JP2007306026A - Cooling system for electronic device and electronic device with cooling system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To facilitate a cooling pipe piping work, to prevent leakage of a liquid refrigerant, and to enhance operation efficiency while the heat exchange capacity of a heat exchanger unit is controlled to prevent dewing and freezing, in a cooling system for an electronic device and the electronic device with the cooling system. <P>SOLUTION: A part of a cooling pipe 10 is flattened, and the flat part 4 is contacted with respective electronic parts to cool them and to facilitate piping work. Piping connection parts are reduced to prevent the leakage of the liquid refrigerant, and the operation efficiency is enhanced while the heat exchange capacity of the heat exchanger unit in the cooling system is controlled to prevent the dewing and the freezing, in response to an outside air temperature, a temperature in the electronic device and a liquid refrigerant temperature. In the electronic device having two electronic systems, the common of a liquid refrigerant tank in respective cooling systems of the two electronic systems allows preventing the dewing and the freezing of the cooling systems in the pause side electronic system. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cooling apparatus for an electronic apparatus, and more particularly to a cooling apparatus that individually cools electronic components such as semiconductor devices, CPUs, FETs, and power amplifiers used in electronic circuits in the electronic apparatus using a liquid refrigerant.

  A large number of circuit boards are densely mounted in the housing of an electronic device such as an electronic computer or a broadcasting system, and electronic components that generate high heat such as semiconductor devices, CPUs, FETs, and power amplifiers are mounted on each circuit board. A cooling device for cooling the electronic device is required. Electronic components that emit high heat, such as semiconductor devices, CPUs, power amplifiers, etc., have a narrow effective operating temperature range, and therefore it is necessary to cool each electronic component individually rather than cooling the entire electronic device. For this reason, recent cooling devices for electronic devices cool a cooling pipe through which a liquid refrigerant passes close to each electronic component.

  For example, a heat sink using a flat serpentine tube (see, for example, Patent Document 1), a high-pressure discharge lamp device (see, for example, Patent Document 2), a water-cooled cold plate, and a manufacturing method thereof (for example, see Patent Document 3) are electronic components. It is proposed that a flat cooling pipe is meandered and attached to a water-cooled cooling plate in which the cooling plate is disposed to increase the thermal contact area between the cooling plate and the flat cooling pipe to increase the cooling efficiency. In this configuration, in order to efficiently guide the heat released from the electronic component to the flat cooling tube, the flattening rate of the normal flat cooling tube is increased, and the heat passage cross-sectional area between the electronic component and the flat cooling tube is increased. For example, the width of the flat cooling pipe is expanded to the width of the electronic component or more. However, when a large number of electronic components are arranged, flat cooling tubes with a large flatness are bent one after the other and placed close to the corresponding positions of the electronic components mounted at high density. This means that the radius of curvature for bending the tube must be reduced. In general, it is much more difficult to manufacture a flat tube with a large flattening ratio to a small radius of curvature than to bend a flat tube with a small flattening rate. Further, as the flatness ratio increases, the pressure loss of the flat cooling pipe increases remarkably.

  On the other hand, if the flattening rate of the flat cooling pipe is kept small, it becomes easy to reduce the radius of curvature of the flat cooling pipe. However, since the heat passage cross-sectional area (or heat contact area) from the electronic component to the flat cooling pipe is reduced, there is a limit to the improvement of the cooling performance of the electronic component.

  In this way, flat cooling pipes with a high flatness rate are bent one after another to accommodate electronic components that are mounted and arranged at high density, which improves cooling performance, improves flat pipe manufacturing, and reduces pressure loss in the flat pipe. However, there is a limit to both.

  Furthermore, in a cooling device for an electronic device, dew condensation is likely to occur around a cooling pipe through which a liquid refrigerant is passed and a cooled electronic component around the electronic component due to the relationship between temperature and humidity. This dew condensation is a cause of poor insulation, deterioration of electronic components, and poor contact of these connectors. In addition, if the temperature of the surroundings of the electronic device such as in cold weather, for example, the atmospheric temperature is too low, the liquid refrigerant that exchanges heat with the surroundings via the heat exchanger freezes, and the cooling pipes burst or electronic parts Will cause a decline in the ability. That is, in order to operate each electronic component efficiently in a relatively narrow predetermined effective operating temperature range, it is necessary to manage the temperature with a cooling device.

  The cooling device (see, for example, Patent Document 4) detects the environmental temperature and humidity around the electronic components in the electronic device, calculates the supply temperature of the liquid refrigerant that can prevent condensation, and controls the supply temperature by the cooling device. A cooling device is proposed.

  The cooling device (for example, refer to Patent Document 5) performs heat exchange between the refrigerant and the gas in the electronic device when the difference between the refrigerant and the gas temperature in the electronic device reaches a predetermined value when the electronic component is not operating. Thus, a cooling device that prevents condensation at the start of operation of the electronic device has been proposed.

  The cooling device (see, for example, Patent Document 6) measures the air temperature in the electronic device and the temperature of the liquid refrigerant, and detects condensation occurring around the cooling pipe of the cooling device with a condensation sensor. A cooling device that reliably prevents ambient condensation is disclosed.

  Further, the cooling device (see, for example, Patent Document 7) has a plurality of different cooling capacities depending on the difference between the supply temperature of the liquid refrigerant and the return temperature, and the difference between the temperature in the electronic device and the supply temperature of the liquid refrigerant. The cooling device which controls the ON-OFF operation | movement of a heat exchange unit and cools efficiently is disclosed.

  As described above, in the cooling device using the liquid refrigerant, the heat exchange unit capacity is set so that the electronic device such as the semiconductor device, FET, CPU and power amplifier in the electronic device operates efficiently. ing. Thus, the heat exchange unit cools the liquid refrigerant by introducing the outside air and exchanging heat with the liquid refrigerant, so that the liquid refrigerant cools to an unnecessarily low temperature in conjunction with a decrease in the temperature of the outside air. As a result, power is consumed excessively, and problems such as freezing and condensation occur.

  In addition, in unmanned broadcasting systems, multiple electronic systems are arranged in parallel to improve reliability, one is always operated as the active machine, and the remaining is kept in standby as a spare machine, causing the active machine to malfunction. In general, a multi-system system that operates a spare machine in such a case is generally used. There is also an electronic apparatus in which a plurality of electronic systems operate independently, and there is a configuration in which other electronic systems are in a suspended state when one electronic system operates. In such an apparatus, each electronic system is provided with a cooling system, and when a certain electronic system is deactivated, the corresponding cooling system is also deactivated. For this reason, since the liquid refrigerant is stagnant in the resting electronic system, it is necessary to prevent the liquid refrigerant from freezing when the outside air temperature becomes low. Therefore, in general, an antifreeze liquid is used as the liquid refrigerant. However, the use of the antifreeze liquid tends to corrode the parts where the antifreeze liquid comes into contact, such as cooling pipes and tanks. In handling the antifreeze, the environment must be fully considered. In addition, if the low-temperature liquid refrigerant flows into the electronic system that is in a high-temperature state when the hibernation system is activated, condensation may occur. Therefore, it is necessary to keep the temperature of the liquid refrigerant at or above the dew point temperature. Therefore, it is necessary to always warm the liquid refrigerant of the pause system with a heater or the like, or to operate all the electronic systems at the same time. As a result, considerable power is required to prevent the liquid refrigerant from falling below the dew point temperature.

  A cooling structure for an electronic device (see, for example, Patent Document 8) is a cooling device that performs cooling by providing a heat exchange unit in each of a plurality of housings that store electronic circuits. A cooling device is disclosed that reduces the air volume as a whole by leading to the heat exchange unit of the housing and cooling the electronic circuit in the second housing by cooling with the heat exchange unit.

  Also, freezing and condensation can be prevented by providing a heater in the tank of each cooling system to warm the liquid refrigerant of the non-operating electronic system, that is, the standby electronic system.

  However, operating the heater in the tank in this way causes an increase in power consumption.

Japanese Utility Model Publication No. 2-28965 JP-A-63-131460 JP-A-6-304739 JP-A-6-164178 JP-A-5-75284 Japanese Patent No. 265681 Japanese Patent No. 2058640 JP-A-9-298377

  In the above-mentioned prior art, flat cooling pipes with a large flat rate are bent one after another to correspond to electronic components that are mounted and arranged at high density. This improves cooling performance, improves flat pipe manufacturing, and increases the pressure in the flat pipe. There is a limit to any loss reduction.

  Further, in the cooling device using the liquid refrigerant, the capability of the heat exchange unit is set so that the electronic device such as the semiconductor device, FET, CPU, and power amplifier in the electronic device operates within a temperature range. Thus, the heat exchange unit cools the liquid refrigerant by introducing the outside air and exchanging heat with the liquid refrigerant, so that the liquid refrigerant cools to an unnecessarily low temperature in conjunction with a decrease in the temperature of the outside air. As a result, power is consumed excessively, and problems such as freezing and condensation occur.

  Further, in an electronic device in which a plurality of electronic systems operate independently, and when one electronic system is operating, the other electronic system is in a stopped state. It is necessary to warm it up or to operate all electronic systems at the same time. As a result, considerable power is required to prevent the liquid refrigerant from falling below the dew point temperature.

  The present invention has been made to solve the above-described problems related to the prior art, and a first object of the present invention is to provide a position corresponding to a large number of electronic components mounted and arranged at high density in an electronic device. A cooling pipe with a high flatness ratio is arranged, and a circular cooling pipe with a small radius of curvature is arranged at the bent part of the cooling pipe to improve the cooling performance of many electronic components, reduce pressure loss, and improve the manufacturability of the cooling pipe. The object is to provide a cooling device for electronic devices.

  The second object of the present invention is to control the heat exchange capability of the heat exchange unit in accordance with the outside air temperature, thereby stably maintaining the operating temperature of the electronic component regardless of the outside air temperature, while maintaining the effective operating temperature. An object of the present invention is to provide a cooling device for an electronic device that saves energy.

  It is a third object of the present invention to provide an electronic device cooling device that improves the reliability of the cooling device and saves energy in an electronic device cooling device having a plurality of electronic systems.

  Furthermore, a fourth object of the present invention is to provide a cooling system for an electronic apparatus having a plurality of electronic systems, which is a standby (standby machine) side cooling system in which the liquid refrigerant of the operating (active machine) side cooling system is suspended. Introduces the temperature of the liquid refrigerant in the standby side cooling system close to the temperature of the liquid refrigerant in the operating side cooling system to prevent freezing and condensation, and enables the standby electronic system to operate quickly and save energy. It is providing the cooling device for electronic devices which aimed at.

  According to the first aspect of the present invention, heat is taken out from the cooling pipe for flowing the liquid refrigerant thermally coupled immediately below or in the vicinity of the heating element, and the liquid refrigerant that has absorbed the heat generated from the heating element. And a heat exchanger that discharges to the outside, and circulates so that a low-temperature liquid refrigerant repeatedly flows through the cooling pipe, and a part of the cooling pipe is formed into a flat shape, and the flat portion of the flat shape is formed. By arranging it close to the heating element, the plane projection area from the heating element is further increased, and the generated heat is more efficiently transmitted to the liquid refrigerant.

  Furthermore, by making the cross-sectional area of the flat part of the cooling pipe smaller than the part outside the flat part, the flow rate of the liquid refrigerant is accelerated and the cooling efficiency is improved.

  Furthermore, liquid leakage is prevented by integrally forming the flat portion of the cooling pipe and the portion outside the flat portion.

  Further, the increase in pressure loss is suppressed by flattening only the necessary portion of the cooling pipe.

  Furthermore, the cooling pipe can be attached from one side of the circuit board by fixing the flat portion of the cooling pipe to the surface facing the mounting surface of the circuit board to which the heating element is attached via a heat conduction block. To do.

  In the present invention, by using the above-described means, the shape of the cooling pipe attached in the vicinity of the heating element is flattened to increase the plane contact area from the heating element, and the heat flux is reduced to the cooling pipe. By making it easy to enter, it is possible to transfer heat to the liquid refrigerant more efficiently.

  In addition, the shape of the cooling pipe attached in the vicinity of the heating element is a cooling pipe with good thermal efficiency by deforming it flat to increase the flow rate of the fluid and improving the heat transfer coefficient.

  In addition, the pressure loss can be kept small by manufacturing only one cooling pipe from the inlet to the outlet of the cooling pipe and deforming only the vicinity of the heating element to a flat shape. In addition, power consumption can be kept low.

  In addition, by producing a single cooling pipe from the inlet to the outlet of the cooling pipe, it is possible to eliminate the seam in the middle, eliminate any water leakage, and improve the quality and reliability of the product.

  In addition, a heat conduction block with good thermal conductivity is joined to a part of the cooling pipe that has been flattened with a brazing material, etc., from the side opposite to the electronic component mounting side that is the heating element of the circuit board. Since the structure can be fixed with screws or the like, the cooling pipe can be attached without affecting the electronic component side, and the assembly workability is improved. That is, by separating the circuit board on which the electronic component is mounted from the cooling pipe, it is possible to avoid the thermal deformation generated when the cooling pipe is assembled from being transmitted directly to the circuit board.

  A cooling device according to a second aspect of the present invention circulates a heat exchange unit that removes heat taken from the heating element when the heating element in the electronic device is cooled, and a liquid refrigerant for cooling the heating element. And a pump for storing the liquid refrigerant, a cooling pipe to which the liquid refrigerant flows and in close proximity to which the heating element is attached, and piping for connecting them, and circulating the liquid refrigerant In the liquid cooling device that supplies and cools the heating element, the heat exchange capability of the heat exchange unit is controlled according to the temperature of the outside air.

  Furthermore, the stability and reliability of the operation of the electronic component are improved by reducing the range in which the operating temperature of the electronic component that generates heat in the electronic device varies with respect to the variation range of the outside air temperature.

  Further, the heat exchange capacity is controlled according to the outside air temperature detected by the temperature detector provided at the intake for taking in the outside air, and the liquid temperature of the liquid refrigerant detected by the temperature detector provided in the electronic device and Confirm that at least one of the temperatures of the electronic component detected by the temperature detector provided in the electronic component as the heating element is within the safe operating range, and drive the fan for introducing the outside air of the heat exchange unit The heat exchange capacity of the heat exchange unit may be controlled by controlling the rotation speed of the motor to be controlled or by controlling the on / off ratio of the input power supply. Accordingly, the heat exchange capability is relatively large, the heat exchange capability is relatively medium, the heat exchange capability is relatively small, and the heat exchange capability due to the fan operation stop for heat exchange is relatively minimal 4 Stage control Utoshite may be.

  A cooling device according to a third aspect of the present invention includes a heat exchange unit that removes heat taken from the electronic device via a cooling pipe, a pump that circulates the liquid refrigerant for cooling the electronic device, and stores the liquid refrigerant And a damper for taking in part of the excluded heat into the fan duct of the heat exchange unit, and cooling the electronic device via the cooling pipe. These cooling devices are composed of two sets as a unit, and one set operates and the other set stands by.

  Moreover, it has a temperature measurement part and the control part which controls the said heat exchange unit according to the signal from this temperature measurement part.

  In other words, the cooling device of the present invention does not exhaust all the heat removed by the heat exchange unit on the operation side, and appropriately opens the damper of the fan duct to take in part and raise the room temperature, thereby preventing condensation of the electronic device. Prevents generation and freezing of liquid refrigerant.

  A high-efficiency liquid cooling device according to a fourth aspect of the present invention includes a heat exchanger unit that removes heat taken from the heating element when the heating element in the electronic device is cooled, and a cooling device for cooling the heating element. A liquid cooling system including a pump for circulating the liquid refrigerant, a tank for storing the liquid refrigerant, a cooling pipe attached immediately below or in the vicinity of the heating element, and pipes connecting them, and through which the liquid refrigerant flows. The cooling device has two systems, and the tank is an integrated tank shared by the two systems.

  Furthermore, the present invention may be a tank having a structure in which the integrated tank is provided with a partition plate for holding the liquid refrigerant every two systems, and the partition plate provided in the integrated tank includes the tank The lower part of the tank is partitioned and opened at the upper part of the tank so that the liquid refrigerant in the tank circulates on the upper side of the tank. It may be possible to flow.

  Furthermore, the present invention provides the input pipe to the tank at a position relatively close to the partition plate and at a height slightly lower than the upper limit height of the partition plate in the tank, The output pipe from the tank is located relatively far from the partition plate, and the outlet of the output pipe is provided at the bottom of the tank, and the liquid that exceeds the partition plate in the tank by the water flow from the pipe port The refrigerant may flow more efficiently to either side of the two systems.

  Further, according to the present invention, when the heating element of the second system does not generate heat while the heating element of the second system generates heat without the heating element of the first system among the two high-efficiency liquid cooling systems, the second system While continuing to circulate the refrigerant, the first system may intermittently circulate or not circulate the liquid refrigerant to prevent freezing and dew condensation related to the first system. When the circulation operation related to the circulation is performed, the cooling fan of the heat exchanger unit of the first system may be deactivated.

  When the high-efficiency liquid cooling device according to the fourth aspect of the present invention performs a circulation operation related to removing heat taken from the heating element when cooling the heating element in the electronic device, the second system The cooling fan of the heat exchange unit may be deactivated.

  As described above, according to the present invention, the cooling pipe can be seamlessly formed as an integral pipe from one end to the other end. That is, it is easy to process a part of a circular pipe made of metal or the like into a flat shape. By integrally forming in such a manner, the possibility of occurrence of water leakage in the cooling pipe in the circuit board can be eliminated as much as possible. Further, even when the seam is eliminated by integral molding, it is possible to eliminate the occurrence of pressure loss that must be generated at the joint.

  In addition, since the heat conduction block and the cooling pipe can be attached to a surface different from the mounting surface of the heating element in the circuit board, the cooling structure of the present invention can be installed without bothering the mounting work of the heating element. Work can be performed more efficiently.

  In addition, the temperature change of the liquid refrigerant can be reduced with respect to fluctuations in the outside air. Therefore, the temperature range for operating electronic components such as FETs is reduced, which increases the operational stability and reliability of the electronic components. To do.

  Further, in a cooling device that uses liquid refrigerant to cool an electronic device or an electric device having a heating element, when cooling, the air temperature in the cooling device and the liquid refrigerant temperature in the tank of the standby system The temperature of the cooling device and the temperature of the liquid refrigerant can be raised using a part of the warmed air discharged from the heat exchange unit based on the temperature difference of the heat exchange unit. The running cost can be reduced by not operating the standby pump.

  And a heat exchange unit for removing heat taken from the heating element, a pump for circulating a liquid refrigerant for cooling the heating element, a tank for storing the liquid refrigerant, and a pipe for connecting the tank. In a high-efficiency cooling system that circulates and supplies liquid refrigerant via a cooling unit to cool the heating element, the working and spare tanks are integrated with a partition plate, and the working and spare tanks are usually integrated. Thus, during the current operation, the liquid refrigerant whose working temperature has been increased is efficiently circulated to the spare tank, so that the temperature of the spare liquid refrigerant is brought close to that of the current tank, thereby preventing condensation and freezing. Also, in the unlikely event of liquid refrigerant leakage, the partition plate stores the liquid refrigerant in the reserve tank by the partition plate, thereby fulfilling a dual function. In addition, it is possible to provide a cooling device that eliminates the use of antifreeze liquid, improves cooling characteristics and device reliability, and prevents environmental pollution, and can achieve downsizing, weight reduction, and energy saving.

    Hereinafter, the present invention will be described in detail in the form of embodiments with reference to the accompanying drawings.

  FIG. 1 is a plan view of a cooling structure according to a first embodiment of the present invention. FIG. 2 is a plan view when viewed from the other surface of the cooling structure shown in FIG. 3 is a cross-sectional view taken along a line AA in the plan view of the cooling structure shown in FIG. FIG. 4 is a diagram for explaining the cooling structure of the present invention in more detail. FIG. 5 is a view for explaining the relationship of each part of the cooling pipe according to the cooling structure of the present invention.

  1, 2, and 3, the heat generated from the heating element 1 attached to the circuit board 2 reaches the flat portion 4 of the cooling pipe 10 through the circuit board 2 and the heat conduction block 5, and the cooling pipe 10 The heat generating body 1 is cooled by the liquid refrigerant flowing inside absorbing the heat and carrying it away from the circuit board 2. Here, in the cooling pipe 10, the liquid refrigerant flows from the outside of the circuit board 2 through the connection plug 6 at one end, and the liquid refrigerant flows out of the circuit board 2 through the connection plug 6 at the other end. It has become so. Here, the circuit board 2 is a generic term for boards on which electronic components are mounted to form an electronic circuit. For example, the circuit board 2 in FIG. 4 is obtained by attaching a printed wiring board to an aluminum plate, and the heating element 1 is directly mounted on the aluminum plate. In addition, for example, the circuit board 2 is an aluminum-based copper-clad laminate, for example, an iron core enamel board.

  The cooling pipe 10 has a flat portion 4 with a flat cross section and a circular portion 3 with a circular cross section. As shown in FIG. 4, the flat portion of the cooling pipe 10 is directly below or in the vicinity of the heating element 1. 4 is arranged. In particular, when cooling a plurality of heating elements 1, the heating elements 1 and the flat portion 4 are equidistant as the heating elements 1 are arranged in a straight line as shown in the plan view of FIG. 1. This flat part 4 is arranged in a straight line. On the other hand, the cooling pipe 10 has a structure of a circular portion 3 between the flat portion 4 and the connection plug 6 or between the two flat portions 4.

  Here, the flat portion 4 and the circular portion 3 of the cooling pipe 10 will be described with reference to FIG. FIG. 5 shows the appearance of the cooling pipe 10, and each cross section is a cross section seen from A1-A1, A2-A2, A3-A3. The shape gradually changes from the circular portion 3 to the flat portion 4. Further, the shape of the cross section perpendicular to the flow direction of the liquid refrigerant in the cooling pipe 10 is a circular cross section with a diameter A in the circular portion 3, and a part shown in the figure between the circular portion 3 and the flat portion 4. Is an elliptical cross section having a major axis B, and the flat portion 4 has a flat section in which two plane portions having a major axis C are parallel or substantially parallel.

In the example of the present invention, the relationship between the diameter and the major axis is as follows:
Diameter A <Long diameter B <Long diameter C
Therefore, the projected area per unit length with respect to the surface of the circuit board 2 is the largest in the flat portion 4. Further, the vertical cross-sectional area with respect to the flow direction is the largest in the circular portion 3, and the cross-sectional area of the flat portion 4 is smaller than the cross-sectional area of the circular portion 3.

  Accordingly, the flat part 4 has a larger projected area than the circular part 3 and the heat flux from the heat generating part 1 reaches the flat part 4 vertically, so that the liquid refrigerant can absorb heat more efficiently.

  FIG. 16 is a heat flux distribution diagram from the heating element to the cooling water when the cooling pipe 162 having a rectangular cross section is brazed to the flat (flat plate) heat conduction block 5. Reference numeral 160 denotes a brazing portion. Reference numeral 163 denotes a contact surface on which the circuit board 2 and the heat conduction block 5 are screwed. Reference numeral 164 denotes a passage through which cooling water flows. In FIG. 16, heat is generated from the heating element 161 in the heating element (electronic component) 1 in the structure shown in the cross-sectional view of FIG. 4, and the rectangular shape passes through the heating element 1, the circuit board 2, and the heat conduction block 5. To the cooling pipe 162. However, the cooling pipe 162 is originally circular or flat, and for convenience of explanation, in FIGS. 16 to 18, it is a rectangular modeled equivalently. 16 to 18, the position indicated by the black circle is the position where the heat flux is calculated, the direction of the arrow starting from that position indicates the direction of heat transfer, and the length of the arrow indicates the size of the heat flux. Show. The same applies to FIGS. 17 and 18. In FIGS. 17 and 18, the black circle indicating the position where the heat flux is calculated is small and difficult to understand, but this is because the number of analysis points is increased.

  FIG. 17 is a diagram showing the result of simulating the heat flux for the structure of one embodiment of the present invention shown in the sectional view of FIG.

  In the simulation, a heating element having a heating value of 88 W 2 is attached to a circuit board (for example, an aluminum circuit board, the board thickness is 6 mm) 2, and a flat copper heat conduction block 5 to which a copper flat pipe 162 is attached is connected to the circuit board 2. This was carried out in a state where the screw was screwed through a heat conductive grease. Here, the flat cooling pipe 162 is a copper pipe having an inner diameter of 9.5 mm that is flattened to an inner dimension thickness of 3 mm, and is modeled as a rectangular pipe equivalent to the flat pipe in FIG. Cooling water flows through the flat pipe 162 at a flow rate of 5 (liters) / min.

  As shown in FIG. 17, it can be seen that the strong heat flux generated from the heating element 161 spreads widely in the circuit board 2 and smoothly flows into the flat cooling pipe 162 through the heat conduction block 5.

  FIG. 18 shows the structure of the heat conduction block 5 to which the flat pipe 162 is attached in a concave shape under substantially the same conditions as FIG. It can be seen that the heat flux reaching the flat pipe 162 flows more smoothly than in FIG.

  Further, since the cross-sectional area of the flat portion 4 is smaller than that of the circular portion 3, the flow rate of the liquid refrigerant increases, so that the heat transfer performance between the cooling pipe wall and the liquid refrigerant can be improved.

  In many cases, the cooling pipe 10 in the circuit board 2 requires a U-shaped piping portion so as to curve the flow of the liquid refrigerant. In this case, the circular portion 3 is used for the curved portion. In other words, the pressure loss can be suppressed to a small extent by making a part of the cooling pipe a flat cross section only in the vicinity of the heating element and making the other part a circular cross section.

  In addition, the bending radius of the circular pipe is smaller than that of the flat pipe, and the workability is good. For this reason, compared with the case where a flat pipe is used for a curved part, the arrangement of electronic devices can be made high density, and the pattern design margin of electronic parts is large.

  The cooling pipe 10 described above can be formed seamlessly as an integral pipe from one end to the other end. That is, it is easy to process a part of a circular pipe made of metal or the like into a flat shape. By integrally forming as such, the possibility of water leakage in the cooling pipe 10 in the circuit board 2 can be eliminated as much as possible. Further, even when the seam is eliminated by integral molding, it is possible to eliminate the occurrence of pressure loss that must be generated at the joint.

  Further, since the heat conduction block 5 and the cooling pipe 10 can be attached to a surface of the circuit board 2 other than the attachment surface of the heating element 1, the cooling structure of the present invention can be provided without bothering the attaching operation of the heating element 1. The work for installing can be performed more efficiently.

  That is, the cooling pipe 10 is directly soldered to the circuit board 2 (for example, a high power metal board (for example, an aluminum circuit board or an aluminum base copper-clad laminate) is used for the circuit board 2) Since each part becomes high temperature when directly attached by attaching or the like, the circuit board 2 is thermally deformed. However, by using the heat conduction block 5 there, heat is not transmitted to the circuit board 2 when the flat pipe is manufactured, so that thermal deformation can be prevented. Further, since the curved portion of the cooling pipe 10 is circular, a step is generated when the cooling pipe 10 is attached to the circuit board 2. However, the step can be absorbed by removing the heat conduction block 5 or changing the thickness of the heat conduction block 5 in the curved portion. In addition, the connection of the circuit board 2 and the heat conductive block 5 to which the cooling pipe 10 is attached is possible by screwing, for example, via a heat conductive compound. FIG. 22 is a cross-sectional view showing a part of the circuit board 2 and the heat conduction block 5, and is a view for explaining that the contact surface 163 is coupled with the screw 165.

  Further, as shown in FIG. 18, the portion to which the cooling pipe 10 of the heat conduction block 5 is attached is formed in a concave shape, for example, by increasing the wet area of the silver brazing, the heat conduction block 5 to the cooling pipe 10. The heat conduction performance is further improved. In addition, it is easy to assemble, connection strength is increased, and reliability is improved.

  A second embodiment of the present invention will be described. As the cooling device of the second embodiment, as shown in FIG. 6, liquid refrigerant is circulated and supplied through a cooling pipe 254 piped in an electronic device 250 having a heating element, and heat is removed from the electronic device 250. ing. Reference numeral 253 denotes a circuit board on which an FET as a heating element is mounted, and a cooling pipe 254 is provided in the vicinity of the FET, and the cooling pipe conducts a liquid refrigerant for cooling by taking heat from the FET. A temperature detector 251 is provided in contact with the cooling pipe 254 of the circuit board 253 to detect the temperature of the liquid refrigerant flowing through the cooling pipe. A temperature detector 252 is provided in contact with an FET (not shown) on the circuit board 253 to detect the temperature of the FET. 270 is a heat exchange unit that cools the liquid refrigerant whose temperature has risen, 271 is a heat exchanger, 272 is a cooling fan, and 273 is a motor for rotating the cooling fan 272. Reference numerals 274 and 275 denote temperature detectors which detect the outside air temperature on the outside air inlet side of the heat exchange unit 270 by any one of them. 260 is a tank and 280 is a pump. Cooling for circulating the cooling solvent from the circuit board 253 to the heat exchange unit 270, from the heat exchange unit 270 to the tank 260, from the tank 260 to the pump 280, and from the pump 280 to the circuit board 253 is performed. Each pipe is provided. Reference numeral 290 denotes a controller for inputting the detected temperatures from the temperature detectors 251, 252, 274 and 275 and for controlling the operation of the motor 273 and the pump 280, respectively.

  In the present invention, the heat exchange capability control of the heat exchange unit 270, that is, the rotation speed control of the cooling fan 272 or the temperature of the heat exchange unit 270 is determined according to the outside air temperature detected by any one of the temperature detectors 274 and 275 installed at the outside air inlet. Rotation or stop operation (operation on / off control) is performed.

  That is, when the outside air temperature is lowered to temperatures 10B, 10C, and 10D as shown in FIG. 7, the temperature of the FET is lowered to temperatures 30B, 30C, and 30D in FIG. Here, in FIG. 7, the horizontal axis represents the outside air temperature, the upper part of the vertical axis represents the FET temperature, and the lower part represents the liquid refrigerant temperature. In this case, by controlling the on / off ratio of the operation of the motor 273 under the control of the controller 290, the operation of the fan can be energy-saving compared to the continuous operation.

  Therefore, the operation will be specifically described with reference to FIGS. In FIG. 7, 10A to 10D indicate the values of the outside air temperature that serve as threshold values for switching the control operation. A broken line 20 indicated by a solid line is a graph of the liquid refrigerant liquid temperature with respect to the outside air temperature in the circuit board 253 of the electronic device 250. A broken line 21 is a graph of the liquid refrigerant liquid temperature with respect to the outside air temperature when the cooling fan 272 is continuously operated, and indicates that the liquid refrigerant liquid temperature fluctuates in proportion to the fluctuation of the outside air temperature. Here, the temperatures 20A to 20D are liquid refrigerant temperatures corresponding to the respective threshold temperatures 10A to 10D of the outside air temperature.

  In FIG. 7, a broken line 30 indicated by a solid line is a graph of the temperature of the FET with respect to the outside air temperature in the circuit board 253 of the electronic device 250. A broken line 31 of a two-dot chain line is a graph of the FET temperature with respect to the outside air temperature when the cooling fan 272 is continuously operated, and indicates that the FET temperature varies in proportion to the variation in the outside air temperature. Here, the temperatures 30 </ b> A to 30 </ b> D are FET temperatures respectively corresponding to the threshold temperatures 10 </ b> A to 10 </ b> D of the outside air temperature.

  Next, regarding the on / off control of the motor 273 for the fan 272 that controls the heat exchange capability of the heat exchanger 271, the correspondence relationship between the outside air temperature, the heat exchange capability, and the liquid refrigerant temperature is shown.

  When the detected outside air temperature is equal to or higher than the temperature 10B (when either of the first and second conditions from the top of step 101 in FIG. 8 is satisfied), controller 290 causes the motor to operate cooling fan 272 continuously. 273 is controlled, and as a result, the heat exchange capacity becomes relatively large (steps 102 and 103). At this time, the liquid refrigerant temperature is 20B or higher, and the FET temperature is 30B or higher. Furthermore, when the outside air temperature is 10 A or higher, the controller 290 may output a warning signal (alarm) to notify that the temperature of the FET exceeds the predetermined temperature. (Step 102).

  When the detected outside air temperature is lower than the temperature 10B and is equal to or higher than the temperature 10C (when the third condition from the top of step 101 is satisfied), the controller 290 turns on the cooling fan 272, for example, an on operation. Then, the motor 273 is controlled so as to be intermittent operation in which the off operation is continued for 1 minute after continuing for 2 minutes, and as a result, the heat exchange capability becomes relatively medium (step 104). At this time, the liquid refrigerant temperature is in the range of temperatures 20B to 20C, and the FET temperature is in the range of temperatures 30B to 30C.

  In addition, when the detected outside air temperature is lower than the temperature 10C and is equal to or higher than the temperature 10D (when the fourth condition from the top of Step 101 is satisfied), the controller 290 turns on the cooling fan 272, for example, an on operation. Then, the motor 273 is controlled so as to be intermittent operation in which the OFF operation is continued for 2 minutes after continuing for 1 minute, and as a result, the heat exchange capability becomes relatively small (step 105). At this time, the liquid refrigerant temperature is in the range of temperatures 20C to 20D, and the FET temperature is in the range of temperatures 30C to 30D.

  When the detected outside air temperature is lower than the temperature 10D (when the fifth condition from the top of step 101 is satisfied), the controller 290 controls the motor 273 to stop the operation of the cooling fan 272, and As a result, the heat exchange capacity is relatively minimal (step 106). At this time, the liquid refrigerant temperature is lower than the temperature 20D, and the FET temperature is lower than the temperature 30D.

  In the above-described example, the heat exchange capacity of the heat exchange unit 270 is such that the fan operation is continuous operation, the on-off operation ratio is 2: 1, the on-off operation ratio is 1: 2. The four-stage capability consisting of intermittent operation and operation stop can be switched as appropriate.

  In addition, at the time of starting of the cooling device or the electronic device described above, the heat exchange capability may be relatively large, and the operation may be performed with a heat exchange capability that is determined in stages according to the outside air temperature. . At this time, the heat exchange capability may be switched in stages.

  According to the above embodiment, the temperature change of the liquid refrigerant can be reduced with respect to the outside air fluctuation. Accordingly, since the temperature range for operating the electronic components such as FETs is reduced, the operational stability of the electronic components is increased and the reliability is also improved.

  A cooling device that efficiently prevents condensation and freeze of an electronic component according to a third embodiment of the present invention will be described below with reference to the drawings. FIG. 9 is a diagram showing a structure according to the third embodiment of the present invention, and FIG. 10 is a diagram showing the configuration of an apparatus for implementing the third embodiment of the present invention.

  In FIG. 9, 308 is a duct, 310 is a damper provided on the wall surface of the duct 308, and 309 is a motor for controlling the opening and closing of the damper 310. In this figure, one of the air heated by the heat exchanger 322 is shown. The part is returning to the cooling device 300 through the opening of the damper 310.

  In addition, FIG. 10 shows the configuration of a cooling device for an electronic device having two cooling system configurations, 301 and 304 are electronic devices having heating elements, 321 and 351 are pumps for circulating a liquid refrigerant, 322 , 352 are heat exchangers of the heat exchange unit, and 324 and 354 are tanks for storing liquid refrigerant, which are connected so that the liquid refrigerant circulates through pipes (cooling pipes) 311, respectively. The heat generated in the heating element is taken away by the liquid refrigerant flowing through the cooling pipe arranged close to the heating element, and the temperature of the liquid refrigerant is lowered by the heat exchangers 322 and 352, and then the tanks 324 and 354 are used. It recirculates to the electronic device. The heat exchangers 322 and 352, together with the cooling fans 323 and 353, respectively, are included in ducts 308a and 308b including dampers 310a and 310b and motors 309a and 309b to constitute a heat exchange unit. In the same manner as above, the cooling fans 323 and 353 blow air, so that the air heated by the liquid refrigerant in the heat exchangers 322 and 352 is discharged to the outside.

  The features of the present invention are as follows. That is, in FIG. 10, the temperature of the liquid refrigerant in the operation-side tank 324 that is operating in the cooling device 300 (referred to as temperature A) and the temperature of the liquid refrigerant in the standby-side tank 354 that is not operating (temperature B). Temperature difference (assuming temperature difference C, temperature difference C = temperature A−temperature B), and based on the temperature difference C, temperature A is generated from the operating-side electronic device 301 in the operating state. The heat is removed from the heat exchanger 322 of the heat exchanger unit 308a. As a result, the warmed air returns into the cooling device 300 from the opening of the damper 310a, at least a part of which is opened, and the warm air that is returned increases the temperature in the cooling device. Then, as the temperature in the cooling device rises, the above-described temperature B also rises. In this case, the temperature difference C becomes smaller, and condensation and freezing in the electronic device 304 on the standby side can be prevented. .

  As the detection of the temperature difference C, for example, the temperature A and the temperature B are each measured by a temperature sensor, and a value obtained by subtracting the measured temperature value is used as the temperature difference C. In addition, as shown in FIG. 10, for example, a method for capturing a part of the heat removed by the heat exchange unit includes a motor 309a or 309b and a damper 310a or 310b attached to the duct 308a or 308b of the heat exchange unit. Alternatively, using the value of temperature B, it is possible to control whether the damper 310a or 310b is controlled to open and close using the motor 309, and whether or not a part of the heat exchanging heat from the heat exchange unit is taken into the cooling device. And

  FIG. 11 is a view showing the structure of the fourth embodiment of the present invention. The difference from FIG. 10 is that the heat exchange unit is not placed in the same apparatus as the tanks 324 and 354. In this case, the air heated by the heat exchange unit can be returned to the apparatus provided with the tanks 324 and 354 by the duct 318a or 318b. FIG. 12 is a specific block diagram of the duct portion of the fourth embodiment of the present invention shown in FIG. In FIG. 12, 309 is a motor, 310 is a damper, 318 is a duct, and 322 is a tank.

  As described above, according to the third and fourth embodiments, in the cooling device that cools the electronic device or the electric device having the heating element using the liquid refrigerant, the cooling is performed when the cooling is performed. Based on the temperature difference between the temperature inside the system and the temperature of the liquid refrigerant in the tank of the standby system, the temperature inside the cooling system and the temperature of the liquid refrigerant are adjusted using a part of the warmed air discharged from the heat exchange unit. The temperature can be raised, the condensation and freezing of the electronic device can be prevented, and the running cost can be reduced by not operating the pump on the standby side.

  The fifth embodiment of the present invention will be described below. FIG. 13 shows a configuration diagram of a fifth embodiment of the liquid cooling apparatus of the present invention. As shown in this figure, the two active cooling systems (the system in operation, hereinafter also referred to as “active”) and the standby system (the system that is out of service, hereinafter referred to as “standby” and “standby”) The electronic devices 450a and 450b having heating elements, the heat exchange units 470a and 470b, and the pumps 480a and 480b, respectively, and the tank 460 are shared. It constitutes a heavy system. These two systems and the controller 440 for controlling these systems roughly constitute the high-efficiency liquid cooling device of the present invention. Here, the last symbol “a” of the reference number indicates a working device, and the symbol “b” indicates a spare device. A thick solid line indicates a cooling pipe, and a thin solid line indicates a signal line.

  Further, the configuration of the liquid cooling device will be described in detail. 451a and 451b are temperature detectors that detect the temperature of the liquid refrigerant flowing through the cooling pipes disposed in the vicinity of the heating elements in the electronic devices 450a and 450b, respectively, and the detected temperatures are sent to the controller 440. 471a and 471b are heat exchangers, 472a and 472b are cooling fans, and 473a and 473b are motors for rotating the cooling fans 472a and 472b, respectively. Reference numerals 474a and 474b denote temperature detectors for detecting the temperature of the liquid refrigerant flowing in the heat exchangers 471a and 471b, respectively, and the detected temperatures are sent to the controller 440. Reference numerals 470a and 40b denote heat exchange units including at least heat exchangers 471a and 471b, cooling fans 472a and 472b, motors 473a and 473b, and temperature detectors 474a and 474b, respectively. The temperature detectors 474a and 474b may detect the temperature of the liquid refrigerant flowing in the predetermined pipes in the heat exchange units 470a and 470b, respectively. Reference numeral 461 denotes a liquid refrigerant stored in the tank 460, and the antifreeze liquid may not be added thereto. 462 is a partition plate for partitioning the inside of the tank 460 into a working side and a spare side, 463a and 463b are input pipes for inputting the liquid refrigerant to the tank 460, and 464a and 464b are for outputting the liquid refrigerant from the tank 460, respectively. This is the output piping.

  Next, a state in which the tank 460 is shared and integrated by two systems, which is one of the main features of the present invention, will be described with reference to FIGS. 14 and 15. In the figure, the inside of the tank 460 is divided into a working side and a spare side on the left and right in the figure by a partition plate 462. However, the partition plate 462 does not have a structure in which the active side and the spare side are completely partitioned. The partition plate 462 partitions the lower part in the tank 460. However, the upper limit of the partition plate 462 is the tank 460. It has not reached to the top of. By doing so, since the upper part of the tank 460 communicated, the liquid refrigerant up to the liquid level 467 exceeding the upper limit of the partition plate 462 may be allowed to flow to either side of the two systems. it can.

  Next, a liquid refrigerant leak occurred, and the liquid level on one side of the partition plate 462, for example, the working side, continued to decrease in the tank 460 as shown in FIG. 15, and the water level dropped to the liquid level 469. However, the amount of liquid refrigerant on the spare side, which is the other side of the partition plate 462, is maintained as long as the amount of liquid as partitioned by the partition plate 462 is maintained regardless of the above-described decrease. Will be kept. In that case, using a means (not shown) for detecting the water level that has dropped to the liquid level 469, the controller 440 sets the working side that was in the operating state to the non-operating state according to the detection result. By controlling the standby side, which was in the operating state, to be in the operating state, it can be continuously operated regardless of the occurrence of the problem of liquid refrigerant leakage as seen in the entire dual system. .

  FIG. 19 is another configuration diagram of the fifth embodiment of the present invention. In the embodiment of FIG. 19, the circulation direction is different from that of FIG. 13, and the liquid refrigerant is output from the tank 460 to the pumps 480a and 480b, and the liquid refrigerant that has passed through the electronic devices 450a and 450b flows into the tank 460. Yes. That is, first, the liquid refrigerant in the tank 460 is input to the pumps 480a and 480b of the operating system, and is sent from the pumps 480a and 480b to the heat exchangers 471a and 471b, respectively. Then, the liquid refrigerant that has passed through the heat exchangers 471a and 471b returns to the tank 460 after passing through the piping in the electronic devices 450a and 450b having heating elements. By adopting such a circulation direction, the temperature of the liquid refrigerant in the tank 460 can be increased as compared with the configuration of FIG.

  By sharing and integrating the tank 460 in two systems as described above, the liquid refrigerant that has passed through the electronic device on the working side is always in a state in which the temperature has risen compared to the outside air temperature by the heating element, Since the liquid refrigerant up to the liquid level 467 exceeding the upper limit of the partition plate 462 can flow to either side of the two systems, the liquid refrigerant from the working side having a higher temperature can be used for the spare side liquid refrigerant. The temperature can be efficiently raised and made higher than the outside air temperature, so that freezing and condensation on the spare side can be prevented.

  Here, an example of the positional relationship between the input piping and the output piping of the tank 460 will be described. As for the input pipes 463a and 463b in FIG. 14, the inlets of the input pipes 463a and 463b are provided at positions close to the partition plate 462 and slightly lower than the upper limit height of the partition plate 462. On the other hand, with respect to the output pipes 464a and 464b, the ports of the output pipes 464a and 464b are provided at positions far from the input pipes 463a and 463b with respect to the partition plate 462 and at the bottom of the tank 460. By arranging the input / output pipes in this way, the water surface of the working side in the vicinity of the partition plate 462 is not operated due to the water flow of the liquid refrigerant 461 input into the tank 460 from the operating input pipes 463a and 463b. Therefore, the flow of the liquid refrigerant from the working side to the backup side is further promoted, and the stirring in the tank 460 can be performed more efficiently. FIG. 20 shows the heat exchangers 471a and 471b provided with bypass passages 181a and 181b in the embodiment of FIG. The bypass passages 181a and 181b are opened and closed by the bypass valves 182a and 182b, respectively. Normally, the bypass valves 182a and 182b are open.

  When the working side is in operation, the controller 440 closes the bypass valve 182a when the temperature detected by the temperature detectors 474a and 452a becomes higher than the threshold value. When the detected temperature is low, the bypass valve 182a is opened to reduce the capacity of the heat exchanger 471a of the heat exchange unit 470. Conversely, when the detected temperature is high, the bypass valve 182a is closed and the heat exchanger of the heat exchange unit 470a is closed. Increase the ability of 471a. Further, when the spare side is operating, the controller 440 controls the bypass 181b, the bypass valve 182b, and the temperature detector 474b or 452b to perform the same operation as described above. In this way, temperature control is possible even by passing the bypass passages 181a and 181b without passing through the heat exchangers 471a and 471b depending on the temperature conditions, so that finer temperature control than the configuration of FIGS. 13 and 19 is possible. Become.

  Needless to say, the above-described positional relationship of the pipes is included in the scope of the present invention as long as the arrangement described above is to improve the efficiency of stirring.

  With the configuration described above, the water temperature on the spare side in the tank 460 can be raised compared to the outside air, but further, in order to prevent freezing in each pipe on the spare side when the outside air temperature decreases. The temperature of the liquid refrigerant in the heat exchanger unit 470b is detected by the temperature detector 474b, and the controller 440 that has input the detected temperature determines that the temperature has become equal to or lower than the preset freezing alarm temperature according to the temperature. In this case, control is performed so that the pump 480b on the standby system side in the non-operating standby state is operated. By doing so, the backup side is operated intermittently for a predetermined period or until the temperature detected by the temperature detector 474b becomes equal to or higher than the predetermined temperature. The occurrence of freezing is prevented by increasing the temperature of the liquid refrigerant in each pipe so that the liquid refrigerant 461 whose temperature has increased circulates in the standby system.

  Similarly, when the temperature of the liquid refrigerant in the backup side pipe drops below the dew point temperature in the electronic device 450b when the outside air temperature is lowered, the electronic device 450b is switched from the active side to the backup side in this state. In this case, condensation occurs and the electronic device 450b is damaged. Therefore, in order to prevent the occurrence of the condensation, the temperature in the electronic device 450b in the rack is detected by the temperature detector 451b, and the temperature of the liquid refrigerant in the cooling pipe of the electronic device 450b is detected by the temperature detector 452b. Thus, the detected temperatures are respectively sent to the controller 440, and the controller 440 determines whether or not the state in the electronic device 450b is a dew condensation condition based on the temperatures. If it is determined that the condensation state is present, the standby-side pump 460 is intermittently operated in the non-operating state, and the liquid refrigerant whose temperature has risen in the tank 460 is circulated, whereby the liquid refrigerant in the electronic device 450b is circulated. By increasing the temperature above the dew point temperature, condensation is prevented.

  FIG. 21 shows a simulation of the water temperature control state with the liquid refrigerant 461 handled as water in the embodiment shown in FIG. In the system used, the current machine generates 21 KW and the cooling water 461 constantly circulates at a flow rate of 60 liters / minute. The pumps 480a and 480b lose 1 KW of heat and are absorbed by the cooling water 461. The amount of tank 460 is 60 liters, the amount of water held in the heat exchanger 471a and the piping is 10.5 liters, the amount of water held in the heat exchanger 471b and the piping is 10.5 liters, and the electronic device 450a or 450b. The amount of water held in each is 8.2 liters. The electronic devices 450a and 450b and the tank 460 are installed at a room temperature of 25 ° C. (for example, the second floor), and the heat exchangers 471a and 471b and the pumps 480a and 480b are installed at a room temperature of 4 ° C.

  In this state, when only the working machine side is operated, the cooling water having a high temperature due to heat generated by the electronic device 450a flows into the tank 460. And it mixes with the cooling water 461 in the tank 460, and the temperature (Tw: Tank-0ut) of the cooling water 461 at the outlet of the tank 460 rises. The cooling water exiting from the tank 460 is cooled by the heat exchanger 471a, but the temperature (Tw: PA1-in) of the cooling water flowing into the electronic device 450a is the cooling water temperature at the outlet of the tank 460 (output pipe 464a). It rises in proportion to the rise.

  If the temperature of the cooling water flowing into the electronic device 450a is 40 ° C. or less, the fan 472a is stopped, but since the heat generation of the electronic device 450a continues, the temperature of the cooling water (Tw: PA1-in) continues to rise, When the temperature reaches 40 ° C., the fan 472a of the heat exchanger 471a starts to rotate. FIG. 21 shows the operation state and the stop state. As a result of the rotation of the fan 472a of the heat exchanger 471a, the temperature of the cooling water starts to decrease. And if it falls to 35 degrees C or less, the fan 472a will stop. By repeating such an operation, the temperature of the cooling water (Tw: PA1-in) is stably controlled within the range of 35 to 40 ° C.

  On the other hand, when the outside air temperature falls, the temperature reaches a temperature at which the stagnant cooling water on the spare machine side may freeze. Here, the temperature at which this cooling water may freeze is assumed to be 4 ° C. Therefore, when the temperature of the cooling water on the standby side (Tw: PA2-in) becomes 4 ° C. or lower, only the pump 480b on the standby side starts operation (in FIG. 21, at the time of 35 minutes). Immediately after the start of the operation of the pump 480b, the low-temperature cooling water on the spare machine side flows into the tank 460 that is in a high-temperature state, so the temperature of the cooling water (Tw at the outlet (output piping 464a, 464b) of the tank 460) : Tank-0ut) decreases. However, even if the temperature of the cooling water in the tank 460 decreases, the heat capacity of the cooling water held by the tank 460 is large and the heat generation on the working machine side continues. The temperature does not become a dew point temperature of 25 ° C. or less in the electronic device 450a. Therefore, no condensation occurs.

  At that time, the temperature of the cooling water continues to rise due to the heat generated by the current machine. Therefore, the high-temperature cooling water mixed in the tank 460 can warm the pipes on the spare side, the pump 480b, the heat exchanger 471b, and the like.

  When 3 minutes elapses during the warming, the controller 440 stops the pump 480b on the spare unit side and performs control so as not to consume more power than necessary. Since the warmed-up cooling water on the spare machine side is left in the spare machine-side pipe, the heat exchanger 471b, and the electronic device 450b in this state, the temperature of the cooling water gradually decreases due to natural heat dissipation. And if it falls to the temperature (4 degreeC) with the possibility of freezing, the driving | operation of the pump 480b by the side of a spare machine will be started again. Hereinafter, the intermittent operation of the pump 480b on the standby side is continuously repeated.

  In FIG. 21, it is not shown that the temperature of the cooling water on the spare machine side that has risen to about 35 ° C. decreases due to natural heat dissipation.

  Thus, it has been found by simulation that the system can save power and prevent condensation and freezing.

  In the intermittent operation described above, the heat exchange unit 470b on the standby side is set to a non-operating state, so that freezing and condensation can be prevented and power can be efficiently saved.

  As described above, according to the fifth embodiment of the present invention, the heat exchange unit for removing the heat taken from the heating element, the pump for circulating the liquid refrigerant for cooling the heating element, and the liquid refrigerant are stored. In a high-efficiency cooling device that has a tank and a pipe that connects the tank and circulates and supplies liquid refrigerant through the pipe to cool the heating element, the current and spare tanks are integrated with a partition plate. Normally, the working and spare tanks are operated as an integrated tank, and the liquid refrigerant whose working temperature has been increased is efficiently circulated to the spare tank during the running operation, so that the liquid temperature of the spare liquid refrigerant is close to that of the working tank and condensation occurs. And prevent freezing. Also, in the unlikely event of liquid refrigerant leakage, the partition plate stores the liquid refrigerant in the reserve tank by the partition plate, thereby fulfilling a dual function. Further, it is possible to provide a cooling device that eliminates the use of antifreeze liquid, improves cooling characteristics and device reliability, and prevents environmental pollution, and can achieve downsizing, weight reduction, and energy saving.

It is a top view of the cooling structure of one Example of this invention. It is a top view at the time of seeing from the other surface of the cooling structure shown in FIG. It is sectional drawing between AA in the top view of the cooling structure shown in FIG. It is a figure for demonstrating in detail the cooling structure of this invention. It is a figure for demonstrating the relationship of each part of the cooling pipe concerning the cooling structure of this invention. The block diagram of the liquid cooling device of 2nd Example in this invention. The graph for demonstrating an example of operation | movement of this invention. The flowchart for demonstrating an example of operation | movement of this invention. FIG. 6 is a structural diagram according to a third embodiment of the present invention. It is a figure which shows the apparatus structure by the 3rd Example of this invention. It is a structure figure of the 4th example of the present invention. It is a figure which shows the apparatus structure by the 4th Example of this invention. The figure which shows the structure of the cooling device of the 5th Example of this invention. The figure explaining the relationship between the liquid refrigerant at the time of normal driving | operation, and a partition plate position. The figure explaining the relationship between the liquid refrigerant at the time of liquid leak generation | occurrence | production, and a partition plate position. It is a figure for demonstrating in detail the cooling structure of this invention. It is a figure for demonstrating in detail the cooling structure of this invention. It is a figure for demonstrating in detail the cooling structure of this invention. The figure which shows another structure of the cooling device of the 5th Example of this invention. The figure which shows another structure of the cooling device of the 5th Example of this invention. The figure explaining the temperature of the cooling device at the time of the operation switching of this invention. The figure for demonstrating the cooling structure of this invention.

Explanation of symbols

  1: heating element, 2: circuit board, 3: circular part, 4: flat part, 5: heat conduction block, 6: connection plug, 10: cooling pipe, 20, 30: broken line, 160: brazed part, 161: Heating element, 162: cooling pipe, 163: contact surface, 164: passage, 165: screw, 181a, 181b: bypass passage, 182a, 182b: bypass valve, 250: electronic device, 251, 252: temperature detector, 253: Circuit board, 254: cooling pipe, 260: tank, 270: heat exchange unit, 271: heat exchanger, 272: cooling fan, 273: pump, 274, 275: temperature detector, 280: pump, 290: controller 300: Cooling device 301, 304: Electronic device 308, 308a, 308b: Duct, 309, 309a, 3 9b: Motor 310, 310a, 310b: Damper, 311: Cooling pipe, 318, 318a, 318b: Duct, 321, 351: Pump, 322, 352: Heat exchanger, 323, 353: Cooling fan, 324, 354: Tank, 440: Controller, 450a, 450b: Electronic device, 451a, 451b: Temperature detector, 452a, 452b, 474a, 474b: Temperature detector, 461: Liquid refrigerant, 462: Partition plate, 463a, 463b: Input piping 464a, 464b: output piping, 467, 468, 469: liquid level, 470a, 470b: heat exchange unit, 471a, 471b: heat exchanger, 472a, 472b: cooling fan, 473a, 473b: motor, 474a, 474b: Motor, 480a, 480b: pump.

Claims (1)

  An electronic component for cooling, a circuit board on which the electronic component is mounted on one surface thereof, an opposite surface of the circuit substrate, and disposed in the vicinity of the opposing surface of the electronic component, at least Heat generated from the electronic component by being coupled to a cooling pipe having a flat portion partially formed into a flat shape, and the opposite surface of the circuit board on which the flat portion of the cooling pipe and the electronic component are mounted. And a heat conduction part having a heat conduction block for transmitting the heat conduction block to the flat part of the cooling pipe, and the heat conduction block is formed in a concave shape so as to surround the flat part of the cooling pipe. Electronic device with device.

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