CN219609129U - High-temperature performance test device for semiconductor device - Google Patents

Abstract

The utility model discloses a high-temperature performance test device for a semiconductor device, which belongs to the technical field of semiconductor devices and comprises a box body, wherein a placing table is fixed on the inner wall of the bottom end of the box body, two inserting grooves are formed in the outer wall of the top end of the placing table, detection metal contact pieces are arranged on the inner wall of the bottom end of each inserting groove, a signal emitter is arranged on one side of the box body, and an oscilloscope is arranged on the outer wall of the box body, which is positioned on one side of the signal emitter; a fan cover is fixed on the inner wall of the top end of the box body, and a plurality of air inlets are formed in the outer wall of the fan cover in a penetrating manner; the platform, the jack groove, detect metal contact, signal transmitter, oscilloscope, fan housing, inlet port, first rotating electrical machines, flabellum, heater strip and temperature controller's cooperation that this scheme set up, be convenient for heat the semiconductor device, carry out high temperature performance test, make the heating and the performance test of semiconductor device go on simultaneously, more convenient laborsaving, improved the efficiency of experiment.

Description

High-temperature performance test device for semiconductor device

Technical Field

The utility model relates to the technical field of semiconductor devices, in particular to a high-temperature performance test device for a semiconductor device.

Background

The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature; semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high power conversion, etc., such as diodes, which are devices fabricated using semiconductors; the importance of semiconductors is enormous, both from a technological and an economic point of view; in order to ensure that the factory can meet the requirements, after the manufacturing is finished, the high-temperature performance of the semiconductor device needs to be tested, and whether the signal output is normal or not is detected under the high-temperature condition, but the test device in the market at present only can heat the semiconductor device first and then test the semiconductor device, and the heating and performance test can not be simultaneously carried out, so that the change of the signal of the semiconductor device under the condition that the temperature is gradually increased is inconvenient to see.

Disclosure of Invention

1. Technical problem to be solved

Aiming at the problems existing in the prior art, the utility model aims to provide the high-temperature performance test device for the semiconductor device, which is used for simultaneously carrying out the heating and performance test of the semiconductor device, so that the change of signals of the semiconductor device under the condition that the temperature is gradually increased is conveniently seen, the device is more convenient and labor-saving, and the efficiency of the test is improved.

2. Technical proposal

In order to solve the problems, the utility model adopts the following technical scheme.

The utility model provides a semiconductor device high temperature performance test device, includes the box, be fixed with on the bottom inner wall of box and place the platform, two jack-in grooves have been seted up on the top outer wall of placing the platform, install the detection metal contact piece on the bottom inner wall of jack-in groove, install signal transmitter on one side of box, the box is located and installs the oscilloscope on the outer wall of signal transmitter one side, rotate on the outer wall of box and install the chamber door.

Further, a fan housing is fixed on the inner wall of the top end of the box body, a plurality of air inlets are formed in a penetrating manner on the outer wall of the fan housing, a first rotating motor is installed on the outer wall of the top end of the box body, a fan blade is sleeved on the bottom end of an output shaft of the first rotating motor, which is located below the fan blade, and a heating wire is installed on the inner wall of the fan housing.

Further, two spouts have been seted up on one side of placing the platform, slidable mounting has the slider on the inside of spout, the slider is fixed with L type grip block on the outside outer wall of spout, it has semiconductor device to press from both sides between the L type grip block, and semiconductor device's contact inserts the jack groove, be fixed with the stopper on one side of slider, the mounting groove has been seted up on the bottom inner wall that the box is located placing platform one side, fixed mounting has the second rotating electrical machines on one side of box, be fixed with the carousel on the one end in the second rotating electrical machines output axle position box, two spacing grooves have been seted up to corresponding stopper on the outer wall of carousel, and the outer wall and the inner wall laminating of spacing groove of stopper.

Further, a temperature controller is arranged on the outer wall of the other side of the box body, and the temperature controller is electrically connected with the heating wire.

Furthermore, the signal transmitter and the oscilloscope are electrically connected with the detection metal contact through signal wires.

3. Advantageous effects

Compared with the prior art, the utility model has the advantages that:

(1) The platform, the jack-in groove, detect metal contact, signal transmitter, the oscilloscope, the fan housing, the inlet port, first rotating electrical machines, the flabellum, the cooperation of heater strip and temperature controller of this scheme setting, be convenient for heat the semiconductor device, carry out high temperature performance test, conveniently see the change of the signal of semiconductor device in the condition that the temperature improves gradually, make the heating and the performance test of semiconductor device go on simultaneously, more convenient laborsaving, the efficiency of experiment has been improved, the spout of setting, the slider, L type grip block, the stopper, the second rotating electrical machines, the carousel, the cooperation of spacing groove and mounting groove, be convenient for the stable centre gripping of semiconductor device, the stability of experiment has been improved.

Drawings

FIG. 1 is a schematic front perspective view of the present utility model;

FIG. 2 is a schematic view of a rear cut-away perspective structure of the present utility model;

FIG. 3 is a schematic side view in cross-section of the present utility model;

fig. 4 is an enlarged view of the area a in fig. 3 according to the present utility model.

The reference numerals in the figures illustrate:

1. a case; 2. a door; 3. a placement table; 4. a plug-in groove; 5. detecting a metal contact; 6. a signal transmitter; 7. an oscilloscope; 8. a fan housing; 9. an air inlet hole; 10. a first rotating electric machine; 11. a fan blade; 12. a heating wire; 13. a temperature controller; 14. a chute; 15. a slide block; 16. an L-shaped clamping plate; 17. a limiting block; 18. a second rotating electric machine; 19. a turntable; 20. a limit groove; 21. and a mounting groove.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model; it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present utility model are within the protection scope of the present utility model.

Example 1:

referring to fig. 1-4, a high temperature performance test device for a semiconductor device comprises a box body 1, wherein a placing table 3 is fixed on the inner wall of the bottom end of the box body 1, two inserting grooves 4 are formed in the outer wall of the top end of the placing table 3, a detection metal contact 5 is arranged on the inner wall of the bottom end of the inserting groove 4, a signal emitter 6 is arranged on one side of the box body 1, an oscilloscope 7 is arranged on the outer wall of the box body 1 positioned on one side of the signal emitter 6, a box door 2 is rotatably arranged on the outer wall of the box body 1, the structure is simple, the operation is convenient, a contact on the semiconductor device is inserted into the inserting groove 4 and is contacted with the detection metal contact 5, the signal emitter 6 sends a set electric signal into the semiconductor body through a signal wire, and the signal fed back by the oscilloscope 7 is observed to judge the high temperature performance of the semiconductor device;

referring to fig. 1-3, a fan housing 8 is fixed on the inner wall of the top end of a box body 1, a plurality of air inlets 9 are formed in a penetrating manner on the outer wall of the fan housing 8, a first rotating motor 10 is installed on the outer wall of the top end of the box body 1, a fan blade 11 is sleeved on the bottom end of an output shaft of the first rotating motor 10 positioned in the fan housing 8, and a heating wire 12 is installed on the inner wall of the fan housing 8 positioned below the fan blade 11;

referring to fig. 1-3, two sliding grooves 14 are formed on one side of the placement table 3, a sliding block 15 is slidably mounted on the inside of the sliding groove 14, an L-shaped clamping plate 16 is fixed on the outer wall of the sliding groove 14, which is positioned on the sliding block 15, a semiconductor device is clamped between the L-shaped clamping plates 16, a contact of the semiconductor device is inserted into the inserting groove 4, a limiting block 17 is fixed on one side of the sliding block 15, a mounting groove 21 is formed on the inner wall of the bottom end of the box body 1, which is positioned on one side of the placement table 3, a second rotating motor 18 is fixedly mounted on one side of the box body 1, a turntable 19 is fixed on one end of the output shaft position box body 1 of the second rotating motor 18, two limiting grooves 20 are formed on the outer wall of the turntable 19 corresponding to the limiting block 17, and the outer wall of the limiting block 17 is attached to the inner wall of the limiting groove 20, so that the semiconductor device is convenient to stably clamp and carry out high-temperature test;

referring to fig. 2, a temperature controller 13 is mounted on the outer wall of the other side of the case 1, and the temperature controller 13 is electrically connected with the heating wire 12, so that the heating temperature of the heating wire 12 is convenient to control and practical;

referring to fig. 1 and 3, the signal transmitter 6 and the oscilloscope 7 are electrically connected with the detection metal contact 5 through signal lines, so that the electrical connection of the device is relatively perfect, and the high temperature performance of the semiconductor device is conveniently tested.

When in use: the contact on the semiconductor device is inserted into the inserting groove 4 and is in contact with the detection metal contact 5, the second rotating motor 18 is started, the second rotating motor 18 drives the turntable 19 to rotate, the two sliding blocks 15 are driven to move mutually through the matching of the limiting block 17 and the limiting groove 20, the sliding blocks 15 drive the L-shaped clamping plate 16 to move, the semiconductor device is clamped and fixed, the heating wire 12 is controlled to start through the temperature controller 13, the semiconductor device is heated, the first rotating motor 10 is started, the first rotating motor 10 drives the fan blade 11 to rotate, the heating efficiency of the semiconductor device is improved, finally the signal emitter 6 sends set electrical signals into the semiconductor body through a signal wire, signals fed back by the oscilloscope 7 are observed, and the high-temperature performance of the semiconductor device is judged.

The above description is only of the preferred embodiments of the present utility model; the scope of the utility model is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present utility model, and the technical solution and the improvement thereof are all covered by the protection scope of the present utility model.

Claims (5)

1. The utility model provides a semiconductor device high temperature performance test device, includes box (1), its characterized in that: the novel portable electronic device is characterized in that a placing table (3) is fixed on the inner wall of the bottom end of the box body (1), two inserting grooves (4) are formed in the outer wall of the top end of the placing table (3), detection metal contact pieces (5) are arranged on the inner wall of the bottom end of the inserting grooves (4), a signal emitter (6) is arranged on one side of the box body (1), an oscilloscope (7) is arranged on the outer wall of one side of the signal emitter (6) of the box body (1), and a box door (2) is rotatably arranged on the outer wall of the box body (1).

2. The semiconductor device high temperature performance test apparatus according to claim 1, wherein: be fixed with fan housing (8) on the top inner wall of box (1), link up on the outer wall of fan housing (8) and seted up a plurality of inlet ports (9), install first rotating electrical machines (10) on the top outer wall of box (1), fan blade (11) have been cup jointed on the bottom that first rotating electrical machines (10) output shaft is located fan housing (8), fan housing (8) are located on the inner wall of fan blade (11) below and install heater strip (12).

3. The semiconductor device high temperature performance test apparatus according to claim 1, wherein: two spouts (14) have been seted up on one side of placing platform (3), slidable mounting has slider (15) on the inside of spout (14), be fixed with L type grip block (16) on the outside outer wall of slider (15) in spout (14), it holds semiconductor device to press from both sides between L type grip block (16), and in inserting socket (4) the contact of semiconductor device, be fixed with stopper (17) on one side of slider (15), install mounting groove (21) have been seted up on the bottom inner wall that box (1) is located one side of placing platform (3), fixed mounting has second rotating electrical machines (18) on one side of box (1), be fixed with carousel (19) on the one end in second rotating electrical machines (18) output axle position box (1), two spacing grooves (20) have been seted up on the outer wall of carousel (19) corresponding stopper (17), and the outer wall of stopper (17) is laminated with the inner wall of spacing groove (20).

4. The semiconductor device high temperature performance test apparatus according to claim 1, wherein: a temperature controller (13) is arranged on the outer wall of the other side of the box body (1), and the temperature controller (13) is electrically connected with the heating wire (12).

5. The semiconductor device high temperature performance test apparatus according to claim 1, wherein: the signal transmitter (6) and the oscilloscope (7) are electrically connected with the detection metal contact (5) through signal wires.