CN219597831U - Punching assembly for full-automatic high-speed AOI (automated optical inspection) detector with Leadframe structure - Google Patents
Punching assembly for full-automatic high-speed AOI (automated optical inspection) detector with Leadframe structure Download PDFInfo
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- CN219597831U CN219597831U CN202320736281.1U CN202320736281U CN219597831U CN 219597831 U CN219597831 U CN 219597831U CN 202320736281 U CN202320736281 U CN 202320736281U CN 219597831 U CN219597831 U CN 219597831U
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Abstract
The utility model relates to the technical field of detection equipment with a lead frame structure, in particular to a punching component for a full-automatic high-speed AOI detection machine with a lead frame structure. According to the utility model, the upper die mechanism and the lower die mechanism are matched to punch and remove the pad area on the poor lead frame structure, and automatic punching operation is realized, so that the pad area on the poor lead frame structure on the lead frame structure is quickly and accurately punched and removed, the punching efficiency is high, the elimination is not needed, the labor cost is reduced, and the detection efficiency of the lead frame structure is improved.
Description
Technical Field
The utility model relates to the technical field of a Leadframe structure detection device, in particular to a punching component for a Leadframe structure full-automatic high-speed AOI (automatic optical inspection) detector.
Background
Lead frame (Leadframe): the lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electric connection between an internal circuit lead-out end of the chip and an external lead by means of bonding alloy wires and forming an electric loop, plays a role of a bridge connected with an external lead, and most of semiconductor integrated blocks need to use the lead frame, thus being an important basic material in the electronic information industry. The product types include TO, DIP, ZIP, SIP, SOP, SSOP, QFP (QFJ), SOD, SOT, etc. The production is mainly carried out by a die stamping method and a chemical etching method.
With the development of industrial modernization, there is an increasing demand for a Leadframe, on the basis of which there is a need to develop a device capable of rapidly detecting a Leadframe for accelerating the production of a Leadframe. One embodiment of the rapid detection is to efficiently remove defective products, and the production efficiency can be improved. In the equipment for detecting the leadframes, the punching assembly plays an important role, so that improvement on the punching assembly for detecting the leadframes is needed.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides the punching component for the full-automatic high-speed AOI detection machine with the lead frame structure, and the upper die mechanism and the lower die mechanism are matched to punch and remove the pad area on the poor lead frame structure, so that the automatic punching operation is realized, the pad area on the poor lead frame structure on the lead frame structure is quickly and accurately punched and removed, the punching efficiency is high, the elimination is not needed, the labor cost is reduced, and the detection efficiency of the lead frame structure is improved.
In order to solve the technical problems, the utility model provides the following technical scheme: the die-cut subassembly for full-automatic high-speed AOI detection machine of lead frame structure, including the support plate, one side fixedly connected with driving motor of support plate, driving motor's output extends to the opposite side of support plate, driving motor's output cover is equipped with the cam, the side of cam is equipped with the circular slot, the upper and lower both ends of support plate opposite side are rotated respectively and are connected with first support arm and second support arm;
one end of the first support arm is rotationally connected in the circular groove, and the other end of the first support arm is rotationally connected with an upper die mechanism;
one end of the second support arm is rotationally connected with a transmission mechanism, the other end of the second support arm is rotationally connected with a lower die mechanism, and the upper die mechanism and the lower die mechanism are matched to be used for punching and removing a bonding pad area on a poor lead frame structure.
Optionally, the upper die mechanism comprises a third guide rail, the third guide rail is fixedly connected to the other side of the carrier plate, a third moving block is slidably connected to the side face of the third guide rail, and the other end of the first support arm is rotatably connected to the third moving block.
Optionally, a punching rod is inserted at the bottom of the third moving block, and the bottom end of the punching rod is square.
Optionally, the upper die mechanism comprises a support, the support is fixedly connected to the other side of the carrier plate, a fixed block is fixedly connected to the inner side of the support, an upper positioning seat is fixedly connected to the bottom of the fixed block, and the bottom end of the stamping rod penetrates through the upper positioning seat and extends to the lower portion of the upper positioning seat.
Optionally, the inside of fixed block is equipped with holds the chamber, hold the inside in chamber and be equipped with buffer spring, third movable block passes through buffer spring and fixed block elastic connection.
Optionally, both sides of the third movable block are fixedly connected with a limiting rod, and both sides of the fixed block are in sliding connection with the inner side of the limiting rod.
Optionally, a limit bolt is connected to the middle of the support through threads, and the limit bolt is located right below the limit rod.
Optionally, the lower mould mechanism is including second guide rail, second movable block and lower positioning seat, second guide rail fixed connection is on the opposite side of support plate, second movable block sliding connection is on the second guide rail, the other end of second support arm rotates to be connected in the second movable block, lower positioning seat fixed connection is on the second movable block, lower positioning seat is located under the positioning seat, be equipped with the inclined hole in the second movable block, the inclined hole communicates with the centre bore of last positioning seat.
Optionally, the drive mechanism includes first guide rail, first guide rail fixed connection is at the opposite side of support plate, sliding connection has first movable block on the first guide rail, the one end of second support arm rotates to be connected in first movable block, the top rotation of first movable block is connected with the gyro wheel, gyro wheel and the outline roll connection of cam.
Optionally, the bottom fixedly connected with bottom plate of carrier plate, fixedly grafting has the collecting piece on the bottom plate, the top of collecting piece is located the below of lower mould mechanism.
By means of the technical scheme, the utility model provides the punching component for the full-automatic high-speed AOI detection machine with the lead frame structure, which has the following beneficial effects:
1. this full-automatic high-speed AOI of Leadframe structure is die-cut subassembly for detection machine, the bonding pad region on the Leadframe structure is transferred to between upper die mechanism and the lower die mechanism, driving motor operation can drive the cam rotatory, drive upper die mechanism motion through first support arm, drive lower die mechanism motion through drive mechanism and second support arm, upper die mechanism and lower die mechanism cooperation can be with the die-cut rejection of the bonding pad region on the Leadframe structure of bad, die-cut automation work, thereby realize quick, accurate die-cut rejection of the bonding pad region on the Leadframe structure of bad Leadframe structure, die-cut efficient, need not to reject, reduce the cost of labor, the detection efficiency of Leadframe structure.
2. This full-automatic high-speed AOI of Leadframe structure detects machine die-cut subassembly, through the setting of last mould mechanism and lower mould mechanism, the one end of first support arm can roll in the circular slot on the cam, drive the third movable block through first support arm and slide on the third guide rail, die-cut the bonding pad region on the poor Leadframe structure through the stamping rod, and can drive the second movable block and slide on the second guide rail through drive mechanism and second support arm, die-cut bonding pad region on the poor Leadframe structure of rejecting falls into the slope downthehole through lower locating seat, finally drop to collect the bonding pad region on the poor Leadframe structure in the collection piece.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model, illustrate and together with the description serve to explain a part of the utility model:
FIG. 1 is a schematic view of the structure of the present utility model in use;
FIG. 2 is a left side view of the structure of the present utility model;
FIG. 3 is a right side view of the structure of the present utility model;
FIG. 4 is a right side view of a partial structure of the present utility model;
FIG. 5 is a schematic view of the upper die mechanism of the present utility model;
fig. 6 is a schematic view of a partial structure of the upper die mechanism of the present utility model.
In the figure: 1. a carrier plate; 2. a driving motor; 3. a cam; 4. a circular groove; 5. a first arm; 6. an upper die mechanism; 601. a third guide rail; 602. a third moving block; 603. punching a rod; 604. a support; 605. a fixed block; 606. an upper positioning seat; 607. a limit rod; 608. a buffer spring; 609. a limit bolt; 7. a first guide rail; 8. a first moving block; 9. a roller; 10. a second arm; 11. a second guide rail; 12. a second moving block; 13. a lower positioning seat; 14. a collection member; 15. and a protective cover.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 2, fig. 3 and fig. 4, a punching component for a full-automatic high-speed AOI detector with a Leadframe structure comprises a carrier plate 1, wherein one side of the carrier plate 1 is fixedly connected with a driving motor 2, the output end of the driving motor 2 extends to the other side of the carrier plate 1, the output end of the driving motor 2 is sleeved with a cam 3, the side surface of the cam 3 is provided with a circular groove 4, and the upper end and the lower end of the other side of the carrier plate 1 are respectively connected with a first support arm 5 and a second support arm 10 in a rotating manner.
As shown in fig. 4, one end of the first support arm 5 is rotatably connected in the circular groove 4, and the other end of the first support arm 5 is rotatably connected with the upper die mechanism 6.
As shown in fig. 4, one end of the second support arm 10 is rotatably connected with a transmission mechanism, the other end of the second support arm 10 is rotatably connected with a lower die mechanism, and the upper die mechanism 6 is matched with the lower die mechanism to perform punching and removing on the bonding pad area on the poor lead frame structure.
As shown in fig. 3, the other side of the carrier plate 1 is fixedly connected with a protecting cover 15, and the cam 3 and the transmission mechanism are both positioned in the protecting cover 15, so that the protecting effect on the cam 3 and the transmission mechanism can be achieved.
As shown in fig. 5 and 6, the upper die mechanism 6 includes a third guide rail 601, the third guide rail 601 is fixedly connected to the other side of the carrier plate 1, a third moving block 602 is slidably connected to a side surface of the third guide rail 601, the other end of the first support arm 5 is rotatably connected to the third moving block 602, a stamping rod 603 is inserted into the bottom of the third moving block 602, and the bottom end of the stamping rod 603 is square.
As shown in fig. 5 and 6, the upper die mechanism 6 includes a support 604, the support 604 is fixedly connected to the other side of the carrier plate 1, a fixed block 605 is fixedly connected to the inner side of the support 604, an upper positioning seat 606 is fixedly connected to the bottom of the fixed block 605, the bottom end of the stamping rod 603 passes through the upper positioning seat 606 and extends to the lower side of the upper positioning seat 606, a containing cavity is formed in the fixed block 605, a buffer spring 608 is arranged in the containing cavity, a third movable block 602 is elastically connected with the fixed block 605 through the buffer spring 608, limit rods 607 are fixedly connected to two sides of the third movable block 602, two sides of the fixed block 605 are slidably connected to the inner sides of the limit rods 607, limit bolts 609 are connected to the middle of the support 604 in a threaded manner, and the limit bolts 609 are located under the limit rods 607.
As shown in fig. 4, the lower die mechanism includes a second guide rail 11, a second moving block 12 and a lower positioning seat 13, the second guide rail 11 is fixedly connected to the other side of the carrier plate 1, the second moving block 12 is slidably connected to the second guide rail 11, the other end of the second support arm 10 is rotatably connected to the second moving block 12, the lower positioning seat 13 is fixedly connected to the second moving block 12, the lower positioning seat 13 is located right below the upper positioning seat 606, an inclined hole is formed in the second moving block 12, the inclined hole is communicated with the central hole of the upper positioning seat 606, the bottom of the carrier plate 1 is fixedly connected with a bottom plate, a collecting member 14 is fixedly inserted on the bottom plate, and the top of the collecting member 14 is located below the lower die mechanism.
As shown in fig. 4, the transmission mechanism comprises a first guide rail 7, the first guide rail 7 is fixedly connected to the other side of the carrier plate 1, a first moving block 8 is slidably connected to the first guide rail 7, one end of a second support arm 10 is rotatably connected to the first moving block 8, a roller 9 is rotatably connected to the top of the first moving block 8, and the roller 9 is in rolling connection with the outer contour of the cam 3.
When in use, as shown in fig. 1, the punching component is arranged beside a detection component of a full-automatic high-speed AOI detector with a lead frame structure, and after a bonding pad area on the lead frame structure is detected and marked, the bonding pad area on the lead frame structure is transferred between an upper die mechanism 6 and a lower die mechanism;
the driving motor 2 can drive the cam 3 to rotate, one end of the first support arm 5 can roll in the circular groove 4 on the cam 3, and the first support arm 5 drives the third moving block 602 to slide on the third guide rail 601 to drive the stamping rod 603 to move up and down;
the roller 9 rolls on the outline of the cam 3, and through the second support arm 10, the second movable block 12 can be driven to slide on the second guide rail 11, the punching rod 603 moves downwards to punch out the bonding pad area on the poor lead frame structure, the bonding pad area on the poor lead frame structure which is punched out falls into the inclined hole through the lower positioning seat 13, and finally falls into the collecting piece 14 to collect the bonding pad area on the poor lead frame structure.
It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a full-automatic high-speed AOI of Leadframe structure detects machine die-cut subassembly, includes carrier plate (1), its characterized in that: one side of the carrier plate (1) is fixedly connected with a driving motor (2), the output end of the driving motor (2) extends to the other side of the carrier plate (1), a cam (3) is sleeved at the output end of the driving motor (2), a circular groove (4) is formed in the side face of the cam (3), and the upper end and the lower end of the other side of the carrier plate (1) are respectively connected with a first support arm (5) and a second support arm (10) in a rotating mode;
one end of the first support arm (5) is rotationally connected in the circular groove (4), and the other end of the first support arm (5) is rotationally connected with an upper die mechanism (6);
one end of the second support arm (10) is rotationally connected with a transmission mechanism, the other end of the second support arm (10) is rotationally connected with a lower die mechanism, and the upper die mechanism (6) and the lower die mechanism are matched to be used for punching and removing a bonding pad area on a poor lead frame structure.
2. The full-automatic high-speed AOI tester die-cut assembly of the Leadframe structure of claim 1, wherein: the upper die mechanism (6) comprises a third guide rail (601), the third guide rail (601) is fixedly connected to the other side of the carrier plate (1), a third moving block (602) is slidably connected to the side face of the third guide rail (601), and the other end of the first support arm (5) is rotatably connected to the inside of the third moving block (602).
3. The full-automatic high-speed AOI tester die-cut assembly of the Leadframe structure of claim 2, wherein: the bottom of third movable block (602) is pegged graft and is had ram rod (603), ram rod (603) bottom is square setting.
4. The full-automatic high-speed AOI tester die-cut assembly of the Leadframe structure of claim 3, wherein: the upper die mechanism (6) comprises a support (604), the support (604) is fixedly connected to the other side of the carrier plate (1), a fixed block (605) is fixedly connected to the inner side of the support (604), an upper positioning seat (606) is fixedly connected to the bottom of the fixed block (605), and the bottom end of the stamping rod (603) penetrates through the upper positioning seat (606) and extends to the lower side of the upper positioning seat (606).
5. The die-cut assembly for a full-automatic high-speed AOI tester with a Leadframe structure according to claim 4, wherein: the inside of fixed block (605) is equipped with holds the chamber, hold the inside in chamber and be equipped with buffer spring (608), third movable block (602) are through buffer spring (608) and fixed block (605) elastic connection.
6. The full-automatic high-speed AOI tester die-cut assembly of claim 5, wherein: both sides of the third movable block (602) are fixedly connected with a limiting rod (607), and both sides of the fixed block (605) are in sliding connection with the inner side of the limiting rod (607).
7. The full-automatic high-speed AOI tester die-cut assembly of the Leadframe structure of claim 6, wherein: the middle part threaded connection of support (604) has spacing bolt (609), spacing bolt (609) are located gag lever post (607) under.
8. The full-automatic high-speed AOI tester die-cut assembly of the Leadframe structure of claim 7, wherein: the lower die mechanism comprises a second guide rail (11), a second moving block (12) and a lower positioning seat (13), wherein the second guide rail (11) is fixedly connected to the other side of the carrier plate (1), the second moving block (12) is slidably connected to the second guide rail (11), the other end of the second support arm (10) is rotatably connected to the second moving block (12), the lower positioning seat (13) is fixedly connected to the second moving block (12), the lower positioning seat (13) is located under the upper positioning seat (606), and an inclined hole is formed in the second moving block (12) and is communicated with the central hole of the upper positioning seat (606).
9. The full-automatic high-speed AOI tester die-cut assembly of the Leadframe structure of claim 1, wherein: the transmission mechanism comprises a first guide rail (7), the first guide rail (7) is fixedly connected to the other side of the carrier plate (1), a first moving block (8) is connected to the first guide rail (7) in a sliding mode, one end of a second support arm (10) is rotatably connected to the first moving block (8), a roller (9) is rotatably connected to the top of the first moving block (8), and the roller (9) is in rolling connection with the outer outline of the cam (3).
10. The full-automatic high-speed AOI tester die-cut assembly of the Leadframe structure of claim 1, wherein: the bottom of the carrier plate (1) is fixedly connected with a bottom plate, a collecting piece (14) is fixedly inserted on the bottom plate, and the top of the collecting piece (14) is positioned below the lower die mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320736281.1U CN219597831U (en) | 2023-03-28 | 2023-03-28 | Punching assembly for full-automatic high-speed AOI (automated optical inspection) detector with Leadframe structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320736281.1U CN219597831U (en) | 2023-03-28 | 2023-03-28 | Punching assembly for full-automatic high-speed AOI (automated optical inspection) detector with Leadframe structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219597831U true CN219597831U (en) | 2023-08-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320736281.1U Active CN219597831U (en) | 2023-03-28 | 2023-03-28 | Punching assembly for full-automatic high-speed AOI (automated optical inspection) detector with Leadframe structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219597831U (en) |
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- 2023-03-28 CN CN202320736281.1U patent/CN219597831U/en active Active
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