CN218240311U

CN218240311U - Test board structure for semiconductor IC packaging

Info

Publication number: CN218240311U
Application number: CN202222341662.8U
Authority: CN
Inventors: 郑英祥
Original assignee: Guizhou Shaohua Electronic Technology Co ltd
Current assignee: Guizhou Shaohua Electronic Technology Co ltd
Priority date: 2022-09-05
Filing date: 2022-09-05
Publication date: 2023-01-06
Anticipated expiration: 2032-09-05

Abstract

The utility model discloses a test panel structure is used after semiconductor IC encapsulates, belong to semiconductor test technical field, the side of test seat is provided with socket and switch, the test seat surface is equipped with the constant head tank, the inner wall contact of constant head tank is connected with the circuit board, test seat fixed surface is connected with the bottom plate, the fixed surface of bottom plate is connected with left branch dagger and right branch dagger, this test panel structure is used after the semiconductor IC encapsulates, the clamp plate of setting has autogiration's function, the quick upper end position of opening the test seat of convenient to use person, then through the notch cuttype constant head tank, quick fixed not unidimensional circuit board that awaits measuring, great improvement the convenience of installing and removing of circuit board, and then improved efficiency of software testing, and the left side pressure cover and the right pressure cover that set up, all through the extrusion force fixed pressing plate of spring and the extrusion position of connecing the circuit board, and can adjust spring's crushing strength through the stop collar, the electricity security and the convenience of connecing of circuit board have been improved.

Description

Test board structure for semiconductor IC packaging

Technical Field

The utility model relates to a semiconductor test technical field, more specifically say, relate to a semiconductor IC encapsulates after with survey test panel structure.

Background

The semiconductor need carry out the selective examination test on the semiconductor test board after integrated circuit encapsulation, for example a semiconductor IC encapsulates with testing board structure after the announcement No. CN215964892U discloses, but the top board that should survey the board setting needs manual upwards to tear out the guide pillar, just then can install and remove the test circuit board, and the operation is comparatively time-consuming and troublesome, and the top board needs manual regulation decurrent extrusion force, has reduced the use convenience and the security of testing board, and then has reduced the efficiency of software testing of circuit board.

SUMMERY OF THE UTILITY MODEL

Problem to exist among the prior art, the utility model aims to provide a test panel structure is used after semiconductor IC encapsulation, this test panel structure is used after semiconductor IC encapsulation, the clamp plate of setting has autogiration's function, the quick upper end position of opening the test seat of convenient to use person, then through the notch cuttype constant head tank, the quick fixed not unidimensional circuit board that awaits measuring, great improvement the convenience of installing and removing of circuit board, and then improved efficiency of software testing, and the left pressure cover and the right pressure cover that set up, all through the extrusion force fixed pressing plate of spring and the extrusion position who connects the circuit board, and can pass through stop collar regulating spring's extrusion intensity, the electricity safety nature and the convenience of connecting of circuit board have been improved.

In order to solve the above problems, the utility model adopts the following technical proposal.

The utility model provides a test panel structure is used to semiconductor IC encapsulation back, includes the test seat, the side of test seat is provided with socket and switch, the test seat surface is equipped with the constant head tank, the inner wall contact of constant head tank is connected with the circuit board, test seat fixed surface is connected with the bottom plate, the fixed surface of bottom plate is connected with left branch dagger and right branch dagger, the surface rotation of left branch dagger is connected with the clamp plate, a fixed surface of clamp plate installs the electricity connection board, the surface that connects the electricity connection board is equipped with the electricity connection piece, the surface that connects the electricity connection piece is connected with the surface contact of circuit board, another surface contact of clamp plate is connected with left side pressure cover and right pressure cover, the equal fixedly connected with spring in surface of left side pressure cover and right pressure cover, the other end fixedly connected with stop collar of spring, this test panel structure is used to semiconductor IC encapsulation back, the clamp plate that sets up has autogiration's function, the quick upper end position of opening the test seat of user of being convenient for convenience then through the notch cuttype constant head tank, quick fixed not unidimensional circuit board that awaits, great improvement the convenience of circuit board, and then the extrusion force and the safety of the extrusion of the safety of the clamp plate can be adjusted through the safety electric power board.

Furthermore, open one side of test seat has the dead slot of keeping away, keep away the dead slot and communicate each other with the constant head tank, the shape of constant head tank is the notch cuttype, the degree of depth of keeping away the dead slot is greater than the maximum depth of constant head tank, keeps away the inside circuit board of taking fast that dead slot convenient to use person's finger inserted the constant head tank.

Furthermore, the surface of the pressing plate is provided with a sliding hole and a clamping groove, the inner walls of the sliding hole and the clamping groove are respectively in contact connection with the surfaces of the left supporting column and the right supporting column, the surfaces of the left supporting column and the right supporting column are respectively in threaded connection with a supporting sleeve, the supporting sleeve can limit the downward moving position of the pressing plate, the supporting height can be adjusted, and the pressing plate can be conveniently positioned.

Further, the socket and the switch are electrically connected through a wire, the inner wall of the positioning groove is provided with a conductive plate, and the conductive plate is electrically connected with the switch through a wire.

Further, the left side is pressed the cover and is pressed the component structure of cover the same with the right side, threaded hole is opened to the central point of stop collar, open on the surface of left branch dagger and right branch dagger has the external screw thread, and the stop collar can carry out the regulation of high position through the screw thread, adjusts the extrusion position to the spring moreover.

Furthermore, the central positions of the left pressing sleeve and the right pressing sleeve are both provided with holes, the inner diameters of the holes are larger than the outer diameters of the left supporting column and the right supporting column, and the left pressing sleeve and the right pressing sleeve have the function of sliding up and down.

Compared with the prior art, the utility model has the advantages of:

(1) The clamp plate that this scheme set up has autogiration's function, and the quick upper end position of opening the test seat of convenient to use person then passes through the notch cuttype constant head tank, the quick fixed not unidimensional circuit board that awaits measuring, great improvement the convenience of installing and removing of circuit board, and then improved efficiency of software testing.

(2) The left side of this scheme setting is pressed the cover and is pressed the cover with the right side, all through the extrusion force fixed pressing plate of spring and connect the extrusion position of electroplax, can adjust spring's extrusion intensity through the stop collar in addition, has improved the electricity security and the convenience of connecting of circuit board.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a top view of the test socket structure of the present invention;

fig. 3 is a top view of the pressing plate structure of the present invention.

The numbering in the figures illustrates:

the test device comprises a test seat 1, a socket 11, a switch 12, a bottom plate 13, a positioning groove 14, a clearance groove 15, a left support column 2, a right support column 3, a pressing plate 4, a sliding hole 41, a clamping groove 42, a support sleeve 43, an electric connection plate 44, an electric connection block 45, a circuit board 5, a left pressure sleeve 6, a spring 61, a limiting sleeve 62 and a right pressure sleeve 7.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1-3, a test board structure for use after semiconductor IC packaging includes a test socket 1, a socket 11 and a switch 12 are disposed on a side surface of the test socket 1, the test socket 1 belongs to the prior art, and can detect a circuit board 5 after being powered on, the test socket 1 is electrically connected to a testing machine, and the working principle of the test board is well known to those skilled in the art, the surface of the test socket 1 is provided with a positioning groove 14, the contour shape of the positioning groove 14 can be set according to actual needs, and is not limited to a rectangle or a circle, the inner wall of the positioning groove 14 is connected to the circuit board 5 in a contact manner, the circuit board 5 is a dust-collecting circuit board after the semiconductor IC packaging, the surface of the test socket 1 is fixedly connected to a bottom board 13, the surface of the bottom board 13 is fixedly connected to a left support pillar 2 and a right support pillar 3, the surface of the left support pillar 2 is rotatably connected to a press plate 4, a surface of the press plate 4 is fixedly provided with a contact plate 44, the contact block 45 is disposed on the surface of the contact plate 44, the contact block 45 is connected to the surface of the circuit board 5 in a contact manner, the other surface of the press plate 4 is connected to a left press sleeve 6 and a right press sleeve 7, the other surface of the press sleeve 6 and a spring 61, the right sleeve 7 are fixedly connected to the other end of the press sleeve, and the other end of the spring 61, and the other end of the press sleeve 61 are fixedly connected to a limit sleeve 62.

One side of the test seat 1 is provided with a clearance groove 15, the clearance groove 15 is communicated with the positioning groove 14, the positioning groove 14 is in a step shape, the depth of the clearance groove 15 is larger than the maximum depth of the positioning groove 14, the clearance groove 15 is convenient for a user to insert a finger into the positioning groove 14 to quickly take the circuit board 5, the surface of the pressing plate 4 is provided with a sliding hole 41 and a clamping groove 42, the inner walls of the sliding hole 41 and the clamping groove 42 are respectively in contact connection with the surfaces of the left supporting column 2 and the right supporting column 3, the surfaces of the left supporting column 2 and the right supporting column 3 are in threaded connection with a supporting sleeve 43, the supporting sleeve 43 can limit the downward moving position of the pressing plate 4, the supporting height can be adjusted, the positioning of the pressing plate 4 is convenient, the socket 11 and the switch 12 are electrically connected through a wire, the inner wall of the positioning groove 14 is provided with a conductive plate, and the conductive plate and the switch 12 are electrically connected through a wire.

In this embodiment, the clamp plate 4 that sets up has autogiration's function, and the quick upper end position of opening test seat 1 of the person of being convenient for then through notch cuttype constant head tank 14, quick fixed not unidimensional circuit board 5 that awaits measuring, great improvement circuit board 5 install and remove the convenience, and then improved efficiency of software testing.

Example 2

Referring to fig. 1-3, a test board structure for use after semiconductor IC packaging includes a test socket 1, a socket 11 and a switch 12 are disposed on a side surface of the test socket 1, the test socket 1 belongs to the prior art, and can detect a circuit board 5 after being powered on, the test socket 1 is electrically connected to a testing machine, and its working principle is well known to those skilled in the art, a positioning groove 14 is disposed on a surface of the test socket 1, a contour shape of the positioning groove 14 can be set according to actual requirements, but not limited to a rectangle or a circle, the inner wall of the positioning groove 14 is connected to the circuit board 5 in a contact manner, the circuit board 5 is a dust-collecting circuit board after semiconductor IC packaging, a bottom board 13 is fixedly connected to a surface of the test socket 1, a left support pillar 2 and a right support pillar 3 are fixedly connected to a surface of the left support pillar 2, a pressing plate 4 is rotatably connected to a surface of the left support pillar 2, a contact plate 44 is fixedly mounted on a surface of the pressing plate 4, an electrical connection block 45 is disposed on a surface of the electrical connection plate 44, a surface of the electrical connection block 45 is connected to a surface of the circuit board 5, a left pressing plate 4 is connected to a right pressing sleeve 6, a spring sleeve 7 is fixedly connected to a surface of the pressing sleeve 61, and a spring 61 is connected to a limiting sleeve 62.

The left side is pressed the cover 6 and is pressed the component structure of cover 7 the same with the right side, the central point of stop collar 62 puts and opens there is the screw hole, the surface of left branch dagger 2 and right branch dagger 3 is opened there is the external screw thread, stop collar 62 can carry out the regulation of high position through the screw thread, and adjust the extrusion position to spring 61, the central point that cover 6 and right branch dagger 7 were pressed to the left side puts and all opens there is the hole, and the internal diameter of hole is greater than the external diameter of left branch dagger 2 and right branch dagger 3, the cover 6 is pressed to the left side and right branch dagger 7 has gliding function from top to bottom.

In this embodiment, the left pressure sleeve 6 and the right pressure sleeve 7 that set up all fix the pressing plate 4 and connect the extrusion position of electric plate 44 through the extrusion force of spring 61, can adjust the extrusion intensity of spring 61 through stop collar 62 in addition, have improved the electric security and the convenience of connecting of circuit board 5.

This test board structure is used after semiconductor IC encapsulation, rotatory clamp plate 4 earlier, make draw-in groove 42 and right branch dagger 3 break away from the connection, make the constant head tank 14 of test socket 1 upper end open, then place the circuit board 5 that awaits measuring in suitable constant head tank 14, then turn around clamp plate 4, move right pressure cover 7 upwards simultaneously, make right pressure cover 7 be in the upper end of clamp plate 4, treat right branch dagger 3 and clamp plate 4 joint back, loosen right pressure cover 7, make clamp plate 4 under the effect of left pressure cover 6 and right pressure cover 7, downward extrusion, make the electricity piece 45 that connects that electroplax 44 set up contact with circuit board 5 and extrude, then peg graft plug and socket 11, open switch 12 test can, the clamp plate 4 that sets up has the function of autogiration, the user is convenient for quick open the upper end position of test socket 1, then pass through notch ladder type constant head tank 14, quick fixed not unidimensional circuit board 5 that awaits, great improvement the convenience of circuit board 5, and then improved efficiency of testing, and the left pressure cover 6 and right pressure cover 7 that set up, all pass through the fixed extrusion force of spring 61 and the limit plate 44 that the extrusion of regulation can connect the convenient extrusion of electricity, the convenient electric board 61 and install and remove.

The foregoing is only a preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.

Claims

1. A test board structure used after semiconductor IC packaging comprises a test socket (1) and is characterized in that: the side of test seat (1) is provided with socket (11) and switch (12), test seat (1) surface is equipped with constant head tank (14), the inner wall contact of constant head tank (14) is connected with circuit board (5), test seat (1) fixed surface is connected with bottom plate (13), the fixed surface of bottom plate (13) is connected with left branch dagger (2) and right branch dagger (3), the surface rotation of left branch dagger (2) is connected with clamp plate (4), a fixed surface of clamp plate (4) installs and connects electroplax (44), the surface that connects electroplax (44) is equipped with and connects electricity piece (45), the surface that connects electricity piece (45) is connected with the surface contact of circuit board (5), another surface contact of clamp plate (4) is connected with left side and presses cover (6) and right side to press cover (7), the equal fixedly connected with spring (61) in surface that cover (6) and right side pressed cover (7), the other end fixedly connected with stop collar (62) of spring (61).

2. The test board structure for use after packaging of semiconductor IC as claimed in claim 1, wherein: open one side of test seat (1) has keep away dead slot (15), keep away dead slot (15) and constant head tank (14) intercommunication each other, the shape of constant head tank (14) is the notch cuttype, the degree of depth of keeping away dead slot (15) is greater than the maximum degree of depth of constant head tank (14).

3. The test board structure for use after packaging of semiconductor IC as claimed in claim 1, wherein: the surface of clamp plate (4) is opened has slide opening (41) and draw-in groove (42), the inner wall of slide opening (41) and draw-in groove (42) is connected with the surface contact of left branch dagger (2) and right branch dagger (3) respectively, there is support cover (43) on the surface of left branch dagger (2) and right branch dagger (3) through threaded connection.

4. The test board structure for use after packaging of semiconductor IC as claimed in claim 1, wherein: socket (11) and switch (12) pass through wire electric connection, the inner wall of constant head tank (14) is equipped with the current conducting plate, and current conducting plate and switch (12) pass through wire electric connection.

5. The structure of claim 1, wherein: the left pressing sleeve (6) and the right pressing sleeve (7) are identical in structure, a threaded hole is formed in the center of the limiting sleeve (62), and external threads are formed in the surfaces of the left supporting column (2) and the right supporting column (3).

6. The structure of claim 1, wherein: the center positions of the left pressing sleeve (6) and the right pressing sleeve (7) are both provided with holes, and the inner diameters of the holes are larger than the outer diameters of the left supporting column (2) and the right supporting column (3).