CN219603671U - Chip tray and electron beam evaporation equipment - Google Patents
Chip tray and electron beam evaporation equipment Download PDFInfo
- Publication number
- CN219603671U CN219603671U CN202320519682.1U CN202320519682U CN219603671U CN 219603671 U CN219603671 U CN 219603671U CN 202320519682 U CN202320519682 U CN 202320519682U CN 219603671 U CN219603671 U CN 219603671U
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- circular groove
- positioning
- chip
- center
- chip tray
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a chip tray and electron beam evaporation equipment, and belongs to the technical field of chip processing. The chip tray is used for bearing a chip substrate, and the side surface of the chip substrate is provided with a positioning surface which comprises a carrying platform and a positioning element; a circular groove is formed on the surface of the carrier; the positioning element is positioned in the circular groove and can rotate around the center of the circular groove, the side surface of the positioning element, which is far away from the center of the circle, is provided with a limiting surface, and when the limiting surface is matched with the positioning surface, one side, which is far away from the positioning surface, of the chip substrate is contacted with the side wall of the circular groove so as to limit the position of the chip substrate in the circular groove. By the method, the relative positions of the chip substrates and the carrier can be limited, and when chips in different batches are prepared, the positions of the chip substrates in different batches relative to the carrier can be rapidly and accurately determined, so that the deviation of the placement angles of the chip substrates in different batches due to manual placement is avoided.
Description
Technical Field
The utility model belongs to the technical field of chip processing, and particularly relates to a chip tray and an electron beam evaporation device.
Background
Electron beam evaporation (Electron Beam Evaporation) is one type of physical vapor deposition. Unlike traditional distillation mode, electron beam evaporation can accurately realize bombardment of target material in crucible by high-energy electrons by electromagnetic field, so as to melt and deposit on substrate. The electron beam evaporation can plate out a film with high purity and high precision.
In the prior art, electronic components can be prepared on chip substrates with patterned mask layers by using an electron beam evaporation device and an evaporation process, and in order to ensure the consistency of chips in different batches, the placement angles of the chip substrates in different batches in the electron beam evaporation device are required to be kept consistent, however, in the prior art, the positions of the chip substrates are often manually placed, so that position errors of the chip substrates in different batches inevitably occur in the process of manufacturing. Therefore, how to avoid the deviation of the placement angle of the chip substrates in each batch when preparing chips in different batches is a problem to be solved in the current urgent need.
It should be noted that the information disclosed in the background section of the present utility model is only for enhancement of understanding of the general background of the present utility model and should not be taken as an admission or any form of suggestion that this information forms the prior art already known to those skilled in the art.
Disclosure of Invention
The utility model aims to provide a chip tray and an electron beam evaporation device, which are used for solving the problem that the angle of a manually placed chip substrate is easy to deviate when chips of different batches are prepared in the prior art.
In order to solve the technical problems, the utility model provides a chip tray for bearing a chip substrate 2, wherein the side surface of the chip substrate 2 is provided with a positioning surface 21, and the chip tray comprises a carrying platform 1 and a positioning element 3; a circular groove 11 is formed on the surface of the carrying platform 1; the positioning element 3 is located in the circular groove 11 and can rotate around the center of the circular groove 11, the side surface of the positioning element 3 away from the center of the circle is provided with a limiting surface 311, and when the limiting surface 311 is matched with the positioning surface 21, one side of the chip substrate 2 away from the positioning surface 21 is contacted with the side wall of the circular groove 11 so as to limit the position of the chip substrate 2 in the circular groove 11.
Preferably, the depth of the circular groove 11 is greater than the thickness of the chip substrate 2.
Preferably, the positioning element 3 includes a positioning plate 31 and a supporting rod 32, the supporting rod 32 is rotatably connected with the bottom surface of the circular groove 11 at the center of a circle, one end of the supporting rod 32 away from the center of a circle is connected with the positioning plate 31, and the limiting surface 311 is formed on the side surface of the positioning plate 31 away from the center of a circle.
Preferably, the positioning element 3 further comprises a positioning bolt 33, the positioning bolt 33 is fixed at the center of the circular groove 11, and the supporting rod 32 is rotatably connected with the positioning bolt 33.
Preferably, the positioning bolt 33 has external threads, a threaded hole is formed in the center of the circular groove 11, and the positioning bolt 33 is fixedly connected with the threaded hole in a threaded manner.
Preferably, the positioning surface 21 and the limiting surface 311 are both planar.
Preferably, the support rods 32 generate elastic force in the radial direction of the circular groove 11 so that the chip substrate 2 and the side walls of the circular groove 11 are pressed against each other.
Preferably, the supporting rod 32 includes a sleeve 321, a spring 322, and a supporting body 323, where the sleeve 321 is rotatably connected with the bottom surface of the circular groove 11 at the center of the circle, the supporting body 323 is piston-connected in the sleeve 321, and the spring 322 is located in the sleeve 321 and applies a reverse elastic force to the supporting body 323 when the supporting body 323 moves toward the sleeve 321.
Preferably, the bottom surface of the circular groove 11 is provided with an angle dial 4 with the center of the circle coincident with the center of the circular groove 11.
The utility model also provides an electron beam evaporation device, which comprises the chip tray and an evaporation cavity for accommodating the chip tray.
Compared with the prior art, the utility model provides the chip tray, the circular groove 11 is formed on the surface of the carrier, the positioning element 3 rotating around the circle center is arranged in the circular groove 11, the position of the chip substrate 2 is predetermined by utilizing the rotation of the positioning element 3, and the position of the chip substrate 2 is finally limited after the positioning surface 21 of the chip substrate 2 is matched with the limiting surface 311 of the positioning element 3. Through the setting, when chips of different batches are prepared, the relative positions of the chip substrates 2 and the carrier 1 can be accurately and rapidly positioned, and the deviation of the placement angles of the chip substrates 2 of different batches on the carrier 1 caused by manual placement is avoided.
Drawings
Fig. 1 is a schematic structural diagram of a chip tray according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a chip substrate according to the present utility model;
FIG. 3 is a schematic view of a positioning element according to the present utility model;
FIG. 4 is a schematic view showing the structure of the support bar according to the present utility model;
reference numerals illustrate: the device comprises a 1-carrying platform, a 11-circular groove, a 2-chip substrate, a 21-positioning surface, a 3-positioning element, a 311-limiting surface, a 31-positioning plate, a 32-supporting rod, a 321-sleeve, a 322-spring, a 323-supporting body, a 33-positioning bolt and a 4-angle dial.
Detailed Description
The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
In the prior art, electronic components can be prepared on a substrate by using an electron beam vapor deposition device by adopting a vapor deposition process, but in order to keep consistency of chips in different batches, in the prior art, manual placement alignment is often adopted, an operator manually places the chip substrate on a carrier, but because the manual placement is often in large error, the position of the chip substrate relative to the carrier is deviated, and the embodiment provided by the utility model well solves the problems.
Referring to fig. 1 and 2, an embodiment of the present utility model provides a chip tray for carrying a chip substrate 2, wherein a side surface of the chip substrate 2 has a positioning surface 21, and the chip tray includes a carrier 1 and a positioning element 3; a circular groove 11 is formed on the surface of the carrier 1; the positioning element 3 is located in the circular recess 11 and can rotate around the center of the circular recess 11, the side surface of the positioning element 3 away from the center of the circle is provided with a limiting surface 311, and when the limiting surface 311 is matched with the positioning surface 21, one side of the chip substrate 2 away from the positioning surface 21 is contacted with the side wall of the circular recess 11 so as to limit the position of the chip substrate 2 in the circular recess 11. In specific implementation, the material of the chip substrate 2 may be sapphire, silicon dioxide, gallium nitride, etc., and in different usage scenarios, the material of the chip substrate 2 may be selected according to actual needs, which is not limited to the above example. Through the arrangement, the limiting surface 311 of the positioning element 3 is adjusted to the target position, and when chips in different batches are prepared, the positioning surface 21 of the chip substrate 2 is matched with the limiting surface 311, so that the positions of the chip substrates 2 in different batches relative to the carrier 1 can be rapidly and accurately determined, and the deviation of the placement angles of the chip substrates 2 in different batches caused by manual placement is avoided.
In some embodiments of the utility model, the depth of the circular recess 11 is greater than the thickness of the chip substrate 2, so that the chip substrate 2 is prevented from being pushed out of the circular recess 11 when pressed by the circular recess 11 side walls and the positioning element 3, and so that the positioning element 3 and the circular recess 11 define the position of the chip substrate 2.
Referring to fig. 1 and 3, in some embodiments of the present utility model, the positioning element 3 includes a positioning plate 31 and a supporting rod 32, the supporting rod 32 is rotatably connected with the bottom surface of the circular groove 11 at the center of a circle, one end of the supporting rod 32 away from the center of the circle is connected with the positioning plate 31, and a limiting surface 311 is formed on a side surface of the positioning plate 31 away from the center of the circle. Specifically, one end of the supporting rod 32 is vertically and fixedly connected with the positioning plate 31, so that the position and the angle of the positioning plate 31 relative to the supporting rod 32 are kept unchanged; the supporting rod 32 is rotatably connected to the center of the circular groove 11, and according to the above setting, the supporting rod 32 can drive the positioning plate 31 to rotate with the axis of the circular groove 11 as the axis.
In some embodiments of the present utility model, the positioning element 3 further comprises a positioning bolt 33, the positioning bolt 33 is fixed at the center of the circular groove 11, and the support rod 32 is rotatably connected with the positioning bolt 33. The positioning bolt 33 is used as a central shaft for rotating the support rod 32, so that the support rod 32 can rotate around the circle center by any angle.
Further, the positioning bolt 33 is provided with external threads, a threaded hole is formed in the center of the circular groove 11, and the positioning bolt 33 is fixedly connected with the threaded hole in a threaded mode. The positioning bolt 33 not only serves as a central shaft for rotation of the support rod 32, but also serves as a locking device for the support rod 32, when the rotation angle of the support rod 32 needs to be adjusted, the positioning bolt 33 is unscrewed, the support rod 32 can rotate around the circle center at any angle, after the support rod 32 is adjusted to a proper position, the positioning bolt 33 is screwed, so that the support rod 32 cannot rotate any more, at the moment, the angle of the support rod 32 is fixed, and the positioning surface 21 of the chip substrate 2 is aligned and matched with the limiting surface 311 of the positioning element 3, so that the relative position of the chip substrate 2 and the carrier 1 can be accurately limited.
Referring to fig. 1 and 2 again, in some embodiments of the present utility model, the positioning surface 21 and the limiting surface 311 are both planar.
Further, the support bars 32 generate elastic force in the radial direction of the circular groove 11 so that the chip substrate 2 and the side walls of the circular groove 11 are pressed against each other.
After the angle of the supporting rod 32 is adjusted, the positioning surface 21 of the chip substrate 2 is attached to the limiting surface 311, the supporting rod 32 generates elastic force in the radial direction of the circular groove 11, and the chip substrate 2 is fixedly clamped between the positioning plate 31 and the side wall of the circular groove 11 due to the pressure of the positioning plate 31, so that the chip substrate 2 can be ensured not to displace on the carrier 1 due to moving and processing.
Referring to fig. 4, in some embodiments of the present utility model, the support rod 32 includes a sleeve 321, a spring 322, and a support body 323, wherein the sleeve 321 is rotatably connected with the bottom surface of the circular groove 11 at the center of a circle, the support body 323 is piston-connected in the sleeve 321, the spring 322 is located in the sleeve 321, and applies a reverse elastic force to the support body 323 when the support body 323 moves towards the sleeve 321.
The sleeve 321 is rotatably connected to the bottom surface of the circular groove 11 by a positioning bolt 33, the supporting body 323 is piston-connected in the sleeve 321, a spring 322 is installed between the bottom of the supporting body 323 and the bottom of the sleeve 321, the spring 322 is always in a compressed state, a force far from the sleeve 321 is always applied to the supporting body 323, and the elastic force can be transmitted to the chip substrate 2 through the positioning plate 31.
Referring to fig. 1 again, an angle dial 4 with a center coincident with the center of the circular groove 11 is disposed on the bottom surface of the circular groove 11. By means of the angle dial 4, the angle of the support bar 32 can be determined more easily, so that the positions of the chip substrates 2 defining different batches relative to the carrier 1 are more precise.
The utility model provides an electron beam evaporation device, which comprises a chip tray and an evaporation cavity for accommodating the chip tray.
As described above, the chip tray is detachably mounted in the evaporation cavity of the electron beam evaporation apparatus, when an electronic component needs to be prepared by evaporation on the chip substrate 2, the chip substrate 2 is mounted on the carrier 1, and the positioning element 3 is matched with the positioning surface 21 on the chip substrate 2, so as to define the position of the chip substrate 2 relative to the carrier 1, thereby being capable of rapidly and accurately positioning the relative positions of the chip substrate 2 and the carrier 1 when preparing chips in different batches, and avoiding the deviation of the placement angles of the chip substrates 2 in different batches due to manual placement.
The foregoing detailed description of the preferred embodiments of the present utility model will be presented in terms of a detailed description of the preferred embodiments of the utility model, but the utility model is not limited to the details of the preferred embodiments of the utility model, and is intended to cover all modifications and equivalent arrangements included within the spirit of the present utility model.
Claims (10)
1. A chip tray for carrying a chip substrate (2), the side of the chip substrate (2) having a positioning surface (21), characterized by comprising a carrier (1) and a positioning element (3); a circular groove (11) is formed on the surface of the carrying platform (1); the positioning element (3) is positioned in the circular groove (11) and can rotate around the center of the circular groove (11), the side surface of the positioning element (3) away from the center of the circle is provided with a limiting surface (311), when the limiting surface (311) is matched with the positioning surface (21), one side of the chip substrate (2) away from the positioning surface (21) is contacted with the side wall of the circular groove (11) so as to limit the position of the chip substrate (2) in the circular groove (11).
2. The chip tray according to claim 1, wherein: the depth of the circular groove (11) is greater than the thickness of the chip substrate (2).
3. The chip tray according to claim 1, wherein: the positioning element (3) comprises a positioning plate (31) and a supporting rod (32), the supporting rod (32) is rotationally connected with the bottom surface of the circular groove (11) at the center of a circle, one end, far away from the center of the circle, of the supporting rod (32) is connected with the positioning plate (31), and the limiting surface (311) is formed on the side, far away from the center of the circle, of the positioning plate (31).
4. A chip tray according to claim 3, wherein: the positioning element (3) further comprises a positioning bolt (33), the positioning bolt (33) is fixed at the center of the circular groove (11), and the supporting rod (32) is rotationally connected with the positioning bolt (33).
5. The chip tray of claim 4, wherein: the positioning bolt (33) is provided with external threads, a threaded hole is formed in the center of the circular groove (11), and the positioning bolt (33) is fixedly connected with the threaded hole in a threaded mode.
6. A chip tray according to claim 3, wherein: the positioning surface (21) and the limiting surface (311) are both plane surfaces.
7. A chip tray according to claim 3, wherein: the support rods (32) generate elastic force in the radial direction of the circular groove (11) so that the chip substrate (2) and the side wall of the circular groove (11) are mutually extruded.
8. The chip tray of claim 7, wherein: the supporting rod (32) comprises a sleeve (321), a spring (322) and a supporting body (323), wherein the sleeve (321) is rotationally connected with the bottom surface of the circular groove (11) at the circle center, the supporting body (323) is connected in the sleeve (321) in a piston mode, the spring (322) is located in the sleeve (321), and reverse elastic force is applied to the supporting body (323) when the supporting body (323) moves towards the sleeve (321).
9. The chip tray according to claim 1, wherein: the bottom surface of the circular groove (11) is provided with an angle dial (4) with the center of the circle coincident with that of the circular groove (11).
10. An electron beam evaporation apparatus comprising the chip tray according to any one of claims 1 to 9 and an evaporation chamber for accommodating the chip tray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320519682.1U CN219603671U (en) | 2023-03-16 | 2023-03-16 | Chip tray and electron beam evaporation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320519682.1U CN219603671U (en) | 2023-03-16 | 2023-03-16 | Chip tray and electron beam evaporation equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219603671U true CN219603671U (en) | 2023-08-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320519682.1U Active CN219603671U (en) | 2023-03-16 | 2023-03-16 | Chip tray and electron beam evaporation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219603671U (en) |
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2023
- 2023-03-16 CN CN202320519682.1U patent/CN219603671U/en active Active
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