystal substrate (3).
6. The grooved inorganic silicon composite board according to claim 5, wherein: the length P of the side edge of the second panel (2) protruding out of the edge of the inorganic silicon crystal substrate (3) is more than or equal to 15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320689481.6U CN219667631U (en) | 2023-03-31 | 2023-03-31 | Grooved inorganic silicon crystal composite board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320689481.6U CN219667631U (en) | 2023-03-31 | 2023-03-31 | Grooved inorganic silicon crystal composite board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219667631U true CN219667631U (en) | 2023-09-12 |
Family
ID=87919865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320689481.6U Active CN219667631U (en) | 2023-03-31 | 2023-03-31 | Grooved inorganic silicon crystal composite board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219667631U (en) |
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2023
- 2023-03-31 CN CN202320689481.6U patent/CN219667631U/en active Active
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