CN116394630A - Manufacturing method of grooved inorganic silicon crystal composite board - Google Patents

Abstract

The invention discloses a manufacturing method of a grooved inorganic silicon crystal composite board, which comprises the following steps of S1: respectively compounding a first panel and a second panel on two sides of the inorganic silicon crystal substrate; controlling the bonding strength between the substrate and the first panel to be 0.02-0.07MPa; s2, cutting: the cutting surface is a first panel, a first splicing area is arranged at the left side of a first secant, a first folding area is arranged between a second secant and a third secant, a second folding area is arranged between a fourth secant and a fifth secant, a third folding area is arranged between a sixth secant and a seventh secant, and a second splicing area is arranged at the right side of an eighth secant; s3, tearing the strip: tearing off the first panel of the area along the cutting line to expose the substrate; s4, milling an inclined plane and grooving: milling inclined planes on the substrates of the first splicing region and the second splicing region, and forming V-shaped grooves on the substrates of the first folding region, the second folding region and the third folding region. In the tearing process, operators can easily tear off the panel skin, and the edge warping phenomenon can not occur in the cutting process, so that the cutting is smooth.

Description

Manufacturing method of grooved inorganic silicon crystal composite board

Technical Field

The invention belongs to the field of smoke prevention and exhaust air pipes, relates to a manufacturing method of an air pipe plate, and in particular relates to a manufacturing method of a grooved inorganic silicon crystal composite plate.

Background

The smoke-proof air duct is manufactured in two modes, one is formed by splicing and jointing four independent air duct plates, and the other is formed by grooving a whole air duct plate and then folding the pipe. The latter manufacturing mode has good tightness because of only one splice joint, but the processing difficulty is high.

When the wind pipe plate of the foldable folding pipe is manufactured in the past by enterprises, if the whole wind pipe plate is directly grooved, the panel leather is compounded on the wind pipe plate, has certain strength and cannot be directly grooved, the panel leather needs to be cut firstly and the panel leather at the position needing to be grooved is torn off, but the panel leather is firmly adhered and compounded with the base plate, and is difficult to be torn off by operators. If the substrate is grooved and then the metal plate is compounded, the difficulty of gluing and compounding the panel is increased due to the existence of the grooves on the substrate, and the precision of the original machine cannot meet the requirements of gluing and compounding the panel at the moment, so that manual operation is required, and mechanized production cannot be realized.

In the cutting process of the panel leather, the panel leather is often bent or distorted due to the cutting stress, so that the cutting is failed, and the problem of waste reporting of the air duct board is solved.

The foldable pipe folding air pipe plate is often transported in the form of a whole plate, the folded pipe is folded on a construction site, the whole plate is transported in a space-saving mode, and the transportation cost is reduced, but in the transportation process, the corners of the air pipe plate, especially the processed thinner edges, can be damaged due to collision.

Disclosure of Invention

In order to solve the problems, the invention provides a manufacturing method of a grooved inorganic silicon crystal composite board, which comprises the following steps:

s1, compounding: compounding a first panel on one surface of an inorganic silicon crystal substrate through a first adhesive, compounding a second panel on the other surface of the inorganic silicon crystal substrate through a second adhesive to prepare an inorganic silicon crystal composite board, and controlling the bonding strength of the inorganic silicon crystal substrate and the first panel to be 0.02-0.07MPa; the moderate bonding strength is convenient for the subsequent tearing operation, and meanwhile, the panel is prevented from edge tilting during subsequent cutting, and the metal plate is prevented from being twisted due to unsmooth cutting and even jamming caused by edge tilting.

S2, cutting: cutting the inorganic silicon crystal composite board obtained in the step S1, wherein the cutting surface is a first panel, the cutting depth is larger than or equal to the thickness of the first panel and smaller than the sum of the thicknesses of the first panel and the inorganic silicon crystal substrate, only the first panel is required to be cut, 8 cutting lines are sequentially cut from left to right, a first splicing area is formed on the left side of the first cutting line, a first folding area is formed between a second cutting line and a third cutting line, a second folding area is formed between a fourth cutting line and a fifth cutting line, a third folding area is formed between a sixth cutting line and a seventh cutting line, and a second splicing area is formed on the right side of the eighth cutting line; when the cutter is used for cold cutting, if the first panel is not firmly bonded with the substrate, degumming and edge warping can occur under the action of mechanical force of cutting, the cutting angle of the cutter to the first panel can be changed, so that cutting is not smooth, even cutting is blocked, the first panel is distorted, the bonding strength of the first panel and the substrate is controlled to be more than 0.02MPa in the step S1, certain bonding strength is ensured, edge warping does not occur, and smooth cutting can be ensured.

S3, tearing the strip: tearing the first panel on the first splicing area, the second splicing area, the first folding area, the second folding area and the third folding area along the secant to expose the inorganic silicon crystal substrate. Since this step is performed manually, if the first panel and the inorganic silicon crystal substrate are bonded too firmly, it is difficult for the operator to tear off the first panel in the above-mentioned region, and therefore the bonding strength between the first panel and the substrate is controlled to be 0.07MPa or less in step S1.

S4, milling an inclined plane and grooving: and inclined planes are milled on the inorganic silicon crystal substrates of the first splicing region and the second splicing region, so that when the pipe is folded, the butt joint of the two splicing end faces is facilitated, and grooves with V-shaped sections are formed on the inorganic silicon crystal substrates of the first folding region, the second folding region and the third folding region, so that the pipe can be folded conveniently.

Preferably, the first panel is a metal panel, the thickness of the first panel is above 0.4mm, the elastic modulus is above 175GPa, the metal panel can provide good surface quality, fireproof performance and mechanical strength for the inorganic silicon crystal composite board, and the metal panel with the thickness and the elastic modulus is selected, so that the metal panel has good bending deformation resistance, and the metal panel can be further ensured not to bend or twist due to the mechanical force of cutting during cutting.

And further, after the step of S3 tearing the strip is finished, the first panel is continuously pressurized and is subjected to drying operation, so that the composite strength of the first panel and the inorganic silicon crystal substrate is enhanced, the final quality of a composite board product is improved, the first panel is prevented from falling off in the subsequent use process, the first panel can be used for a long time, and the service life of the product is prolonged.

Preferably, the second panel is a flexible panel, and the second panel is one of a color steel plate, a galvanized iron sheet and an aluminum plate. The flexible second panel is convenient to manufacture the smoke prevention and exhaust air pipe through folding, and the flexible second panel is used as the folding outside of the air pipe.

The first splicing area is further divided into a first reserved area and a first surface milling area, wherein the first reserved area is arranged at the outer side of the first splicing area, and the first surface milling area is arranged at the inner side of the first splicing area; the second splicing area is also divided into a second reserved area and a second milling area, wherein the outer side of the second splicing area is the second reserved area, and the inner side of the second splicing area is the second milling area; s4, milling inclined planes on the inorganic silicon crystal substrates in the first surface milling area and the second surface milling area; the arrangement of the reserved area enables the inorganic silicon crystal composite board above the reserved area to protect the composite board body when the grooved inorganic silicon crystal composite board is transported, the damage to the composite board body caused by corner collision can be avoided, the inorganic silicon crystal substrate on the reserved area is removed when the folding pipe is folded, the protruding second panel below the reserved area can also carry out the edge covering operation on the spliced part when the folding pipe is folded, no extra edge covering strips are needed, and the folding pipe is convenient and fast.

Preferably, the width D of the first reserved area and the second reserved area is 15-30mm, the proper width can well protect the composite board body, the proper width can meet the edge wrapping requirement, and excessive waste of boards is avoided.

In the step S3, the staff can use the protruded side as a force application point and pull the protruded side to tear the first panel on the first splicing area, the second splicing area, the first folding area, the second folding area and the third folding area along the secant in the step S3, if the protruded side is not present, the staff cannot find the force application point to be difficult to tear the tape because the first panel is tightly attached to the substrate and has no edge and gap, the staff can use a knife to tear the tape, and the arrangement of the protruded side can facilitate the tape tearing operation, so that the efficiency is improved.

Preferably, the length L of the first panel protruding out of the edge of the inorganic silicon crystal substrate is within 5mm, the overlong protrusion not only wastes the board but also is easy to scratch operators, the overlong protrusion is easy to cause edge warping at the beginning of cutting, the phenomenon of edge warping caused by the protrusion is hardly caused by controlling the protruding length L within 5mm, and the manufacturing of a subsequent air pipe is not influenced.

The smoke-preventing air duct is made of slotted inorganic silicon crystal composite board folded pipe, and the slotted inorganic silicon crystal composite board is made by the method.

Through the technical scheme, the invention at least comprises the following beneficial effects:

1. through the proper bonding strength of the first panel and the substrate, an operator can easily tear off the corresponding panel skin in the tearing process, the edge warping phenomenon caused by insufficient bonding strength can be avoided in the cutting process, and the unsmooth cutting caused by edge warping can be avoided; in the further scheme, through the outstanding upper side or lower side of first panel, make operating personnel can have the force application point at tearing strip in-process, can more convenient and fast tear strip operation, make efficiency promote.

2. Through proper design and selection of the first panel, the first panel has better bending deformation resistance, and can ensure that the first panel cannot bend or distort due to the mechanical force of cutting during cutting, thereby improving the yield

3. In another further scheme, through dividing the reserve district on the concatenation district, the setting of reserve district makes this fluting inorganic silicon crystal composite sheet when the transportation, and the inorganic silicon crystal base plate of reserve district top can protect the composite sheet body, can avoid corner collision to cause the damage to the composite sheet body, and the inorganic silicon crystal base plate on the reserve district is got rid of when folding the coincide pipe, and the outstanding second panel of reserve district below can also carry out the operation of borduring, need not extra strip of borduring, convenient and fast.

Drawings

Fig. 1 is a schematic diagram of a manufacturing method corresponding to step S2 in embodiment 1 of the present application;

FIG. 2 is an enlarged view of FIG. 1 at A;

FIG. 3 is a schematic diagram of a manufacturing method corresponding to step S3 in embodiment 1 of the present application;

FIG. 4 is a schematic diagram of a manufacturing method corresponding to the step S4 in embodiment 1 of the present application;

FIG. 5 is a schematic diagram showing a certain manufacturing step of the grooved inorganic silicon composite board in example 2 of the present application;

FIG. 6 is an enlarged view at B in FIG. 5;

FIG. 7 is a schematic view showing a certain manufacturing step of the grooved inorganic silicon composite board in example 3 of the present application;

FIG. 8 is a schematic view of another step of fabricating a grooved inorganic silicon composite board as described in example 3 of the present application;

FIG. 9 is an enlarged view of FIG. 8 at C;

reference numerals illustrate: 1 a first panel, 2 a second panel, 3 a inorganic silicon crystal substrate, 4 a bevel, 5 a groove, 21 a first cut line, 22 a second cut line, 23 a third cut line, 24 a fourth cut line, 25 a fifth cut line, 26 a sixth cut line, 27 a seventh cut line, 28 an eighth cut line, 31 a first splicing region, 32 a second splicing region, 41 a first folding region, 42 a second folding region, 43 a third folding region, 51 a first reserved region, 52 a second reserved region, 61 a first milling region, 62 a second milling region.

Detailed Description

The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings, which are simplified schematic diagrams illustrating the basic structure of the present invention only by way of illustration, and thus show only the constitution related to the present invention.

In the description of the present application, it should be understood that, if there are terms such as "upper", "lower", "left", "right", "front", "rear", etc., that indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not indicated or implied that the apparatus or element to be referred must have a specific azimuth, be constructed and operated in a specific azimuth, and thus terms describing the positional relationship in the drawings are merely for exemplary illustration and should not be construed as limiting the present patent, and it is possible for those of ordinary skill in the art to understand the specific meaning of the above terms according to the specific circumstances.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Example 1

Referring to fig. 1-4, a method for manufacturing a grooved inorganic silicon crystal composite board comprises the following steps:

s1, compounding: one surface of the inorganic silicon crystal substrate 3 is compounded with a first panel 1 through a first adhesive, the other surface of the inorganic silicon crystal substrate 3 is compounded with a second panel 2 through a second adhesive (refer to fig. 2), the bonding strength of the inorganic silicon crystal substrate 3 and the first panel 1 is controlled to be 0.02-0.07MPa, the first adhesive is an organic adhesive or an inorganic fireproof adhesive added with fireproof components, and the adhesive with stable performance on the market can be selected according to the property of the first panel 1 so that the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 can meet the requirement; the moderate bonding strength is convenient for the subsequent tearing operation, and meanwhile, the panel is ensured not to warp when being cut subsequently, and the metal plate is not twisted due to unsmooth cutting and even jamming caused by the warp;

s2, cutting: referring to fig. 1, the inorganic silicon crystal composite board obtained in step S1 is cut, the cut surface is a first panel 1, the cutting depth is greater than or equal to the thickness of the first panel 1 and is smaller than the sum of the thicknesses of the first panel 1 and the inorganic silicon crystal substrate 3, and only the first panel 1 is required to be cut, so in this embodiment, the cutting depth is slightly greater than the thickness of the first panel 1; 8 cut lines are cut from left to right in sequence, a first splicing area 31 is formed at the left side of a first cut line 21, a first folding area 41 is formed between a second cut line 22 and a third cut line 23, a second folding area 42 is formed between a fourth cut line 24 and a fifth cut line 25, a third folding area 43 is formed between a sixth cut line 26 and a seventh cut line 27, and a second splicing area 32 is formed at the right side of an eighth cut line 28; when the cutter is used for cold cutting, if the first panel 1 is not firmly bonded with the substrate, degumming and edge warping can occur under the action of mechanical force of cutting, the cutting angle of the cutter to the first panel 1 can be changed, so that cutting is not smooth, even cutting is blocked, the first panel 1 is distorted, the bonding strength of the first panel 1 and the substrate is controlled to be more than 0.02MPa in the step S1, certain bonding strength is ensured between the first panel 1 and the substrate, edge warping cannot occur, and smooth cutting can be ensured. For the size-adaptive tube closing, the area of the area between the first cut line 21 and the second cut line 22 is equal to the area of the area between the fifth cut line 25 and the sixth cut line 26, so that opposite air duct plates can be formed after the tube closing is folded; the area of the area between the third cut line 23 and the fourth cut line 24 is equal to the area of the area between the seventh cut line 27 and the eighth cut line 28, so that opposite air duct plates can be formed after folding and closing the pipe.

S3, tearing the strip: referring to fig. 3, the first panel 1 on the first, second, and third splicing sections 31, 32, 41, 42, and 43 is torn along a cut line, exposing the inorganic silicon crystalline substrate 3. Since this step needs to be performed manually, if the first panel 1 and the inorganic silicon crystal substrate 3 are bonded too firmly, it is difficult for the operator to tear off the first panel 1 in the above-mentioned region, and therefore the bonding strength between the first panel 1 and the substrate is controlled to be 0.07MPa or less in step S1.

S4, milling an inclined plane and grooving: referring to fig. 4, an inclined plane 4 is milled on the inorganic silicon crystal substrate 3 in the first splicing region 31 and the second splicing region 32, so that when the pipe is folded, the butt joint of the two splicing end faces is facilitated, and grooves 5 with the cross sections of V shape are cut on the inorganic silicon crystal substrate 3 in the first folding region 41, the second folding region 42 and the third folding region 43, so that the pipe can be folded conveniently.

The first panel 1 is a metal panel, the thickness of the first panel 1 is above 0.4mm, the elastic modulus is above 175GPa, the metal panel can provide good surface quality, fireproof performance and mechanical strength for inorganic silicon crystal composite boards, and the metal panel with the thickness and the elastic modulus is selected, so that the metal panel has good bending deformation resistance, and the metal panel can be further ensured not to be bent or distorted due to the mechanical force of cutting during cutting. The second panel 2 is a flexible panel, specifically one of a color steel plate, a galvanized iron sheet and an aluminum plate, and in this embodiment, the second panel 2 is specifically a color steel plate. The flexible second panel 2 facilitates the subsequent manufacture of the smoke prevention and exhaust air duct by folding, and the flexible second panel 2 serves as the folding outer face of the air duct.

In addition, after the step of tearing the strip S3 is finished, the first panel 1 is continuously pressurized, and drying operation is performed, so that the composite strength of the first panel 1 and the inorganic silicon crystal substrate 3 is enhanced, the final quality of a composite board product is improved, the first panel 1 is prevented from falling off in the subsequent use process, the long-time use can be realized, and the service life of the product is prolonged. The plate pressing or stacking and placing can be specifically carried out in a drying box or a drying room, and the temperature is controlled to be 60-80 ℃ for 1-2 hours.

In the specific scheme of the embodiment, the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 is 0.02MPa, the thickness of the first panel 1 is 0.4mm, and the elastic modulus is 175GPa;

or, the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 is 0.07MPa, the thickness of the first panel 1 is 0.5mm, and the elastic modulus is 181GPa;

or, the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 is 0.05MPa, the thickness of the first panel 1 is 0.6mm, and the elastic modulus is 194GPa;

comprehensively considering the strength of the panel, the cost of the panel and the adhesive, and the weight of the composite board, the preferable scheme is as follows: the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 was 0.03MPa, the thickness of the first panel 1 was 0.5mm, and the elastic modulus was 181GPa

In the embodiment, a single-edge spiral milling cutter for cutting is adopted to cut the first panel 1, the spiral milling cutter is made of tungsten steel hard alloy, the specification is M6 x 0.75, and the rotating speed during cutting is 16000r/min; the cutting speed was 1.7m/min to 2.5m/min, and the first panel 1 was selected with different parameters for cutting and trial production, the detailed parameters and results are shown in Table 1

Table 1:

in the cutting process of the first panel 1, the cutting angle of the spiral milling cutter to the first panel 1 can be changed when the panel is warped, so that the cutting is not smooth, the mechanical force applied to the panel is increased, cutting clamping can be caused when the mechanical force is severe, and the panel is bent or distorted; and the greater the cutting speed, the greater the mechanical force to which the panel is subjected, the more susceptible it is to bending or twisting.

In the scheme of this embodiment, the staff can be relaxed tear strip operation, and the phenomenon of perk or crooked or distortion also does not take place for first panel 1 in the cutting process, and the cutting is smooth and easy not blocked.

The manufactured grooved inorganic silicon crystal composite board can be manufactured into an anti-smoke exhaust air pipe through folding and overlapping pipes.

Example 2

In this embodiment, referring to fig. 5 and 6, in step S1, the area of the first panel 1 is larger than that of the inorganic silicon substrate 3, the lower side edge of the first panel 1 protrudes from the edge of the inorganic silicon substrate 3, in step S3, the operator can tear the first panel 1 on the first splicing region 31, the second splicing region 32, the first folding region 41, the second folding region 42 and the third folding region 43 along the dividing line by pulling the protruding side edge along the dividing line with the protruding side edge as a force application point, if the protruding side edge is not present, the operator cannot find the force application point because the first panel 1 is tightly attached to the substrate, the edge is not warped and the slit is not easy to tear, and the edge is tilted by a knife, so that the arrangement of the protruding side edge can facilitate the tear operation, and the efficiency is improved.

Referring to fig. 6, the length L of the lower side edge of the first panel 1 protruding from the edge of the inorganic silicon crystal substrate 3 is within 5mm, and the overlong protrusion not only wastes the board but also is easy to scratch operators, and at the beginning of cutting, the overlong protrusion also is easy to cause edge lifting,

the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 is 0.02MPa, the thickness of the first panel 1 is 0.4mm, and the elastic modulus is 175GPa;

or, the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 is 0.07MPa, the thickness of the first panel 1 is 0.5mm, and the elastic modulus is 181GPa;

or, the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 is 0.05MPa, the thickness of the first panel 1 is 0.6mm, and the elastic modulus is 194GPa;

or, the bonding strength of the first panel 1 and the inorganic silicon crystal substrate 3 is 0.03MPa, the thickness of the first panel 1 is 0.5mm, and the elastic modulus is 181GPa

In the four embodiments of the above embodiment 1, the protruding length L is controlled within 5mm, and the phenomenon of edge warping caused by protruding does not occur; the shorter length does not affect the manufacture of subsequent ductwork.

Example 3

In this embodiment, on the basis of embodiment 1 or embodiment 2, in the manufacturing process, both ends of the grooved inorganic silicon crystal composite board are provided with reserved areas, which can protect corners at both ends of the composite board, especially the outer edges of the inclined planes, referring to fig. 7, the first splicing area 31 is further divided into a first reserved area 51 and a first milling area 61, the outer side of the first splicing area 31 is the first reserved area 51, and the inner side of the first splicing area 31 is the first milling area 61; the second splicing area 32 is further divided into a second reserved area 52 and a second milling area 62, the second reserved area 52 is arranged on the outer side of the second splicing area 32, and the second milling area 62 is arranged on the inner side of the second splicing area 32; referring to fig. 8, in step S4, the inclined surface 4 is milled on the inorganic silicon crystal substrate 3 of the first and second face milling regions 61 and 62. The setting of reserve district makes this fluting inorganic silicon crystal composite sheet when the transportation, and the inorganic silicon crystal base plate 3 of reserve district top can protect the composite sheet body, can avoid corner collision to cause the damage to the composite sheet body, gets rid of the inorganic silicon crystal base plate 3 on the reserve district when folding the coincide pipe, and outstanding second panel 2 of reserve district below can also carry out the operation of borduring to the concatenation department when folding the close pipe, need not extra strip of borduring, convenient and fast.

Referring to fig. 9, the width D of the first reserved area 51 and the second reserved area 52 is 15-30mm, and the appropriate width can well protect the composite board body, and can meet the requirement of edge covering, and the board is not wasted too much. The width D of the specific first reserved area 51 and the second reserved area 52 may be 15mm or 18mm or 22mm or 26mm or 30mm; when the splicing part is covered by the tube, if the width D is lower than 15mm, the width of the protruding second panel 2 below the reserved area is insufficient, so that the covered width is insufficient, and the rivet is not wide enough to reinforce, so that the covered edge is not firm; the width of 15mm or 18mm or 22mm or 26mm or 30mm is set to meet the operation requirement of rivet reinforcement, and the edge wrapping is attractive and does not warp; if the width is more than 30mm, it is not necessary at all, resulting in waste of the plate material.

The foregoing description is only illustrative of the preferred embodiments of the present invention, and various changes and modifications can be made by those skilled in the art without departing from the spirit and principles of the present invention, and it is intended to cover all such modifications, equivalents, and improvements as fall within the true spirit and scope of the invention.

Claims (9)

1. The manufacturing method of the grooved inorganic silicon crystal composite board is characterized by comprising the following steps of:

s1, compounding: one surface of the inorganic silicon crystal substrate (3) is compounded with a first panel (1) through a first adhesive, the other surface of the inorganic silicon crystal substrate (3) is compounded with a second panel (2) through a second adhesive, and the bonding strength of the inorganic silicon crystal substrate (3) and the first panel (1) is controlled to be 0.02-0.07MPa;

s2, cutting: cutting the inorganic silicon crystal composite board obtained in the step S1, wherein the cutting surface is a first panel (1), the cutting depth is greater than or equal to the thickness of the first panel (1), 8 cutting lines are sequentially cut from left to right, a first splicing region (31) is formed on the left side of the first cutting line (21), a first folding region (41) is formed between a second cutting line (22) and a third cutting line (23), a second folding region (42) is formed between a fourth cutting line (24) and a fifth cutting line (25), a third folding region (43) is formed between a sixth cutting line (26) and a seventh cutting line (27), and a second splicing region (32) is formed on the right side of an eighth cutting line (28);

s3, tearing the strip: tearing the first panel (1) on the first splicing region (31), the second splicing region (32), the first folding region (41), the second folding region (42) and the third folding region (43) along a cutting line to expose the inorganic silicon crystal substrate (3);

s4, milling an inclined plane and grooving: an inclined plane (4) is milled on the inorganic silicon crystal substrates (3) of the first splicing region (31) and the second splicing region (32), and grooves (5) with V-shaped sections are formed on the inorganic silicon crystal substrates (3) of the first folding region (41), the second folding region (42) and the third folding region (43).

2. The method for manufacturing the grooved inorganic silicon crystal composite board according to claim 1, wherein the first panel (1) is a metal panel, the thickness of the first panel (1) is more than 0.4mm, and the elastic modulus is more than 175 GPa.

3. The method for manufacturing the grooved inorganic silicon crystal composite board according to claim 1, wherein the method comprises the following steps: and S3, after the tearing step is finished, continuously pressurizing the first panel (1), and performing a drying step.

4. The method for manufacturing the grooved inorganic silicon crystal composite board according to claim 1, wherein the method comprises the following steps: the second panel (2) is a flexible panel, and the second panel (2) is one of a color steel plate, a galvanized iron sheet plate and an aluminum plate.

5. The method for manufacturing the grooved inorganic silicon crystal composite board according to any one of claims 1 to 4, wherein the method comprises the following steps: the first splicing area (31) is further divided into a first reserved area (51) and a first milling area (61), the outer side of the first splicing area (31) is the first reserved area (51), the inner side of the first splicing area (31) is the first milling area (61), and in the step S4, an inclined plane (4) is milled on the inorganic silicon crystal substrate (3) in the first milling area (61);

and/or, the second splicing area (32) is also divided into a second reserved area (52) and a second milling area (62), the outer side of the second splicing area (32) is the second reserved area (52), and the inner side of the second splicing area (32) is the second milling area (62); in the step S4, an inclined plane (4) is milled on the inorganic silicon crystal substrate (3) in the second milling area (62).

6. The method for manufacturing a grooved inorganic silicon composite board according to claim 5, wherein the width D of the first reserved area (51) and the second reserved area (52) is 15-30mm.

7. A method for manufacturing a grooved inorganic silicon composite board according to any one of claims 1 to 4 and 6, characterized in that: in the step S1, the area of the first panel (1) is larger than that of the inorganic silicon crystal substrate (3), and at least one side edge of the upper side edge and the lower side edge of the first panel (1) protrudes out of the edge of the inorganic silicon crystal substrate (3).

8. The method for manufacturing the grooved inorganic silicon crystal composite board according to claim 7, wherein the method comprises the following steps: the length L of the first panel (1) protruding from the edge of the inorganic silicon crystal substrate (3) is within 5 mm.

9. An anti-smoke exhaust air duct is characterized in that: is produced by folding and laminating a grooved inorganic silicon crystal composite board, which is produced by the method of any one of claims 1 to 8.

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