CN219612447U - Heat dissipation system - Google Patents

Abstract

The utility model relates to a heat radiation system, which comprises a refrigerator, a heat radiation machine case, a detection component and a control component, wherein the refrigerator comprises a semiconductor refrigeration sheet and a water cooling component, the water cooling component is overlapped on the semiconductor refrigeration sheet, and the water cooling component is provided with a heat exchange cavity; the heat dissipation machine case comprises a heat exchange assembly, an output pipe, an input pipe, a liquid pump and a fan, wherein the heat exchange assembly is provided with a heat exchange channel, a first interface and a second interface, the first interface and the second interface are positioned at two ends of the heat exchange channel, the first interface is communicated with a heat exchange cavity through the output pipe, the second interface is communicated with the heat exchange cavity through the input pipe, the liquid pump is arranged on the input pipe or the output pipe, the detection assembly is used for detecting the surface temperature and the surface humidity of the water cooling assembly and/or the heat exchange assembly, and the control assembly is used for controlling the semiconductor refrigerating sheet, the liquid pump and the fan to work according to the surface temperature and the surface humidity. The heat radiation system has controllable temperature and humidity during heat radiation, so as to avoid condensed water generated by low temperature and reduce damage probability of a refrigerator and electronic equipment.

Description

Heat dissipation system

Technical Field

The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation system.

Background

With the rapid development of electronic devices such as smart phones and tablet computers, more and more functional modules are integrated in the smart phones, and functions which can be realized are more and more abundant, and as a result, the smart phones are easy to heat and heat under the use scenes such as games, videos and the like. In order to avoid the phenomena that the service life of the smart phone is influenced due to serious heating of the smart phone in the use scenes such as games, videos and the like, or the smart phone is blocked, unsmooth in operation and the like, a heat dissipation device which corresponds to the back of the electronic equipment and dissipates heat of the smart phone is arranged.

However, in the related art, when the heat dissipating device dissipates heat of the electronic device, the heat dissipating device is prone to continuously cooling to cause condensation, so that condensed water permeates into the heat dissipating device to affect the service life of the heat dissipating device, and even the temperature of the electronic device is too low to generate condensed water in the electronic device, which causes damage to the electronic device.

Disclosure of Invention

The utility model provides a heat dissipation system, which aims to solve the technical problem that equipment is damaged due to condensed water in a heat dissipation process.

The utility model provides a heat dissipation system, comprising:

the refrigerator comprises a semiconductor refrigerating sheet and a water cooling component, wherein the semiconductor refrigerating sheet is provided with a heating surface and a refrigerating surface which are arranged in a back-to-back mode, the water cooling component is overlapped on one side where the heating surface is located, the water cooling component is provided with a heat exchange cavity, and the heat exchange cavity is used for circulating a cooling medium to take away heat of the heating surface;

the heat dissipation machine case comprises a heat exchange assembly, an output pipe, an input pipe, a liquid pump and a fan, wherein the heat exchange assembly is provided with a heat exchange channel, a first interface and a second interface which are positioned at two ends of the heat exchange channel, the first interface is communicated with the heat exchange cavity through the output pipe, the second interface is communicated with the heat exchange cavity through the input pipe, the liquid pump is arranged in the input pipe or the output pipe, and the fan is used for dissipating heat of the heat exchange assembly;

the detection component is used for detecting the surface temperature and the surface humidity of the water cooling component and/or the heat exchange component;

and the control assembly is electrically connected with the detection assembly and is used for controlling the semiconductor refrigeration piece, the liquid pump and the fan to work according to the surface temperature and the surface humidity detected by the detection assembly.

According to the heat radiation system, the detection component detects the surface temperature and the surface humidity of the water cooling component and/or the heat exchange component, and the control component controls the semiconductor refrigerating sheet, the liquid pump and the fan to work according to the surface temperature and the surface humidity detected by the detection component, so that the temperature and the humidity of the heat radiation system during heat radiation are controllable, condensed water generated due to the fact that the temperature is too low is avoided, and the damage probability of a refrigerator and electronic equipment is reduced.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of a heat dissipation system and an electronic device according to an embodiment.

Fig. 2 is a block diagram of a heat dissipation system according to an embodiment.

Fig. 3 is a schematic top view of a refrigerator of a heat dissipation system according to an embodiment.

Fig. 4 is a schematic cross-sectional view of a refrigerator of the heat dissipation system shown in fig. 3 along line I-I.

Fig. 5 is a schematic view of a part of a heat dissipating chassis of a heat dissipating system according to an embodiment.

Fig. 6 is a schematic structural diagram of a heat exchange component of a heat dissipating case in the heat dissipating system according to an embodiment.

Fig. 7 is a schematic structural diagram of a heat exchange assembly of a heat dissipating chassis in a heat dissipating system according to another embodiment.

Fig. 8 is a schematic view of an external appearance structure of a refrigerator of a heat dissipation system according to an embodiment when a clamping assembly is provided.

Fig. 9 is a schematic illustration of the connection of the refrigerator, clamp assembly and shell assembly shown in fig. 8.

Reference numerals illustrate:

100. a heat dissipation system; 10. a refrigerator; 10a, a shell assembly; 11. a semiconductor refrigeration sheet; 11a, a heating surface; 11b, a refrigeration surface; 12. a water cooling assembly; 121. a heat conductive member; 121a, a heat conducting plate; 121b, a heat conducting block; 122. a housing; 122a, a bottom plate; 122b, a surrounding wall; 122c, a first separator; 13. a first pipe joint; 14. a second pipe joint; q, heat exchange cavity; A. a first chamber; B. a second chamber; H. a return port; t, a glue filling groove; 15. a clamping assembly; 15a, clamping arms; 20. a heat dissipating chassis; 21. a heat exchange assembly; 211. a first water tank; 212. a second water tank; 213. a communicating pipe; 214. a second separator; 215. a heat radiation fin; 211a, an input chamber; 211b, an output cavity; 21a, a first interface; 21b, a second interface; 22. an output pipe; 23. an input tube; 24. a liquid pump; 25. a fan; 30. a detection assembly; 31. a first temperature sensor; 32. a second temperature sensor; 33. a humidity sensor; 40. a control assembly; 41. a first control unit; 42. a second control unit; 42a, a flow rate sensor; 42b, an alarm; 50. a switching element; 200. an electronic device; 200a, a display surface; 200b, back side.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Preferred embodiments of the present utility model are shown in the drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

As used herein, "electronic device" refers to a device capable of receiving and/or transmitting communication signals that includes, but is not limited to, a device connected via any one or several of the following connections:

(1) Via a wireline connection, such as via a public-switched telephone network (Public Switched Telephone Networks, PSTN), a digital subscriber line (Digital Subscriber Line, DSL), a digital cable, a direct cable connection;

(2) Via wireless pipe connections, such as cellular networks, wireless local area networks (Wireless Local Area Network, WLAN), digital television networks such as DVB-H networks, satellite networks, AM-FM broadcast transmitters.

An electronic device configured to communicate through a wireless pipe joint may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

(1) Satellite phones or cellular phones;

(2) A personal communications system (Personal Communications System, PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities;

(3) A radiotelephone, pager, internet/intranet access, web browser, notepad, calendar, personal digital assistant (Personal Digital Assistant, PDA) equipped with a global positioning system (Global Positioning System, GPS) receiver;

(4) Conventional laptop and/or palmtop receivers;

(5) Conventional laptop and/or palmtop radiotelephone transceivers, and the like.

Referring to fig. 1 and 2, a heat dissipation system 100 according to an embodiment of the present utility model is provided, where the heat dissipation system 100 includes a refrigerator 10, a heat dissipation case 20, a detection assembly 30, and a control assembly 40.

As shown in conjunction with fig. 3 and 4, the refrigerator 10 includes semiconductor refrigeration sheets 11 and a water cooling assembly 12. The semiconductor refrigeration piece 11 is provided with a heating surface 11a and a refrigeration surface 11b which are arranged in opposite directions, and the water cooling assembly 12 is overlapped on one side of the heating surface 11 a. The water cooling assembly 12 has a heat exchange cavity Q for circulating a cooling medium to remove heat from the heating surface 11a, so as to avoid the excessive temperature of the heating surface 11a of the water cooling assembly 12.

Referring to fig. 5, the heat dissipating case 20 includes a heat exchanging assembly 21, an output pipe 22, an input pipe 23, a liquid pump 24, and a fan 25. The heat exchange assembly 21 is provided with a heat exchange channel, a first interface 21a and a second interface 21b which are positioned at two ends of the heat exchange channel, the first interface 21a is communicated with the heat exchange cavity Q of the water cooling assembly 12 through an output pipe 22, the second interface 21b is communicated with the heat exchange cavity Q of the water cooling assembly 12 through an input pipe 23, and a liquid pump 24 is arranged on the input pipe 23 or the output pipe 22. The liquid pump 24 is used for driving the cooling medium to circulate between the heat exchange channel and the heat exchange cavity Q through the output pipe 22 and the input pipe 23, so that the cooling medium brings heat in the heat exchange cavity Q out of the heat exchange channel for heat exchange, and the heat is transferred to the heat exchange assembly 21. The fan 25 is used for dissipating heat of the heat exchange assembly 21 to avoid the heat exchange assembly 21 from being excessively high in temperature, so that the cooling medium flowing through the heat exchange assembly 21 can be utilized to continuously carry heat of the water cooling assembly 12 out to the heat exchange assembly 21 for dissipating heat, thereby improving the cooling effect.

In this embodiment, the detection assembly 30 is used to detect the surface temperature and surface humidity of the water cooling assembly 12 and/or the heat exchange assembly 21. The control assembly 40 is electrically connected with the detection assembly 30, and is used for controlling the semiconductor refrigeration piece 11, the liquid pump 24 and the fan 25 to work according to the surface temperature and the surface humidity detected by the detection assembly 30, so that the temperature and the humidity of the heat dissipation system 100 when the heat dissipation system dissipates heat of the electronic equipment 200 are controllable, condensed water is avoided, and the damage probability of the refrigerator 10 and the electronic equipment 200 is reduced.

In some embodiments, as shown in fig. 2, the detection assembly 30 includes a first temperature sensor 31 and a second temperature sensor 32. The first temperature sensor 31 and the second temperature sensor 32 are respectively provided on the heating surface 11a and the cooling surface 11b. When the first temperature sensor 31 detects that the temperature of the heat generating surface 11a is higher than the first preset temperature value, the control component 40 controls the semiconductor refrigeration piece 11 to increase the power, so that the cooling efficiency of the electronic device 200 is increased, and damage to the electronic device 200 due to overhigh temperature is avoided. When the second temperature sensor 32 detects that the temperature of the cooling surface 11b is lower than the second preset temperature value, the control component 40 controls the semiconductor cooling fin 11 to reduce power, so that condensed water caused by too low temperature is avoided, and damage to the electronic equipment 200 is reduced.

The control assembly 40 includes a first control unit 41 and a second control unit 42. The first control unit 41 and the second control unit 42 may be MCUs (Microcontroller Unit; micro control units). The semiconductor refrigeration sheet 11, the first temperature sensor 31, and the second temperature sensor 32 are all electrically connected to the first control unit 41. The second control unit 42 is in signal connection with the first control unit 41, and the second control unit 42 is electrically connected with the liquid pump 24. The second control unit 42 is configured to control the operating state of the liquid pump 24 according to the temperature value detected by the first temperature sensor 31, so that the power of the liquid pump 24 and the power of the semiconductor refrigeration sheet 11 are in positive correlation. In the process of cooling the electronic equipment 200 by using the heat dissipation system 100, the phenomenon that the temperature of the semiconductor refrigeration piece 11 is too high or too low cannot occur, and the first control unit 41 and the second control unit 42 are used for realizing intelligent control of the heat dissipation system 100 so as to facilitate accurate and controllable cooling of the electronic equipment 200.

The second control unit 42 and the first control unit 41 may be connected by bluetooth or Wifi. The connection between the first control unit 41 and the second control unit 42 is not limited herein.

In some embodiments, the detection assembly 30 includes a humidity sensor 33 for enabling humidity detection. The basic unit of the humidity sensor 33 is a humidity sensor, and is divided into two main types, namely, a resistive type and a capacitive type. The humidity-sensitive resistor is characterized in that a film made of a humidity-sensitive material is covered on a substrate, when water vapor in air is adsorbed on the humidity-sensitive film, the resistivity and the resistance value of the element are changed, and the humidity can be measured by utilizing the characteristic. The humidity-sensitive capacitor is generally made of a polymer film capacitor, when the ambient humidity changes, the dielectric constant of the humidity-sensitive capacitor changes, so that the capacitance of the humidity-sensitive capacitor also changes, and the capacitance change amount is in direct proportion to the relative humidity. Therefore, when the surface humidity from the humidity sensor 33 to the heat exchange assembly 21 or the surface humidity of the water cooling assembly 12 is too high, the control assembly 40 will send out a control signal, so that the power of the fan 25 or the water pump is reduced, and damage such as short circuit, corrosion of components and the like of the heat dissipation system 100 or the electronic device 200 caused by excessive condensed water is prevented.

In some embodiments, the fan 25 has PWM speed regulation, RD alarm, FG signal feedback, etc. functions to facilitate speed regulation and real-time fault detection. When the temperature of the electronic device 200 is too high, the rotation speed of the fan 25 is increased to achieve the effect of rapid cooling. As the heat dissipation system 100 cools the electronic device 200, the temperature of the electronic device 200 gradually decreases, and the rotation speed of the fan 25 gradually decreases to save power consumption.

In some embodiments, the second control unit 42 is electrically connected to a flow rate sensor 42a and an alarm 42b. The flow rate sensor 42a is provided to the output pipe 22 or the input pipe 23, and is configured to detect the flow rate of the cooling medium. When the flow rate value detected by the flow rate sensor 42a exceeds the preset range, the second control unit 42 controls the alarm 42b to give an alarm, thereby reminding the user to send the heat dissipation system 100 to repair in time, and avoiding more serious damage caused by continuous operation when the heat dissipation system 100 is in an abnormal state.

The preset range is set according to the flow rate of the cooling medium caused when the liquid pump 24 is operating normally. Different powers of the liquid pump 24 correspond to different water flow rates. When the liquid pump 24 starts to operate at normal power, the flow rate of the cooling medium has a normal value corresponding to the flow rate, and if the flow rate of the water is too small or too large, an abnormal phenomenon such as blockage or water leakage of the output pipe 22 or the input pipe 23 is indicated, and the alarm 42b sends an alarm. The alarm 42b includes, but is not limited to, a buzzer, a vibrator, etc., to alert the user to an abnormality in the piping of the heat dissipating system 100 in the form of a sound or vibration, etc. This prevents the pump 24 from increasing power blindly due to clogging by foreign matter, thereby protecting the pump 24 and the heat dissipation system 100

It should be noted that the heat dissipation system 100 may be used for cooling the electronic devices 200 such as a smart phone, a tablet computer, an electronic reader, etc.

The electronic device 200 may have a display surface 200a and a back surface 200b facing away from the display surface 200a. When the heat dissipation system 100 is used to cool the electronic device 200, the cooling surface 11b of the semiconductor cooling fin 11 may be directly contacted with the back surface 200b of the electronic device 200, so that the cooling surface 11b cools the electronic device 200. In some embodiments, the cooling surface 11b of the semiconductor cooling fin 11 may also be in indirect contact with the back surface 200b of the electronic device 200, as long as heat of the back surface 200b of the electronic device 200 can be transferred to the cooling surface 11b of the semiconductor cooling fin 11.

When the heat dissipation system 100 is utilized to cool the electronic device 200, the part of the refrigerator 10, which corresponds to the electronic device 200 and needs to be cooled, can be opposite, a user only needs to hold the electronic device 200 and the refrigerator 10, and the heat dissipation case 20 can be placed on a table top or a ground and other platforms, so that the user does not need to hold the heat dissipation case 20, and thus the user does not feel heavy during use, and good holding and using experience is provided for the user.

The refrigerator 10 may be provided with a magnet to be magnetically attracted to the back surface 200b of the electronic device 200.

In some embodiments, the refrigerator 10 may also be disposed on the back 200b of the electronic device 200 in a clamping manner. For example, as shown in connection with fig. 8 and 9, the heat dissipation system 100 further includes a clamping assembly 15, and the refrigerator 10 is connected to the clamping assembly 15. The clamping assembly 15 can clamp the electronic device 200 so that the electronic device 200 is disposed opposite to the cooling surface 11b of the semiconductor cooling fin 11, so that the refrigerator 10 stably cools the electronic device 200. Further, the refrigerator 10 and the clamping assembly 15 are installed in the same case assembly 10a, so that the overall structure is compact and small, and the electronic device 200 can be conveniently cooled when the electronic device 200 is held for use.

When the refrigerator 10 is fixed to the electronic device 200 by the clamping assembly 15, the clamping assembly 15 may be a side frame clamped to the electronic device 200, and the clamping assembly 15 may be positioned on the back surface 200b side of the electronic device 200 except for a portion for clamping the side frame, so as not to obstruct the display surface 200a of the electronic device 200.

As shown in connection with fig. 2 and 9, the clamping assembly 15 is provided with a switching element 50. The switch element 50 is electrically connected with the semiconductor refrigeration piece 11, the liquid pump 24 and the fan 25 through the control component 40, and the switch element 50 is used for triggering the control component 40 to start the semiconductor refrigeration piece 11, the liquid pump 24 and the fan 25 when the clamping component 15 is at the clamping position, so that when the heat dissipation system 100 is used for cooling the electronic equipment 200, only the clamping component 15 is required to be operated for clamping the electronic equipment 200, the heat dissipation system 100 is convenient to operate, and the user experience is improved.

The switching element 50 includes, but is not limited to, an all-pole hall effect switch, which may be mounted on two clamping arms 15a of the clamping assembly 15 for clamping the electronic device 200. When the two clamping arms 15a of the clamping assembly 15 are moved away from each other to open, the value of the all-pole hall effect switch changes to signal the control assembly 40 such that the control assembly 40 turns on the semiconductor refrigeration sheet 11, the liquid pump 24, and the fan 25.

In some embodiments, the heat dissipating chassis 20 is connected to an external power source through a power port such as a TYPE-C, DC round port, through which power can be supplied to the heat dissipating system 100 via the power port and the corresponding adapter. In some embodiments, a battery may be disposed within the heat dissipating case 20 such that an external power source may also charge the battery.

The power for the heat dissipation system 100 may be supplied by a variety of chargers and adapters. The charger specifically includes, but is not limited to, a TYPE-C port or a DC 5.5 x 2.5 outlet. The DC jack has the highest priority. When the DC port is inserted, the control module 40 of the heat dissipation system 100 will first identify the operating voltage value, and then determine the adapted power range by pulling power. When the TYPE-C port is inserted, the control assembly 40 of the heat dissipation system 100 also recognizes the power range of the charger according to various handshaking protocols.

As shown in conjunction with fig. 3 and 4, the water cooling assembly 12 includes a heat conductive member 121 and a housing 122. The heat conducting member 121 is connected with the housing 122 in a sealing manner and encloses a heat exchanging cavity Q, and the heat exchanging cavity Q can be filled with a cooling medium, so that the surface of the heat conducting member 121 corresponding to the inner wall of the heat exchanging cavity Q is contacted with the cooling medium for heat exchanging. When the temperature of the heat conducting member 121 is higher than the cooling medium, heat will be transferred from the heat conducting member 121 to the cooling medium.

Semiconductor cooling fins 11 include, but are not limited to, semiconductor coolers 10 (Thermo Electric Cooler, TEC). In some embodiments, the type of the refrigerating plate can be TEC112704, TEC112705 or TEC112706, and the size is 40×40, and the driving of the refrigerating plate adopts a mode of regulating the PWM duty ratio by a constant voltage to control the refrigerating power, and the driving circuit supports a step-up/step-down working mode and can work stably under various input voltage values.

In the embodiment of the semiconductor refrigeration piece 11 having the heating surface 11a and the refrigeration surface 11b, the heating surface 11a of the semiconductor refrigeration piece 11 is overlapped with the heat conducting member 121, so that when the semiconductor refrigeration piece 11 works, heat is transferred from the heating surface 11a to the heat conducting member 121, and the heat conducting member 121 exchanges heat with the cooling medium in the heat exchange cavity Q, so that the heat is transferred to the cooling medium, the temperature range of the heating surface 11a can be controlled, and the damage to the refrigerator 10 caused by the overhigh temperature of the heating surface 11a due to the continuous working of the semiconductor refrigeration piece 11 is avoided.

When the semiconductor cooling fin 11 is in operation, the temperature of the cooling surface 11b is lower than the temperature of the heat generating surface 11a, so that the electronic device 200 can be cooled by the cooling surface 11b with a lower temperature, thereby achieving the effect of radiating heat from the electronic device 200.

It should be noted that, since the refrigerator 10 is used for cooling the electronic device 200, the heat dissipation case 20 can conduct heat from the refrigerator 10 and dissipate heat, so that separation of cooling and heat dissipation is achieved, and structural designs of the refrigerator 10 and the heat dissipation case 20 are not interfered with each other, so that the electronic device has greater flexibility, and is beneficial to reducing structural complexity as a whole.

As shown in fig. 1, 3 and 4, the housing 122 is provided with a first pipe joint 13 and a second pipe joint 14 communicating with the heat exchange chamber Q. The output pipe 22 is communicated between the first pipe joint 13 and the first interface 21a of the heat exchange assembly 21, and the input pipe 23 is communicated between the second pipe joint 14 and the second interface 21b of the heat exchange assembly 21. Based on the liquid pump 24 being arranged at the output pipe 22 or the input pipe 23, the liquid pump 24 is operated to provide power for the flow of the cooling medium, so that the cooling medium circulates between the heat exchange cavity Q and the heat exchange assembly 21.

In the embodiment where the water cooling assembly 12 includes the heat conducting member 121 and the housing 122, after the cooling medium exchanges heat in the heat exchanging assembly 21, the cooling medium flows to the first pipe joint 13 through the output pipe 22 to flow into the heat exchanging cavity Q through the first pipe joint 13, and the temperature of the cooling medium is lower than that of the heat conducting member 121 due to the heat exchange between the cooling medium and the heat exchanging assembly 21, so that the cooling medium can cool the heat conducting member 121 in the heat exchanging cavity Q, that is, the temperature of the heat conducting member 121 is transferred to the cooling medium in the heat exchanging cavity Q. With the driving of the liquid pump 24, the cooling medium in the heat exchange cavity Q flows into the input pipe 23 through the second pipe joint 14 and enters the heat exchange assembly 21 through the input pipe 23, so that heat is brought from the heat exchange cavity Q to the heat exchange assembly 21 for heat exchange. The temperature of the heat conducting member 121 is continuously transferred to the heat exchanging assembly 21, and the heat of the heat exchanging assembly 21 can be brought out of the heat dissipating case 20 by the air flow generated by the fan 25, so that when the heat dissipating system 100 cools the electronic device 200, hot air can be discharged from the heat dissipating case 20, but hot air can not be generated near the refrigerator 10, and when a user holds the electronic device 200 and uses the refrigerator 10, the user can keep away from the hot air as far as possible, so as to obtain good use experience.

The cooling medium may be water or a liquid having cooling performance such as a phase-change liquid or oil, and the type of the cooling medium is not limited herein.

As shown in conjunction with fig. 3 and 4, the housing 122 includes a bottom plate 122a, a surrounding wall 122b, and a first partition 122c. The surrounding wall 122b is connected with the bottom plate 122a, the heat conducting member 121 is connected with one side of the surrounding wall 122b facing away from the bottom plate 122a, and the surrounding wall 122b encloses between the heat conducting member 121 and the bottom plate 122a to form a heat exchange cavity Q.

The first partition 122c is connected to the bottom plate 122a and divides the heat exchange chamber Q into a first chamber a and a second chamber B which are communicated. The first chamber a communicates with the first pipe joint 13 and the second chamber B communicates with the second pipe joint 14. When the cooling medium flows into the first chamber a through the first pipe joint 13, the cooling medium in the first chamber a may contact the heat conductive member 121 to exchange heat. Since the first partition 122c communicates the first and second chambers a and B partitioned by the heat exchanging chamber Q with each other, the cooling medium in the first chamber a may flow into the second chamber B to continue heat exchanging with the corresponding second chamber B of the heat conductive member 121, thereby allowing the cooling medium to sufficiently exchange heat with the heat conductive member 121 and improving heat dissipation efficiency.

The housing 122 may be a unitary structure. For example, the bottom plate 122a, the surrounding wall 122b, and the first partition 122c are integrally formed. Specifically, the integral molding means includes, but is not limited to, injection molding integral molding, stamping integral molding, or casting integral molding.

The shape of the surrounding wall 122b may be circular, square or oval, or may be other irregular shape as long as it can accommodate the assembly of the heat conductive member 121 and form the heat exchange chamber Q together with the heat conductive member 121.

Continuing to combine fig. 3 and 4, the first pipe joint 13 and the second pipe joint 14 are located on the same side of the casing 122, one end, closer to the first pipe joint 13, of the first partition 122c is connected with the surrounding wall 122B, the other end is spaced from the surrounding wall 122B to form a return port H, the first cavity a and the second cavity B are communicated through the return port H, the length of a circulation path of the cooling medium flowing through the heat exchange cavity Q can be increased by the arrangement, and when the cooling medium flows through the first cavity a and the second cavity B, the heat conducting member 121 can be cooled, so that heat can be timely taken out of the heat dissipation system 100, and heat dissipation efficiency is improved.

In the embodiment of the present utility model, there are various possibilities regarding the structure of the heat conducting member 121, as long as the heat conducting member 121 can be hermetically connected with the housing 122 to form the heat exchanging cavity Q, so that the cooling medium in the heat exchanging cavity Q can exchange heat with the heat conducting member 121.

As shown in fig. 4, the heat conductive member 121 includes a heat conductive plate 121a and a plurality of heat conductive blocks 121b, the plurality of heat conductive blocks 121b are protruded on a side of the heat conductive plate 121a facing the bottom plate 122a, and the plurality of heat conductive blocks 121b are disposed at intervals from each other. The plurality of heat conductive blocks 121b may increase a contact surface with the cooling medium, thereby improving a heat exchange effect.

The heat conductive member 121 may be of a unitary structure. For example, the heat conductive plate 121a and the heat conductive block 121b are formed in one body by a laser cutting process or by a casting process. In some embodiments, a welding, screw connection, or snap connection may also be adopted between the heat conductive plate 121a and the heat conductive block 121 b.

The plurality of heat conducting blocks 121b are strip-shaped and parallel to the first partition 122c, so that when the cooling medium flows along the direction parallel to the first partition 122c, the resistance of the heat conducting blocks 121b to the cooling medium is small, the cooling medium flows smoothly, the heat of the heat conducting blocks 121b can be taken away by the cooling medium in time, and the cooling efficiency of the structure is high.

The arrangement of the heat conductive block 121b is not limited to the above-described case of being parallel to the first partition 122c. For example, the heat conductive block 121b may be disposed at an acute angle with respect to the first partition 122c, as long as the cooling medium can contact the heat conductive block 121b to take away heat of the heat conductive member 121.

At least one of the plurality of heat conductive blocks 121B is located at one side of the first partition 122c to be located in the first cavity a, respectively, and the other heat conductive blocks 121B are located at the other side of the first partition 122c to be located in the second cavity B, respectively, so that the heat conductive member 121 has good heat dissipation efficiency at positions corresponding to both the first cavity a and the second cavity B.

Referring to fig. 4, the surrounding wall 122b is provided with a glue filling groove T for filling glue, and the heat conducting plate 121a is lapped on the surrounding wall 122b and is connected with the surrounding wall 122b in a sealing manner through the glue. Thus, the assembly between the heat conducting member 121 and the housing 122 can be completed by only filling the glue material into the glue filling groove T and then abutting the heat conducting plate 121a of the heat conducting member 121 against the surrounding wall 122 b. The structural arrangement adopted by the embodiment not only can reduce the assembly difficulty of the heat conducting piece 121 and the shell 122, but also can enhance the connection stability between the heat conducting piece 121 and the shell 122 by the glue material in the glue filling groove T.

As shown in fig. 6, the heat exchange assembly 21 includes a first water tank 211, a second water tank 212, and a plurality of communicating pipes 213, wherein a second partition 214 is disposed in the first water tank 211, the second partition 214 divides the first water tank 211 into an input chamber 211a and an output chamber 211b, and the plurality of communicating pipes 213 are connected between the first water tank 211 and the second water tank 212 to form a heat exchange channel. The plurality of communicating pipes 213 are disposed at opposite sides of the second separator 214 at intervals, and air flow generated when the fan 25 operates passes through the intervals between the communicating pipes 213, so that heat can be carried out by using the air flow generated by the fan 25, so as to increase the heat dissipation efficiency of the communicating pipes 213 in the surrounding air.

The communication pipe 213 at one side of the second partition 214 is communicated with the input chamber 211a and the second water tank 212, and the communication pipe 213 at the other side of the second partition 214 is communicated with the output chamber 211b and the second water tank 212. The input chamber 211a and the output chamber 211b are respectively communicated with the heat exchange chamber Q through the input pipe 23 and the output pipe 22, specifically, the input chamber 211a is communicated with the second interface 21b and the input pipe 23, and the output chamber 211b is communicated with the output pipe 22 through the first interface 21 a.

In this embodiment, the input chamber 211a may be connected to the second pipe joint 14 through the output pipe 22, so that the cooling medium in the heat exchange chamber Q will be input to the input chamber 211a along the output pipe 22, the cooling medium in the input chamber 211a will enter the second water tank 212 through the corresponding communication pipe 213, and the cooling medium will flow into the output chamber 211b through the communication pipe 213 corresponding to the output chamber 211b after entering the second water tank 212. The output cavity 211b is connected to the first pipe joint 13 through the input pipe 23, so that the cooling medium input to the output cavity 211b is input to the first pipe joint 13 along the input pipe 23 and enters the heat exchanging cavity Q through the first pipe joint 13, thus realizing the circulation flow of the cooling medium between the heat exchanging cavity Q and the heat exchanging assembly 21, and realizing the heat transfer of the heat conducting member 121 to the heat exchanging assembly 21 by the cooling medium.

As shown in connection with fig. 7, in some embodiments, the heat exchange assembly 21 includes heat radiating fins 215, and the heat radiating fins 215 are disposed between the adjacent 2 communicating tubes 213 and serve to conduct out heat of the communicating tubes 213. The heat radiating fins 215 can increase the contact surface with air, thereby accelerating the heat radiating efficiency.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (15)

1. A heat dissipation system, comprising:

the refrigerator comprises a semiconductor refrigerating sheet and a water cooling component, wherein the semiconductor refrigerating sheet is provided with a heating surface and a refrigerating surface which are arranged in a back-to-back mode, the water cooling component is overlapped on one side where the heating surface is located, the water cooling component is provided with a heat exchange cavity, and the heat exchange cavity is used for circulating a cooling medium to take away heat of the heating surface;

the heat dissipation machine case comprises a heat exchange assembly, an output pipe, an input pipe, a liquid pump and a fan, wherein the heat exchange assembly is provided with a heat exchange channel, a first interface and a second interface which are positioned at two ends of the heat exchange channel, the first interface is communicated with the heat exchange cavity through the output pipe, the second interface is communicated with the heat exchange cavity through the input pipe, the liquid pump is arranged in the input pipe or the output pipe, and the fan is used for dissipating heat of the heat exchange assembly;

the detection component is used for detecting the surface temperature and the surface humidity of the water cooling component and/or the heat exchange component;

and the control assembly is electrically connected with the detection assembly and is used for controlling the semiconductor refrigeration piece, the liquid pump and the fan to work according to the surface temperature and the surface humidity detected by the detection assembly.

2. The heat dissipation system according to claim 1, wherein the detection assembly includes a first temperature sensor and a second temperature sensor, the first temperature sensor and the second temperature sensor are respectively disposed on the heating surface and the cooling surface, when the first temperature sensor detects that the temperature of the heating surface is higher than a first preset temperature value, the control assembly controls the semiconductor cooling plate to increase power, and when the second temperature sensor detects that the temperature of the cooling surface is lower than a second preset temperature value, the control assembly controls the semiconductor cooling plate to decrease power.

3. The heat dissipating system of claim 2, wherein the control assembly comprises a first control unit and a second control unit, the semiconductor refrigeration sheet, the first temperature sensor and the second temperature sensor are all electrically connected to the first control unit, the second control unit is in signal connection with the first control unit, the second control unit is electrically connected to the liquid pump, and is configured to control the operating state of the liquid pump according to the temperature value detected by the first temperature sensor, such that the power of the liquid pump and the power of the semiconductor refrigeration sheet are in positive correlation.

4. The heat dissipating system according to claim 3, wherein the second control unit is electrically connected to a flow rate sensor provided in the output pipe or the input pipe and configured to detect a flow rate of the cooling medium, and an alarm is provided to the second control unit when a flow rate value detected by the flow rate sensor exceeds a preset range.

5. The heat removal system of any one of claims 1-4, wherein the refrigerator further comprises a clamp assembly, the water cooling assembly being coupled to the clamp assembly, the clamp assembly being capable of clamping an electronic device such that the electronic device is disposed opposite the cooling surface.

6. The heat dissipating system of claim 5, wherein the clamping assembly is provided with a switching element electrically connected to the semiconductor refrigeration sheet, the liquid pump and the fan by the control assembly, the switching element for triggering the control assembly to turn on the semiconductor refrigeration sheet, the liquid pump and the fan when the clamping assembly is in the clamping position.

7. The heat dissipating system of claim 1 wherein the water cooling assembly comprises a thermally conductive member and a housing, the thermally conductive member being sealingly connected to the housing and enclosing the heat generating surface of the semiconductor cooling fin forming the heat exchange cavity against the thermally conductive member.

8. The heat dissipating system of claim 7, wherein said housing is provided with a first tube connector and a second tube connector in communication with said heat exchanging cavity, said output tube being in communication between said first tube connector and said first port, and said input tube being in communication between said second tube connector and said second port.

9. The heat dissipating system of claim 8, wherein said housing comprises a base plate, an enclosure wall connected to said base plate, said heat conducting member connected to a side of said enclosure wall facing away from said base plate, said enclosure wall enclosing said heat exchanging cavity between said heat conducting member and said base plate, and a first partition wall connected to said base plate and separating said heat exchanging cavity into a first cavity and a second cavity in communication, said first cavity in communication with said first tube joint, said second cavity in communication with said second tube joint.

10. The heat dissipating system of claim 9, wherein said first fitting and said second fitting are on the same side of said housing, said first baffle being connected to said enclosure wall at an end thereof closer to said first fitting and being spaced from said enclosure wall at an opposite end thereof to form a return port, said first chamber and said second chamber being in communication through said return port.

11. The heat dissipating system of claim 9, wherein the heat conducting member comprises a heat conducting plate and a plurality of heat conducting blocks, the plurality of heat conducting blocks are protruding from a side of the heat conducting plate facing the bottom plate, and the plurality of heat conducting blocks are disposed at intervals from each other.

12. The heat dissipating system of claim 11, wherein said enclosure wall is provided with a glue filling groove for filling glue, and said heat conducting plate is overlapped with said enclosure wall and is connected with said enclosure wall in a sealing manner by said glue.

13. The heat dissipation system of claim 11, wherein the plurality of heat conducting blocks are strip-shaped and parallel to the first separator, at least one of the plurality of heat conducting blocks being located on one side of the first separator and the other heat conducting blocks being located on the other side of the first separator.

14. The heat dissipating system of claim 1, wherein the heat exchanging assembly comprises a first water tank, a second water tank, and a plurality of communicating pipes, wherein a second partition is disposed in the first water tank, the second partition divides the first water tank into an input chamber and an output chamber, the plurality of communicating pipes are connected between the first water tank and the second water tank to form the heat exchanging channel, the plurality of communicating pipes are disposed at opposite sides of the second partition at intervals, an air flow generated when the fan operates passes through the intervals between the communicating pipes, the communicating pipe on one side of the second partition is communicated with the input chamber and the second water tank, the communicating pipe on the other side of the second partition is communicated with the output chamber and the second water tank, the input chamber is communicated with the second port and the input pipe, and the output chamber is communicated with the output pipe through the first port.

15. The heat radiation system according to claim 14, wherein the heat exchange assembly comprises heat radiation fins disposed between 2 adjacent communication tubes for conducting heat out of the communication tubes.