CN219644244U

CN219644244U - Plasma carrier structure

Info

Publication number: CN219644244U
Application number: CN202320354959.XU
Authority: CN
Inventors: 董志明; 温唯
Original assignee: Xiamen Hongxin Electronic Technology Group Co Ltd
Current assignee: Xiamen Hongxin Electronic Technology Group Co Ltd
Priority date: 2023-03-01
Filing date: 2023-03-01
Publication date: 2023-09-05
Anticipated expiration: 2033-03-01

Abstract

The utility model discloses a plasma carrier structure, which comprises a bottom plate, wherein the bottom plate is provided with a clamping groove for fixing a substrate of a multilayer circuit board; the cover plate is hinged to the bottom plate and provided with a plurality of plasma through holes. The utility model can be used for accommodating the multilayer circuit board, so that the phenomena of board burning, board explosion, layering and the like are not easy to occur in the plasma photoresist removing process of the multilayer circuit board, and the product yield is affected.

Description

Plasma carrier structure

Technical Field

The utility model relates to the technical field of circuit board production equipment, in particular to a plasma carrier structure.

Background

A multilayer circuit board refers to a circuit board with multiple wiring layers, and a dielectric layer is arranged between every two wiring layers, and electrical connection of the multiple wiring layers is usually realized through plated through holes on the cross section of the circuit board. In the preparation of multilayer circuit boards, it is often necessary to perform the operations of plating through holes and plating blind holes, and it is often necessary to remove the colloid in the through holes or blind holes before plating.

The processed board of the multi-layer circuit board is shown in fig. 1, and the multi-layer circuit board includes a substrate 11 and a trace layer 12. At present, the colloid in the through hole or the blind hole is removed usually directly by using plasma colloid removing equipment to remove colloid, but the product is directly subjected to plasma colloid removing, and phenomena such as plate burning, plate explosion and layering easily occur in a colloid separating area of the multilayer circuit board, so that the product yield is affected.

In view of the above, the present utility model is developed and designed to solve many drawbacks and inconveniences caused by the lack of perfection in the above-mentioned process, and to actively study and improve the trial work.

Disclosure of Invention

The utility model aims to overcome the defects and shortcomings of the prior art and provide a plasma carrier structure.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a plasma carrier structure comprises

The base plate is provided with a clamping groove for fixing the substrate of the multilayer circuit board;

the cover plate is hinged to the bottom plate and provided with a plurality of plasma through holes.

In one embodiment, the device further comprises two magnetic strips, wherein the two magnetic strips are respectively arranged on the bottom plate and the cover plate and are used for enabling the cover plate to be covered on the bottom plate.

In one embodiment, an arc opening is formed in one side edge of the cover plate.

In one embodiment, the magnetic strip comprises a bottom plate, and the bottom plate is provided with a magnetic strip.

In one embodiment, the bottom plate and the cover plate are aluminum alloy plate materials.

In one embodiment, the cross-sectional profile of the through-plasma via is located within the edge profile of the trace layer, and either the blind via or the via is located within the through-plasma via

After the technical scheme is adopted, the utility model has the advantages that before the multilayer circuit board is plated with the through holes or blind holes, the multilayer circuit board is firstly placed in the clamping groove of the bottom plate, the cover plate is covered above the bottom plate, and the first wiring layer and the second wiring layer are positioned in the plasma through holes, so that the plasma glue removal can be directly carried out on the areas in the plasma through holes in the plasma glue removal process, other positions of the multilayer circuit board are covered by the cover plate, the glue in the glue layering area is not easy to be subjected to plasma operation, the phenomena of plate burning, plate explosion and layering are reduced, and the product yield is improved.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.

Fig. 1 is a layout of a multi-layer circuit board of the present utility model.

FIG. 2 is a schematic diagram of a plasma carrier structure according to the present utility model.

Reference numerals: 11. a substrate; 12. a wiring layer; 2. a bottom plate; 3. a cover plate; 31. passing through the plasma through hole; 32. an arc opening; 4. a magnetic stripe; 5. and (3) a hinge.

Detailed Description

In order to further explain the technical scheme of the utility model, the utility model is explained in detail by specific examples.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate an orientation or a positional relationship based on that shown in the drawings, merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

The multi-layer circuit board provided by the utility model is a circuit board with a plurality of wiring layers, and a dielectric layer is arranged between every two wiring layers. As shown in fig. 1, the multilayer circuit board includes a substrate 11 and a trace layer 12, the trace layer 12 is sequentially adhered above the substrate 11, the trace layer 12 is provided with a plurality of blind holes or through holes for realizing circuit communication, and an edge contour of the trace layer 12 is a laminating adhesive region 13. Before the operation of plating the blind holes or the through holes is carried out, the residual colloid in the blind holes or the through holes needs to be removed, but the circuit board is directly placed in a plasma colloid remover for removing colloid, the inventor notices that the phenomena of board burning, board explosion, layering and the like of the multilayer circuit board are easy to occur after colloid removal, and the occurrence part is mostly a layered colloid area. In order to reduce this phenomenon and improve the product yield, a plasma carrier structure is designed.

Referring to fig. 2, the utility model discloses a plasma carrier structure, which comprises a bottom plate 2, a cover plate 3, a magnetic stripe 4 and a hinge 5, wherein the bottom plate 2 and the cover plate 3 can clamp and fix a multi-layer circuit board. The bottom plate 2 is provided with a clamping groove, the clamping groove is matched with the substrate 11, the clamping groove is in a rectangular structure, and certainly, the clamping groove is not limited to a rectangle, and in other embodiments, the clamping groove structure is matched with the substrate of the correspondingly produced multi-layer circuit board so as to be used for fixing the substrate of the multi-layer circuit board.

Hinge 5 sets up in the one side border department of bottom plate 2 and apron 3, and the interior piece and the outer piece of hinge 5 are installed in bottom plate 2 and apron 3 through the screw respectively, so that apron 3 one side border articulates in bottom plate 2, can cover in multilayer circuit board top through the upset of apron 3, a plurality of plasma through-holes 31 have been seted up to apron 3, the profile and the wiring layer 12 looks adaptation of passing plasma through-holes 31, make the plasma remove the gluey in-process, only the region of wiring layer 12 can carry out the plasma and remove gluey, reduce that the other regions of multilayer circuit board carry out the plasma and remove the phenomenon that burns the board, explodes board or layering appear. It should be noted that the outline of the through-plasma via 31 is not limited to the structure of the present utility model, and it may be designed according to the plasma photoresist removing region required for the multi-layer circuit board.

Further, the cross-sectional profile of the through-plasma via 31 is located within the edge profile of the trace layer, and either the blind hole or the via is located within the through-plasma via 31. Specifically, the through-plasma via hole 31 can expose all the blind holes or through holes formed on the wiring layer, and the blind holes or through holes can sufficiently perform the plasma photoresist removing operation, and the edge of the through-plasma via hole 31 needs to shield the boundary between the wiring layer 12 and the substrate 11, so that the photoresist removing process is not performed in the photoresist laminating area, and the phenomena of burning, popping or lamination are reduced.

The magnetic stripe 4 is provided with two and two magnetic stripes 4 install respectively in the bottom plate 2 and cover plate 3 one side border of keeping away from hinge 5, and after the cover plate 3 lid was closed in bottom plate 2, two magnetic stripes 4 inter attraction to the apron 3 can be comparatively firm lid closes in bottom plate 2, and the multilayer circuit board of plasma gumming in-process is difficult for dropping. An arc opening 32 is formed at one side edge of the cover plate 3 so as to facilitate the user to open the cover plate 3.

In this embodiment, as a preferred embodiment of the present utility model, the bottom plate 2 and the cover plate 3 are both made of aluminum alloy sheet. In the plasma photoresist removing process, the aluminum alloy plate is weak in oxidation effect by plasma, difficult to generate loss and longer in service life.

The foregoing is merely illustrative of the present utility model and not restrictive, and other modifications and equivalents thereof may occur to those skilled in the art without departing from the spirit and scope of the present utility model.

Claims

1. A plasma carrier structure, characterized in that: comprising

A bottom plate (2), wherein the bottom plate (2) is provided with a clamping groove for fixing a substrate of the multilayer circuit board;

the cover plate (3), the cover plate (3) is articulated in the bottom plate (2), a plurality of plasma through holes (31) are formed in the cover plate (3).

2. The plasma carrier structure of claim 1, wherein: the novel magnetic strip comprises a base plate (2) and a cover plate (3), and is characterized by further comprising magnetic strips (4), wherein the two magnetic strips (4) are arranged on the base plate (2) and the cover plate (3) respectively, and the cover plate (3) is covered on the base plate (2).

3. The plasma carrier structure of claim 2, wherein: an arc opening (32) is formed in one side edge of the cover plate (3).

4. The plasma carrier structure of claim 1, wherein: also comprises a hinge (5), the hinge (5) is positioned on one side of the bottom plate (2) far away from the magnetic stripe (4).

5. The plasma carrier structure of any one of claims 1 to 4, wherein: the bottom plate (2) and the cover plate (3) are made of aluminum alloy plates.

6. The plasma carrier structure of any one of claims 1 to 4, wherein: the cross-section outline of the through plasma through hole (31) is positioned in the edge outline of the wiring layer, and the blind holes or the through holes are positioned in the through plasma through hole (31).